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NC7SZ386L6X

NC7SZ386L6X

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    UFDFN6

  • 描述:

    IC GATE XOR 1CH 3-INP 6MICROPAK

  • 数据手册
  • 价格&库存
NC7SZ386L6X 数据手册
DATA SHEET www.onsemi.com TinyLogic UHS Three-Input Exclusive-OR Gate MARKING DIAGRAMS NC7SZ386 Description Pin 1 The NC7SZ386 is a single three−input Exclusive−OR Gate from onsemi’s Ultra−High Speed Series of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra−high speed with high output drive while maintaining low static power dissipation over a broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V VCC operating range. The inputs and output are high impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V independent of VCC operating voltage. Features • • • • • • • • • F4KK XYZ SIP6 1.45x1.0 CASE 127EB Ultra−High Speed: tPD = 4.8 ns (Typical) into 50 pF at 5 V VCC High Output Drive: ±24 mA at 3 V VCC Broad VCC Operating Range: 1.65 V to 5.5 V Power Down High Impedance Inputs / Outputs Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Ultra−Small MicroPak™ Packages Space−Saving SC70 Package These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 6 SC−88 CASE 419B−02 386M G G 1 F4, 386 KK XY Z M G = Specific Device Code = 2−Digit Lot Run Traceability Code = 2−Digit Date Code Format = Assembly Plant Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. IEEC / IEC A B =1 Y C Figure 1. Logic Symbol © Semiconductor Components Industries, LLC, 2001 March, 2022 − Rev. 2 1 Publication Order Number: NC7SZ386/D NC7SZ386 Pin Configurations A 1 A 1 6 C GND 2 5 VCC B 3 4 Y GND 2 5 VCC B 3 Figure 2. SC−88 (Top View) (Top View) 6C 4Y Figure 4. MicroPak (Top Through View) AAA Pin One AAA represents Product Code Top Mark − see ordering code. NOTE: Orientation of Top Mark determines Pin One location. Read the Top Product Code Mark left to right, Pin One is the lower left pin (see diagram). Figure 3. Pin 1 Orientation FUNCTION TABLE PIN DEFINITIONS Pin # SC−88 Pin # MicroPak Name 1 1 A 2 2 GND 3 3 4 Description Inputs Output Input A B C Y Ground L L L L B Input L L H H 4 Y Output L H L H 5 5 VCC Supply Voltage L H H L 6 6 C Input H L L H H L H L H H L L H H H H H = HIGH Logic Level L = LOW Logic Level www.onsemi.com 2 NC7SZ386 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VCC Supply Voltage −0.5 6.5 V VIN DC Input Voltage −0.5 6.5 V DC Output Voltage −0.5 6.5 V VOUT Parameter IIK DC Input Diode Current VIN < 0 V − −50 mA IOK DC Output Diode Current VOUT < 0 V − −50 mA IOUT DC Output Current − ±50 mA DC VCC or Ground Current − ±50 mA −65 +150 °C ICC or IGND TSTG Storage Temperature Range TJ Junction Temperature Under Bias − +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation in Still Air SC−88 − 332 mW MicroPak−6 ESD − 812 Human Body Model, JESD22−A114 − 4000 Charge Device Model, JESD22−C101 − 2000 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT Parameter Min Max Unit Supply Voltage Operating 1.65 5.50 V Supply Voltage Data Retention 1.50 5.50 Input Voltage 0 5.5 V Output Voltage 0 VCC V TA Operating Temperature tr, tf Input Rise and Fall Times qJA Thermal Resistance Conditions −40 +85 °C VCC at 1.8 V, 2.5 V ±0.2 V 0 20 ns/V VCC at 3.3 V ±0.3 V 0 10 VCC at 5.0 V ±0.5 V 0 5 SC−88 − 377 MicroPak−6 − 154 °C/W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. www.onsemi.com 3 NC7SZ386 DC ELECTRICAL CHARACTERISTICS TA = 25°C Symbol VIH VIL VOH Parameter HIGH Level Input Voltage LOW Level Input Voltage Typ Max Min Max Unit 1.65 to 1.95 0.65 VCC − − 0.65 VCC − V 2.30 to 5.50 0.70 VCC − − 0.70 VCC − 1.65 to 1.95 − − 0.35 VCC − 0.35 VCC 2.30 to 5.50 − − 0.30 VCC − 0.30 VCC 1.55 1.65 − 1.55 − 2.20 2.30 − 2.20 − 3.00 2.90 3.00 − 2.90 − 4.50 4.40 4.50 − 4.40 − VCC (V) HIGH Level Output Voltage Conditions VIN = VIH or VIL, IOH = −100 mA 1.65 2.30 VOL LOW Level Output Voltage 1.65 IOH = −4 mA 1.29 1.52 − 1.29 − 2.30 IOH = −8 mA 1.90 2.15 − 1.90 − 3.00 IOH = −16 mA 2.50 2.80 − 2.40 − 3.00 IOH = −24 mA 2.40 2.68 − 2.30 − 4.50 IOH = −32 mA 3.90 4.20 − 3.80 − 1.65 VIN = VIH or VIL, IOL = 100 mA − 0.00 0.10 − 0.10 − 0.00 0.10 − 0.10 − 0.00 0.10 − 0.10 2.30 3.00 4.50 IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current TA = −40 to +85°C Min V V V − 0.00 0.10 − 0.10 1.65 IOL = 4 mA − 0.80 0.24 − 0.24 2.30 IOL = 8 mA − 0.10 0.30 − 0.30 3.00 IOL = 16 mA − 0.15 0.40 − 0.40 3.00 IOL = 24 mA − 0.22 0.55 − 0.55 4.50 IOL = 32 mA − 0.22 0.55 − 0.55 VIN = 5.5 V, GND − − ±1 − ±10 mA VIN or VOUT = 5.5 V − − 1 − 10 mA VIN = 5.5 V, GND − − 2 − 20 mA 1.65 to 5.5 0 1.65 to 5.50 AC ELECTRICAL CHARACTERISTICS TA = 25°C Symbol tPLH, tPHL Parameter Propagation Delay (Figure 5, 6) TA = −40 to +85°C VCC (V) Conditions Min Typ Max Min Max Unit 1.80 ±0.15 CL = 15 pF, RL = 1 MW − 14.0 22.5 − 23.0 ns − 8.0 12.5 − 13.0 3.30 ±0.30 − 6.0 9.2 − 9.5 5.00 ±0.50 − 4.3 5.7 − 6.1 − 6.1 9.5 − 9.8 2.50 ±0.20 3.30 ±0.30 5.00 ±0.50 CL = 50 pF, RL = 500 W − 4.8 6.5 − 6.9 CIN Input Capacitance 0.00 − 4 − − − pF CPD Power Dissipation Capacitance (Note 2) (Figure 7) 3.30 − 25 − − − pF 5.00 − 31 − − − 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle.(See Figure 7) CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). www.onsemi.com 4 NC7SZ386 AC Loading and Waveforms VCC 90% 90% CL 50% INPUT OUTPUT INPUT tf = 3 ns VCC tr = 3 ns 10% RL 50% tW tPLH NOTES: 3. CL includes load and stray capacitance 4. Input PRR = 1.0 MHz, tW = 500 ns. tPHL 50% OUTPUT 10% GND VOH 50% VOL Figure 5. AC Test Circuit Figure 6. AC Waveforms VCC A INPUT NOTE: 5. Input = AC Waveform; tr = tf = 1.8 ns; PRR = 10 MHz; Duty Cycle = 50%. Figure 7. ICCD Test Circuit DEVICE ORDERING INFORMATION Top Mark Packages Shipping† NC7SZ386P6X 386 6−Lead SC70, EIAJ SC−88, 1.25 mm Wide 3000 / Tape & Reel NC7SZ386P6X−L22347 386 6−Lead SC70, EIAJ SC−88, 1.25 mm Wide 3000 / Tape & Reel NC7SZ386L6X F4 6−Lead MicroPak, 1.00 mm Wide 5000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MicroPak is a trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13590G SIP6 1.45X1.0 DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y 1 SCALE 2:1 DATE 11 DEC 2012 2X aaa H D D H A D 6 5 GAGE PLANE 4 1 2 L L2 E1 E DETAIL A 3 aaa C 2X bbb H D 2X 3 TIPS e B 6X b ddd TOP VIEW C A-B D M A2 DETAIL A A 6X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. ccc C A1 SIDE VIEW C SEATING PLANE END VIEW c RECOMMENDED SOLDERING FOOTPRINT* 6X DIM A A1 A2 b C D E E1 e L L2 aaa bbb ccc ddd MILLIMETERS MIN NOM MAX −−− −−− 1.10 0.00 −−− 0.10 0.70 0.90 1.00 0.15 0.20 0.25 0.08 0.15 0.22 1.80 2.00 2.20 2.00 2.10 2.20 1.15 1.25 1.35 0.65 BSC 0.26 0.36 0.46 0.15 BSC 0.15 0.30 0.10 0.10 GENERIC MARKING DIAGRAM* 6 XXXMG G 6X 0.30 INCHES NOM MAX −−− 0.043 −−− 0.004 0.035 0.039 0.008 0.010 0.006 0.009 0.078 0.086 0.082 0.086 0.049 0.053 0.026 BSC 0.010 0.014 0.018 0.006 BSC 0.006 0.012 0.004 0.004 MIN −−− 0.000 0.027 0.006 0.003 0.070 0.078 0.045 0.66 1 2.50 0.65 PITCH XXX = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. *Date Code orientation and/or position may vary depending upon manufacturing location. *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. STYLES ON PAGE 2 DOCUMENT NUMBER: DESCRIPTION: 98ASB42985B SC−88/SC70−6/SOT−363 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y DATE 11 DEC 2012 STYLE 1: PIN 1. EMITTER 2 2. BASE 2 3. COLLECTOR 1 4. EMITTER 1 5. BASE 1 6. COLLECTOR 2 STYLE 2: CANCELLED STYLE 3: CANCELLED STYLE 4: PIN 1. CATHODE 2. CATHODE 3. COLLECTOR 4. EMITTER 5. BASE 6. ANODE STYLE 5: PIN 1. ANODE 2. ANODE 3. COLLECTOR 4. EMITTER 5. BASE 6. CATHODE STYLE 6: PIN 1. ANODE 2 2. N/C 3. CATHODE 1 4. ANODE 1 5. N/C 6. CATHODE 2 STYLE 7: PIN 1. SOURCE 2 2. DRAIN 2 3. GATE 1 4. SOURCE 1 5. DRAIN 1 6. GATE 2 STYLE 8: CANCELLED STYLE 9: PIN 1. EMITTER 2 2. EMITTER 1 3. COLLECTOR 1 4. BASE 1 5. BASE 2 6. COLLECTOR 2 STYLE 10: PIN 1. SOURCE 2 2. SOURCE 1 3. GATE 1 4. DRAIN 1 5. DRAIN 2 6. GATE 2 STYLE 11: PIN 1. CATHODE 2 2. CATHODE 2 3. ANODE 1 4. CATHODE 1 5. CATHODE 1 6. ANODE 2 STYLE 12: PIN 1. ANODE 2 2. ANODE 2 3. CATHODE 1 4. ANODE 1 5. ANODE 1 6. CATHODE 2 STYLE 13: PIN 1. ANODE 2. N/C 3. COLLECTOR 4. EMITTER 5. BASE 6. CATHODE STYLE 14: PIN 1. VREF 2. GND 3. GND 4. IOUT 5. VEN 6. VCC STYLE 15: PIN 1. ANODE 1 2. ANODE 2 3. ANODE 3 4. CATHODE 3 5. CATHODE 2 6. CATHODE 1 STYLE 16: PIN 1. BASE 1 2. EMITTER 2 3. COLLECTOR 2 4. BASE 2 5. EMITTER 1 6. COLLECTOR 1 STYLE 17: PIN 1. BASE 1 2. EMITTER 1 3. COLLECTOR 2 4. BASE 2 5. EMITTER 2 6. COLLECTOR 1 STYLE 18: PIN 1. VIN1 2. VCC 3. VOUT2 4. VIN2 5. GND 6. VOUT1 STYLE 19: PIN 1. I OUT 2. GND 3. GND 4. V CC 5. V EN 6. V REF STYLE 20: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. EMITTER 5. COLLECTOR 6. COLLECTOR STYLE 21: PIN 1. ANODE 1 2. N/C 3. ANODE 2 4. CATHODE 2 5. N/C 6. CATHODE 1 STYLE 22: PIN 1. D1 (i) 2. GND 3. D2 (i) 4. D2 (c) 5. VBUS 6. D1 (c) STYLE 23: PIN 1. Vn 2. CH1 3. Vp 4. N/C 5. CH2 6. N/C STYLE 24: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE 5. CATHODE 6. CATHODE STYLE 25: PIN 1. BASE 1 2. CATHODE 3. COLLECTOR 2 4. BASE 2 5. EMITTER 6. COLLECTOR 1 STYLE 26: PIN 1. SOURCE 1 2. GATE 1 3. DRAIN 2 4. SOURCE 2 5. GATE 2 6. DRAIN 1 STYLE 27: PIN 1. BASE 2 2. BASE 1 3. COLLECTOR 1 4. EMITTER 1 5. EMITTER 2 6. COLLECTOR 2 STYLE 28: PIN 1. DRAIN 2. DRAIN 3. GATE 4. SOURCE 5. DRAIN 6. DRAIN STYLE 29: PIN 1. ANODE 2. ANODE 3. COLLECTOR 4. EMITTER 5. BASE/ANODE 6. CATHODE STYLE 30: PIN 1. SOURCE 1 2. DRAIN 2 3. DRAIN 2 4. SOURCE 2 5. GATE 1 6. DRAIN 1 Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment. DOCUMENT NUMBER: DESCRIPTION: 98ASB42985B SC−88/SC70−6/SOT−363 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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