NCV7341
High Speed Low Power CAN
Transceiver
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PIN ASSIGNMENT
TxD
1
14
STB
GND
2
13
CANH
VCC
3
12
RxD
4
VIO
Features
• Ideal Passive Behavior when Supply Voltage is Removed
• Separate VIO Supply for Digital Interface Allowing Communication
•
•
•
•
•
•
•
•
•
•
•
•
•
to CAN Controllers and Microcontrollers with Different Supply
Levels
Fully Compatible with the ISO 11898 Standard
High Speed (up to 1 Mb)
Very Low Electromagnetic Emission (EME)
VSPLIT Voltage Source for Stabilizing the Recessive Bus Level if
Split Termination is Used (Further Improvement of EME)
Differential Receiver with High Common−Mode Range for
Electromagnetic Immunity (EMI)
Up to 110 Nodes can be Connected in Function of the Bus Topology
Transmit Data (TxD) Dominant Time−out Function
Bus Error Detection with Version NCV7341D20
Bus Pins Protected Against Transients in Automotive Environments
Bus Pins and Pin VSPLIT Short−Circuit Proof to Battery and Ground
Thermally Protected
NCV Prefix for Automotive and Other Applications Requiring Site
and Change Controls
These are Pb−Free Devices*
EN
INH
NCV7341
The NCV7341 CAN transceiver is the interface between a
controller area network (CAN) protocol controller and the physical
bus and may be used in both 12 V and 24 V systems. The transceiver
provides differential transmit capability to the bus and differential
receive capability to the CAN controller.
Due to the wide common−mode voltage range of the receiver inputs,
the NCV7341 is able to reach outstanding levels of electromagnetic
susceptibility (EMS). Similarly, extremely low electromagnetic
emission (EME) is achieved by the excellent matching of the output
signals.
The NCV7341 is a new addition to the ON Semiconductor CAN
high−speed transceiver family and offers the following additional
features:
CANL
11
VSPLIT
5
10
VBAT
6
9
7
8
(Top View)
WAKE
ERR
PC20060727.1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 17 of this data sheet.
Typical Applications
• Automotive
• Industrial Networks
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2009
May, 2009 − Rev. 4
1
Publication Order Number:
NCV7341/D
NCV7341
Table 1. TECHNICAL CHARACTERISTICS
Max
Max
Unit
VCC
Symbol
Supply Voltage for the Core Circuitry
Parameter
Condition
4.75
5.25
V
VIO
Supply Voltage for the Digital Interface
2.8
5.25
V
VEN
DC Voltage at Pin EN
−0.3
VIO + 0.3
V
VSTB
DC Voltage at Pin STB
−0.3
VIO + 0.3
V
VTxD
DC Voltage at Pin TxD
−0.3
VIO + 0.3
V
VRxD
DC Voltage at Pin RxD
−0.3
VIO + 0.3
V
VERR
DC Voltage at Pin ERR
−0.3
VIO + 0.3
V
VCANH
DC Voltage at Pin CANH
0 < VCC < 5.25 V; No Time Limit
−58
+58
V
VCANL
DC Voltage at Pin CANL
0 < VCC < 5.25 V; No Time Limit
−58
+58
V
VSPLIT
DC Voltage at Pin VSPLIT
0 < VCC < 5.25 V; No time Limit
−58
+58
V
VO(dif)(bus_dom)
Differential Bus Output Voltage in Dominant
State
42.5 W < RLT < 60 W
1.5
3
V
CMrange
Input Common−Mode Range for Comparator
Guaranteed Differential Receiver
Threshold and Leakage Current
−35
+35
V
Cload
Load Capacitance on IC Outputs
15
pF
tpd(rec−dom)
Propagation Delay TxD to RxD
See Figure 6
90
230
ns
tpd(dom−rec)
Propagation Delay TxD to RxD
See Figure 6
90
245
ns
TJ
Junction Temperature
−40
150
°C
ESDHBM
ESD Level, Human Body Model
−4
−3
4
3
kV
Pins CANH, CANL, VSPLIT,
WAKE, VBAT other Pins
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NCV7341
BLOCK DIAGRAM
VIO
5
VIO
INH
VBAT
VCC
10
7
3
POR
13
TxD
1
Timer
Thermal
shutdown
6
EN
CANH
VCC
11
V SPLIT
VSPLIT
”Active”
STB
Level
shifter
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
VIO
ERR
12
Driver
control
14
Digital
Control
Block
Wake −up
Filter
CANL
Rec
Low Power
8
Rec
Clock
4
VIO
”Active”
+
WAKE
VCC/2
26 kW
RxD
26 kW
VIO
2
−
9
NCV7341
PC20060921.1
Figure 1. Block Diagram
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3
GND
NCV7341
TYPICAL APPLICATION SCHEMATICS
OUT
100 nF
x mF*
VCC
1
EN
CAN
controller
5
6
STB 14
RxD
VBAT
10 nF
Vio
TxD
IN
1 kW
VCC INH VBAT
3
7
10 WAKE
9
2.7 kW
CANH
13
N C V7341
100nF
5V−Reg
4
11
VSPLIT
180 kW
10 nF
RLT = 60 W
CAN
BUS
CLT= 4.7 nF
ERR 8
12
2
GND
CANL
RLT = 60 W
GND
Note (*): Value depending on regulator
PC20060921.4
Figure 2. Application Diagram with a 5V CAN Controller
x mF*
OUT
3V−reg
IN
OUT
100 nF
x mF*
100 nF
Vcc
5
3
10
9
RxD
14
4
NCV7341
STB
13
11
WAKE
2.7 kW
CANH
VSPLIT
10 nF
RLT = 60 W
CAN
BUS
CLT = 4.7 nF
ERR 8
12
2
GND
180 kW
INH VBAT
7
EN
CAN
controller
VBAT
10 nF
1
6
IN
1 kW
Vcc
Vio
TxD
5V−reg
CANL
RLT = 60 W
GND
Note (*): Value depending on regulator
PC20060921.4
Figure 3. Application Diagram with a 3V CAN Controller
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4
NCV7341
PIN DESCRIPTION
1
14
STB
GND
2
13
CANH
VCC
3
12
RxD
4
VIO
EN
INH
NCV7341
TxD
CANL
11
VSPLIT
5
10
VBAT
6
9
7
8
WAKE
ERR
PC20060727.1
Figure 4. NCV7340 Pin Assignment
Table 2. PIN DESCRIPTION
Pin
Name
Description
1
TxD
Transmit data input; low level = dominant on the bus; internal pull−up current
2
GND
Ground
3
VCC
Supply voltage for the core circuitry and the transceiver
4
RxD
Receive data output; dominant bus => low output
5
VIO
Supply voltage for the CAN controller interface
6
EN
Enable input; internal pull−down current
7
INH
High voltage output for controlling external voltage regulators
8
ERR
Digital output indicating errors and power−up; active low
9
WAKE
10
VBAT
Local wake−up input
11
VSPLIT
Common−mode stabilization output
12
CANL
Low−level CAN bus line (low in dominant)
13
CANH
High−level CAN bus line (high in dominant)
14
STB
Battery supply connection
Stand−by mode control input; internal pull−down current
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NCV7341
FUNCTIONAL DESCRIPTION
OPERATING MODES
Operation modes of NCV7341 are shown in Figures 5 and in Table 3.
SLEEP
MODE
STB = H and EN = L
and
VCC/VIO undervoltage flag reset
RECEIVE
ONLY
MODE
STB = L
and
flags set
STB = H and EN = H
and
VCC/VIO undervoltage flag reset
STB = H
and
EN = H
STB = H
and
EN = L
NORMAL
MODE
STB = H
and
EN = H
flags reset
and
t > t h(min)
STB = H
and
EN = L
STB = H
and
EN = L
STB = H
and
EN = H
STB = L
and
(EN = L or flags set)
STB = L
and
EN = H
STB = L and EN = H
and
flags reset
STB = L
and
EN = L
STANDBY
MODE
POWER
UP
STB = L and EN = H
and
flags reset
GOTO
SLEEP
MODE
STB = L
and
(EN = L or flags set)
LEGEND
”Flags set” :
”Flags reset” :
PC20060921.2
wake−up or power−up
not (wake−up or power−up)
Figure 5. Operation Modes
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NCV7341
Table 3. OPERATION MODES
Conditions
Transceiver Behavior
Pin STB
Pin EN
VCC/VIO
Undervoltage
Flag
X
X
Set
X
X
Sleep
Floating
Reset
Set
Set
Standby
High
Reset
If in sleep, then no change
Floating
otherwise stand−by
High
Low
Low
Low
High
Reset
Reset
VBAT
Undervoltage
Flag
Power−up or
Wakeup Flag
Operating Mode
Pin INH
Reset
Reset
High
Low
Reset
Reset
High
High
Reset
Reset
Normal Mode
Set
Stand−by
High
Reset
If in sleep, then no change
Floating
otherwise stand−by
High
Set
Stand−by
High
Reset
If in sleep, then no change
Floating
otherwise go−to−sleep
High
X
Receive−only
High
X
Normal
High
puts pin EN to High and STB Pin to Low. If the logical state
of Pins EN and STB is kept unchanged for minimum period
of th(min) and neither a wake−up nor a power−up event occur
during this time, the transceiver enters sleep mode. While in
go−to−sleep mode, the transceiver behaves identically to
stand−by mode.
In Normal mode, the transceiver is able to communicate
via the bus lines. The CAN controller can transmit data to the
bus via TxD pin and receive data from the bus via Pin RxD.
The bus lines (CANH and CANL) are internally biased to
VCC/2 via the common−mode input resistance. Pin VSPLIT
is also providing voltage VCC/2 which can be further used
to externally stabilize the common mode voltage of the bus
– see Figure 2 and Figure 3. Pin INH is active (pulled high)
so that the external regulators controlled by INH Pin are
switched on.
Sleep Mode
Sleep mode is a low−power mode in which the
consumption is further reduced compared to stand−by
mode. Sleep mode can be entered via go−to−sleep mode or
in case an undervoltage on either VCC or VIO occurs for
longer than the under−voltage detection time. The
transceiver behaves identically to standby mode, but the
INH Pin is deactivated (left floating) and the external
regulators controlled by INH Pin are switched off. In this
way, the VBAT consumption is reduced to a minimum. The
device will leave sleep mode either by a wake−up event (in
case of a CAN bus wake−up or via Pin WAKE) or by putting
Pin STB high (as long as an under−voltage on VCC or VIO
is not detected).
Receive−Only Mode
In Receive−only mode, the CAN transmitter is disabled.
The CAN controller can still receive data from the bus via
RxD Pin as the receiver part remains active. Equally to
normal mode, the bus lines (CANH and CANL) are
internally biased to VCC/2 and Pin VSPLIT is providing
voltage VCC/2. Pin INH is also active (pulled high).
Standby Mode
Standby mode is a low−power mode. Both the transmitter
and the receiver are disabled and a very low−power
differential receiver monitors the CAN bus activity. Bus
lines are biased internally to ground via the common mode
input resistance and Pin VSPLIT is high−impedant (floating).
A wake−up event can be detected either on the CAN bus or
on the WAKE Pin. A valid wake−up is signaled on pins ERR
and RxD. Pin INH remains active (pulled high) so that the
external regulators controlled by INH Pin are switched on.
Internal Flags
The transceiver keeps several internal flags reflecting
conditions and events encountered during its operation.
Some flags influence the operation mode of the transceiver
(see Figure 5 and Table 3). Beside the undervoltage and the
TxD dominant timeout flags, all others can be read by the
CAN controller on Pin ERR. Pin ERR signals internal flags
depending on the operation mode of the transceiver. An
overview of the flags and their visibility on Pin ERR is given
in Table 4. Because the ERR Pin uses negative logic, it will
be pulled low if the signaled flag is set and will be pulled
high if the signaled flag is reset.
Go−To−Sleep Mode
Go−To−Sleep mode is an intermediate state used to put the
transceiver into sleep mode in a controlled way.
Go−To−Sleep mode is entered when the CAN controller
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NCV7341
Table 4. INTERNAL FLAGS AND THEIR VISIBILITY
Internal Flag
Set Condition
VCC/VIO Undervoltage
VCC < VCC(SLEEP) longer than tUV(VCC)
or VIO < VIO(SLEEP) longer than tUV(VIO)
At wake−up or power−up
No
VBAT Undervoltage
VBAT < VBAT(STB)
When VBAT recovers
No
Powerup
VBAT rises above VBAT(PWUP)
(VBAT connection to the transceiver)
When normal mode is
entered
In receive−only mode. Not
going from normal mode
When remote or local wake−up is
detected
At power−up or when normal
mode is entered or when
VCC/VIO undervoltage flag is
set
Both on ERR and RxD (both
pulled to low). In
go−to−sleep, standby and
sleep mode.
Local Wake−up
When local wake−up is detected
(i.e.via pin WAKE)
At power−up or when leaving
normal mode
In normal mode before 4
consecutive dominant
symbols are sent. Then ERR
pin becomes High again
Failure
Pin TxD clamped low or
overtemperature
When entering normal mode
or when RxD is Low while
TxD is high (provided all
failures disappeared)
Overtemperature condition
observable in receive−only
mode entered from normal
mode
Bus Failure
(NCV7341D20)
One of the bus lines shorted to ground
or supply during four consecutive
transmitted dominants
No bus line short (to ground
or supply) detected during
four consecutive dominant bit
transmissions
In normal mode
Wake−up
Reset Condition
VCC/VIO Undervoltage Flag
Visibility on Pin ERR
is reset at power−up or when VCC/VIO undervoltage occurs
or when Normal mode is entered.
The VCC/VIO undervoltage flag is set if VCC supply drops
below VCC(sleep) level for longer than tUV(VCC) or VIO
supply drops below VIO(sleep) level for longer than tUV(VIO).
If the flag is set, the transceiver enters sleep mode. After a
waiting time identical to the undervoltage detection times
tUV(VCC) and tUV(VIO), respectively, the flag can be reset
either by a valid wake−up request or when the powerup flag
is set. During this waiting time, the wakeup detection is
blocked.
Local wake−up Flag
This flag is set when a valid wake−up request through
WAKE Pin occurs. It can be observed on the ERR Pin in
normal mode. It can only be set when the powerup flag is
reset. The local wake−up flag is reset at powerup or at
leaving Normal mode.
Failure Flag
The failure flag is set in one of the following situations:
• TxD Pin is Low (i.e. dominant is requested by the CAN
controller) for longer than tdom(TxD) − Under this
condition, the transmitter is disabled so that a bus
lockup is avoided in case of an application failure
which would drive permanent dominant on the bus. The
transmitter remains disabled until the failure flag is
reset.
• Overtemperature − If the junction temperature reaches
TJ(SD), the transmitter is disabled in order to protect it
from overheating and the failure flag is set. The
transmitter remains disabled until the failure flag is
reset.
The failure flag is reset when Normal mode is entered or
when TxD pin is High while RxD pin is Low. In case of
overtemperature, the failure flag is observable on pin ERR.
VBAT Under−voltage Flag
The flag is set when VBAT supply drops below VBAT(STB)
level. The transceiver will enter the standby mode. The flag
is reset when VBAT supply recovers. The transceiver then
enters the mode defined by inputs STB and EN.
Power−up Flag
This flag is set when VBAT supply recovers after being
below VBAT(PWUP) level, which corresponds to a
connection of the transceiver to the battery. The VCC/VIO
undervoltage flag is cleared so that the transceiver cannot
enter the Go−to−sleep Mode, ensuring that INH Pin is high
and the external voltage regulators are activated at the
battery connection. In Receive−only mode, the powerup
flag can be observed on the ERR Pin. The flag is reset when
Normal mode is entered.
Wake−up Flag
Bus Failure Flag (NCV7341D20)
This flag is set when the transceiver detects a valid
wake−up request via the bus or via the WAKE Pin. Setting
the wake−up flag is blocked during the waiting time of the
VCC/VIO undervoltage flag. The wake−up flag is
immediately propagated to Pins ERR and RxD – provided
that supplies VCC and VIO are available. The wake−up flag
The transmitter of the NCV7341D20 device version
allows bus failure detection. During dominant bit
transmission, a short of the CANH or CANL line to ground
or supply (VCC, VBAT or other) is internally detected. If the
short circuit condition lasts for four consecutive dominant
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NCV7341
A local wake−up is detected after a change of state (High
to Low, or Low to High) on WAKE Pin which is stable for
at least tWAKE. To increase the EMS level of the WAKE Pin,
an internal current source is connected to it. If the state of the
WAKE Pin is stable at least for tWAKE, the direction of the
current source follows (pulldown current for Low state,
pullup current for High state). It is recommended to connect
Pin WAKE either to GND or VBAT if it’s not used in the
application.
transmissions, an internal bus failure flag is set and made
immediately visible through a Low level on the ERR pin.
The transmission and reception circuitry continues to
function.
When four consecutive dominant transmissions succeed
without a bus line short being detected, the internal bus
failure flag is reset and ERR pin is released to High level.
Split Circuit
The VSPLIT Pin is operational only in normal and
receive−only modes. It is floating in standby and sleep
modes. The VSPLIT can be connected as shown in Figure 2
and Figure 3 and its purpose is to provide a stabilized DC
voltage of VCC/2 to the bus avoiding possible steps in the
common−mode signal, therefore reducing EME. These
unwanted steps could be caused by an unpowered node on
the network with excessive leakage current from the bus that
shifts the recessive voltage from its nominal VCC/2 level.
Fail Safe Features
Fail safe behavior is ensured by the detection functions
associated with the internal flags.
Furthermore, a current−limiting circuit protects the
transmitter output stage from damage caused by accidental
short circuit to either positive or negative supply voltage,
although power dissipation increases during this fault
condition.
The Pins CANH and CANL are protected from
automotive electrical transients (according to ISO 7637; see
Figure 9). Pins TxD is pulled high and Pins STB and EN are
pulled low internally should the input become disconnected.
Pins TxD, STB, EN and RxD will be floating, preventing
reverse supply should the VIO supply be removed.
Wake−up
The transceiver can detect wake−up events in stand−by,
go−to−sleep and sleep modes. Two types of wake−up events
are handled – remote wake−up via the CAN bus or a local
wake−up via the WAKE pin. A valid remote wake−up is
recognized after two dominant states of the CAN bus of at
least tdom, each of them followed by a recessive state of at
least trec.
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NCV7341
ELECTRICAL CHARACTERISTICS
Definitions
Absolute Maximum Ratings
All voltages are referenced to GND (Pin 2). Positive
currents flow into the IC. Sinking current means the current
is flowing into the pin; sourcing current means the current
is flowing out of the pin.
Stresses above those listed in the following table may
cause permanent device failure. Exposure to absolute
maximum ratings for extended periods may affect device
reliability.
Table 5. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Conditions
Min.
Max.
Unit
VBAT
Supply voltage
−0.3
58
V
VCC
Supply voltage
−0.3
+7
V
VIO
Supply voltage
−0.3
+7
V
VCANH
DC voltage at pin CANH
0 < VCC < 5.25 V;
no time limit
−58
+58
V
VCANL
DC voltage at pin CANL
0 < VCC < 5.25 V;
no time limit
−58
+58
V
DC voltage between bus pins CANH and CANL
0 < VCC < 5.25 V;
no time limit
−58
+58
V
DC voltage at pin VSPLIT
0 < VCC < 5.25 V;
no time limit
−58
+58
V
DC voltage at pin INH
−0.3
VBAT+0.3
V
DC voltage at pin WAKE
−0.3
58
V
VCANL−VCANH
VSPLIT
VINH
VWAKE
VTxD
DC voltage at pin TxD
−0.3
7
V
VRxD
DC voltage at pin RxD
−0.3
VIO + 0.3
V
VSTB
DC voltage at pin STB
−0.3
7
V
VEN
DC voltage at pin EN
−0.3
7
V
VERR
DC voltage at pin ERR
−0.3
VIO + 0.3
V
Vtran(CANH)
Transient voltage at pin CANH
(Note 1)
−300
+300
V
Vtran(CANL)
Transient voltage at pin CANL
(Note 1)
−300
+300
V
Transient voltage at pin VSPLIT
(Note 1)
−300
+300
V
Electrostatic discharge voltage at pins intended to be
wired outside of the module
(CANH, CANL, VSPLIT, VBAT, WAKE)
(Note 2)
(Note 4)
−4
−500
4
500
kV
V
Electrostatic discharge voltage at all other pins
(Note 2)
(Note 4)
−3
−500
3
500
kV
V
Static latch−up at all pins
(Note 3)
120
mA
Vtran(VSPLIT)
Vesd(CANL/CANH/
VSPLIT, VBAT, WAKE)
Vesd
Latch−up
Tstg
Storage temperature
−50
+150
°C
Tamb
Ambient temperature
−50
+125
°C
Tjunc
Maximum junction temperature
−50
+180
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 9).
2. Standardized human body model electrostatic discharge (ESD) pulses in accordance to MIL883 method 3015.7.
3. Static latch-up immunity: Static latch-up protection level when tested according to EIA/JESD78.
4. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.
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NCV7341
Operating Conditions
Operating conditions define the limits for functional operation, parametric characteristics and reliability specification of the
device. Functionality of the device is not guaranteed outside the operating conditions.
Table 6. OPERATING RANGES
Symbol
Parameter
Conditions
Min
Max
Unit
5.0
50
V
6.0
50
V
4.75
5.25
V
VBAT
Supply Voltage
VBAT_SLEEP
Supply Voltage in the Sleep Mode
VCC
Supply Voltage
VIO
Supply Voltage
2.8
5.25
V
VCANH
DC Voltage at Pin CANH
Receiver Function Guaranteed
−35
+35
V
VCANL
DC Voltage at Pin CANL
Receiver Function Guaranteed
−35
+35
V
VCANL−VCANH
DC Voltage Between Bus Pins CANH
and CANL
Receiver Function Guaranteed
−35
+35
V
VSPLIT
DC Voltage at Pin VSPLIT
Leakage and Current Limitation are
Guaranteed
−35
+35
V
VINH
DC Voltage at Pin INH
−0.3
VBAT + 0.3
V
VWAKE
DC Voltage at Pin WAKE
−0.3
VBAT + 0.3
V
VTxD
DC Voltage at Pin TxD
−0.3
VIO + 0.3
V
VRxD
DC Voltage at Pin RxD
−0.3
VIO + 0.3
V
VSTB
DC Voltage at Pin STB
−0.3
VIO + 0.3
V
VEN
DC Voltage at Pin EN
−0.3
VIO + 0.3
V
DC Voltage at Pin ERR
−0.3
VIO + 0.3
V
15
pF
VERR
CLOAD
(Note 1)
Capacitive Load on Digital Outputs
(Pins RxD and ERR)
TA
Ambient Temperature
−40
+125
°C
TJ
Maximum Junction Temperature
−40
+150
°C
1. In the sleep mode, all relevant parameters are guaranteed only for VBAT > 6 V. For VBAT between 5 V and 6 V, no power−on−reset will occur
and the functionality is also guaranteed, but some parameters might get slightly out of the specification − e.g. the wakeup detection
thresholds.
Table 7. THERMAL CHARACTERISTICS
Symbol
Parameter
Conditions
Value
Unit
Rth(vj−a)
Thermal Resistance from Junction−to−Ambient in SOIC−14 Package
1S0P PCB
128
K/W
Rth(vj−a)
Thermal Resistance from Junction−to−Ambient in SOIC−14 Package
2S2P PCB
70
K/W
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NCV7341
Characteristics
The characteristics of the device are valid for operating conditions defined in Table 7 and the bus lines are considered to be
loaded with RLT = 60 W, unless specified otherwise.
Table 8. DC CHARACTERISTICS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
SUPPLY (PIN VBAT)
VBAT(STB)
Level for Setting VBAT
Undervoltage Flag
VCC = 5 V
2.75
3.3
4.5
V
VBAT(PWUP)
Level for Setting Powerup
Flag
VCC = 0 V
2.75
3.3
4.5
V
IVBAT
VBAT Current Consumption in
Normal and Receive−Only
Modes
INH and WAKE Not Loaded
1.0
10
40
mA
VBAT Current Consumption in
Standby and Go−to−Sleep
Modes. The total supply
current is drawn partially from
VBAT and partially from VCC.
VVCC > 4.75 V, VVIO > 2.8 V
VINH = VWAKE = VVBAT = 12 V
Tamb < 100°C
18
mA
22.5
mA
VBAT Current Consumption in
Sleep Mode. The supply
current is drawn from VBAT
only.
VVCC = VINH = VVIO = 0 V
VWAKE = VVBAT = 12 V
Tamb < 100°C
35
mA
VCC(SLEEP)
VCC Level for Setting VCC/VIO
Undervoltage Flag
VBAT = 12 V
IVCC
VCC Current Consumption in
Normal or Receive−Only
Mode
VVCC > 4.75 V, VVIO > 2.8 V
VINH = VWAKE = VVBAT = 12 V
VVCC = VINH = VVIO = 0 V
VWAKE = VVBAT = 12 V
8.0
12
10
20
50
mA
2.75
3.3
4.5
V
Normal Mode:
VTxD = 0 V, i.e. Dominant
25
55
80
mA
Normal Mode: VTxD = VIO, i.e.
Recessive (or Receive−Only
Mode)
2.0
6.0
10
mA
17.5
mA
19.5
mA
1.0
mA
SUPPLY (PIN VCC)
VCC Current Consumption in
Standby and Go−to−Sleep
Mode. The total supply
current is drawn partially from
VBAT and partially from VCC.
Tamb < 100°C
VCC Current Consumption in
Sleep Mode
Tamb < 100°C
6.5
12
0.2
0.5
2.0
mA
0.9
1.6
2.0
V
100
350
1000
mA
0
0.2
1.0
mA
1.0
mA
SUPPLY (PIN VIO)
VIO(SLEEP)
VIO Level for Setting VCC/VIO
Undervoltage Flag
IVIO
VIO Current Consumption in
Normal or Receive−Only
Mode
VIO Current Consumption in
Standby or Sleep Mode
Normal Mode:
VTxD = 0V, i.e. Dominant
Normal Mode: VTxD = VIO, i.e.
Recessive (or Receive−Only
mode)
Tamb < 100°C
0
0
5.0
mA
V
TRANSMITTER DATA INPUT (PIN TxD)
VIH
High−Level Input Voltage
Output Recessive
0.7VVIO
−
VIO +
0.3
VIL
Low−Level Input Voltage
Output Dominant
−0.3
−
0.3VVIO
V
IIH
High−Level Input Current
VTxD = VVIO
−5.0
0
+5.0
mA
http://onsemi.com
12
NCV7341
Table 8. DC CHARACTERISTICS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TRANSMITTER DATA INPUT (PIN TxD)
IIL
Low−Level Input Current
VTxD = 0.3 VVIO
−70
−250
−500
mA
Ci
Input Capacitance
Not Tested
1.0
5.0
10
pF
STANDBY AND ENABLE INPUTS (PINS STB AND EN)
VIH
High−Level Input Voltage
0.7VVIO
−
VIO +
0.3
V
VIL
Low−Level Input Voltage
−0.3
−
0.3VVIO
V
IIH
High−Level Input Current
VSTB = VEN = 0.7VVIO
1.0
5.0
10
mA
IIL
Low−Level Input Current
VSTB = VEN = 0 V
−0.5
0
5.0
mA
Ci
Input Capacitance
1.0
5.0
10
pF
RECEIVER DATA OUTPUT (PIN RxD)
IOH
High−Level Output Current
VRxD = VVIO − 0.4 V
VVIO = VVCC
−1.0
−3.0
−6.0
mA
IOL
Low−Level Output Current
VRxD = 0.4 V
VTxD = 0 V Bus is Dominant
2.0
5.0
12
mA
FLAG INDICATION OUTPUT (PIN ERR)
IOH
High−Level Output Current
VERR = VVIO − 0.4 V
VVIO = VVCC
−4.0
−20
−50
mA
IOL
Low−Level Output Current
VERR = 0.4 V
100
200
350
mA
LOCAL WAKE−UP INPUT (PIN WAKE)
IIH
High−Level Input Current
VWAKE = VVBAT − 1.9 V
−1.0
−5.0
−10
mA
IIL
Low−Level Input Current
VWAKE = VVBAT − 3.1 V
1.0
5.0
10
mA
Vthreshold
Threshold of the Local
Wake−up Comparator
Sleep or Standby Mode
VVBAT −
3V
VVBAT −
2.5 V
VVBAT −
2V
V
50
200
800
mV
0
−
5.0
mA
0
−
1.0
mA
INHIBIT OUTPUT (PIN INH)
VHDROP
High Level Voltage Drop
ILEAK
Leakage Current in Sleep
Mode
IINH = −180 mA
Tamb < 100°C
BUS LINES (PINS CANH AND CANL)
Vo(reces) (norm)
Recessive Bus Voltage
VTxD = VVCC; No Load, Normal
Mode
2.0
2.5
3.0
V
Vo(reces) (stby)
Recessive Bus Voltage
VTxD = VVCC; No Load, Standby
Mode
−100
0
100
mV
Io(reces) (CANH)
Recessive Output Current at
Pin CANH
−35 V < VCANH < +35 V;
0 V < VCC < 5.25 V
−2.5
−
+2.5
mA
Io(reces) (CANL)
Recessive Output Current at
Pin CANL
−35 V < VCANL < +35 V;
0 V < VVCC < 5.25 V
−2.5
−
+2.5
mA
Vo(dom) (CANH)
Dominant output Voltage at
Pin CANH
VTxD = 0 V
3.0
3.6
4.25
V
Vo(dom) (CANL)
Dominant Output Voltage at
Pin CANL
VTxD = 0 V
0. 5
1.4
1.75
V
Vo(dif) (bus_dom)
Differential Bus Output
Voltage (VCANH − VCANL)
VTxD = 0 V; Dominant;
42.5 W < RLT < 60 W
1.5
2.25
3.0
V
Vo(dif) (bus_rec)
Differential Bus Output
Voltage (VCANH − VCANL)
VTxD = VCC; Recessive; No
Load
−120
0
+50
mV
Io(sc) (CANH)
Short−Circuit Output Current
at Pin CANH
VCANH = 0 V; VTxD = 0 V
−45
−70
−120
mA
http://onsemi.com
13
NCV7341
Table 8. DC CHARACTERISTICS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCANL = 42 V; VTxD = 0 V
45
70
120
mA
BUS LINES (PINS CANH AND CANL)
Io(sc) (CANL)
Short−Circuit Output Current
at Pin CANL
Vi(dif) (th)
Differential Receiver Threshold
Voltage (see Figure 7)
−12 V < VCANL < +12 V
−12 V < VCANH < +12 V
0.5
0.7
0.9
V
Vihcm(dif) (th)
Differential Receiver Threshold
Voltage for High
Common−Mode (see Figure 7)
−35 V < VCANL < +35 V
−35 V < VCANH < +35 V
0.35
0.7
1.00
V
Vi(dif) (hys)
Differential Receiver Input
Voltage Hysteresis
(see Figure 7)
−35 V < VCANL < +35 V
−35V 1.4 V
0.75
2.5
5.0
ms
Vdif(CAN) > 1.2 V
0.75
3.0
5.8
ms
trec
Recessive Time for Wake−up
via the Bus
VBAT = 12 V
0.75
2.5
5.0
ms
tWAKE
Debounce Time for the
Wake−up via WAKE Pin
VBAT = 12 V
5.0
25
50
ms
terrdet
Minimum dominant bit time for
bus error detection
NCV7341D20 version
1
2
4
ms
MEASUREMENT DEFINITIONS AND SETUPS
recessive
TxD
recessive
dominant
50%
50%
CANH
CANL
Vi(dif) = VCANH − VCANL
0.9V
0.5V
RxD
0.7 x VCC
0.3 X VCC
td(TxD−BUSon)
tpd(rec−dom)
td(TxD−BUSoff)
td(BUSon−RxD)
t pd(dom−rec)
td(BUSoff−RxD)
PC20060915.2
Figure 6. Timing Diagram for AC Characteristics
http://onsemi.com
15
NCV7341
VRxD
High
Low
Hysteresis
0.9
0.5
PC20040829.7
Vi(dif)(hys)
Figure 7. Hysteresis of the Receiver
47 mF
+5V
1 kW
100 nF
+12V
10 nF
Vcc INH VBAT
Vio
5
EN
3
10
7
6
STB
9
ERR
8
Generator TxD
1
RxD
CANH
NCV7341
14
13
RLT
VSPLIT
11
60 W
4
CLT
100 pF
CANL
12
2
15 pF
WAKE
GND
PC20060921.6
Figure 8. Test Circuit for Timing Characteristics
+5V
47 mF
1 kW
100 nF
10 nF
Vcc INH VBAT
Vio
STB
ERR
TxD
RxD
15 pF
3
7
10
6
14
8
1
9
10 nF
WAKE
CANH
NCV7341
EN
5
13
1 nF
11
4
12
2
VSPLIT
CANL
1 nF
GND
PC20060921.5
Figure 9. Test Circuit for Automotive Transients
http://onsemi.com
16
Transient
Generator
NCV7341
DEVICE ORDERING INFORMATION
Part Number
NCV7341D20G
Description
Temperature Range
Package Type
Shipping†
HS CAN Transceiver
with bus error detection
−40°C − 125°C
SOIC−14
(Pb−Free)
55 Tube / Tray
−40°C − 125°C
SOIC−14
(Pb−Free)
3000 / Tape & Reel
−40°C − 125°C
SOIC−14
(Pb−Free)
55 Tube / Tray
−40°C − 125°C
SOIC−14
(Pb−Free)
3000 / Tape & Reel
NCV7341D20R2G
NCV7341D21G
NCV7341D21R2G
HS CAN Transceiver
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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17
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14
CASE 751AP
ISSUE B
14
1
SCALE 1:1
NOTES 4&5
D
D
0.10 C D
45 5 CHAMFER
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
H
ALLOWABLE PROTRUSION SHALL BE 0.004 mm IN EXCESS OF
MAXIMUM MATERIAL CONDITION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS
SHALL NOT EXCEED 0.006 mm PER SIDE. DIMENSION E1 DOES
NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED 0.010 mm PER SIDE.
5. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOT
TOM. DIMENSIONS D AND E1 ARE DETERMINED AT THE OUTER
SEATING
L
MOST EXTREMES OF THE PLASTIC BODY AT DATUM H.
C PLANE
6. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM H.
DETAIL A
7. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10 TO 0.25 FROM THE LEAD TIP.
8. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING
PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
h
NOTE 6
A
14
2X
8
0.10 C D
E
E1
NOTES 4&5
L2
0.20 C D
2X
1
7
B
NOTE 6
14X b
0.25
TOP VIEW
M
C A-B D
NOTES 3&7
NOTE 7
c
0.10 C
e
A1
C
SIDE VIEW
NOTE 8
DIM
A
A1
A2
b
c
D
E
E1
e
h
L
L2
DETAIL A
A2
A
DATE 18 MAY 2015
END VIEW
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
--1.75
0.10
0.25
1.25
--0.31
0.51
0.10
0.25
8.65 BSC
6.00 BSC
3.90 BSC
1.27 BSC
0.25
0.41
0.40
1.27
0.25 BSC
GENERIC
MARKING DIAGRAM*
14X
0.76
14
XXXXXXXXXG
AWLYWW
14X
1.52
1
7.00
1
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON30871E
SOIC−14
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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