NCV8774DT33RKG

NCV8774 Ultra Low Iq 350 mA LDO Regulator The NCV8774 is a 350 mA LDO regulator. Its robustness allows NCV8774 to be used in severe automotive environments. Ultra low quiescent current as low as 18 mA typical makes it suitable for applications permanently connected to battery requiring ultra low quiescent current with or without load. This feature is especially critical when modules remain in active mode when ignition is off. The NCV8774 contains protection functions as current limit, thermal shutdown and reverse output current protection. http://onsemi.com MARKING DIAGRAM DPAK−3 DT SUFFIX CASE 369C Features • • • • • • • • Output Voltage Options: 3.3 V and 5 V Output Voltage Accuracy: ±1.5% (TJ = 25°C to 125°C) Output Current up to 350 mA Ultra Low Quiescent Current: typ 18 mA (max 23 mA) Very Wide Range of Cout and ESR Values for Stability Wide Input Voltage Operation Range: up to 40 V Protection Features − Current Limitation − Thermal Shutdown These are Pb−Free Devices xx A WL, L Y WW G See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. Body Control Module Instruments and Clusters Occupant Protection and Comfort Powertrain VBAT Cin 0.1 mF = Voltage Option = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION Typical Applications • • • • 8774xxG ALYWW Vin Vout NCV8774 Vout Cout 1 mF GND Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2013 April, 2013 − Rev. 0 1 Publication Order Number: NCV8774/D NCV8774 Vin Vout Driver With Current Limit − + Thermal Vref Shutdown GND Figure 2. Simplified Block Diagram PIN CONNECTIONS PIN Tab, 1. Vin 2. GND 3. Vout 1 DPAK−3 Figure 3. Pin Connections PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 Vin Description 2, TAB GND Power Supply Ground. 3 Vout Regulated Output Voltage. Connect 1 mF capacitor with ESR < 100 W to ground. Positive Power Supply Input. Connect 0.1 mF capacitor to ground. http://onsemi.com 2 NCV8774 ABSOLUTE MAXIMUM RATINGS Rating Input Voltage (Note 1) Symbol Min Max Unit Vin −0.3 − 40 45 V DC Transient, t < 100 ms Input Current Iin −5 − mA Output Voltage (Note 2) Vout −0.3 5.5 V Output Current Iout −3 Current Limited mA Junction Temperature TJ −40 150 °C Storage Temperature TSTG −55 150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. 5.5 V or (Vin + 0.3 V) (whichever is lower). ESD CAPABILITY (Note 3) Symbol Rating Min Max Unit ESD Capability, Human Body Model ESDHBM −2 2 kV ESD Capability, Machine Model ESDMM −200 200 V ESD Capability, Charged Device Model ESDCDM −1 1 kV Max Unit 3. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) ESD Charge Device Model tested per AEC−Q100−011 (EIA/JESD22−C101) LEAD SOLDERING TEMPERATURE AND MSL (Note 4) Symbol Rating Moisture Sensitivity Level DPAK−3 Min MSL Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions TSLD 1 − − 265 peak °C 4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. THERMAL CHARACTERISTICS (Note 5) Symbol Rating Thermal Characteristics, DPAK−3 Thermal Resistance, Junction−to−Air (Note 6) Thermal Reference, Junction−to−Case (Note 6) Value Unit °C/W 56 8.4 RqJA RYJC 5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. RECOMMENDED OPERATING RANGE (Note 7) Rating Symbol Min Max Unit Input Voltage (Note 8) Vin 4.5 40 V Junction Temperature TJ −40 150 °C 7. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 8. Minimum Vin = 4.5 V or (Vout + VDO), whichever is higher. http://onsemi.com 3 NCV8774 ELECTRICAL CHARACTERISTICS Vin = 13.2 V, Cin = 0.1 mF, Cout = 1 mF, for typical values TJ = 25°C, for min/max values TJ = −40°C to 150°C; unless otherwise noted. (Notes 9 and 10) Parameter Test Conditions Symbol Min Typ Max Unit 3.2505 4.925 (−1.5 %) 3.3 5.0 3.3495 5.075 (+1.5%) 3.234 3.234 4.9 4.9 (−2 %) 3.3 3.3 5.0 5.0 3.366 3.366 5.1 5.1 (+2%) 3.234 4.9 (−2 %) 3.3 5.0 3.366 5.1 (+2%) Regline −20 0 20 mV Regload −35 0 35 mV − − 250 440 500 875 − − 18 − 22 23 REGULATOR OUTPUT Output Voltage (Accuracy %) Output Voltage (Accuracy %) Output Voltage (Accuracy %) Line Regulation Load Regulation Dropout Voltage (Note 11) TJ = 25 °C to 125 °C 3.3 V Vin = 4.5 V to 16 V, Iout = 0.1 mA to 200 mA 5.0 V Vin = 5.575 V to 16 V, Iout = 0.1 mA to 200 mA 3.3 V Vin = 4.5 V to 40 V, Iout = 0.1 mA to 200 mA Vin = 4.5 V to 16 V, Iout = 0.1 mA to 350 mA 5.0 V Vin = 5.6 V to 40 V, Iout = 0.1 mA to 200 mA Vin = 5.975 V to 16 V, Iout = 0.1 mA to 350 mA TJ = −40°C to 125°C 3.3 V Vin = 4.5 V to 28 V, Iout = 0 mA to 350 mA 5.0 V Vin = 5.975 V to 28 V, Iout = 0 mA to 350 mA 3.3 V Vin = 4.5 V to 28 V, Iout = 5 mA 5.0 V Vin = 6 V to 28 V, Iout = 5 mA Iout = 0.1 mA to 350 mA Vout Vout Vout VDO 5.0 V Iout = 200 mA Iout = 350 mA V V V mV QUIESCENT CURRENT Quiescent Current (Iq = Iin − Iout) Iout = 0.1 mA, TJ = 25°C Iout = 0.1 mA to 350 mA, TJ ≤ 125°C Iq mA CURRENT LIMIT PROTECTION Current Limit Vout = 0.96 x Vout_nom ILIM 400 − 1100 mA Short Circuit Current Limit Vout = 0 V ISC 400 − 1100 mA PSRR − 54 − dB Thermal Shutdown Temperature (Note 12) TSD 150 175 195 °C Thermal Shutdown Hysteresis (Note 12) TSH − 25 − °C PSRR Power Supply Ripple Rejection (Note 12) f = 100 Hz, 0.5 Vpp THERMAL SHUTDOWN 9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [ TJ. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V. 12. Values based on design and/or characterization. http://onsemi.com 4 NCV8774 TYPICAL CHARACTERISTICS 100 Vin = 13.2 V Iout = 100 mA 23 Iq, QUIESCENT CURRENT (mA) Iq, QUIESCENT CURRENT (mA) 24 22 21 20 19 18 17 16 15 14 −40 −20 0 20 40 60 80 Iout = 100 mA TJ = 25°C 80 60 40 20 0 100 120 140 160 0 5 10 Figure 4. Quiescent Current vs. Temperature 20 25 30 35 40 Figure 5. Quiescent Current vs. Input Voltage 24 Iq, QUIESCENT CURRENT (mA) 15 Vin, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C) Vin = 13.2 V 23 22 TJ = 150°C 21 20 TJ = −40°C 19 TJ = 25°C 18 17 16 15 14 0 50 100 150 200 250 300 350 IOUT, OUTPUT CURRENT (mA) Figure 6. Quiescent Current vs. Output Current Vin = 13.2 V Iout = 100 mA 5.08 5.05 5.03 3.36 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 5.10 Vin = 13.2 V Iout = 100 mA 3.34 3.32 5.00 4.98 4.95 3.3 3.28 4.93 4.90 −40 −20 0 20 40 60 80 3.26 −40 −20 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) Figure 7. Output Voltage vs. Temperature (5 V Option) Figure 8. Output Voltage vs. Temperature (3.3 V Option) http://onsemi.com 5 NCV8774 TYPICAL CHARACTERISTICS 4.0 6 5 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) Iout = 1 mA 4 3 TJ = 150°C TJ = 25°C 2 1 TJ = −40°C 0 0 2 4 6 8 10 Vin, INPUT VOLTAGE (V) 12 3.0 2.5 2.0 TJ = 150°C 1.5 TJ = 25°C 1.0 TJ = −40°C 0.5 0.0 14 Iout = 1 mA 3.5 0 800 800 700 700 TJ = 150°C 600 500 400 TJ = 25°C 300 200 TJ = −40°C 100 0 0 50 100 150 200 250 300 4 6 8 10 Vin, INPUT VOLTAGE (V) 12 14 Figure 10. Output Voltage vs. Input Voltage (3.3 V Option) VDO, DROPOUT VOLTAGE (mV) VDO, DROPOUT VOLTAGE (mV) Figure 9. Output Voltage vs. Input Voltage (5 V Option) 2 Iout = 350 mA 600 500 400 Iout = 200 mA 300 200 100 0 −40 −20 350 Iout, OUTPUT CURRENT (mA) 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) Figure 12. Dropout vs. Temperature (5 V Option) Figure 11. Dropout vs. Output Current (5 V Option) http://onsemi.com 6 NCV8774 TYPICAL CHARACTERISTICS 800 TJ = 25°C ILIM, ISC, CURRENT LIMIT (mA) ILIM, ISC, CURRENT LIMIT (mA) 700 ISC @ Vout = 0 V 600 ILIM @ Vout = 4.8 V 500 400 300 200 0 5 10 15 20 25 30 Vin, INPUT VOLTAGE (V) 35 TJ = 25°C 700 600 ISC @ Vout = 0 V 500 ILIM @ Vout = 3.17 V 400 300 200 100 0 40 0 Figure 13. Output Current Limit vs. Input Voltage (5 V Option) ILIM, ISC, CURRENT LIMIT (mA) ISC @ Vout = 0 V ILIM @ Vout = 4.8 V 550 500 −40 −20 0 20 40 60 80 15 20 25 30 Vin, INPUT VOLTAGE (V) 35 40 700 650 600 10 Figure 14. Output Current Limit vs. Input Voltage (3.3 V Option) Vin = 13.2 V Vin = 13.2 V 650 600 ISC @ Vout = 0 V ILIM @ Vout = 3.17 V 550 500 −40 −20 100 120 140 160 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 15. Output Current Limit vs. Temperature (5 V Option) Figure 16. Output Current Limit vs. Temperature (3.3 V Option) 100 ESR, STABILITY REGION (W) ILIM, ISC, CURRENT LIMIT (mA) 700 5 Vin = 13.2 V TJ = −40°C to 150°C Cout = 1 mF − 100 mF 10 1 STABLE REGION 0.1 0.01 0 50 100 150 200 250 300 350 Iout, OUTPUT CURRENT (mA) Figure 17. Cout ESR Stability Region vs. Output Current http://onsemi.com 7 NCV8774 TYPICAL CHARACTERISTICS TJ = 25°C Iout = 1 mA Cout = 10 mF trise/fall = 1 ms (Vin) 14.2 V Vin (1 V/div) 13 V Vin (1 V/div) TJ = 25°C Iout = 1 mA Cout = 10 mF trise/fall = 1 ms (Vin) 13 V 12.2 V 12.2 V 3.4 V 5.16 V Vout (100 mV/div) 5V Vout (100 mV/div) 4.95 V 3.28 V TIME (1 ms/div) TJ = 25°C Vin = 13.2 V Cout = 10 mF trise/fall = 1 ms (Iout) Iout (50 mA/div) TIME (100 ms/div) 14.2 V Figure 18. Line Transients (5 V Option) 100 mA 3.24 V Figure 19. Line Transients (3.3 V Option) TJ = 25°C Vin = 13.2 V Cout = 10 mF trise/fall = 1 ms (Iout) 100 mA Iout (50 mA/div) 0.1 mA 0.1 mA 3.42 V 5.15 V 3.3 V 5V Vout (100 mV/div) Vout (100 mV/div) 4.88 V 3.11 V TIME (50 ms/div) TIME (50 ms/div) Figure 20. Load Transients (5 V Option) Figure 21. Load Transients (3.3 V Option) TJ = 25°C Iout = 1 mA Cout = 10 mF TJ = 25°C Iout = 1 mA Cout = 10 mF Vin (5 V/div) Vin (5 V/div) Vout (2 V/div) Vout (2 V/div) TIME (100 ms/div) TIME (100 ms/div) Figure 22. Power Up/Down Response (5 V Option) Figure 23. Power Up/Down Response (3.3 V Option) http://onsemi.com 8 NCV8774 TYPICAL CHARACTERISTICS 100 80 80 70 60 60 50 50 40 40 30 30 20 20 10 10 100 1000 10000 100000 0 10 100 1000 10000 f, FREQUENCY (Hz) f, FREQUENCY (Hz) Figure 24. PSRR vs. Frequency (5 V Option) Figure 25. PSRR vs. Frequency (3.3 V Option) 5000 TJ = 25°C Vin = 13.2 V Cout = 1 mF Iout = 350 mA 4500 NOISE DENSITY (nV/√Hz) 0 10 TJ = 25°C Vin = 13.2 V $ 0.5 Vpp Cout = 1 mF Iout = 1.0 mA 90 PSRR (dB) 70 PSRR (dB) 100 TJ = 25°C Vin = 13.2 V $ 0.5 Vpp Cout = 1 mF Iout = 1.0 mA 90 4000 3500 3000 2500 2000 1500 1000 500 0 10 100 1000 10000 f, FREQUENCY (Hz) Figure 26. Noise vs. Frequency http://onsemi.com 9 100000 100000 NCV8774 DEFINITIONS General Current Limit and Short Circuit Current Limit All measurements are performed using short pulse low duty cycle techniques to maintain junction temperature as close as possible to ambient temperature. Current Limit is value of output current by which output voltage drops below 96% of its nominal value. Short Circuit Current Limit is output current value measured with output of the regulator shorted to ground. Output voltage The output voltage parameter is defined for specific temperature, input voltage and output current values or specified over Line, Load and Temperature ranges. PSRR Power Supply Rejection Ratio is defined as ratio of output voltage and input voltage ripple. It is measured in decibels (dB). Line Regulation The change in output voltage for a change in input voltage measured for specific output current over operating ambient temperature range. Line Transient Response Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope. Load Regulation The change in output voltage for a change in output current measured for specific input voltage over operating ambient temperature range. Load Transient Response Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between low−load and high−load conditions. Dropout Voltage The input to output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. It is measured when the output drops 100 mV below its nominal value. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Quiescent and Disable Currents Maximum Package Power Dissipation Quiescent Current (Iq) is the difference between the input current (measured through the LDO input pin) and the output load current. The power dissipation level is maximum allowed power dissipation for particular package or power dissipation at which the junction temperature reaches its maximum operating value, whichever is lower. Thermal Protection http://onsemi.com 10 NCV8774 APPLICATIONS INFORMATION The NCV8774 regulator is self−protected with internal thermal shutdown and internal current limit. Typical characteristics are shown in Figures 4 to 26. Since TJ is not recommended to exceed 150°C, then the NCV8774 soldered on 645 mm2, 1 oz copper area, FR4 can dissipate up to 2.35 W when the ambient temperature (TA) is 25°C. See Figure 27 for RqJA versus PCB area. The power dissipated by the NCV8774 can be calculated from the following equations: Input Decoupling (Cin) A ceramic or tantalum 0.1 mF capacitor is recommended and should be connected close to the NCV8774 package. Higher capacitance and lower ESR will improve the overall line and load transient response. If extremely fast input voltage transients are expected then appropriate input filter must be used in order to decrease rising and/or falling edges below 50 V/ms for proper operation. The filter can be composed of several capacitors in parallel. P D + V inǒI q@I outǓ ) I outǒV in * V outǓ or V in(max) + NOTE: P D(max) ) ǒV out I outǓ I out ) I q (eq. 3) Items containing Iq can be neglected if Iout >> Iq. 100 RqJA, THERMAL RESISTANCE (°C/W) Output Decoupling (Cout) The NCV8774 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. Stability region of ESR vs Output Current is shown in Figure 17. The minimum output decoupling value is 1 mF and can be augmented to fulfill stringent load transient requirements. The regulator works with ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. Thermal Considerations As power in the NCV8774 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCV8774 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCV8774 can handle is given by: P D(max) + (eq. 2) ƪTJ(max) * TAƫ 90 80 70 DPAK 1 oz 60 DPAK 2 oz 50 40 0 100 200 300 400 500 600 COPPER HEAT SPREADER (mm2) 700 Figure 27. Thermal Resistance vs. PCB Copper Area Hints Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCV8774 and make traces as short as possible. (eq. 1) R qJA ORDERING INFORMATION Output Voltage Marking Package Shipping† NCV8774DT50RKG 5.0 V 877450G DPAK−3 (Pb−Free) 2500 / Tape & Reel NCV8774DT33RKG 3.3 V 877433G DPAK−3 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 11 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C ISSUE F 4 1 2 DATE 21 JUL 2015 3 SCALE 1:1 A E b3 C A B c2 4 L3 Z D 1 L4 2 3 NOTE 7 b2 e c SIDE VIEW b 0.005 (0.13) TOP VIEW H DETAIL A M BOTTOM VIEW C Z H L2 GAUGE PLANE C L L1 DETAIL A Z SEATING PLANE BOTTOM VIEW A1 ALTERNATE CONSTRUCTIONS ROTATED 905 CW STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR STYLE 6: PIN 1. MT1 2. MT2 3. GATE 4. MT2 STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN STYLE 7: PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 8: PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE STYLE 4: PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE STYLE 9: STYLE 10: PIN 1. ANODE PIN 1. CATHODE 2. CATHODE 2. ANODE 3. RESISTOR ADJUST 3. CATHODE 4. CATHODE 4. ANODE SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.028 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.114 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.72 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.90 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− GENERIC MARKING DIAGRAM* XXXXXXG ALYWW AYWW XXX XXXXXG IC Discrete = Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. 6.17 0.243 SCALE 3:1 DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z XXXXXX A L Y WW G 3.00 0.118 1.60 0.063 STYLE 5: PIN 1. GATE 2. ANODE 3. CATHODE 4. ANODE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON10527D DPAK (SINGLE GAUGE) Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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