NTGS3447PT1G

NTGS3447P Power MOSFET -12 V, -5.3 A, Single P-Channel, TSOP-6 Features • Low RDS(on) in TSOP-6 Package • 1.8 V Gate Rating • This is a Pb-Free Device Applications V(BR)DSS http://onsemi.com RDS(on) MAX 40 mW @ -4.5 V -12 V 53 mW @ -2.5 V 72 mW @ -1.8 V P-Channel Value -12 $8 -4.7 -3.4 -5.3 PD 1.25 1.6 W 4 Unit V V A 3 1256 ID MAX -4.7 A -4.1 A -2.0 A • Battery Switch and Load Management Applications in Portable • • Equipment High Side Load Switch PA Switch MAXIMUM RATINGS (TJ = 25°C unless otherwise stated) Parameter Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current (Note 1) Steady State tv5s Power Dissipation (Note 1) Steady State tv5s Continuous Drain Current (Note 2) Power Dissipation (Note 2) Pulsed Drain Current Steady State TA = 25°C TA = 85°C TA = 25°C tp = 10 ms PD IDM TJ, TSTG TL ID TA = 25°C TA = 85°C TA = 25°C TA = 25°C Symbol VDSS VGS ID MARKING DIAGRAM TSOP-6 CASE 318G STYLE 1 1 SE = Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) -3.4 -2.5 0.7 -19 -55 to 150 260 A 1 SE MG G W A °C °C Operating Junction and Storage Temperature Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) PIN ASSIGNMENT Drain Drain Source 654 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surface-mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces) 2. Surface-mounted on FR4 board using the minimum recommended pad size. 1 2 3 Drain Drain Gate ORDERING INFORMATION Device NTGS3447PT1G Package TSOP-6 (Pb-Free) Shipping† 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2007 1 August, 2007 - Rev. 0 Publication Order Number: NTGS3447P/D NTGS3447P THERMAL RESISTANCE MAXIMUM RATINGS Parameter Junction-to-Ambient – Steady State (Note 3) Junction-to-Ambient – t v 5 s (Note 3) Junction-to-Ambient – Minimum Pad (Note 4) Symbol RqJA RqJA RqJA Value 100 78 188 °C/W Unit 3. Surface-mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces) 4. Surface-mounted on FR4 board using the minimum recommended pad size (Cu area = 0.0775 in sq). ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage Zero Gate Voltage Drain Current V(BR)DSS IDSS IGSS VGS = 0 V, ID = -250 mA VGS = 0 V, VDS = -12 V TJ = 25°C TJ = 85°C -12 -1.0 -5.0 $0.1 mA V mA Symbol Test Condition Min Typ Max Unit Gate-to-Source Leakage Current ON CHARACTERISTICS (Note 5) Gate Threshold Voltage Drain-to-Source On Resistance VDS = 0 V, VGS = ±8 V VGS = VDS, ID = -250 mA VGS = -4.5 V, ID = -4.7 A VGS = -2.5 V, ID = -4.1 A VGS = -1.8 V, ID = -2.0 A VGS(TH) RDS(on) -0.45 30 40 53 12 -1.0 40 53 72 V mW Forward Transconductance gFS VDS = -5 V, ID = -4.7 A S CHARGES, CAPACITANCES AND GATE RESISTANCE Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Threshold Gate Charge Gate-to-Source Charge Gate-to-Drain Charge CISS COSS CRSS QG(TOT) QG(TH) QGS QGD VGS = -4.5 V, VDS = -6 V; ID = -4.7 A VGS = 0 V, f = 1 MHz, VDS = -6 V 1053 254 129 10.4 1.0 1.7 0.4 15 nC pF SWITCHING CHARACTERISTICS, VGS = 4.5 V (Note 6) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time DRAIN-SOURCE DIODE CHARACTERISTICS Forward Diode Voltage Reverse Recovery Time VSD tRR VGS = 0 V, IS = -1.7 A TJ = 25°C -0.7 33 -1.2 66 V ns td(ON) tr td(OFF) tf VGS = -4.5 V, VDS = -6 V, ID = -1.0 A, RG = 6.0 W 7 14 78 47 11 22 117 71 ns VGS = 0 V, dISD/dt = 100 A/ms, IS = -1.7 A 5. Pulse Test: pulse width v 300 ms, duty cycle v 2% 6. Switching characteristics are independent of operating junction temperatures http://onsemi.com 2 NTGS3447P TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) 20 -ID, DRAIN CURRENT (AMPS) VGS = -4.5 V -2.5 V -2 V -1.8 V TJ = 25°C -ID, DRAIN CURRENT (AMPS) 20 VDS = 5 V 15 16 12 10 8 -1.5 V 4 5 TJ = 25°C TJ = 125°C 0 0 1 2 3 4 5 -VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) 0 0.5 TJ = -55°C 1.5 2 2.5 1 -VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) Figure 1. On-Region Characteristics RDS(on), DRAIN-TO-SOURCE RESISTANCE (W) RDS(on), DRAIN-TO-SOURCE RESISTANCE (W) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 1 1.5 2 2.5 3 3.5 4 4.5 5 -VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) ID = -4.7 A TJ = 25°C 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0 Figure 2. Transfer Characteristics TJ = 25°C -1.8 V -2 V VGS = -2.5 V VGS = -4.5 V 4 8 12 16 20 -ID, DRAIN CURRENT (AMPS) Figure 3. On-Resistance vs. Gate-to-Source Voltage 1.5 RDS(on), DRAIN-TO-SOURCE RESISTANCE (NORMALIZED) 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 -50 -25 0 25 50 75 100 125 150 ID = -4.7 A VGS = -4.5 V C, CAPACITANCE (pF) 1600 1400 1200 1000 800 600 400 200 0 Figure 4. On-Resistance vs. Drain Current and Gate Voltage Ciss VGS = 0 V TJ = 25°C f = 1 MHz Coss Crss 0 2 4 6 8 10 12 TJ, JUNCTION TEMPERATURE (°C) DRAIN-TO-SOURCE VOLTAGE (VOLTS) Figure 5. On-Resistance Variation with Temperature Figure 6. Capacitance Variation http://onsemi.com 3 NTGS3447P TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) -V GS, GATE-TO-SOURCE VOLTAGE (VOLTS) 5 QT 4 VGS 3 VDS 6 2 QGS QGD 4 1 0 0 2 4 6 8 10 QG, TOTAL GATE CHARGE (nC) VDS = -6.0 V ID = -4.7 A TJ = 25°C 2 0 10 8 12 20 -IS, SOURCE CURRENT (AMPS) VGS = 0 V 10 -V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS) TJ = 150°C TJ = 25°C 1.0 0.0 0.2 0.6 1.0 0.4 0.8 1.2 -VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS) Figure 7. Gate-to-Source and Drain-to-Source Voltage vs. Total Charge Figure 8. Diode Forward Voltage vs. Current 0.8 ID = -250 mA 0.7 0.6 -VGS(th) (V) 0.5 0.4 0.3 0.2 -50 POWER (WATTS) -25 0 25 50 75 100 125 150 60 50 40 30 20 10 0 0.001 0.01 0.1 1 10 100 1000 TJ, JUNCTION TEMPERATURE (°C) SINGLE PULSE TIME (s) Figure 9. Threshold Voltage Figure 10. Single Pulse Maximum Power Dissipation 100 -ID, DRAIN CURRENT (A) 10 100 ms 1 ms 1 10 ms VGS = 8.0 V SINGLE PULSE 0.1 TC = 25°C dc RDS(on) LIMIT Thermal Limit Package Limit 0.01 0.1 1 10 -VDS, DRAIN-TO-SOURCE VOLTAGE (V) 100 Figure 11. Maximum Rated Forward Biased Safe Operating Area http://onsemi.com 4 NTGS3447P R(t), EFFECTIVE TRANSIENT THERMAL RESPONSE NORMALIZED (°C/W) 1 50% Duty Cycle 20% 0.1 10% 5% 2% 1% 0.01 t1 Single Pulse t2 DUTY CYCLE, D = t1/t2 0.0001 0.001 0.01 0.1 PULSE TIME (s) 1 10 100 1000 P(pk) Test Type = 1 sq in 2 oz RqJA = 1 sq in 2 oz 0.001 0.000001 0.00001 Figure 12. FET Thermal Response http://onsemi.com 5 NTGS3447P PACKAGE DIMENSIONS TSOP-6 CASE 318G-02 ISSUE S D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.014 0.007 0.118 0.059 0.037 0.016 0.108 MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° 6 5 1 2 4 HE E 3 b e q 0.05 (0.002) A1 A L c SOLDERING FOOTPRINT* 2.4 0.094 STYLE 1: PIN 1. DRAIN 2. DRAIN 3. GATE 4. SOURCE 5. DRAIN 6. DRAIN 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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