Jitter Attenuator
ICS874003D-02
PRODUCT DISCONTINUATION NOTICE - LAST TIME BUY EXPIRES SEPTEMBER 7, 2016
DATA SHEET
General Description
Features
The ICS874003D-02 is a high performance Differential-to-LVDS
Jitter Attenuator. In some PCI Express systems, such as those found
in desktop PCs, the PCI Express clocks are generated from a low
bandwidth, high phase noise PLL frequency synthesizer. In these
systems, a jitter attenuator may be required to attenuate high
frequency random and deterministic jitter components from the PLL
synthesizer and from the system board. The ICS874003D-02 has a
bandwidth of 3MHz. The 3MHz provides an intermediate bandwidth
that can easily track triangular spread profiles, while providing good
jitter attenuation.
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•
•
Three differential LVDS output pairs
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•
•
•
•
•
•
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Input frequency range: 98MHz to 128MHz
The ICS874003D-02 uses IDT’s 3rd Generation FemtoClock® PLL
technology to achieve the lowest possible phase noise. The device is
packaged in a 20-Lead TSSOP package, making it ideal for use in
space constrained applications such as PCI Express add-on cards.
One differential clock input
CLK, nCLK can accept the following differential input levels:
LVPECL, LVDS, HCSL
Output frequency range: 98MHz to 320MHz
VCO range: 490MHz - 640MHz
Cycle-to-Cycle jitter: 30ps (maximum)
3MHz PLL loop bandwidth
0°C to 70°C ambient operating temperature
Full 3.3V operating supply
Lead-free (RoHS 6) packaging
For drop-in replacement use 874003AG-02
Pin Assignment
F_SEL[2:0] Function Table
Inputs
Outputs
F_SEL2
F_SEL1
F_SEL0
QA[0:1],
nQA[0:1]
QB0, nQB0
0
0
0
÷2 (default)
÷2 (default)
1
0
0
÷5
÷2
0
1
0
÷4
÷2
1
1
0
÷2
÷4
0
0
1
÷2
÷5
1
0
1
÷5
÷4
0
1
1
÷4
÷5
1
1
1
÷4
÷4
ICS874003DG-02 REVISION A MARCH 11, 2016
QA1
VDDO
QA0
nQA0
MR
F_SEL0
nc
VDDA
F_SEL1
VDD
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
nQA1
VDDO
QB0
nQB0
F_SEL2
OEB
GND
nCLK
CLK
OEA
ICS874003D-02
20-Lead TSSOP
6.5mm x 4.4mm x 0.925mm package body
G Package
Top View
1
©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Block Diagram
OEA
F_SEL2:0
Pullup
Pulldown
3
QA0
÷5
÷4
÷2 (default)
nQA0
QA1
CLK
nCLK
Pulldown
Pullup
Phase
Detector
VCO
nQA1
490 - 640MHz
3
÷5
÷4
÷2 (default)
M = ÷5 (fixed)
MR
OEB
QB0
nQB0
Pulldown
Pullup
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Pin Description and Pin Characteristic Tables
Table 1. Pin Descriptions
Number
Name
Type
Description
1, 20
QA1, nQA1
Output
Differential output pair. LVDS interface levels.
2, 19
VDDO
Power
Output supply pins.
3, 4
QA0, nQA0
Output
Differential output pair. LVDS interface levels.
5
MR
Input
Pulldown
Active HIGH Master Reset. When logic HIGH, the internal dividers are reset
causing the true outputs (Qx) to go low and the inverted outputs (nQx) to go
high. When logic LOW, the internal dividers and the outputs are enabled.
LVCMOS/LVTTL interface levels.
6,
9,
16
F_SEL0,
F_SEL1,
F_SEL2
Input
Pulldown
Frequency select pin for QAx, nQAx and QB0, nQB0 outputs.
LVCMOS/LVTTL interface levels.
7
nc
Unused
8
VDDA
Power
Analog supply pin.
10
VDD
Power
Core supply pin.
11
OEA
Input
Pullup
12
CLK
Input
Pulldown
13
nCLK
Input
Pullup
14
GND
Power
15
OEB
Input
17, 18
nQB0, QB0
Output
No connect.
Output enable pin for QAx pins. When HIGH, the QAx, nQAx outputs are
active. When LOW, the QAx, nQAx outputs are in a high impedance state.
LVCMOS/LVTTL interface levels.
Non-inverting differential clock input.
Inverting differential clock input.
Power supply ground.
Pullup
Output enable pin for QB0 pins. When HIGH, the QB0, nQB0 outputs are
active. When LOW, the QB0, nQB0 outputs are in a high impedance state.
LVCMOS/LVTTL interface levels.
Differential output pair. LVDS interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
k
RPULLDOWN
Input Pulldown Resistor
51
k
Function Table
Table 3. Output Enable Function Table
Inputs
Outputs
OEA
OEB
QA[0:1], nQA[0:1]
QB0, nQB0
0
0
Hi-Impedance
Hi-Impedance
1
1
Enabled
Enabled
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress
specifications only. Functional operation of the product at these conditions or any conditions beyond those listed in the DC Characteristics or
AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Item
Rating
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5V
Outputs, IO
Continuous Current
Surge Current
10mA
15mA
Package Thermal Impedance, JA
86.7°C/W (0 mps)
Storage Temperature, TSTG
-65C to 150C
DC Electrical Characteristics
Table 4A. LVDS Power Supply DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VDD
Core Supply Voltage
3.135
3.3
3.465
V
VDDA
Analog Supply Voltage
VDD – 0.15
3.3
VDD
V
VDDO
Output Supply Voltage
3.135
3.3
3.465
V
IDD
Power Supply Current
80
mA
IDDA
Analog Supply Current
15
mA
IDDO
Output Supply Current
75
mA
Maximum
Units
Table 4B. LVCMOS/LVTTL DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
VIH
Input High Voltage
2
VDD + 0.3
V
VIL
Input Low Voltage
-0.3
0.8
V
IIH
Input High
Current
IIL
Input Low
Current
OEA, OEB
VDD = VIN = 3.465V
5
µA
MR,
F_SEL[2:0]
VDD = VIN = 3.465V
150
µA
OEA, OEB
VDD = 3.465V, VIN = 0V
-150
µA
MR,
F_SEL[2:0]
VDD = 3.465V, VIN = 0V
-5
µA
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Table 4C. Differential DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
Test Conditions
IIH
Input High
Current
IIL
Input Low
Current
VPP
Peak-to-Peak Voltage;
NOTE 1
VCMR
Common Mode Input
Voltage; NOTE 1, 2
Minimum
Typical
Maximum
Units
CLK
VDD = VIN = 3.465V
150
µA
nCLK
VDD = VIN = 3.465V
5
µA
CLK
VDD = 3.465V, VIN = 0V
-5
µA
nCLK
VDD = 3.465V, VIN = 0V
-150
µA
0.15
1.3
V
GND + 0.5
VDD – 0.85
V
NOTE 1: VIL should not be less than -0.3V.
NOTE 2: Common mode input voltage is defined as VIH.
Table 4D. LVDS DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
VOD
Differential Output Voltage
VOD
VOD Magnitude Change
VOS
Offset Voltage
VOS
VOS Magnitude Change
Test Conditions
Minimum
Typical
Maximum
Units
275
375
485
mV
50
mV
1.5
V
50
mV
Maximum
Units
320
MHz
1.2
1.35
Table 5. AC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
fOUT
Output Frequency
Test Conditions
Minimum
tjit(cc)
Cycle-to-Cycle Jitter; NOTE 1
30
ps
tsk(o)
Output Skew; NOTE 2, 3
185
ps
98
tsk(b)
Bank Skew; NOTE 1, 4
Bank A
tR / tF
Output Rise/Fall Time
20% to 80%
odc
Output Duty Cycle
Typical
65
ps
250
700
ps
47
53
%
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium
has been reached under these conditions.
NOTE 1: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential crosspoints.
NOTE 3: These parameters are guaranteed by characterization. Not tested in production.
NOTE 4: Defined as skew within a bank of outputs at the same voltage and with equal load conditions.
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Parameter Measurement Information
VDD
3.3V ±5%
VDD,
VDDO
nCLK
VDDA
V
V
Cross Points
PP
CMR
CLK
GND
Differential Input Level
3.3V LVDS Output Load Test Circuit
nQA0
nQA[0:1],
nQB0
QA0
QA[0:1],
QB0
nQA1
tcycle n
tcycle n+1
tjit(cc) = |tcycle n – tcycle n+1|
1000 Cycles
QA1
tsk(b)
Cycle-to-Cycle Jitter
Bank Skew
nQx
nQA[0:1],
nQB0
Qx
QA[0:1],
QB0
nQy
Qy
Output Duty Cycle/Pulse Width/Period
Output Skew
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Parameter Measurement Information, continued
nQA[0:1],
nQB0
80%
80%
VOD
QA[0:1],
QB0
20%
20%
tR
tF
Output Rise/Fall Time
Offset Voltage Setup
Differential Output Voltage Setup
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Applications Information
Wiring the Differential Input to Accept Single-Ended Levels
Figure 1 shows how a differential input can be wired to accept single
ended levels. The reference voltage V1= VCC/2 is generated by the
bias resistors R1 and R2. The bypass capacitor (C1) is used to help
filter noise on the DC bias. This bias circuit should be located as close
to the input pin as possible. The ratio of R1 and R2 might need to be
adjusted to position the V1in the center of the input voltage swing. For
example, if the input clock swing is 2.5V and VCC = 3.3V, R1 and R2
value should be adjusted to set V1 at 1.25V. The values below are for
when both the single ended swing and VCC are at the same voltage.
This configuration requires that the sum of the output impedance of
the driver (Ro) and the series resistance (Rs) equals the transmission
line impedance. In addition, matched termination at the input will
attenuate the signal in half. This can be done in one of two ways.
First, R3 and R4 in parallel should equal the transmission line
impedance. For most 50 applications, R3 and R4 can be 100. The
values of the resistors can be increased to reduce the loading for
slower and weaker LVCMOS driver. When using single-ended
signaling, the noise rejection benefits of differential signaling are
reduced. Even though the differential input can handle full rail
LVCMOS signaling, it is recommended that the amplitude be
reduced. The datasheet specifies a lower differential amplitude,
however this only applies to differential signals. For single-ended
applications, the swing can be larger, however VIL cannot be less
than -0.3V and VIH cannot be more than VCC + 0.3V. Though some
of the recommended components might not be used, the pads
should be placed in the layout. They can be utilized for debugging
purposes. The datasheet specifications are characterized and
guaranteed by using a differential signal.
Figure 1. Recommended Schematic for Wiring a Differential Input to Accept Single-ended Levels
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Differential Clock Input Interface
The CLK /nCLK accepts LVDS, LVPECL, HCSL and other differential
signals. The differential signal must meet the VPP and VCMR input
requirements. Figures 2A to 2D show interface examples for the
CLK/nCLK input driven by the most common driver types. The input
interfaces suggested here are examples only. Please consult with the
vendor of the driver component to confirm the driver termination
requirements.
Figure 2A. CLK/nCLK Input Driven by a
3.3V LVPECL Driver
Figure 2B. CLK/nCLK Input Driven by a
3.3V LVPECL Driver
3.3V
3.3V
*R3
CLK
nCLK
HCSL
*R4
Differential
Input
Figure 2D. CLK/nCLK Input Driven by a 3.3V LVDS Driver
Figure 2C. CLK/nCLK Input Driven by a
3.3V HCSL Driver
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Recommendations for Unused Input and Output Pins
Inputs:
Outputs:
LVCMOS Control Pins
LVDS Outputs
All control pins have internal pullup or pulldown resistors; additional
resistance is not required but can be added for additional protection.
A 1k resistor can be used.
All unused LVDS output pairs can be either left floating or terminated
with 100 across. If they are left floating, there should be no trace
attached.
LVDS Driver Termination
For a general LVDS interface, the recommended value for the
termination impedance (ZT) is between 90 and 132. The actual
value should be selected to match the differential impedance (Z0) of
your transmission line. A typical point-to-point LVDS design uses a
100 parallel resistor at the receiver and a 100 differential
transmission-line environment. In order to avoid any
transmission-line reflection issues, the components should be
surface mounted and must be placed as close to the receiver as
possible. IDT offers a full line of LVDS compliant devices with two
types of output structures: current source and voltage source. The
LVDS
Driver
standard termination schematic as shown in Figure 3A can be used
with either type of output structure. Figure 3B, which can also be
used with both output types, is an optional termination with center tap
capacitance to help filter common mode noise. The capacitor value
should be approximately 50pF. If using a non-standard termination, it
is recommended to contact IDT and confirm if the output structure is
current source or voltage source type. In addition, since these
outputs are LVDS compatible, the input receiver’s amplitude and
common-mode input range should be verified for compatibility with
the output.
ZO ZT
ZT
LVDS
Receiver
Figure 3A. Standard Termination
LVDS
Driver
ZO ZT
C
ZT
2 LVDS
ZT Receiver
2
Figure 3B. Optional Termination
LVDS Termination
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Schematic Layout
Figure 4 shows an example of ICS874003D-02 application
schematic. This example focuses on functional connections and is
not configuration specific. In this example, the device is operated at
VDD = VDDO = 3.3V. Refer to the pin description and functional tables
in the datasheet to ensure the logic control inputs are properly set.
For the LVDS output drivers, two termination examples are shown in
the schematic.
possible.This is represented by the placement of these capacitors in
the schematic. If space is limited, the ferrite beads, 10µF and 0.1µF
capacitor connected to the board supplies can be placed on the
opposite side of the PCB. If space permits, place all filter components
on the device side of the board.
Power supply filter recommendations are a general guideline to be
used for reducing external noise from coupling into the devices. The
filter performance is designed for a wide range of noise frequencies.
This low-pass filter starts to attenuate noise at approximately 10 kHz.
If a specific frequency noise component is known, such as switching
power supplies frequencies, it is recommended that component
values be adjusted and if required, additional filtering be added.
Additionally, good general design practices for power plane voltage
stability suggests adding bulk capacitance in the local area of all
devices.
As with any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance,
power supply isolation is required. The ICS874003D-02 provides
separate VDD, VDDA and VDDO power supplies to isolate any high
switching noise from coupling into the internal oscillator. In order to
achieve the best possible filtering, it is highly recommended that the
0.1uF capacitors on the device side of the ferrite beads be placed on
the device side of the PCB as close to the power pins as
QA0
Logic Contr ol Input Exam ples
Zo = 50 Ohm
V DD
Set Logic
Input to
'1'
RU1
1K
+
Set Logic
Input to
'0'
VD D
R1
1 00
-
R U2
N ot In s ta ll
nQA 0
Zo = 50 Ohm
To Logic
Input
pins
VD D O
To Logic
Input
pins
RD1
N ot I n st a ll
QA1
nQA1
VD D O
R D2
1K
U1
MR
F_S EL 0
R2
V DD A
F_S EL 1
10
C1
0. 1u F
C2
1 0uF
QA1
VD D O
QA0
nQA 0
MR
F_ SEL0
nc
VD D A
F_ SEL1
VD D
n Q A1
V DD O
QB0
n Q B0
F_ SE L2
OE B
GN D
n C LK
C LK
OE A
20
19
18
17
16
15
14
13
12
11
1
3.3 V
B LM1 8BB2 21SN 1
C5
0. 1u F
C4
0.1uF
1
2
3
4
5
6
7
8
9
10
FB 1
2
C9
10u F
C8
0 . 1uF
V DD O
QB0
n QB0
F _S EL2
OEB
GN D
OEA
Zo = 5 0 Oh m
C7
0 . 1uF
V DD
R4
50
3.3 V
1
FB2
2
C LK
BLM18 BB 22 1SN 1
C1 0
0 .1 uF
+
Zo = 50 Ohm
C6
1 0uf
Zo = 50 Ohm
C3
0.1u F
R5
50
-
nCLK
LVPE C L D ri v er
R6
50
R7
50
R8
50
Zo = 5 0 Oh m
Alternate
LVDS
Termination
Figure 4. ICS874003D-02 Schematic Layout
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS874003D-02.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS74003D-02 is the sum of the core power plus the analog power plus the power dissipated due to the
load. The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
•
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (80mA + 15mA) = 329.175mW
•
Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 75mA = 259.87mW
Total Power_MAX = 329.175mW + 259.87mW = 589.045mW
•
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 86.7°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.589W * 86.7°C/W = 121.1°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance JA for 20-Lead TSSOP, Forced Convection
JA by Velocity
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
ICS874003DG-02 REVISION A MARCH 11, 2016
0
1
2.5
86.7°C/W
82.4°C/W
80.2°C/W
12
©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Reliability Information
Table 7. JA vs. Air Flow Table for a 20-Lead TSSOP
JA by Velocity
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
86.7°C/W
82.4°C/W
80.2°C/W
Transistor Count
The transistor count for ICS874003D-02 is: 1408
Package Outline and Package Dimensions
Package Outline - G Suffix for 20-Lead TSSOP
Table 8. Package Dimensions
Symbol
N
A
A1
A2
b
c
D
E
E1
e
L
aaa
All Dimensions in Millimeters
Minimum
Maximum
20
1.20
0.05
0.15
0.80
1.05
0.19
0.30
0.09
0.20
6.40
6.60
6.40 Basic
4.30
4.50
0.65 Basic
0.45
0.75
0°
8°
0.10
Reference Document: JEDEC Publication 95, MO-153
ICS874003DG-02 REVISION A MARCH 11, 2016
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©2016 Integrated Device Technology, Inc.
ICS874003D-02 Data Sheet
JITTER ATTENUATOR
Ordering Information
Table 9. Ordering Information
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
874003DG-02LF
ICS74003D02L
“Lead-Free” 20-Lead TSSOP
Tube
0C to 70C
874003DG-02LFT
ICS74003D02L
“Lead-Free” 20-Lead TSSOP
Tape & Reel
0C to 70C
Revision History
3/11/16
Product Discontinuation Notice - Last time buy expires September 7, 2016.
PDN N-16-02
ICS874003DG-02 REVISION A MARCH 11, 2016
14
©2016 Integrated Device Technology, Inc.
ICS874003D-04 Data Sheet
JITTER ATTENUATOR
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800-345-7015 (inside USA)
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Fax: 408-284-2775
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+480-763-2056
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document,
including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the
suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any
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(Rev.1.0 Mar 2020)
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