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8T49N205A-999NLGI

8T49N205A-999NLGI

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    VFQFN-40

  • 描述:

    IC FREQ TRANSLATOR 40VFQFPN

  • 数据手册
  • 价格&库存
8T49N205A-999NLGI 数据手册
FemtoClock® NG Universal Frequency Translator with Phase Build-Out General Description Features The IDT8T49N205I is a highly flexible FemtoClock® NG general purpose, low phase noise Frequency Translator / Synthesizer with Phase Build-Out (PBO) suitable for networking and communications applications. It is able to generate any output frequency in the 0.98MHz - 312.5MHz range and most output frequencies in the 312.5MHz - 1,300MHz range (see Table 3 for details). A wide range of input reference clocks and a range of low-cost fundamental mode crystal frequencies may be used as the source for the output frequency. • • • Applications: PCI Express, Computing, General Purpose Translates any input clock in the 16MHz - 710MHz frequency range into any supported output frequency. This mode has a high PLL loop bandwidth in order to track input reference changes, such as Spread-Spectrum Clock modulation, so it will not attenuate much jitter on the input reference. RMS phase jitter at 155.52MHz, using a 40MHz crystal (12kHz - 20MHz): 378fs (typical), Low Bandwidth Mode (FracN) • Output supply voltage modes: VCC/VCCA/VCCO 3.3V/3.3V/3.3V 3.3V/3.3V/2.5V 2.5V/2.5V/2.5V • -40°C to 85°C ambient operating temperature VEE OE1 30 29 28 27 26 25 24 23 22 21 20 nc nc 32 19 nc LF0 33 18 S_A0 LF1 34 17 S_A1 16 CONFIG 15 SCLK 40 Lead VFQFN 35 6mm x 6mm x 0.925mm 36 EPad 4.65mm x 4.65mm 37 NL Package 38 XTALBAD 40 Top View 1 2 3 4 5 6 7 8 9 10 14 SDATA 13 12 VCC 11 nc PLL_BYPASS nCLK1 39 CLK1 CLK1BAD VEE CLK0BAD IDT8T49N205I VCC HOLDOVER 1 nQ1 31 VCCA To implement other configurations, these power-up default settings can be overwritten after power-up using the I2C interface and the device can be completely reconfigured. However, these settings would have to be re-written next time the device powers-up. Q1 CLK_ACTIVE VEE One usage example might be to install the device on a line card with two optional daughter cards: an OC-12 option requiring a 622.08MHz LVDS clock translated from a 19.44MHz input and a Gigabit Ethernet option requiring a 125MHz LVPECL clock translated from the same 19.44MHz input reference. VCCO LOCK_IND Pin Assignment This device provides two factory-programmed default power-up configurations burned into One-Time Programmable (OTP) memory. The configuration to be used is selected by the CONFIG pin. The two configurations are specified by the customer and are programmed by IDT during the final test phase from an on-hand stock of blank devices. The two configurations may be completely independent of one another. IDT8T49N205ANLGI REVISION B JULY 9, 2013 I2C Serial interface for register programming nQ0 This mode supports PLL loop bandwidths in the 10Hz - 580Hz range and makes use of an external crystal to provide significant jitter attenuation. Settings may be overwritten after power-up via I2C nCLK0 • Translates any input clock in the 8kHz -710MHz frequency range into any supported output frequency. Configurations customized via One-Time Programmable ROM Q0 Applications: Networking & Communications. Power-up default configuration pin or register selectable • 3) Low-Bandwidth Frequency Translator • • Two factory-set register configurations for power-up default state CLK0 • Crystal input frequency range: 16MHz - 40MHz OE0 • • Phase Build-Out minimizes output phase change on switchover • • • • 2) High-Bandwidth Frequency Translator Input frequency range: 8kHz - 710MHz CLK_SEL Fractional feedback division is used, so there are no requirements for any specific crystal frequency to produce the desired output frequency with a high degree of accuracy. Two differential inputs support the following input types: LVPECL, LVDS, LVHSTL, HCSL VCC • • • • Programmable output frequency: 0.98MHz up to 1,300MHz VCC Synthesizes output frequencies from a 16MHz - 40MHz fundamental mode crystal. Both outputs may be set to use 2.5V or 3.3V output levels XTAL_IN • Two outputs, individually programmable as LVPECL or LVDS • Frequency Synthesizer Zero ppm frequency translation XTAL_OUT 1 Universal Frequency Translator/Frequency Synthesizer • • The IDT8T49N205I has three operating modes to support a very broad spectrum of applications: DATA SHEET Fourth Generation FemtoClock® NG technology • • IDT8T49N205I ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Complete Block Diagram IDT8T49N205ANLGI REVISION B JULY 9, 2013 2 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Pin Descriptions and Characteristics Table 1. Pin Descriptions Number Name Type Description 1 2 XTAL_IN XTAL_OUT Input Crystal Oscillator interface designed for 12pF parallel resonant crystals. XTAL_IN (pin 1) is the input and XTAL_OUT (pin 2) is the output. 3, 7, 13, 29 VCC Power Core supply pins. All must be either 3.3V or 2.5V. 4 CLK_SEL Input Pulldown Input clock select. Selects the active differential clock input. LVCMOS/LVTTL interface levels. 0 = CLK0, nCLK0 (default) 1 = CLK1, nCLK1 5 CLK0 Input Pulldown Non-inverting differential clock input. 6 nCLK0 Input Pullup/ Pulldown Inverting differential clock input. VCC/2 default when left floating (set by the internal pullup and pulldown resistors). 8, 21, 35 VEE Power 9 CLK1 Input Pulldown Non-inverting differential clock input. 10 nCLK1 Input Pullup/ Pulldown Inverting differential clock input. VCC/2 default when left floating (set by the internal pullup and pulldown resistors). 11, 19, 20, 32 nc Unused 12 PLL_BYPAS S Input Pulldown 14 SDATA I/O Pullup I2C Data Input/Output. Open drain. 15 SCLK Input Pullup I2C Clock Input. LVCMOS/LVTTL interface levels. Negative supply pins. No connect. These pins are to be left unconnected. Bypasses the VCXO PLL. In bypass mode, outputs are clocked off the falling edge of the input reference. LVCMOS/LVTTL interface levels. 0 = PLL Mode (default) 1 = PLL Bypassed 16 CONFIG Input Pulldown Configuration Pin. Selects between one of two factory programmable pre-set power-up default configurations. The two configurations can have different output/input frequency translation ratios, different PLL loop bandwidths, etc. These default configurations can be overwritten after power-up via I2C if the user so desires. LVCMOS/LVTTL interface levels. 0 = Configuration 0 (default) 1 = Configuration 1 17 S_A1 Input Pulldown I2C Address Bit 1. LVCMOS/LVTTL interface levels. 18 S_A0 Input Pulldown I2C Address Bit 0. LVCMOS/LVTTL interface levels. 22 OE1 Input Pullup 23, 24 nQ1, Q1 Output Differential output pair. Output type is programmable to LVDS or LVPECL interface levels. 25 VCCO Power Output supply pins for Q1, nQ1 and Q0, nQ0 outputs. Either 2.5V or 3.3V. 26, 27 nQ0, Q0 Output Differential output pair. Output type is programmable to LVDS or LVPECL interface levels. 28 OE0 Input 30 LOCK_IND Output IDT8T49N205ANLGI REVISION B JULY 9, 2013 Pullup Active High Output Enable for Q1, nQ1. LVCMOS/LVTTL interface levels. 0 = Output pins high-impedance 1 = Output switching (default) Active High Output Enable for Q0, nQ0. LVCMOS/LVTTL interface levels. 0 = Output pins high-impedance 1 = Output switching (default) Lock Indicator - indicates that the PLL is in a locked condition. LVCMOS/LVTTL interface levels. 3 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet Number FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Name Type Description Indicates which of the two differential clock inputs is currently selected. LVCMOS/LVTTL interface levels. 0 = CLK0, nCLK0 differential input pair 1 = CLK1, nCLK1 differential input pair 31 CLK_ACTIVE Output 33, 34 LF0, LF1 Analog I/O 36 VCCA Power Analog supply voltage. See Applications section for details on how to connect this pin. Loop filter connection node pins. LF0 is the output. LF1 is the input. 37 HOLDOVER Output Alarm output reflecting if the device is in a holdover state. LVCMOS/LVTTL interface levels. 0 = Device is locked to a valid input reference 1 = Device is not locked to a valid input reference 38 CLK0BAD Output Alarm output reflecting the state of CLK0. LVCMOS/LVTTL interface levels. 0 = Input Clock 0 is switching within specifications 1 = Input Clock 0 is out of specification 39 CLK1BAD Output Alarm output reflecting the state of CLK1. LVCMOS/LVTTL interface levels. 0 = Input Clock 1 is switching within specifications 1 = Input Clock 1 is out of specification 40 XTALBAD Output Alarm output reflecting the state of XTAL. LVCMOS/LVTTL interface levels. 0 = crystal is switching within specifications 1 = crystal is out of specification NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. Table 2. Pin Characteristics Symbol Parameter CIN Input Capacitance 3.5 pF RPULLUP Input Pullup Resistor 51 k RPULLDOWN Input Pulldown Resistor 51 k IDT8T49N205ANLGI REVISION B JULY 9, 2013 Test Conditions 4 Minimum Typical Maximum Units ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Functional Description The IDT8T49N205I is designed to provide two copies of almost any desired output frequency within its operating range (0.98 - 1300MHz) from any input source in the operating range (8kHz - 710MHz). It is capable of synthesizing frequencies from a crystal or crystal oscillator source. The output frequency is generated regardless of the relationship to the input frequency. The output frequency will be exactly the required frequency in most cases. In most others, it will only differ from the desired frequency by a few ppb. IDT configuration software will indicate the frequency error, if any. The IDT8T49N205I can translate the desired output frequency from one of two input clocks. Again, no relationship is required between the input and output frequencies in order to translate to the output clock rate. In this frequency translation mode, a low-bandwidth, jitter attenuation option is available that makes use of an external fixed-frequency crystal or crystal oscillator to translate from a noisy input source. If the input clock is known to be fairly clean or if some modulation on the input needs to be tracked, then the high-bandwidth frequency translation mode can be used, without the need for the external crystal. device may be designed into a communications line card that supports different I/O modules such as a standard OC-12 module running at 622.08MHz or a (255/237) FEC rate OC-12 module running at 669.32MHz. The different I/O modules would result in a different level on the CONFIG pin which would select different divider ratios within the IDT8T49N205I for the two different card configurations. Access via I2C would not be necessary for operation using either of the internal configurations. Operating Modes The IDT8T49N205I has three operating modes which are set by the MODE_SEL[1:0] bits. There are two frequency translator modes low bandwidth and high bandwidth and a frequency synthesizer mode. The device will operate in the same mode regardless of which configuration is active. Please make use of IDT-provided configuration applications to determine the best operating settings for the desired configurations of the device. The input clock references and crystal input are monitored continuously and appropriate alarm outputs are raised both as register bits and hard-wired pins in the event of any out-of-specification conditions arising. Clock switching is supported in manual, revertive & non-revertive modes. Output Dividers & Supported Output Frequencies In all 3 operating modes, the output stage behaves the same way, but different operating frequencies can be specified in the two configurations. The IDT8T49N205I has two factory-programmed configurations that may be chosen from as the default operating state after reset. This is intended to allow the same device to be used in two different applications without any need for access to the I2C registers. These defaults may be over-written by I2C register access at any time, but those over-written settings will be lost on power-down. Please contact IDT if a specific set of power-up default settings is desired. The internal VCO is capable of operating in a range anywhere from 1.995GHz - 2.6GHz. It is necessary to choose an integer multiplier of the desired output frequency that results in a VCO operating frequency within that range. The output divider stage N[10:0] is limited to selection of integers from 2 to 2046. Please refer to Table 3 for the values of N applicable to the desired output frequency. Configuration Selection Table 3. Output Divider Settings & Frequency Ranges The IDT8T49N205I comes with two factory-programmed default configurations. When the device comes out of power-up reset the selected configuration is loaded into operating registers. The IDT8T49N205I uses the state of the CONFIG pin or CONFIG register bit (controlled by the CFG_PIN_REG bit) to determine which configuration is active. When the output frequency is changed either via the CONFIG pin or via internal registers, the output behavior may not be predictable during the register writing and output settling periods. Devices sensitive to glitches or runt pulses may have to be reset once reconfiguration is complete. Once the device is out of reset, the contents of the operating registers can be modified by write access from the I2C serial port. Users that have a custom configuration programmed may not require I2C access. It is expected that the IDT8T49N205I will be used almost exclusively in a mode where the selected configuration will be used from device power-up without any changes during operation. For example, the IDT8T49N205ANLGI REVISION B JULY 9, 2013 5 Register Setting Frequency Divider Minimum fOUT Maximum fOUT Nn[10:0] N (MHz) (MHz) 0000000000x 2 997.5 1300 00000000010 2 997.5 1300 00000000011 3 665 866.7 00000000100 4 498.75 650 00000000101 5 399 520 0000000011x 6 332.5 433.3 0000000100x 8 249.4 325 0000000101x 10 199.5 260 ... Even N 1995 / N 2600 / N 1111111111x 2046 0.98 1.27 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Frequency Synthesizer Mode This mode of operation allows an arbitrary output frequency to be generated from a fundamental mode crystal input. For improved phase noise performance, the crystal input frequency may be doubled. As can be seen from the block diagram in Figure 1, only the upper feedback loop is used in this mode of operation. It is recommended that CLK0 and CLK1 be left unused in this mode of operation. The input reference frequency range is now extended up to 710MHz. A pre-divider stage P is needed to keep the operating frequencies at the phase detector less than 100MHz. Low-Bandwidth Frequency Translator Mode As can be seen from the block diagram in Figure 3, this mode involves two PLL loops. The lower loop with the large integer dividers is the low bandwidth loop and it sets the output-to-input frequency translation ratio.This loop drives the upper DCXO loop (digitally controlled crystal oscillator) via an analog-digital converter. The upper feedback loop supports a delta-sigma fractional feedback divider. This allows the VCO operating frequency to be a non-integer multiple of the crystal frequency. By using an integer multiple only, lower phase noise jitter on the output can be achieved, however the use of the delta-sigma divider logic will provide excellent performance on the output if a fractional divisor is used. Figure 3. Low Bandwidth Frequency Translator Mode Block Diagram The pre-divider stage is used to scale down the input frequency by an integer value to achieve a frequency in this range. By dividing down the fed-back VCO operating frequency by the integer divider M1[16:0] to as close as possible to the same frequency, exact output frequency translations can be achieved. For improved phase noise performance, the crystal input frequency may be doubled. The phase detector of the lower loop is designed to work with frequencies in the 8kHz - 16kHz range. For improved phase noise performance, the crystal input frequency may be doubled. Figure 1. Frequency Synthesizer Mode Block Diagram High-Bandwidth Frequency Translator Mode This mode of operation is used to translate one of two input clocks of the same nominal frequency into an output frequency with little jitter attenuation. As can be seen from the block diagram in Figure 2, similarly to the Frequency Synthesizer mode, only the upper feedback loop is used. Alarm Conditions & Status Bits The IDT8T49N205I monitors a number of conditions and reports their status via both output pins and register bits. All alarms will behave as indicated below in all modes of operation, but some of the conditions monitored have no valid meaning in some operating modes. For example, the status of CLK0BAD, CLK1BAD and CLK_ACTIVE are not relevant in Frequency Synthesizer mode. The outputs will still be active and it is left to the user to determine which to monitor and how to respond to them based on the known operating mode. CLK_ACTIVE - indicates which input clock reference is being used to derive the output frequency. LOCK_IND - This status is asserted on the pin & register bit when the PLL is locked to the appropriate input reference for the chosen mode of operation. The status bit will not assert until frequency lock has been achieved, but will de-assert once lock is lost. Figure 2. High Bandwidth Frequency Translator Mode Block Diagram IDT8T49N205ANLGI REVISION B JULY 9, 2013 6 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT XTALBAD - indicates if valid edges are being received on the crystal input. Detection is performed by comparing the input to the feedback signal at the upper loop’s Phase / Frequency Detector (PFD). If three edges are received on the feedback without an edge on the crystal input, the XTALBAD alarm is asserted on the pin & register bit. Once an edge is detected on the crystal input, the alarm is immediately deasserted. The IDT8T49N205I will only switch input references on command from the user. The user must either change the CLK_SEL register bit (if in Manual via Register) or CLK_SEL input pin (if in Manual via Pin). Automatic Switching Mode When the AUTO_MAN[1:0] field is set to either of the automatic selection modes (Revertive or Non-Revertive), the IDT8T49N205I determines which input reference it prefers / starts from by the state of the CLK_SEL register bit only. The CLK_SEL input pin is not used in either Automatic switching mode. CLK0BAD - indicates if valid edges are being received on the CLK0 reference input. Detection is performed by comparing the input to the feedback signal at the appropriate Phase / Frequency Detector (PFD). When operating in high-bandwidth mode, the feedback at the upper PFD is used. In low-bandwidth mode, the feedback at the lower PFD is used. If three edges are received on the feedback without an edge on the divided down (÷P) CLK0 reference input, the CLK0BAD alarm is asserted on the pin & register bit. Once an edge is detected on the CLK0 reference input, the alarm is deasserted. When starting from an unlocked condition, the device will lock to the input reference indicated by the CLK_SEL register bit. It will not pay attention to the non-selected input reference until a locked state has been achieved. This is necessary to prevent ‘hunting’ behavior during the locking phase. Once the IDT8T49N205I has achieved a stable lock, it will remain locked to the preferred input reference as long as there is a valid clock on it. If at some point, that clock fails, then the device will automatically switch to the other input reference as long as there is a valid clock there. If there is not a valid clock on either input reference, the IDT8T49N205I will go into holdover (Low Bandwidth Frequency Translator mode) or free-run (High Bandwidth Frequency Translator mode) state. In either case, the HOLDOVER alarm will be raised. CLK1BAD - indicates if valid edges are being received on the CLK1 reference input. Behavior is as indicated for the CLK0BAD alarm, but with the CLK1 input being monitored and the CLK1BAD output pin & register bits being affected. HOLDOVER - indicates that the device is not locked to a valid input reference clock. This can occur in Manual switchover mode if the selected reference input has gone bad, even if the other reference input is still good. In automatic mode, this will only assert if both input references are bad. The device will recover from holdover / free-run state once a valid clock is re-established on either reference input. If clocks are valid on both input references, the device will choose the reference indicated by the CLK_SEL register bit. Input Reference Selection and Switching When operating in Frequency Synthesizer mode, the CLK0 and CLK1 inputs are not used and the contents of this section do not apply. Except as noted below, when operating in either High or Low Bandwidth Frequency Translator mode, the contents of this section apply equally when in either of those modes. If running from the non-preferred input reference and a valid clock returns, there is a difference in behavior between Revertive and Non-revertive modes. In Revertive mode, the device will switch back to the reference indicated by the CLK_SEL register bit even if there is still a valid clock on the non-preferred reference input. In Non-revertive mode, the IDT8T49N205I will not switch back as long as the non-preferred input reference still has a valid clock on it. Both input references CLK0 and CLK1 must be the same nominal frequency. These may be driven by any type of clock source, including crystal oscillator modules. A difference in frequency may cause the PLL to lose lock when switching between input references. Please contact IDT for the exact limits for your situation. Switchover Behavior of the PLL Even though the two input references have the same nominal frequency, there may be minor differences in frequency and potentially large differences in phase between them. The IDT8T49N205I has two options: Phase Build-Out or Phase-Slope Limiting to determine how it will adjust its output to the new input reference when operating in Low-Bandwidth mode. Only Phase-Slope limiting is available in High-Bandwidth mode. The PBO_DISABLE bit is used to determine which method is used in Low_bandwidth mode. The global control bits AUTO_MAN[1:0] dictate the order of priority and switching mode to be used between the CLK0 and CLK1 inputs. Manual Switching Mode When the AUTO_MAN[1:0] field is set to Manual via Pin, then the IDT8T49N205I will use the CLK_SEL input pin to determine which input to use as a reference. Similarly, if set to Manual via Register, then the device will use the CLK_SEL register bit to determine the input reference. In either case, the PLL will lock to the selected reference if there is a valid clock present on that input. In Phase Slope Limiting operation, the IDT8T49N205I will adjust the output phase at a fixed maximum rate until the output phase and frequency are now aligned to the new input reference. Phase will always be adjusted so that no unacceptably short clock periods are generated on the output of the IDT8T49N205I. Please contact IDT if more information on the maximum phase slope adjustment rate is needed. If there is not a valid clock present on the selected input, the IDT8T49N205I will go into holdover (Low Bandwidth Frequency Translator mode) or free-run (High Bandwidth Frequency Translator mode) state. In either case, the HOLDOVER alarm will be raised. This will occur even if there is a valid clock on the non-selected reference input. The device will recover from holdover / free-run state once a valid clock is re-established on the selected reference input. IDT8T49N205ANLGI REVISION B JULY 9, 2013 In Phase Build-Out operation, the device will absorb most of the phase difference between the two inputs (or between the input and current VCO setting if recovering from holdover). Please refer to 7 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Output Configuration Table 6 for exact limits. Any phase difference that is not absorbed will be reflected on the output at the same maximum rate as in Phase Slope Limiting operation. The two outputs of the IDT8T49N205I both provide the same clock frequency. Both must operate from the same output voltage level of 3.3V or 2.5V, although this output voltage may be less than or equal to the core voltage (3.3V or 2.5V) the rest of the device is operating from. The output voltage level used on the two outputs is supplied on the VCCO pin. Holdover / Free-run Behavior When both input references have failed (Automatic mode) or the selected input has failed (Manual mode), the IDT8T49N205I will enter holdover (Low Bandwidth Frequency Translator mode) or free-run (High Bandwidth Frequency Translator mode) state . The two outputs are individually selectable as LVDS or LVPECL output types via the Q0_TYPE and Q1_TYPE register bits. These two selection bits are provided in each configuration to allow different output type settings under each configuration. If operating in Low Bandwidth Frequency Translation mode, the PLL will continue to reference itself to the local oscillator and will hold its output phase and frequency in relation to that source. Output stability is determined by the stability of the local oscillator in this case. The two outputs can be enabled individually also via both register control bits and input pins. When both the OEn register bit and OEn pin are enabled, then the appropriate output is enabled. The OEn register bits default to enabled so that by default the outputs can be directly controlled by the input pins. Similarly, the input pins are provisioned with weak pull-ups so that if they are left unconnected, the output state can be directly controlled by the register bits. When the differential output is in the disabled state, it will show a high impedance condition. However, if operating in High Bandwidth Frequency Translation mode, the PLL no longer has any frequency reference to use and the VCO will return to the center of its tuning range. Similarly, if operating in Low-Bandwidth mode and no initial frequency lock has been achieved, the VCO will stay at or return to the center of its tuning range. If the device is programmed to perform Manual switching, once the selected input reference recovers, the IDT8T49N205I will switch back to that input reference. If programmed for either Automatic mode, the device will switch back to whichever input reference has a valid clock first. The switchover that results from returning from holdover or free-run is handled in the same way as a switch between two valid input references as described in the previous section. IDT8T49N205ANLGI REVISION B JULY 9, 2013 8 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Serial Interface Configuration Description The IDT8T49N205I has an I2C-compatible configuration interface to access any of the internal registers (Table 4D) for frequency and PLL parameter programming. The IDT8T49N205I acts as a slave device on the I2C bus and has the address 0b11011xx, where xx is set by the values on the S_A0 & S_A1 pins (see Table 4A for details). The interface accepts byte-oriented block write and block read operations. An address byte (P) specifies the register address (Table 4D) as the byte position of the first register to write or read. Data bytes (registers) are accessed in sequential order from the lowest to the highest byte (most significant bit first, see table 4B, 4C). Read and write block transfers can be stopped after any complete byte transfer. It is recommended to terminate I2C the read or write transfer after accessing byte #23. For full electrical I2C compliance, it is recommended to use external pull-up resistors for SDATA and SCLK. The internal pull-up resistors have a size of 50k typical. Note: if a different device slave address is desired, please contact IDT. Table 4A. I2C Device Slave Address 1 1 0 1 1 S_A1 S_A0 R/W Table 4B. Block Write Operation Bit Description 1 2:8 9 10 11:18 19 20:27 28 29-36 37 ... ... ... START Slave Address W (0) ACK Address Byte (P) ACK Data Byte (P) ACK Data Byte (P+1) ACK Data Byte ... ACK STOP 1 7 1 1 8 1 8 1 8 1 8 1 1 Length (bits) Table 4C. Block Read Operation Bit 1 2:8 9 10 11:18 19 20 21:27 28 29 30:37 38 39-46 47 ... ... ... Description START Slave Address W (0) A C K Address Byte (P) A C K Repeate d START Slave Address R (1) A C K Data Byte (P) A C K Data Byte (P+1) A C K Data Byte ... A C K STOP Length (bits) 1 7 1 1 8 1 1 7 1 1 8 1 8 1 8 1 1 IDT8T49N205ANLGI REVISION B JULY 9, 2013 9 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Register Descriptions Please consult IDT for configuration software and/or programming guides to assist in selection of optimal register settings for the desired configurations. Table 4D. I2C Register Map Register Bit Reg Binary Register Address D7 D6 D5 D4 D3 D2 D1 D0 0 00000 MFRAC0[17] MFRAC0[16] MFRAC0[15] MFRAC0[14] MFRAC0[13] MFRAC0[12] MFRAC0[11] MFRAC0[10] 1 00001 MFRAC1[17] MFRAC1[16] MFRAC1[15] MFRAC1[14] MFRAC1[13] MFRAC1[12] MFRAC1[11] MFRAC1[10] 2 00010 MFRAC0[9] MFRAC0[8] MFRAC0[7] MFRAC0[6] MFRAC0[5] MFRAC0[4] MFRAC0[3] MFRAC0[2] 3 00011 MFRAC1[9] MFRAC1[8] MFRAC1[7] MFRAC1[6] MFRAC1[5] MFRAC1[4] MFRAC1[3] MFRAC1[2] 4 00100 MFRAC0[1] MFRAC0[0] MINT0[7] MINT0[6] MINT0[5] MINT0[4] MINT0[3] MINT0[2] 5 00101 MFRAC1[1] MFRAC1[0] MINT1[7] MINT1[6] MINT1[5] MINT1[4] MINT1[3] MINT1[2] 6 00110 MINT0[1] MINT0[0] P0[16] P0[15] P0[14] P0[13] P0[12] P0[11] 7 00111 MINT1[1] MINT1[0] P1[16] P1[15] P1[14] P1[13] P1[12] P1[11] 8 01000 P0[10] P0[9] P0[8] P0[7] P0[6] P0[5] P0[4] P0[3] 9 01001 P1[10] P1[9] P1[8] P1[7] P1[6] P1[5] P1[4] P1[3] 10 01010 P0[2] P0[1] P0[0] M1_0[16] M1_0[15] M1_0[14] M1_0[13] M1_0[12] 11 01011 P1[2] P1[1] P1[0] M1_1[16] M1_1[15] M1_1[14] M1_1[13] M1_1[12] 12 01100 M1_0[11] M1_0[10] M1_0[9] M1_0[8] M1_0[7] M1_0[6] M1_0[5] M1_0[4] 13 01101 M1_1[11] M1_1[10] M1_1[9] M1_1[8] M1_1[7] M1_1[6] M1_1[5] M1_1[4] 14 01110 M1_0[3] M1_0[2] M1_0[1] M1_0[0] N0[10] N0[9] N0[8] N0[7] 15 01111 M1_1[3] M1_1[2] M1_1[1] M1_1[0] N1[10] N1[9] N1[8] N1[7] 16 10000 N0[6] N0[5] N0[4] N0[3] N0[2] N0[1] N0[0] BW0[6] 17 10001 N1[6] N1[5] N1[4] N1[3] N1[2] N1[1] N1[0] BW1[6] 18 10010 BW0[5] BW0[4] BW0[3] BW0[2] BW0[1] BW0[0] Q1_TYPE0 Q0_TYPE0 19 10011 BW1[5] BW1[4] BW1[3] BW1[2] BW1[1] BW1[0] Q1_TYPE1 Q0_TYPE1 20 10100 MODE_SEL[1] MODE_SEL[0] CONFIG CFG_PIN_REG OE1 OE0 Rsvd Rsvd 21 10101 CLK_SEL AUTO_MAN[1] AUTO_MAN[0] 0 ADC_RATE[1] ADC_RATE[0] LCK_WIN[1] LCK_WIN[0] 22 10110 1 0 1 0 DBL_XTAL 0 PBO_DISABLE 1 23 10111 CLK_ACTIVE HOLDOVER CLK1BAD CLK0BAD XTAL_BAD LOCK_IND Rsvd Rsvd Register Bit Color Key Configuration 0 Specific Bits Configuration 1 Specific Bits Global Control & Status Bits IDT8T49N205ANLGI REVISION B JULY 9, 2013 10 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT The register bits described in Table 4E are duplicated, with one set applying for Configuration 0 and the other for Configuration 1. The functions of the bits are identical, but only apply when the configuration they apply to is enabled. Replace the lowercase n in the bit field description with 0 or 1 to find the field’s location in the bitmap in Table 4D. Table 4E. Configuration-Specific Control Bits Register Bits Function Q0_TYPEn Determines the output type for output pair Q0, nQ0 for Configuration n. 0 = LVPECL 1 = LVDS Q1_TYPEn Determines the output type for output pair Q1, nQ1 for Configuration n. 0 = LVPECL 1 = LVDS Pn[16:0] Reference Pre-Divider for Configuration n. M1_n[16:0] Integer Feedback Divider in Lower Feedback Loop for Configuration n. M_INTn[7:0] Feedback Divider, Integer Value in Upper Feedback Loop for Configuration n. M_FRACn[17:0] Feedback Divider, Fractional Value in Upper Feedback Loop for Configuration n. Nn[10:0] Output Divider for Configuration n. BWn[6:0] Internal Operation Settings for Configuration n. Please use IDT IDT8T49N205I Configuration Software to determine the correct settings for these bits for the specific configuration. Alternatively, please consult with IDT directly for further information on the functions of these bits.The function of these bits are explained in Tables 4J and 4K. Table 4F. Global Control Bits Register Bits Function MODE_SEL[1:0] PLL Mode Select 00 = Low Bandwidth Frequency Translator 01 = Frequency Synthesizer 10 = High Bandwidth Frequency Translator 11 = High Bandwidth Frequency Translator CFG_PIN_REG Configuration Control. Selects whether the configuration selection function is under pin or register control. 0 = Pin Control 1 = Register Control CONFIG Configuration Selection. Selects whether the device uses the register configuration set 0 or 1. This bit only has an effect when the CONFIG_PIN_REG bit is set to 1 to enable register control. OE0 Output Enable Control for Output 0. Both this register bit and the corresponding Output Enable pin OE0 must be asserted to enable the Q0, nQ0 output. 0 = Output Q0, nQ0 disabled 1 = Output Q0, nQ0 under control of the OE0 pin OE1 Output Enable Control for Output 1. Both this register bit and the corresponding Output Enable pin OE1 must be asserted to enable the Q1, nQ1 output. 0 = Output Q1, nQ1 disabled 1 = Output Q1, nQ1 under control of the OE1 pin Rsvd Reserved bits - user should write a ‘0’ to these bit positions if a write to these registers is needed AUTO_MAN[1:0] Selects how input clock selection is performed. 00 = Manual Selection via pin only 01 = Automatic, non-revertive 10 = Automatic, revertive 11 = Manual Selection via register only IDT8T49N205ANLGI REVISION B JULY 9, 2013 11 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet CLK_SEL ADC_RATE[1:0] FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT In manual clock selection via register mode, this bit will command which input clock is selected. In the automatic modes, this indicates the primary clock input. In manual selection via pin mode, this bit has no effect. 0 = CLK0 1 = CLK1 Sets the ADC sampling rate in Low-Bandwidth Mode as a fraction of the crystal input frequency. 00 = Crystal Frequency / 16 01 = Crystal Frequency / 8 10 = Crystal Frequency / 4 (recommended) 11 = Crystal Frequency / 2 LCK_WIN[1:0] Sets the width of the window in which a new reference edge must fall relative to the feedback edge: 00 = 125nsec (recommended), 01 = 500nsec, 10 = 2sec, 11 = 8sec PBO_DISABLE Disables the use of Phase Build-Out when switching between inputs: 0 = PBO Enabled 1 = PBO Disabled and only Phase-Slope Limiting used DBL_XTAL When set, this bit will double the frequency of the crystal input before applying it to the Phase-Frequency Detector. Table 4G. Global Status Bits Register Bits Function CLK0BAD Status Bit for input clock 0. This function is mirrored in the CLK0BAD pin. 0 = input 0 good 1 = input 0 bad. Self clears when input clock returns to good status CLK1BAD Status Bit for input clock 1. This function is mirrored in the CLK1BAD pin. 0 = input 0 good 1 = input 0 bad. Self clears when input clock returns to good status XTALBAD Status Bit. This function is mirrored on the XTALBAD pin. 0= crystal input good 1 = crystal input bad. Self-clears when the XTAL clock returns to good status LOCK_IND Status bit. This function is mirrored on the LOCK_IND pin. 0 = PLL unlocked 1 = PLL locked HOLDOVER Status Bit. This function is mirrored on the HOLDOVER pin. 0 = Input to phase detector is within specifications and device is tracking to it 1 = Phase detector input not within specifications and DCXO is frozen at last value CLK_ACTIVE Status Bit. Indicates which input clock is active. Automatically updates during fail-over switching. Status also indicated on CLK_ACTIVE pin. Table 4H. BW[6:0] Bits Mode BW[6] BW[5] BW[4] BW[3] BW[2] BW[1] BW[0] Synthesizer Mode PLL2_LF[1] PLL2_LF[0] DSM_ORD DSM_EN PLL2_CP[1] PLL2_CP[0] PLL2_LOW_Icp High-Bandwidth Mode PLL2_LF[1] PLL2_LF[0] DSM_ORD DSM_EN PLL2_CP[1] PLL2_CP[0] PLL2_LOW_Icp Low-Bandwidth Mode ADC_GAIN[3] ADC_GAIN[2] ADC_GAIN[1] ADC_GAIN[0] PLL1_CP[1] PLL1_CP[0] PLL2_LOW_Icp IDT8T49N205ANLGI REVISION B JULY 9, 2013 12 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Table 4I. Functions of Fields in BW[6:0] Register Bits Function PLL2_LF[1:0] Sets loop filter values for upper loop PLL in Frequency Synthesizer & High-Bandwidth modes. Defaults to setting of 00 when in Low Bandwidth Mode. See Table 4L for settings. DSM_ORD Sets Delta-Sigma Modulation to 2nd (0) or 3rd order (1) operation Enables Delta-Sigma Modulator 0 = Disabled - feedback in integer mode only 1 = Enabled - feedback in fractional mode DSM_EN Upper loop PLL charge pump current settings: 00 = 173A (defaults to this setting in Low Bandwidth Mode) 01 = 346A 10 = 692A 11 = reserved PLL2_CP[1:0] PLL2_LOW_Icp Reduces Charge Pump current by 1/3 to reduce bandwidth variations resulting from higher feedback register settings or high VCO operating frequency (>2.4GHz). ADC_GAIN[3:0] Gain setting for ADC in Low Bandwidth Mode. Lower loop PLL charge pump current settings (lower loop is only used in Low Bandwidth Mode): 00 = 800A 01 = 400A 10 = 200A 11 = 100A PLL1_CP[1:0] Table 4J. Upper Loop (PLL2) Bandwidth Settings Desired Bandwidth PLL2_CP PLL2_LOW_ICP PLL2_LF Frequency Synthesizer Mode 200kHz 00 1 00 400kHz 01 1 01 800kHz 10 1 10 2MHz 10 1 11 High Bandwidth Frequency Translator Mode 200kHz 00 1 00 400kHz 01 1 01 800kHz 10 1 10 4MHz 10 0 11 NOTE: To achieve 4MHz bandwidth, reference to the phase detector should be 80MHz. IDT8T49N205ANLGI REVISION B JULY 9, 2013 13 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Absolute Maximum Ratings NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Rating Supply Voltage, VCC 3.6V Inputs, VI XTAL_IN Other Inputs 0V to 2V -0.5V to VCC + 0.5V Outputs, VO (LVCMOS) -0.5V to VCCO + 0.5V Outputs, IO (LVPECL) Continuous Current Surge Current 50mA 100mA Outputs, IO (LVDS) Continuous Current Surge Current 10mA 15mA Package Thermal Impedance, JA 32.4C/W (0 mps) Storage Temperature, TSTG -65C to 150C DC Electrical Characteristics Table 5A. LVPECL Power Supply DC Characteristics, VCC = VCCO = 3.3V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter VCC Core Supply Voltage VCCA Test Conditions Minimum Typical Maximum Units 3.135 3.3 3.465 V Analog Supply Voltage VCC – 0.30 3.3 VCC V VCCO Output Supply Voltage 3.135 3.3 3.465 V IEE Power Supply Current 320 mA ICCA Analog Supply Current 30 mA Table 5B. LVPECL Power Supply DC Characteristics, VCC = 3.3V±5%, VCCO = 2.5V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter VCC Core Supply Voltage VCCA Minimum Typical Maximum Units 3.135 3.3 3.465 V Analog Supply Voltage VCC – 0.30 3.3 VCC V VCCO Output Supply Voltage 2.375 2.5 2.625 V IEE Power Supply Current 320 mA ICCA Analog Supply Current 30 mA IDT8T49N205ANLGI REVISION B JULY 9, 2013 Test Conditions 14 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Table 5C. LVPECL Power Supply DC Characteristics, VCC = VCCO = 2.5V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter VCC Core Supply Voltage VCCA Test Conditions Minimum Typical Maximum Units 2.375 2.5 2.625 V Analog Supply Voltage VCC – 0.26 2.5 VCC V VCCO Output Supply Voltage 2.375 2.5 2.625 V IEE Power Supply Current 304 mA ICCA Analog Supply Current 26 mA Table 5D. LVDS Power Supply DC Characteristics, VCC = VCCO = 3.3V±5%, TA = -40°C to 85°C Symbol Parameter VCC Core Supply Voltage VCCA Test Conditions Minimum Typical Maximum Units 3.135 3.3 3.465 V Analog Supply Voltage VCC – 0.30 3.3 VCC V VCCO Output Supply Voltage 3.135 3.3 3.465 V ICC Power Supply Current 273 mA ICCA Analog Supply Current 30 mA ICCO Output Supply Current 42 mA Table 5E. LVDS Power Supply DC Characteristics, VCC = 3.3V±5%, VCCO = 2.5V±5%, TA = -40°C to 85°C Symbol Parameter VCC Core Supply Voltage VCCA Test Conditions Minimum Typical Maximum Units 3.135 3.3 3.465 V Analog Supply Voltage VCC – 0.30 3.3 VCC V VCCO Output Supply Voltage 2.375 2.5 2.625 V ICC Power Supply Current 273 mA ICCA Analog Supply Current 30 mA ICCO Output Supply Current 42 mA Table 5F. LVDS Power Supply DC Characteristics, VCC = VCCO = 2.5V±5%, TA = -40°C to 85°C Symbol Parameter VCC Core Supply Voltage VCCA Minimum Typical Maximum Units 2.375 2.5 2.625 V Analog Supply Voltage VCC – 0.26 2.5 VCC V VCCO Output Supply Voltage 2.375 2.5 2.625 V ICC Power Supply Current 263 mA ICCA Analog Supply Current 26 mA ICCO Output Supply Current 42 mA IDT8T49N205ANLGI REVISION B JULY 9, 2013 Test Conditions 15 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Table 5G. LVCMOS/LVTTL DC Characteristics, TA = -40°C to 85°C Symbol Parameter VIH Input High Voltage VIL Input Low Voltage IIH Input High Current IIL Input Low Current Test Conditions Minimum VCC = 3.3V Typical Maximum Units 2.2 VCC + 0.3 V VCC = 2.5V 1.7 VCC + 0.3 V VCC = 3.3V -0.3 0.8 V VCC = 2.5V -0.3 0.7 V CLK_SEL, CONFIG, PLL_BYPASS, S_A[1:0] VCC = VIN = 3.465V or 2.625V 150 µA OE0, OE1, SCLK, SDATA VCC = VIN = 3.465V or 2.625V 5 µA CLK_SEL, CONFIG, PLL_BYPASS, S_A[1:0] VCC = 3.465V or 2.625V, VIN = 0V -5 µA OE0, OE1, SCLK, SDATA VCC = 3.465V or 2.625V, VIN = 0V -150 µA VCC = 3.465V, IOH = -8mA 2.6 V VCC = 2.625V, IOH = -8mA 1.8 V VOH Output High Voltage HOLDOVER, SDATA CLK_ACTIVE, LOCK_IND, XTALBAD, CLK0BAD, CLK1BAD VOL Output Low Voltage HOLDOVER, SDATA CLK_ACTIVE, LOCK_IND, XTALBAD, CLK0BAD, CLK1BAD VCC = 3.465V or 2.625V, IOL = 8mA 0.5 V Table 5H. Differential DC Characteristics, VCC = VCCO = 3.3V±5% or 2.5V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter IIH Input High Current IIL Input Low Current Test Conditions Minimum Typical Maximum Units 150 µA CLK0, nCLK0, CLK1, nCLK1 VCC = VIN = 3.465V or 2.625V CLK0, CLK1 VCC = 3.465V or 2.625V, VIN = 0V -5 µA nCLK0, nCLK1 VCC = 3.465V or 2.625V, VIN = 0V -150 µA VPP Peak-to-Peak Voltage VCMR Common Mode Input Voltage; NOTE 1 0.15 1.3 V VEE + 0.5 VCC – 1.0 V Maximum Units NOTE 1: Common mode input voltage is defined as the crosspoint voltage. Table 5I. LVPECL DC Characteristics, VCC = VCCO = 3.3V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions Minimum Typical VOH Output High Voltage; NOTE 1 VCCO – 1.1 VCCO – 0.7 V VOL Output Low Voltage NOTE 1 VCCO – 2.0 VCCO – 1.5 V VSWING Peak-to-Peak Output Voltage Swing 0.6 1.0 V NOTE 1: Outputs terminated with 50 to VCCO – 2V. IDT8T49N205ANLGI REVISION B JULY 9, 2013 16 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Table 5J. LVPECL DC Characteristics, VCC = 3.3V±5% or 2.5V±5%, VCCO = 2.5V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions VOH Output High Voltage; NOTE 1 VOL Output Low Voltage NOTE 1 VSWING Peak-to-Peak Output Voltage Swing Minimum Typical Maximum Units VCCO – 1.1 VCCO – 0.7 V VCCO – 2.0 VCCO – 1.5 V 0.6 1.0 V Maximum Units 454 mV 50 mV 1.375 V 50 mV NOTE 1: Outputs terminated with 50 to VCCO – 2V. Table 5K. LVDS DC Characteristics, VCC = VCCO = 3.3V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions VOD Differential Output Voltage VOD VOD Magnitude Change VOS Offset Voltage VOS VOS Magnitude Change Minimum Typical 247 1.125 Table 5L. LVDS DC Characteristics, VCC = 3.3V ± 5% or 2.5V±5%, VCCO = 2.5V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions VOD Differential Output Voltage VOD VOD Magnitude Change VOS Offset Voltage VOS VOS Magnitude Change Minimum Typical Maximum Units 454 mV 50 mV 1.375 V 50 mV Maximum Units 16 40 MHz High Bandwidth Mode 16 710 MHz Low Bandwidth Mode 0.008 710 MHz 5 MHz 247 1.125 Table 6. Input Frequency Characteristics, VCC = VCCO = 3.3V ± 5%, TA = -40°C to 85°C Symbol Parameter Test Conditions XTAL_IN, XTAL_OUT NOTE 1 fIN Input Frequency CLK0, nCLK0, CLK1, nCLK1 Minimum Typical SCLK NOTE 1: For the input crystal and CLKx, nCLKx frequency range, the M value must be set for the VCO to operate within the 1995MHz to 2600MHz range. Table 7. Crystal Characteristics Parameter Test Conditions Minimum Mode of Oscillation Maximum Units 40 MHz 100  7 pF Fundamental Frequency 16 Equivalent Series Resistance (ESR) Shunt Capacitance IDT8T49N205ANLGI REVISION B JULY 9, 2013 Typical 17 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT AC Electrical Characteristics Table 8. AC Characteristics, VCC = VCCO = 3.3V±5% or 2.5V±5%, or VCC = 3.3V±5%, VCCO = 2.5V±5% (LVPECL Only), VEE = 0V, TA = -40°C to 85°C Symbol Parameter fOUT Output Frequency fVCO VCO Frequency tjit(Ø) tjit(cc) tsk(o) tjit(per) Test Conditions RMS Phase Jitter; Integer Divide Ratio Cycle-to-Cycle Jitter; NOTE 2, 5 Maximum Units 0.98 1300 MHz 1995 2600 MHz Synth Mode (Integer FB), fOUT = 400MHz, 40MHz XTAL, Integration Range: 12kHz – 40MHz 245 385 fs Synth Mode (FracN FB), fOUT = 698.81MHz, 40MHz XTAL, Integration Range: 12kHz – 20MHz 355 605 fs LVDS output (NOTE 1), HBW Mode, fIN = 133.33MHz, fOUT = 400MHz, Integration Range: 12kHz – 20MHz 320 460 fs LVPECL output, LBW Mode (FracN), 40MHz XTAL, fIN = 10MHz, fOUT = 155.52MHz, Integration Range: 12kHz – 20MHz 379 610 fs LVPECL output, LBW Mode (FracN), 40MHz XTAL, fIN = 25MHz, fOUT = 161.1328125MHz, Integration Range: 12kHz – 20MHz 396 650 fs Frequency Synthesizer Mode 40 ps Frequency Translator Mode 40 ps 35 ps RMS Period Jitter; NOTE 5 LVPECL Outputs 2.0 6.5 ps LVDS Outputs 2.0 4.5 ps Initial Phase Error tPWL Switchover Phase Slope tR / tF Output Rise/Fall Time; NOTE 5 tSET Typical Output Skew; NOTE 2, 3, 5 tERR odc Minimum Output Duty Cycle; NOTE 5 fIN0 = 8kHz, fIN1 = 8kHz with 40usec phase offset, Low-Bandwidth mode 4.5 ns High-Bandwidth mode, 800kHz loop BW; fOUT = 100MHz, 4µS phase error 1.5 ms / s LVPECL Outputs 20% to 80% 95 485 ps LVDS Outputs 20% to 80% 128 498 ps LVPECL Outputs fOUT < 600MHz 47 53 % LVDS Outputs fOUT  600MHz 45 55 % Output Re-configuration Settling Time NOTE 4 from falling edge of the 8th SCLK for a register change 200 ns from edge on CONFIG pin 10 ns NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium IDT8T49N205ANLGI REVISION B JULY 9, 2013 18 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT has been reached under these conditions. NOTE 1: Measured using a Rohde & Schwarz SMA100 Signal Generator, 9kHz to 6GHz as the input source. NOTE 2: This parameter is defined in accordance with JEDEC Standard 65. NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential cross points. NOTE 4: This settling time does not include PLL re-calibration and locking if required. Since those times are highly dependent on the specific configuration, please contact IDT for times if PLL re-configuration is performed as part of the configuration change. NOTE 5: Measurements are collected with the following output frequencies: 19.44MHz, 38.88MHz, 66.6667Mhz, 125MHz, 156.25MHz, 161.1328125MHz, 311.04MHz, 400MHz, 480MHz, 622.08MHz 1000MHz, 1200MHz, 1300MHz. IDT8T49N205ANLGI REVISION B JULY 9, 2013 19 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Noise Power (dBc / Hz) Typical Phase Noise at 400MHz (3.3V) Offset Frequency (Hz) IDT8T49N205ANLGI REVISION B JULY 9, 2013 20 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Parameter Measurement Information 2V 2V 2V 2V VCC, VCCO VCC, VCCO VCCA VCCA -0.5V±0.125V -1.3V+0.165V 2.5 Core/2.5V LVPECL Output Load Test Circuit 3.3 Core/3.3V LVPECL Output Load Test Circuit 2.8V±0.04V 2V 2.8V±0.04V VCC Qx VCCO SCOPE VCC, VCCO VCCA VCCA nQx VEE -0.5V±0.125V 3.3 Core/3.3V LVDS Output Load Test Circuit 3.3 Core/2.5V LVPECL Output Load Test Circuit 3.3V±5% 2.5V±5% SCOPE VCC, 2.5V±5% POWER SUPPLY + Float GND – VCC VCCA Qx VCCO V CCA SCOPE + + VCCO nQx nQx 2.5 Core/2.5V LVDS Output Load Test Circuit IDT8T49N205ANLGI REVISION B JULY 9, 2013 Qx – POWER SUPPLY Float GND 3.3 Core/2.5V LVDS Output Load Test Circuit 21 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Parameter Measurement Information, continued VCC nQx nCLKx Qx CLKx nQy Qy VEE Output Skew Differential Input Levels VOH nQx VREF Qx VOL tcycle n tcycle n+1 tPER(n) n = 1...10000 cycles tjit(cc) = |tcycle n – tcycle n+1| 1000 Cycles tjit(per) = 10000 n=1 (tPER(n) – tPER mean)2 / (n – 1) RMS Period Jitter Cycle-to-Cycle Jitter nQx nQx 80% 80% VOD Qx 20% 20% tR Qx tF LVPECL Output Rise/Fall Time LVDS Output Rise/Fall Time IDT8T49N205ANLGI REVISION B JULY 9, 2013 22 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Parameter Measurement Information, continued Offset Voltage Setup RMS Phase Jitter nQx Qx Differential Output Duty Cycle/Output Pulse Width/Period IDT8T49N205ANLGI REVISION B JULY 9, 2013 Differential Output Voltage Setup 23 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Applications Information Recommendations for Unused Input and Output Pins Inputs: Outputs: CLKx/nCLKx Inputs LVPECL Outputs For applications not requiring the use of either differential input, both CLKx and nCLKx can be left floating. Though not required, but for additional protection, a 1k resistor can be tied from CLKx to ground. It is recommended that CLKx, nCLKx be left unconnected in frequency synthesizer mode. All unused LVPECL output pairs can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated. LVDS Outputs All unused LVDS output pairs can be either left floating or terminated with 100 across. If they are left floating there should be no trace attached. LVCMOS Control Pins All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1k resistor can be used. LVCMOS Outputs All unused LVCMOS outputs can be left floating. There should be no trace attached. Recommended Values for Low-Bandwidth Mode Loop Filter External loop filter components are not needed in Frequency Synthesizer or High-Bandwidth modes. In Low-Bandwidth mode, the loop filter structure and components shown in Figure 11 are recommended. Please consult IDT if other values are needed. IDT8T49N205ANLGI REVISION B JULY 9, 2013 24 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Wiring the Differential Input to Accept Single-Ended Levels Figure 4 shows how a differential input can be wired to accept single ended levels. The reference voltage V1 = VCC/2 is generated by the bias resistors R1 and R2. The bypass capacitor (C1) is used to help filter noise on the DC bias. This bias circuit should be located as close to the input pin as possible. The ratio of R1 and R2 might need to be adjusted to position the V1 in the center of the input voltage swing. For example, if the input clock swing is 2.5V and VCC = 3.3V, R1 and R2 value should be adjusted to set V1 at 1.25V. The values below are for when both the single ended swing and VCC are at the same voltage. This configuration requires that the sum of the output impedance of the driver (Ro) and the series resistance (Rs) equals the transmission line impedance. In addition, matched termination at the input will attenuate the signal in half. This can be done in one of two ways. First, R3 and R4 in parallel should equal the transmission line impedance. For most 50 applications, R3 and R4 can be 100. The values of the resistors can be increased to reduce the loading for slower and weaker LVCMOS driver. When using single-ended signaling, the noise rejection benefits of differential signaling are reduced. Even though the differential input can handle full rail LVCMOS signaling, it is recommended that the amplitude be reduced. The datasheet specifies a lower differential amplitude, however this only applies to differential signals. For single-ended applications, the swing can be larger, however VIL cannot be less than -0.3V and VIH cannot be more than VCC + 0.3V. Though some of the recommended components might not be used, the pads should be placed in the layout. They can be utilized for debugging purposes. The datasheet specifications are characterized and guaranteed by using a differential signal. VCC VCC VCC VCC R3 100 Ro RS R1 1K Zo = 50 Ohm + Driver V1 Ro + Rs = Zo R4 100 Receiv er - C1 0.1uF R2 1K Figure 4. Recommended Schematic for Wiring a Differential Input to Accept Single-ended Levels IDT8T49N205ANLGI REVISION B JULY 9, 2013 25 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Overdriving the XTAL Interface The XTAL_IN input can be overdriven by an LVCMOS driver or by one side of a differential driver through an AC coupling capacitor. The XTAL_OUT pin can be left floating. The amplitude of the input signal should be between 500mV and 1.8V and the slew rate should not be less than 0.2V/nS. For 3.3V LVCMOS inputs, the amplitude must be reduced from full swing to at least half the swing in order to prevent signal interference with the power rail and to reduce internal noise. Figure 5A shows an example of the interface diagram for a high speed 3.3V LVCMOS driver. This configuration requires that the sum of the output impedance of the driver (Ro) and the series resistance (Rs) equals the transmission line impedance. In addition, matched termination at the crystal input will attenuate the signal in half. This VCC can be done in one of two ways. First, R1 and R2 in parallel should equal the transmission line impedance. For most 50 applications, R1 and R2 can be 100. This can also be accomplished by removing R1 and changing R2 to 50. The values of the resistors can be increased to reduce the loading for a slower and weaker LVCMOS driver. Figure 5B shows an example of the interface diagram for an LVPECL driver. This is a standard LVPECL termination with one side of the driver feeding the XTAL_IN input. It is recommended that all components in the schematics be placed in the layout. Though some components might not be used, they can be utilized for debugging purposes. The datasheet specifications are characterized and guaranteed by using a quartz crystal as the input. XTAL_OUT R1 100 Ro Rs C1 Zo = 50 ohms XTAL_IN R2 100 Zo = Ro + Rs .1uf LVCMOS Driver Figure 5A. General Diagram for LVCMOS Driver to XTAL Input Interface XTAL_OUT C2 Zo = 50 ohms XTAL_IN .1uf Zo = 50 ohms LVPECL Driver R1 50 R2 50 R3 50 Figure 5B. General Diagram for LVPECL Driver to XTAL Input Interface IDT8T49N205ANLGI REVISION B JULY 9, 2013 26 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Differential Clock Input Interface with the vendor of the driver component to confirm the driver termination requirements. For example, in Figure 8A, the input termination applies for IDT open emitter LVHSTL drivers. If you are using an LVHSTL driver from another vendor, use their termination recommendation. The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR input requirements. Figures 6A to 6E show interface examples for the CLK/nCLK input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult 3.3V 3.3V 3.3V 1.8V Zo = 50Ω Zo = 50Ω CLK CLK Zo = 50Ω Zo = 50Ω nCLK nCLK Differential Input LVHSTL IDT LVHSTL Driver R1 50Ω R2 50Ω Differential Input LVPECL R1 50Ω R2 50Ω R2 50Ω Figure 6B. CLK/nCLK Input Driven by a 3.3V LVPECL Driver Figure 6A. CLK/nCLK Input Driven by an IDT Open Emitter LVHSTL Driver 3.3V 3.3V 3.3V 3.3V 3.3V Zo = 50Ω CLK CLK R1 100Ω nCLK Differential Input LVPECL Zo = 50Ω LVDS nCLK Receiver Figure 6D. CLK/nCLK Input Driven by a 3.3V LVDS Driver Figure 6C. CLK/nCLK Input Driven by a 3.3V LVPECL Driver 3.3V 3.3V *R3 CLK nCLK HCSL *R4 Differential Input Figure 6E. CLK/nCLK Input Driven by a 3.3V HCSL Driver IDT8T49N205ANLGI REVISION B JULY 9, 2013 27 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT LVDS Driver Termination For a general LVDS interface, the recommended value for the termination impedance (ZT) is between 90 and 132. The actual value should be selected to match the differential impedance (Z0) of your transmission line. A typical point-to-point LVDS design uses a 100 parallel resistor at the receiver and a 100 differential transmission-line environment. In order to avoid any transmission-line reflection issues, the components should be surface mounted and must be placed as close to the receiver as possible. IDT offers a full line of LVDS compliant devices with two types of output structures: current source and voltage source. The LVDS Driver standard termination schematic as shown in Figure 7A can be used with either type of output structure. Figure 7B, which can also be used with both output types, is an optional termination with center tap capacitance to help filter common mode noise. The capacitor value should be approximately 50pF. If using a non-standard termination, it is recommended to contact IDT and confirm if the output structure is current source or voltage source type. In addition, since these outputs are LVDS compatible, the input receiver’s amplitude and common-mode input range should be verified for compatibility with the output. ZO  ZT ZT LVDS Receiver Figure 7A. Standard Termination LVDS Driver ZO  ZT C ZT 2 LVDS ZT Receiver 2 Figure 7B. Optional Termination LVDS Termination IDT8T49N205ANLGI REVISION B JULY 9, 2013 28 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Termination for 3.3V LVPECL Outputs The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned are recommended only as guidelines. transmission lines. Matched impedance techniques should be used to maximize operating frequency and minimize signal distortion. Figures 8A and 8B show two different layouts which are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board designers simulate to guarantee compatibility across all printed circuit and clock component process variations. The differential outputs are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources must be used for functionality. These outputs are designed to drive 50 R3 125 3.3V R4 125 3.3V 3.3V Zo = 50 + _ LVPECL Input Zo = 50 R1 84 Figure 8A. 3.3V LVPECL Output Termination IDT8T49N205ANLGI REVISION B JULY 9, 2013 R2 84 Figure 8B. 3.3V LVPECL Output Termination 29 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Termination for 2.5V LVPECL Outputs level. The R3 in Figure 9B can be eliminated and the termination is shown in Figure 9C. Figure 10A and Figure 9B show examples of termination for 2.5V LVPECL driver. These terminations are equivalent to terminating 50 to VCCO – 2V. For VCCO = 2.5V, the VCCO – 2V is very close to ground 2.5V VCCO = 2.5V 2.5V 2.5V VCCO = 2.5V R1 250 R3 250 50 + 50 + 50 – 50 2.5V LVPECL Driver – R1 50 2.5V LVPECL Driver R2 62.5 R2 50 R4 62.5 R3 18 Figure 9A. 2.5V LVPECL Driver Termination Example Figure 9B. 2.5V LVPECL Driver Termination Example 2.5V VCCO = 2.5V 50 + 50 – 2.5V LVPECL Driver R1 50 R2 50 Figure 9C. 2.5V LVPECL Driver Termination Example IDT8T49N205ANLGI REVISION B JULY 9, 2013 30 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT VFQFN EPAD Thermal Release Path In order to maximize both the removal of heat from the package and the electrical performance, a land pattern must be incorporated on the Printed Circuit Board (PCB) within the footprint of the package corresponding to the exposed metal pad or exposed heat slug on the package, as shown in Figure 10. The solderable area on the PCB, as defined by the solder mask, should be at least the same size/shape as the exposed pad/slug area on the package to maximize the thermal/electrical performance. Sufficient clearance should be designed on the PCB between the outer edges of the land pattern and the inner edges of pad pattern for the leads to avoid any shorts. and dependent upon the package power dissipation as well as electrical conductivity requirements. Thus, thermal and electrical analysis and/or testing are recommended to determine the minimum number needed. Maximum thermal and electrical performance is achieved when an array of vias is incorporated in the land pattern. It is recommended to use as many vias connected to ground as possible. It is also recommended that the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is desirable to avoid any solder wicking inside the via during the soldering process which may result in voids in solder between the exposed pad/slug and the thermal land. Precautions should be taken to eliminate any solder voids between the exposed heat slug and the land pattern. Note: These recommendations are to be used as a guideline only. For further information, please refer to the Application Note on the Surface Mount Assembly of Amkor’s Thermally/ Electrically Enhance Lead frame Base Package, Amkor Technology. While the land pattern on the PCB provides a means of heat transfer and electrical grounding from the package to the board through a solder joint, thermal vias are necessary to effectively conduct from the surface of the PCB to the ground plane(s). The land pattern must be connected to ground through these vias. The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are application specific PIN PIN PAD SOLDER EXPOSED HEAT SLUG GROUND PLANE THERMAL VIA SOLDER LAND PATTERN (GROUND PAD) PIN PIN PAD Figure 10. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale) IDT8T49N205ANLGI REVISION B JULY 9, 2013 31 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Schematic Layout Figure 11 (next page), shows an example of the UFT (8T49N205) application schematic. Input and output terminations shown are intended as examples only and may not represent the exact user configuration. Refer to the pin description and functional tables in the datasheet to ensure the logic control inputs are properly set. In order to achieve the best possible filtering, it is highly recommended that the 0.1µF capacitors on the device side of the ferrite beads be placed on the device side of the PCB as close to the power pins as possible. This is represented by the placement of these capacitors in the schematic. If space is limited, the ferrite beads and 10µf capacitors connected to 3.3V can be placed on the opposite side of the PCB. If space permits, place all filter components on the device side of the board. In this example, the device is operated at VCC=3.3V. For 2.5V option, please refer to the “Termination for 2.5V LVPECL Outputs” for output termination recommendation. A 12pF parallel resonant Fox FX325BS Series 16MHz to 40MHz crystal is used in this example. Different crystal frequencies may be used. The C1 = C2 = 5pF are recommended for frequency accuracy. If different crystal types are used, please consult IDT for recommendations. For different board layout, the C1 and C2 may be slightly adjusted for optimizing frequency accuracy. It is recommended that the loop filter components be laid out for the 3-pole option. This will also allow either 2-pole or 3-pole filter to be used. The 3-pole filter can be used for additional spur reduction. If a 2-pole filter construction is used, the LF0 and LF1 pins must be tied-together and to the filter. Power supply filter recommendations are a general guideline to be used for reducing external noise from coupling into the devices. The filter performance is designed for a wide range of noise frequencies. This low-pass filter starts to attenuate noise at approximately 10 kHz. If a specific frequency noise component is known, such as switching power supplies frequencies, it is recommended that component values be adjusted and if required, additional filtering be added. Additionally, good general design practices for power plane voltage stability suggests adding bulk capacitance in the local area of all devices. As with any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The UFT (8T49N205) provides separate VCC, VCCA and VCCO power supplies to isolate any high switching noise from coupling into the internal PLL. IDT8T49N205ANLGI REVISION B JULY 9, 2013 32 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT O utpu t Te rmina tion Exa mple L VDS outp ut sh own (Not e 3) Zo = Zo_D if f = 100-ohm + R1 VC C 3. 3V 100 C4 C5 C6 C7 0. 1uF 0. 1uF 0.1uF 0.1uF - F B1 VC C O VC C O m uR ata, BLM18BB221SN 1 C13 0.1uF C 14 C 15 10uF 0.1uF 3. 3V R 17 R4 125 125 Zo = 50-ohm FB2 R2 + 10 VC C Zo = 50-ohm m uR ata, BLM18BB221SN 1 C 12 C 11 0.1uF 0. 1uF 10uF U2 Fox FX325BS C2 5pF (Note 1) (Note 2)C LK_SEL 4 5 6 9 10 CLK0 L VDS Input T ermi natio n E xamp le ( Note 3) R5 (Note (Note (Note (Note 100 nC LK0 1) 2)P LL_BYP ASS 1)S _A0 1)S _A1 12 18 17 15 14 16 SCLK SDA TA (Note 1)C ON FIG V CC L VPEC L Inp ut T ermi natio n E xamp le ( Note 3) R 10 125 125 CLK1 CLK_SEL CLK0 CLK0 CLK1 CLK1 VC C A Q1 Q1 OE1 U FT PLL_BY PASS S_A0 S_A1 SC LK SD ATA CON FI G 8 21 35 (Note 2) R9 XTAL_IN XTAL_OU T LOC K_IN D C LK_A CTI VE H OLD OVER CLK0BAD CLK1BAD XTALBAD LF1 nc nc nc nc 1 2 Q0 Q0 OE0 LF0 27 26 28 24 23 22 84 84 OE1 (Note 1) LOCK_ IND CLK_ACTIVE HO LDOVER CL KBAD CL K1BAD XTALBAD 30 31 37 38 39 40 34 3-pole loop filter LF1 2- pole loop filter - (opt ional) 33 LF0 C3 R3 0. 001uF 220K R11 4. 7K R7 Outp ut T ermi nati on E xamp le LVPE CL o utpu t sh own (Not e 3) OE0 (Note 1) 19 20 11 32 X1 VC C O V CC VC C VC C V CC F p 2 1 C1 5pF 16MH z to 40MH z R6 36 C 10 10uF 25 3 7 13 29 C9 V EE VEE VEE C8 0.1uF R 12 4.7K Rs 1 Rs 470K 470K Cp1 C s1 nC LK1 Cp V CC R15 84 84 0. 001uF 1uF 0.001uF R 14 Cs 1uF Logic In put Pin Exam ples Notes VC C Set Logic Input to '1' RU 1 1K VC C Set Logic Input to '0' RU2 No t Installed To Logic Input pins To Logic Input pins RD 1 Not Installed RD 2 1K Note 1: CE0, OE1, CLK_SEL, PLL_BYPASS, S_A0 and S_A1 are digital control input s. If external pull-up/down needed, see "Logic Input Pin Examples" shown at left. Please note t hat OE0 and OE1 are internally pulled up so no external pull-ups are required to enable t hem. Note 2: CLK_SEL, PLL_BYPASS and CONFIG are internally pulled down. No external compononents required to select default condition. Note 3: Other configurations are supported. Please contact IDT for details. Figure 11. IDT8T49N205I Application Schematic IDT8T49N205ANLGI REVISION B JULY 9, 2013 33 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT LVPECL Power Considerations This section provides information on power dissipation and junction temperature for the IDT8T49N205I. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the IDT8T49N205I is the sum of the core power plus the output power dissipated due to loading. The following is the output power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating output power dissipated due to loading. • Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 320mA = 1108.8W • Power (outputs)MAX = 33.2mW/Loaded Output pair If all outputs are loaded, the total power is 2 * 33.2mW = 66.4mW Total Power_MAX (3.465V, with all outputs switching) = 1108.8mW + 66.4mW = 1175.2mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond wire and bond pad temperature remains below 125°C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 32.4°C/W per Table 9 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 1.175W * 32.4°C/W = 123.1°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (multi-layer). Table 9. Thermal Resistance JA for 40 Lead VFQFN, Forced Convection JA by Velocity Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards IDT8T49N205ANLGI REVISION B JULY 9, 2013 0 1 2.5 32.4°C/W 25.7°C/W 23.4°C/W 34 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT 3. Calculations and Equations. The purpose of this section is to calculate the power dissipation for the LVPECL output pairs. LVPECL output driver circuit and termination are shown in Figure 12. VCCO Q1 VOUT RL 50Ω VCCO - 2V Figure 12. LVPECL Driver Circuit and Termination To calculate output power dissipation due to loading, use the following equations which assume a 50 load, and a termination voltage of VCCO – 2V. • For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.7V (VCCO_MAX – VOH_MAX) = 0.7V • For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.5V (VCCO_MAX – VOL_MAX) = 1.5V Pd_H is power dissipation when the output drives high. Pd_L is the power dissipation when the output drives low. Pd_H = [(VOH_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOH_MAX) = [(2V – (VCCO_MAX – VOH_MAX))/RL] * (VCCO_MAX – VOH_MAX) = [(2V – 0.7V)/50] * 0.7V = 18.2mW Pd_L = [(VOL_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOL_MAX) = [(2V – (VCCO_MAX – VOL_MAX))/RL] * (VCCO_MAX – VOL_MAX) = [(2V – 1.5V)/50] * 1.5V = 15mW Total Power Dissipation per output pair = Pd_H + Pd_L = 33.2mW IDT8T49N205ANLGI REVISION B JULY 9, 2013 35 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT LVDS Power Considerations This section provides information on power dissipation and junction temperature for the IDT8T49N205I. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the IDT8T49N205I is the sum of the core power plus the output power dissipation due to the load. The following is the output power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results. • Power (core)MAX = VCC_MAX * (ICC_MAX + ICCA_MAX) = 3.465V * (273mA + 30mA) = 1049.895mW • Power (outputs)MAX = VCCO_MAX * ICCO_MAX = 3.465V * 42mA = 145.53mW Total Power_MAX = 1049.895mW + 145.53mW = 1195.425mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond wire and bond pad temperature remains below 125°C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 32.4°C/W per Table 10 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 1.195W * 32.4°C/W = 123.7°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (multi-layer). Table 10. Thermal Resistance JA for 40 Lead VFQFN, Forced Convection JA by Velocity Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards IDT8T49N205ANLGI REVISION B JULY 9, 2013 0 1 2.5 32.4°C/W 25.7°C/W 23.4°C/W 36 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Reliability Information Table 11. JA vs. Air Flow Table for a 40 Lead VFQFN JA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards 0 1 2.5 32.4°C/W 25.7°C/W 23.4°C/W Transistor Count The transistor count for IDT8T49N205I is: 53,727 IDT8T49N205ANLGI REVISION B JULY 9, 2013 37 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT 40 Lead VFQFN Package Outline and Package Dimensions IDT8T49N205ANLGI REVISION B JULY 9, 2013 38 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT 40 Lead VFQFN Package Outline and Package Dimensions, continued 40 Lead VFQFN, D2/E2 EPAD Dimensions: 4.65mm x 4.65mm IDT8T49N205ANLGI REVISION B JULY 9, 2013 39 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT Ordering Information Table 12. Ordering Information Part/Order Number 8T49N205A-dddNLGI Marking Package IDT8T49N205A-dddNLGI “Lead-Free” 40 Lead VFQFN Shipping Packaging Temperature Tray -40C to +85C 8T49N205A-dddNLGI8 IDT8T49N205A-dddNLGI “Lead-Free” 40 Lead VFQFN Tape & Reel -40C to +85C NOTE: For the specific -ddd order codes, refer to FemtoClock NG Universal Frequency Translator Ordering Product Information document. IDT8T49N205ANLGI REVISION B JULY 9, 2013 40 ©2013 Integrated Device Technology, Inc. IDT8T49N205I Data Sheet FEMTOCLOCK® NG UNIVERSAL FREQUENCY TRANSLATOR WITH PHASE BUILD-OUT We’ve Got Your Timing Solution 6024 Silver Creek Valley Road San Jose, California 95138 Sales 800-345-7015 (inside USA) +408-284-8200 (outside USA) Fax: 408-284-2775 www.IDT.com/go/contactIDT Technical Support Sales netcom@idt.com +480-763-2056 DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. Copyright 2013. All rights reserved. IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
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