RRH050P03TB1

RRH050P03 Pch -30V -5A Power MOSFET Datasheet lOutline VDSS -30V RDS(on) (Max.) 50mW ID -5A PD 2.0W SOP8 (7) (5) (6) (8) (4) (3) (1) (2) lInner circuit lFeatures 1) Low on - resistance. (1) (2) (3) (4) 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (SOP8). 4) Pb-free lead plating ; RoHS compliant Source Source Source Gate (5) (6) (7) (8) Drain Drain Drain Drain *1 ESD PROTECTION DIODE *2 BODY DIODE lPackaging specifications Packaging lApplication DC/DC Converter Type Taping Reel size (mm) 330 Tape width (mm) 12 Quantity (pcs) 2,500 Taping code TB Marking RRH050P03 lAbsolute maximum ratings(Ta = 25°C) Parameter Symbol Value Unit Drain - Source voltage VDSS -30 V Continuous drain current ID *1 5 A ID,pulse *2 20 A Gate - Source voltage VGSS 20 V Avalanche energy, single pulse EAS *3 0.2 mJ PD *4 2.0 W PD *5 0.65 W Tj 150 °C Tstg -55 to +150 °C Pulsed drain current Power dissipation Junction temperature Range of storage temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 lThermal resistance Parameter Symbol Values Min. Typ. Max. Unit Thermal resistance, junction - ambient RthJA *4 - - 62.5 °C/W Thermal resistance, junction - ambient RthJA *5 - - 125 °C/W lElectrical characteristics(Ta = 25°C) Parameter Drain - Source breakdown voltage Breakdown voltage temperature coefficient Symbol V(BR)DSS Conditions VGS = 0V, ID = -1mA ΔV(BR)DSS ID = -1mA ΔTj referenced to 25C Values Unit Min. Typ. Max. -30 - - V - -25 - mV/C Zero gate voltage drain current IDSS VDS = -30V, VGS = 0V - - -1 mA Gate - Source leakage current IGSS VGS = 20V, VDS = 0V - - 10 mA Gate threshold voltage VGS (th) VDS = -10V, ID = -1mA -1 - -2.5 V Gate threshold voltage temperature coefficient ΔV(GS)th ΔTj ID = -1mA referenced to 25°C - 3.9 - mV/C VGS= -10V, ID= -5A - 36 50 VGS= -4.5V, ID= -2.5A - 52 72 VGS= -4.0V, ID= -2.5A - 58 80 VGS= -10V, ID= -5A, Tj=125C - 45 63 RG f = 1MHz, open drain - 9.5 - W gfs *6 VDS = -10V, ID = -5A 4.0 8.0 - S Static drain - source on - state resistance Gate input resistannce Transconductance RDS(on) *6 mW *1 Limited only by maximum temperature allowed. *2 Pw  10ms, Duty cycle  1% *3 L ⋍ 10mH, VDD = -15V, Rg = 25W, starting Tj = 25°C *4 Mounted on a ceramic board (30×30×0.8mm) *5 Mounted on a FR4 (20×20×0.8mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 lElectrical characteristics(Ta = 25°C) Parameter Symbol Conditions Values Min. Typ. Max. Input capacitance Ciss VGS = 0V - 850 - Output capacitance Coss VDS = -10V - 120 - Reverse transfer capacitance Crss f = 1MHz - 120 - VDD ⋍ -15V, VGS = -10V - 9 - tr *6 ID = -2.5A - 25 - td(off) *6 RL = 6.0W - 55 - tf *6 RG = 10W - 30 - Turn - on delay time Rise time Turn - off delay time Fall time td(on) *6 Unit pF ns lGate Charge characteristics(Ta = 25°C) Parameter Total gate charge Symbol Qg *6 Gate - Source charge Qgs *6 Gate - Drain charge Qgd *6 Conditions Values Min. Typ. Max. VDD ⋍ -15V, ID = -5A VGS = -5V - 9.2 - VDD ⋍ -15V, ID = -5A VGS = -10V - 17 - - 2.4 - - 3.6 - VDD ⋍ -15V, ID = -5A VGS = -5V Unit nC lBody diode electrical characteristics (Source-Drain)(Ta = 25°C) Parameter Inverse diode continuous, forward current Forward voltage Symbol IS *1 VSD *6 Reverse recovery time trr *6 Reverse recovery charge Qrr *6 Conditions Values Unit Min. Typ. Max. Ta = 25°C - - -1.6 A VGS = 0V, Is = -5.0A - - -1.2 V IS = -5A di/dt = 100A / ms - 20 40 ns - 15 30 mC *6 Plused www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area 120 100 PW = 1ms 10 80 60 40 20 0 0 50 100 150 PW = 10ms 1 0.1 0.01 200 Operation in this area is limited by RDS(on) (VGS = 10V) DC Operation Ta=25ºC Single Pulse Mounted on a ceramic board. (30mm × 30mm × 0.8mm) 0.1 1 10 100 Drain - Source Voltage : -VDS [V] Junction Temperature : Tj [°C] Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width Fig.4 Single Pluse Maxmum Power dissipation 10 10000 Ta=25ºC Single Pulse Ta=25ºC Single Pulse 1 top D=1 D=0.5 D=0.1 D=0.05 D=0.01 bottom Signle 0.1 0.01 0.001 0.0001 Rth(ch-a)=62.5ºC/W Rth(ch-a)(t)=r(t)×Rth(ch-a) Mounted on ceramic board (30mm × 30mm × 0.8mm) 0.01 1 Peak Transient Power : P(W) Normalized Transient Thermal Resistance : r(t) PW = 100μs 100 Drain Current : -ID [A] Power Dissipation : PD/PD max. [%] lElectrical characteristic curves 100 10 1 0.0001 100 0.01 1 100 Pulse Width : PW [s] Pulse Width : PW [s] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1000 4/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 lElectrical characteristic curves Fig.6 Avalanche Energy Derating Curve vs Junction Temperature 100 120% Starting Tch=25ºC VDD= -15V VGS= -10V RG=10W Single Pulse Avalanche Current : -IAR [A] 10 1 0.1 0.01 0.01 0.1 1 10 100 Avalanche Energy : EAS / EAS max. [%] Fig.5 Avalanche Current vs Inductive Load 100% 80% 60% 40% 20% 0% 0 Coil Inductance : L [mH] 25 50 75 100 125 150 175 Junction Temperature : Tj [ºC] Fig.7 Typical Output Characteristics(I) Fig.8 Typical Output Characteristics(II) 10 10 Ta= 25ºC 6 VGS= -3.5V 4 VGS= -3.0V 2 0 0.2 0.4 0.6 0.8 VGS= -3.0V 6 4 2 0 1.0 0 2 4 6 8 10 Drain - Source Voltage : -VDS [V] Drain - Source Voltage : -VDS [V] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. Ta= 25ºC VGS= -2.5V VGS= -2.5V 0.0 VGS= -10V VGS= -4.5V VGS= -3.5V 8 Drain Current : -ID [A] Drain Current : -ID [A] 8 VGS= -10V VGS= -4.5V VGS= -4.0V 5/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 Fig.9 Breakdown Voltage vs. Junction Temperature Fig.10 Typical Transfer Characteristics 60 10 VDS = -10V VGS=0V ID= -1mA Drain Current : -ID [A] 1 40 20 0 -50 0 50 100 0.01 0.001 150 Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 0.1 1.0 Junction Temperature : Tj [°C] 1.5 2.0 2.5 3.0 Gate - Source Voltage : -VGS [V] Fig.11 Gate Threshold Voltage vs. Junction Temperature Fig.12 Transconductance vs. Drain Current 3 100 VDS= -10V ID= -1mA VDS = -10V Transconductance : gfs [S] Gate Threshold Voltage : -VGS(th) [V] Drain - Source Breakdown Voltage : -V(BR)DSS [V] lElectrical characteristic curves 2 1 0 -50 0 50 100 Ta = -25ºC Ta = 25ºC Ta = 75ºC Ta = 125ºC 1 0 150 Junction Temperature : Tj [°C] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 10 0.1 1.0 10.0 Drain Current : -ID [A] 6/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 lElectrical characteristic curves Fig.14 Static Drain - Source On - State Resistance vs. Gate Source Voltage 1.2 200 Drain Current Dissipation : ID / ID max. (%) 1 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 100 125 150 Static Drain - Source On-State Resistance : RDS(on) [mW] Fig.13 Drain Current Derating Curve Ta= 25ºC 180 160 140 ID= -5.0A 120 100 ID= -2.5A 80 60 40 20 0 Junction Temperature : Tj [ºC] 2 4 6 8 10 12 14 Gate - Source Voltage : VGS [V] 1000 60 Ta= 25ºC VGS= -4.0V VGS= -4.5V VGS= -10V 100 10 0.1 1 10 Static Drain - Source On-State Resistance : RDS(on) [mW] Fig.16 Static Drain - Source On - State Resistance vs. Junction Temperature Static Drain - Source On-State Resistance : RDS(on) [mW] Fig.15 Static Drain - Source On - State Resistance vs. Drain Current(I) Drain Current : ID [A] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 40 20 VGS= -10V ID= -5.0A 0 -50 -25 0 25 50 75 100 125 150 Junction Temperature : Tj [ºC] 7/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 lElectrical characteristic curves Fig.17 Static Drain - Source On - State Resistance vs. Drain Current(II) Fig.18 Static Drain - Source On - State Resistance vs. Drain Current(III) 1000 VGS = -10V Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 100 10 0.1 1 10 Static Drain - Source On-State Resistance : RDS(on) [mW] Static Drain - Source On-State Resistance : RDS(on) [mW] 1000 Drain Current : -ID [A] VGS= -4.5V Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 100 10 0.1 1 10 Drain Current : I-D [A] Fig.19 Static Drain - Source On - State Resistance vs. Drain Current(IV) Static Drain - Source On-State Resistance : RDS(on) [mW] 1000 VGS= -4.0V 100 Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 10 1 0.1 1 10 Drain Current : -ID [A] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 8/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 lElectrical characteristic curves Fig.20 Typical Capacitance vs. Drain - Source Voltage Fig.21 Switching Characteristics 10000 10000 Capacitance : C [pF] Ciss Switching Time : t [ns] Ta = 25ºC f=1MHz VGS=0V 1000 Crss 100 Coss 1000 td(off) tf 100 10 td(on) 10 0.01 0.1 1 10 1 100 0.0 tr 0.1 1.0 10.0 Drain Current : -ID [A] Drain - Source Voltage : -VDS [V] Fig.22 Dynamic Input Characteristics Fig.23 Source Current vs. Source Drain Voltage 10 10 VGS = 0V 8 Source Current : -IS [A] Gate - Source Voltage : -VGS [V] Ta = 25ºC VDD= -15V VGS= -10V RG=10W 6 4 Ta = 25ºC VDD= -15V ID= -5.0A RG=10W 2 0 0 5 10 15 Total Gate Charge : Qg [nC] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 0.1 0.01 20 Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Source-Drain Voltage : -VDS [V] 9/11 2017.08 2012.06 -- Rev.D Rev.C Datasheet RRH050P03 Measurement circuits Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 10/11 2017.08 - Rev.D Datasheet RRH050P03 lDimensions (Unit : mm) e c L1 Lp E HE SOP8 b x A3 S A l1 D A1 A2 A b2 e A S e1 y s Patterm of terminal position areas DIM A A1 A2 A3 b c D E e HE L1 Lp x y DIM b2 e1 l1 MILIMETERS MIN MAX 1.75 0.15 1.40 1.60 0.25 0.30 0.50 0.10 0.30 4.80 5.20 3.75 4.05 1.27 5.70 6.30 0.50 0.70 0.65 0.85 0.15 0.10 MILIMETERS MIN MAX 0.65 5.15 1.15 INCHES MIN - MAX 0.069 0.006 0.055 0.063 0.01 0.012 0.004 0.189 0.148 0.02 0.012 0.205 0.159 0.05 0.224 0.02 0.026 0.248 0.028 0.033 0.006 0.004 INCHES MIN - MAX 0.026 0.203 - 0.045 Dimension in mm/inches www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 11/11 2017.08 2012.06 -- Rev.D Rev.C Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. 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Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001