RW1C026ZP
Pch -20V -2.5A Middle Power MOSFET
Datasheet
l Outline
RDS(on)(Max.)
70mΩ
ID
±2.5A
PD
0.7W
WEMT6
or
-20V
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VDSS
l Inner circuit
l Features
1) Low on - resistance.
2) High Power small mold Package (WEMT6).
3) Pb-free lead plating ; RoHS compliant.
4) Halogen Free.
l Packaging specifications
Packing
l Application
Switching
Type
Reel size (mm)
Tape width (mm)
Basic ordering unit (pcs)
Taping code
Marking
Embossed
Tape
180
8
8000
T2CR
ZK
R
l Absolute maximum ratings (Ta = 25°C)
Parameter
Symbol
VDSS
ID
ID,pulse*1
VGSS
PD*2
Tj
Tstg
N
ot
Drain - Source voltage
Continuous drain current
Pulsed drain current
Gate - Source voltage
Power dissipation
Junction temperature
Range of storage temperature
Value
Unit
-20
±2.5
±10
±10
0.7
150
-55 to +150
V
A
A
V
W
℃
℃
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© 2014 ROHM Co., Ltd. All rights reserved.
1/11
20140707 - Rev.001
Datasheet
l Thermal resistance
Parameter
Symbol
RthJA*2
Thermal resistance, junction - ambient
Values
Min.
Typ.
Max.
-
179
-
l Electrical characteristics (T a = 25°C)
Symbol
Conditions
Values
Min.
Drain - Source breakdown
voltage
Breakdown voltage
temperature coefficient
V(BR)DSS VGS = 0V, ID = -1mA
ΔV(BR)DSS ID = -1mA
ΔTj referenced to 25℃
℃/W
Unit
Typ.
Max.
-20
-
-
V
-
-21.9
-
mV/℃
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Parameter
Unit
or
RW1C026ZP
Zero gate voltage
drain current
IDSS
VDS = -20V, VGS = 0V
-
-
-1
μA
Gate - Source leakage current
IGSS
VGS = ±10V, VDS = 0V
-
-
±10
μA
VGS(th)
VDS = -10V, ID = -1mA
-0.3
-
-1
V
-
2.4
-
mV/℃
VGS = -4.5V, ID = -2.5A
-
50
70
VGS = -2.5V, ID = -1.2A
-
65
90
VGS = -1.8V, ID = -1.2A
-
85
130
VGS = -1.5V, ID = -0.5A
-
100
200
VDS = -10V, ID = -2.5A
2.2
-
-
Gate threshold voltage
Gate threshold voltage
temperature coefficient
ΔVGS(th) ID = -1mA
ΔTj referenced to 25℃
Static drain - source
on - state resistance
gfs*3
mΩ
S
R
Transconductance
RDS(on)*3
ot
*1 Pw ≦ 10μs, Duty cycle ≦ 1%
*2 MOUNTED ON A CERAMIC BOARD
N
*3 Pulsed
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© 2014 ROHM Co., Ltd. All rights reserved.
2/11
20140707 - Rev.001
RW1C026ZP
Datasheet
l Electrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Ciss
VGS = 0V
-
1250
-
Output capacitance
Coss
VDS = -10V
-
100
-
Reverse transfer capacitance
Crss
f = 1MHz
-
VDD ⋍ -10V,VGS = -4.5V
-
tr*3
ID = -1.2A
td(off)*3
tf*3
Rise time
Turn - off delay time
Fall time
td(on)*3
30
-
170
-
-
290
-
RL = 8.3Ω
-
2550
-
RG = 10Ω
-
850
-
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Turn - on delay time
pF
or
Input capacitance
ns
l Gate charge characteristics (Ta = 25°C)
Values
Parameter
Symbol
Total gate charge
Qg*3
Gate - Source charge
Qgs*3
Gate - Drain charge
Qgd*3
Conditions
VDD ⋍ -10V, ID = -2.5A
VGS = -4.5V
Min.
Typ.
Max.
-
10
-
-
2.1
-
-
2.0
-
Unit
nC
R
l Body diode electrical characteristics (Source-Drain) (Ta = 25°C)
ot
Parameter
N
Body diode continuous
forward current
Values
Symbol
Conditions
IS
Min.
Typ.
Max.
-
-
-0.5
Ta = 25℃
Body diode
pulse current
ISP*1
Forward voltage
VSD*3
VGS = 0V, IS = -2.5A
Unit
A
-
-
-10
-
-
-1.2
V
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© 2014 ROHM Co., Ltd. All rights reserved.
3/11
20140707 - Rev.001
RW1C026ZP
Datasheet
l Electrical characteristic curves
Fig.2 Maximum Safe Operating Area
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Fig.1 Power Dissipation Derating Curve
Fig.4 Single Pulse Maximum Power
dissipation
N
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Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
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© 2014 ROHM Co., Ltd. All rights reserved.
4/11
20140707 - Rev.001
RW1C026ZP
Datasheet
l Electrical characteristic curves
Fig.6 Typical Output Characteristics(II)
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Fig.5 Typical Output Characteristics(I)
Fig.8 Typical Transfer Characteristics
N
ot
R
Fig.7 Breakdown Voltage vs. Junction
Temperature
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© 2014 ROHM Co., Ltd. All rights reserved.
5/11
20140707 - Rev.001
RW1C026ZP
Datasheet
l Electrical characteristic curves
Fig.10 Tranceconductance vs. Drain
Current
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Fig.9 Gate Threshold Voltage vs. Junction
Temperature
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
N
ot
R
Fig.11 Drain Current Derating Curve
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© 2014 ROHM Co., Ltd. All rights reserved.
6/11
20140707 - Rev.001
RW1C026ZP
Datasheet
l Electrical characteristic curves
Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current(I)
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Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperature
Fig.16 Static Drain - Source On - State
Resistance vs. Drain Current(III)
N
ot
R
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(II)
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© 2014 ROHM Co., Ltd. All rights reserved.
7/11
20140707 - Rev.001
RW1C026ZP
Datasheet
l Electrical characteristic curves
Fig.18 Static Drain - Source On - State
Resistance vs. Drain Current(Ⅴ)
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Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current(Ⅳ)
Fig.20 Switching Characteristics
N
ot
R
Fig.19 Typical Capacitance vs. Drain Source Voltage
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© 2014 ROHM Co., Ltd. All rights reserved.
8/11
20140707 - Rev.001
RW1C026ZP
Datasheet
l Electrical characteristic curves
Fig.22 Source Current vs. Source Drain
Voltage
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Fig.21 Dynamic Input Characteristics
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© 2014 ROHM Co., Ltd. All rights reserved.
9/11
20140707 - Rev.001
RW1C026ZP
Datasheet
l Measurement circuits
Fig.1-2 Switching Waveforms
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Fig.1-1 Switching Time Measurement Circuit
Fig.2-2 Gate Charge Waveform
N
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Fig.2-1 Gate Charge Measurement Circuit
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© 2014 ROHM Co., Ltd. All rights reserved.
10/11
20140707 - Rev.001
RW1C026ZP
Datasheet
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l Dimensions
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© 2014 ROHM Co., Ltd. All rights reserved.
11/11
20140707 - Rev.001
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or
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