ALED8102SXTTR

ALED8102S Datasheet 8 channel LED driver with direct switch control Features HTSSOP16 (Exposed pad) • • • • • • • • • 8 constant current output channels controlled by four switch inputs Output enable input for global dimming Output current: from 5 mA to 100 mA Current programmable through external resistor Supply voltage: 3 V to 5.5 V Thermal shutdown 20 V current generator rated voltage Available in high thermal efficiency HTSSOP exposed pad package ESD protection 2.0 kV HBM, 100 V MM Applications • Automotive LED interior and exterior lighting – Clusters – LCD back-light – Ambient light – Dome light – Rear combination light Description Maturity status link ALED8102S Device summary Order code ALED8102SXTTR Package HTSSOP16 Packing 2500 parts per reel The ALED8102S is a monolithic, low voltage, 8 low-side channels. The ALED8102S guarantees up to 20 V output driving capability allowing users to connect several LEDs in series. In the output stage, 8 regulated current sources provide from 5 mA to 100 mA constant current to drive the LEDs. Current is programmed though a single external resistor. The ALED8102S is equipped with a thermal management that protects the device forcing it in shutdown (typically: power-off at 170 °C with 15 °C hysteresis to restart). The thermal protection switches OFF the output channels only. The operative supply voltage range is between 3 V and 5.5 V. The output control is provided by four switch inputs, proving an on/off toggle action suitable also for local dimming. Moreover, on all active output LEDs brightness can be adjusted with a global PWM signal applied to the output enable pin (OE). Outputs can be connected in parallel, or left unconnected if not used, as required by the application. DS12430 - Rev 1 - January 2018 For further information contact your local STMicroelectronics sales office. www.st.com/ ALED8102S Pin description 1 Pin description Figure 1. Pinout for HTSSOP16 GND VDD SW1 R-EXT SW2 OE SW3 SW4 OUT0 OUT7 OUT1 OUT6 OUT2 OUT5 OUT3 OUT4 Table 1. Pin description DS12430 - Rev 1 HTSSOP16 Symbol Name and function 1 GND Ground terminal 2 SW1 Providing local dimming capability 3 SW2 Providing local dimming capability 4 SW3 Providing local dimming capability 5-12 OUT0-OUT7 Output terminals 13 SW4 Providing local dimming capability 14 OE Global PWM brightness control input terminal (it must be connected to GND if not used) 15 R-EXT Terminal for external resistor for constant current programming 16 VDD Supply voltage terminal page 2/19 ALED8102S Simplified internal block diagram 2 Simplified internal block diagram Figure 2. ALED8102S simplified block diagram SWx DS12430 - Rev 1 page 3/19 ALED8102S Absolute maximum ratings 3 Absolute maximum ratings Stressing the device above the ratings listed in the table below may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute maximum ratings 3.1 Symbol Parameter Value Unit VDD Supply voltage 0 to 7 V VO Output voltage - 0.5 to 20 V IO Output current 100 mA VI Input voltage -0.4 to VDD V IGND GND terminal current 800 mA ESD Electrostatic discharge protection HBM human body model ±2 KV Electrostatic discharge protection MM machine model 100 V Thermal characteristics Table 3. Thermal characteristics Symbol Parameter Value Unit TJ Operative junction temperature range -40 to +150 °C TSTG Storage ambient temperature range -55 to +150 Rthj-amb Thermal resistance junction-ambient (HTSSOP16) (1) 37.5 °C/W 1. The exposed pad should be soldered directly to the PCB to realize the thermal benefits. DS12430 - Rev 1 page 4/19 ALED8102S Electrical characteristics 4 Electrical characteristics VDD = 5 V, Tj = -40 to 125 °C, REXT = 386 Ω, VO = 0.85 V unless otherwise specified. Table 4. Electrical characteristics Symbol Parameter VDD Supply voltage VUVLO UVLO threshold (rising) Conditions UVLO threshold (falling) HyUVLO UVLO hysteresis VO Output voltage (1)(2) VIH SWx / OE input voltage Min. Typ. Max. Unit 3.0 - 5.5 V 2.7 2.9 2.1 2.3 0.4 OUT0 – OUT7 VIL 0.85 - 19 0.8VDD - VDD GND - 0.2VDD RUP Pull-up resistor for OE pin - 300 - RDW Pull-down resistor for SWx pins - 310 - REXT External current set-up resistance - - 3.9 IDD(OFF1) Supply current (OFF) OUT0 to 7 = OFF - 7 8 REXT = 190 Ω - 14 16 - 14 16 VO from 1 V to 3 V; - 0.1 - VDD from 3 V to 5.5 V - 1 - IDD(OFF2) KΩ mA OUT0 to 7 = OFF IDD(ON) Supply current (ON) REXT = 190 Ω VO = 1.4 V OUT0 to 7 = ON %/dVO Output current vs. outputvoltage regulation %/dVDD Output current vs. supply voltage regulation (1)(4) ∆IOL Output current precision: chip to chip (1) - - ±6 % ∆IOL1 Output current precision: channel to channel (1) (5) - ±1.5 ±4 % VO = 1.4 V; REXT = 190 Ω - ±1.2 ±4 VO = 19 V OUTn = OFF - 0.5 2 (1) (3) ∆IOL2 |%/V| IOleak Single output leakage current µA Tsd Thermal shutdown (6) 170 °C Tsd_hys Thermal shutdown hysteresis (6) 15 °C 1. Test with just one output ON. 2. Minimum regulation voltage @ IO = 50 mA. 3. 4. Δ % /V = Δ % /V = Ion@Von3.0V − Ion@Von1.0V 100 × Ion@Von = 1.0V 3−1 Ion@VDD = 5.5V − Ion@VDD = 3.0V 100 × 5.5 − 1 Ion@VDD = 3.0V 5. ((IOn – IOavg0-7)/ IOavg0-7) x 100. 6. Not tested in production. DS12430 - Rev 1 page 5/19 ALED8102S Switching characteristics 5 Switching characteristics VDD = 5 V, Tj = 25 °C, IO = 50 mA, RL = 60 Ω, CL = 10 pF, VL = 5 V, unless otherwise specified. Table 5. Switching characteristics Symbol tPLH1 tPLH2 tPHL1 tPHL2 tON tOFF tW(OE) Parameter Conditions Min. Typ. Max. Unit ns SWx – OUTn Propagation delay time VDD = 3.3 V - 220 - (OE just “0”) (“L” to “H”) VDD = 5 V - 200 - OE - OUTn Propagation delay time VDD = 3.3 V - 220 - (SWx just “1”) (“L” to “H”) VDD = 5 V - 200 - SWx – OUTn Propagation delay time VDD = 3.3 V - 100 - (OE just “0”) (“H” to “L”) VDD = 5 V - 100 - OE - OUTn Propagation delay time VDD = 3.3 V - 90 - (SWx just “1”) (“H” to “L”) VDD = 5 V - 100 - OUTn Current rise time. VDD = 3.3 V - 430 - Evaluated as OUTn falling time VDD = 5 V - 400 - OUTn current fall time. VDD = 3.3 V - 430 - Evaluated as OUTn rising time VDD = 5 V - 400 - 1 - - Output enable minimum pulse width µs Figure 3. tON - tOFF time evaluation Figure 4. tPLH - tPHL time evaluation DS12430 - Rev 1 page 6/19 ALED8102S Simplified internal block diagram 6 Simplified internal block diagram Inputs OE and SWx terminals have pull-up and pull-down connection respectively: Figure 5. OE Terminal VDD 300 KW OE 1 KW GND Figure 6. SWx Terminals VDD 1 KW SWx 300 KW GND DS12430 - Rev 1 page 7/19 ALED8102S The switch output control 7 The switch output control All switch inputs (SWx) are pulled down by a 300 kΩ. If the generic SWx pin is left floating or connected to GND or polarized at low logic level, the corresponding outputs are in OFF condition. If SWx pin is connected to VDD or polarized at high logic level, the corresponding outputs are in ON condition. See below the complete truth table: Table 6. Switch output control Switch inputs Outputs controlled (ON/OFF) SW1 OUT0 and OUT1 simultaneously SW2 OUT2 and OUT3 simultaneously SW3 OUT4 and OUT5 simultaneously SW4 OUT6 and OUT7 simultaneously Table 7. Switches vs. output truth table DS12430 - Rev 1 SW4 SW3 SW2 SW1 OE Out0 Out1 Out2 Out3 Out4 Out5 Out6 Out7 0 0 0 0 x off off off off off off off off 0 0 0 1 0 on on off off off off off off 0 0 1 0 0 off off on on off off off off 0 0 1 1 0 on on on on off off off off 0 1 0 0 0 off off off off on on off off 0 1 0 1 0 on on off off on on off off 0 1 1 0 0 off off on on on on off off 0 1 1 1 0 on on on on on on off off 1 0 0 0 0 off off off off off off on on 1 0 0 1 0 on on off off off off on on 1 0 1 0 0 off off on on off off on on 1 0 1 1 0 on on on on off off on on 1 1 0 0 0 off off off off on on on on 1 1 0 1 0 on on off off on on on on 1 1 1 0 0 off off on on on on on on 1 1 1 1 0 on on on on on on on on x x x x 1 off off off off off off off off page 8/19 ALED8102S Typical characteristics 8 Typical characteristics Figure 7. ISET vs. dropout voltage (VDROP @ 25 °C) 910 810 Vdrop (mV) 710 610 Vdd 5.0 V Vdd 3.0 V 510 410 310 210 110 10 0 10 20 30 40 50 60 70 80 90 100 110 Iset (mA) Table 8. Table settings Vdd Iset (mA) Rext (Ω) VDROP min. (mV) VDROP max. (mV) VDROP AVG (mV) 3 5 3930 46.5 52.9 48.63 10 1910 80.9 100 82.26 20 963 150 161 157 50 386 392 396 394.3 80 241 636 646 640.3 100 192 846 850 848 5 3930 40.8 41.7 41.16 10 1910 80.1 105 89.2 20 963 153 154 154 5 DS12430 - Rev 1 50 386 379 386 382 80 241 618 626 621 100 192 825 830 827 page 9/19 ALED8102S Typical application 9 Typical application Figure 8. Typical application circuit Typical application circuit The figure above shows a typical application schematic for the ALED8102S, Cled value depends on common rail voltage connection length and driver total output current, typically it is around 47 µF; Cin is about 1 µF; current setting resistor depends on output current set (ex. with REXT = 386 Ω → IO ≈ 50 mA). The external programming resistor between R-EXT and GND should be connected as close as possible to the device. To have the proper device functionality, it is strongly suggested to follow a correct power-up sequence: VDD and VLED power supplies must be provided simultaneously or at least, VDD must be connected before VLED so to activate all internal digital control blocks earlier than LEDs power supply. If VLED anticipates driver VDD, this could result in a visible flash on connected LEDs (output stage undesired activation). Device thermal management The aim of this section is to provide some recommendation that can be useful to design the application PCB for a better power dissipation: • • • • • • • To decrease the device working temperature, the package exposed pad needs soldering to the board. To improve thermal performance at least a 4-layer (e.g. 2S2P) PCB should be used. The copper area below the package thermal pad should be as wide as possible also outside the package perimeter (using the package sides without pins) A reasonable number of vias must connect the copper area below the package to all available PCB layers especially just below the device package (e.g. 3x3 or 4x3 vias array) but also outside the package perimeter. The smaller and closely spaced vias are, the better solution is. The best implementation is represented by copper filled vias. On each inner layer a copper area must be provided for dissipation (wider it is better, if possible at least 4 times or more the package dimensions). A good condition is to have at least a power layer as an entire copper area (e.g. GND layer) Traces for pin connection must be as wide as layout constrains allow Several devices in power dissipation on the same board must be properly spaced. Figure 9 shows, once the maximum power dissipation is fixed, which ambient temperature range can be covered according to the maximum junction temperature and package thermal resistance: 37.5 °C/W for HTSSOP16 on DS12430 - Rev 1 page 10/19 ALED8102S Typical application Jedec PCB (2S2P) and conditions. With the same thermal resistance, figure 10 shows the junction temperature as a function of ambient temperature considering 1 W of power dissipation. Figure 9. Power dissipation rating vs. ambient temperature (Rth = 37.5 °C/W; Tj = 125 °C) 5.00 4.50 4.00 Tj=125 °C Rth=37.5 °C/W Pd [ W ] 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 -40 -20 0 20 40 60 80 100 120 140 Ta [ °C ] Figure 10. Junction temperature vs. ambient temperature (Rth = 37.5°C/W; Pd = 1 W) 140 120 Tj [ °C/W ] 100 80 Pd=1W Rth=37.5 °C/W 60 40 20 0 -40 -20 0 20 40 60 80 100 120 140 Ta [ °C ] DS12430 - Rev 1 page 11/19 ALED8102S Package information 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DS12430 - Rev 1 page 12/19 ALED8102S HTSSOP16 package information 10.1 HTSSOP16 package information Figure 11. HTSSOP16 exposed pad package outline 7419276_B Table 9. HTSSOP16 exposed pad mechanical data Dim. mm Min. Max. A 1.20 A1 0.15 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 4.90 5.00 5.10 D1 2.80 3.00 3.20 E 6.20 6.40 6.60 E1 4.30 4.40 4.50 E2 2.80 3.00 3.20 e L k aaa 1.00 1.05 0.65 0.45 L1 DS12430 - Rev 1 Typ. 0.60 0.75 1.00 0.00 8.00 0.10 page 13/19 ALED8102S HTSSOP16 packing information 10.2 HTSSOP16 packing information Figure 12. HTSSOP16 tape and reel outline Table 10. HTSSOP16 tape and reel mechanical data Dim. mm Min. A Max. 330 C 12.8 D 20.2 N 60 T DS12430 - Rev 1 Typ. 13.2 22.4 Ao 6.7 6.9 Bo 5.3 5.5 Ko 1.6 1.8 Po 3.9 4.1 P 7.9 8.1 page 14/19 ALED8102S Revision history Table 11. Document revision history DS12430 - Rev 1 Date Version 29-Jan-2018 1 Changes Initial release. page 15/19 ALED8102S Contents Contents 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Simplified internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.1 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Simplified internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 The switch output control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Typical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Typical application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 10 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 10.1 HTSSOP16 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 10.2 HTSSOP16 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 DS12430 - Rev 1 page 16/19 ALED8102S List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Pin description. . . . . . . . . . . . . . . . . . . . Absolute maximum ratings . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . Electrical characteristics . . . . . . . . . . . . . Switching characteristics. . . . . . . . . . . . . Switch output control . . . . . . . . . . . . . . . Switches vs. output truth table . . . . . . . . . Table settings . . . . . . . . . . . . . . . . . . . . HTSSOP16 exposed pad mechanical data HTSSOP16 tape and reel mechanical data Document revision history . . . . . . . . . . . . DS12430 - Rev 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 . 4 . 4 . 5 . 6 . 8 . 8 . 9 13 14 15 page 17/19 ALED8102S List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. DS12430 - Rev 1 Pinout for HTSSOP16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ALED8102S simplified block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tON - tOFF time evaluation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tPLH - tPHL time evaluation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OE Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SWx Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISET vs. dropout voltage (VDROP @ 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power dissipation rating vs. ambient temperature (Rth = 37.5 °C/W; Tj = 125 °C) Junction temperature vs. ambient temperature (Rth = 37.5°C/W; Pd = 1 W) . . . . HTSSOP16 exposed pad package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . HTSSOP16 tape and reel outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 . 3 . 6 . 6 . 7 . 7 . 9 10 11 11 13 14 page 18/19 ALED8102S IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12430 - Rev 1 page 19/19