BULD741T4

BULD741T4 Datasheet High voltage fast-switching NPN power transistor Features • • • • TAB 2 3 1 High voltage capability Low spread of dynamic parameters Minimum lot-to-lot spread for reliable operation Very high switching speed DPAK Applications C(2, TAB) • • Electronic ballast for fluorescent lighting Switch mode power supplies B(1) Description The BULD741T4 is manufactured using high voltage multi-epitaxial planar technology to enhance switching speeds and high voltage capability. E(3) SC06960_TAB Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand a high collector current level during breakdown condition, without using the transil protection usually necessary in typical converters for lamp ballast. Product status link BULD741T4 Product summary Order code BULD741T4 Marking BULD741 Package DPAK Packing Tape and reel DS5049 - Rev 3 - July 2022 For further information contact your local STMicroelectronics sales office. www.st.com BULD741T4 Electrical ratings 1 Electrical ratings Table 1. Absolute maximum rating Symbol Parameter Value Unit V(BR)EBO V VEBO Emitter-base voltage (IC = 0 A, IB = 2 A, tP < 10 ms) VCES Collector-emitter voltage (VBE = 0 V) 1050 V VCEO Collector-emitter voltage (IB = 0 A) 400 V Collector current 2.5 A 5 A 1.5 A Base peak current (tP < 5 ms) 3 A PTOT Total power dissipation at TC = 25 °C 30 W Tstg Storage temperature range -65 to 150 °C 150 °C IC ICM IB IBM TJ Collector peak current (tP < 5 ms) Base current Maximum operating junction temperature Table 2. Thermal data Symbol RthJC DS5049 - Rev 3 Parameter Thermal resistance, junction-to-case Value Unit 4.16 °C/W page 2/14 BULD741T4 Electrical characteristics 2 Electrical characteristics TC = 25 °C unless otherwise specified. Table 3. Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit ICES Collector cut-off current VCE = 1050 V, VBE = 0 V 0.2 10 µA ICEO Collector cut-off current VCE = 400 V, IB = 0 A 10 250 µA Collector-emitter sustaining voltage IC = 10 mA, IB = 0 A 400 450 V(BR)EBO Emitter-base breakdown voltage IC = 0 A, IE = 1 mA 15 19 24 VCE(sat) (1) Collector-emitter saturation voltage IC = 0.7 A, IB = 0.14 A 0.15 0.5 IC = 2 A, IB = 0.6 A 0.5 1.5 VBE(sat) (1) Base-emitter saturation voltage IC = 2 A, IB = 0.6 A 1.1 1.5 VCEO(sus) (1) hFE (1) DC current gain V IC = 0.1 A, VCE = 5 V 48 70 100 IC = 0.45 A, VCE = 3 V 25 35 50 V V V Resistive load VCC = 125 V, IC = 1 A, ts Storage time IB(on) = -IB(off) = 0.2 A, 2.5 3.5 μs tf Fall time tp= 300 μs, VBE(off) = -5 V 350 500 ns EAR Repetitive avalanche energy L= 2 mH, C= 1.8 nF, VBE(off)= -5 V 5 mJ 1. Pulsed: Pulse duration = 300 μs, duty cycle ≤1.5%. DS5049 - Rev 3 page 3/14 BULD741T4 Electrical characteristics (curves) 2.1 Electrical characteristics (curves) Figure 1. Safe operating area Figure 2. Derating curve Figure 3. Output characteristics Figure 4. Reverse biased safe operating area Figure 5. DC current gain (VCE = 3 V) Figure 6. DC current gain (VCE = 5 V) DS5049 - Rev 3 page 4/14 BULD741T4 Electrical characteristics (curves) Figure 7. Base-emitter saturation voltage Figure 8. Collector-emitter saturation voltage Figure 9. Resistive load switching on times (hFE = 5) Figure 10. Resistive load switching on times (hFE = 10) Figure 11. Resistive load switching off times (hFE = 5) Figure 12. Resistive load switching off times (hFE = 10) DS5049 - Rev 3 page 5/14 BULD741T4 Test circuits 3 Test circuits Figure 13. Resistive load switching test circuit Figure 14. Energy rating test circuit DS5049 - Rev 3 page 6/14 BULD741T4 Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 4.1 DPAK (TO-252) type C package information Figure 15. DPAK (TO-252) type C package outline 0068772_C_31 DS5049 - Rev 3 page 7/14 BULD741T4 DPAK (TO-252) type C package information Table 4. DPAK (TO-252) type C mechanical data Dim. mm Min. Typ. Max. A 2.20 2.30 2.38 A1 0.90 1.01 1.10 A2 0.00 0.10 b 0.72 0.85 b4 5.13 c 0.47 0.60 c2 0.47 0.60 D 6.00 6.10 6.20 D1 5.15 5.40 5.65 E 6.50 6.60 6.70 E1 4.70 4.85 5.00 e 2.186 2.286 2.386 H 9.80 10.10 10.40 L 1.40 1.50 1.70 L1 L2 0.90 1.25 0.51 BSC 0.60 L6 DS5049 - Rev 3 5.46 2.90 REF L3 L4 5.33 0.80 1.00 1.80 BSC θ1 5° 7° 9° θ2 5° 7° 9° V2 0° 8° page 8/14 BULD741T4 DPAK (TO-252) type C package information Figure 16. DPAK (TO-252) recommended footprint (dimensions are in mm) FP_0068772_31 DS5049 - Rev 3 page 9/14 BULD741T4 DPAK (TO-252) packing information 4.2 DPAK (TO-252) packing information Figure 17. DPAK (TO-252) tape outline 10 pitches cumulative tolerance on tape +/- 0.2 mm T P0 Top cover tape P2 D E F B1 K0 For machine ref. only including draft and radii concentric around B0 W B0 A0 P1 D1 User direction of feed R Bending radius User direction of feed AM08852v1 DS5049 - Rev 3 page 10/14 BULD741T4 DPAK (TO-252) packing information Figure 18. DPAK (TO-252) reel outline T 40mm min. access hole at slot location B D C N A G measured at hub Tape slot in core for tape start 2.5mm min.width Full radius AM06038v1 Table 5. DPAK (TO-252) tape and reel mechanical data Tape Dim. mm mm Dim. Min. Max. A0 6.8 7 A B0 10.4 10.6 B 1.5 12.1 C 12.8 1.6 D 20.2 G 16.4 50 B1 DS5049 - Rev 3 Reel Min. Max. 330 13.2 D 1.5 D1 1.5 E 1.65 1.85 N F 7.4 7.6 T K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 18.4 22.4 page 11/14 BULD741T4 Revision history Table 6. Document revision history Date Revision Changes 20-Dec-2006 1 Initial release. 09-Jul-2007 2 Updated package names in page 1, added figure 4, updated figure 12 and 13. 15-Jul-2022 3 Removed obsolete order code BULD741-1 and updated Section 4.1 DPAK (TO-252) type C package information. Minor text changes. DS5049 - Rev 3 page 12/14 BULD741T4 Contents Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 4.1 DPAK (TO-252) type C package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.2 DPAK (TO-252) packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 DS5049 - Rev 3 page 13/14 BULD741T4 IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS5049 - Rev 3 page 14/14