ECMF02-2AMX6

ECMF02-2AMX6 Common mode filter with ESD protection for USB 2.0 and MIPI D-PHY/MDDI interface Features ■ ■ Very large differential bandwidth > 6 GHz High common mode attenuation: – -34 dB at 900 MHz – -20 dB between 800 MHz and 2.2 GHz Very low PCB space consumption Thin package: 0.55 mm max Lead-free package High reduction of parasitic elements through integration µQFN-6L ■ ■ ■ ■ Complies with the following standards: ■ IEC 61000-4-2 level 4 input and output pins: – ±15 kV (air discharge) – ±8 kV (contact discharge) Figure 1. Pin configuration (top view) Applications ■ ■ ■ ■ D+ ESD ESD D+ Mobile phones Notebook, laptop Portable devices PND GND D- DESD ESD Description The ECMF02-2AMX6 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI or USB 2.0. The ECMF02-2AMX6 can protect and filter one differential lane. NC June 2011 Doc ID 17815 Rev 2 1/15 www.st.com 15 Characteristics ECMF02-2AMX6 1 Table 1. Symbol VPP IDC Top Tj Tstg Characteristics Absolute maximum ratings (Tamb = 25 °C) Parameter Peak pulse voltage(1) Maximum DC current Operating temperature Maximum junction temperature Storage temperature range IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Value 8 20 200 -40 to +85 125 - 55 to +150 Unit kV mA °C °C °C 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353. Figure 2. Electrical characteristics (definitions) Table 2. Symbol VBR IRM RDC Electrical characteristics (values, Tamb = 25 °C) Test conditions IR = 1 mA VRM = 1.5 V per line DC serial resistance 1.8 Min. 6 100 2.5 Typ. Max Unit V nA Ω Compliant with USB 2.0 high speed sync field test (150 mV diff). 2/15 Doc ID 17815 Rev 2 ECMF02-2AMX6 Characteristics Figure 3. SDD21 differential attenuation measurements (Z0 diff = 100 Ω) Figure 4. SCC21 common mode attenuation measurements (Z0 com = 50 Ω) 0 SDD21 (dB) -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -2.2 -2.4 -2.6 -2.8 -3 300k 1M 3M F(Hz) 10M 30M 100M 300M 1G 3G 0 SCC21 (dB) -2 -4 -6 -8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 - 26 - 28 - 30 - 32 - 34 - 36 300k 1M 3M F(Hz) 10M 30M 100M 300M 1G 3G Figure 5. SDD11 / SDD22 differential return loss measurements (Z0 diff = 100 Ω) SDD11 SDD22 Figure 6. SDD21 differential attenuation measurements (Z0 diff = 90 Ω) 0 -5 - 10 - 15 - 20 - 25 - 30 - 35 - 40 SDD11 / SDD22 (dB) F(Hz) 300k 1M 3M 10M 30M 100M 300M 1G 3G 0 SDD21 (dB) 0.2 0.4 0.6 0.8 -1 - 1.2 - 1.4 - 1.6 - 1.8 -2 - 2.2 - 2.4 - 2.6 - 2.8 -3 300k 1M 3M - F(Hz) 10M 30M 100M 300M 1G 3G Figure 7. SCC21 common mode attenuation measurements (Z0 com = 45 Ω) 0 -2 -4 -6 -8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 - 26 - 28 - 30 - 32 - 34 - 36 SCC21 (dB) F(Hz) 300k 1M 3M 10M 30M 100M 300M 1G 3G Doc ID 17815 Rev 2 3/15 Characteristics ECMF02-2AMX6 Figure 8. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 20 ns/Div Figure 9. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 20 V/Div 82.3 V PIN 6 20 V/Div C2 PIN 6 20 ns/Div C2 -71.1 V 112 V C3 -115 V PIN 5 PIN 5 C3 50 V/Div 20 ns/Div 50 V/Div 20 ns/Div Figure 10. MIPI D-PHY low power mode test setup Generator Agilent 81110 Pattern mode, F=10MHz, modulation RZ, 50Ω output Oscilloscope Lecroy 7300A, 1MΩ input CMF Figure 11. Low power pulse response - see Figure 10 for test setup 500 mV/div Pulse: 50 ns, tr = tf = 5 ns 200 ns/div 500 mV/div 200 ns/div 4/15 Doc ID 17815 Rev 2 ECMF02-2AMX6 Figure 12. USB 2.0 HSync measurement test setup Characteristics Net PC Samsung NP-N510 Left USB output Oscilloscope Lecroy 7300A CMF USB output USB key Figure 13. USB 2.0 HSync measurement result 200 mV/Div 200 mV/Div 5 ns/Div 5 ns/Div Figure 14. USB 2.0 eye diagram, mask T1 0.2V/div 342.2ps/div Doc ID 17815 Rev 2 5/15 Application schematics ECMF02-2AMX6 2 Application schematics Figure 15. MIPI D-PHY ECMF02-2AMX6 ECMF04-4AMX12 6/15 Doc ID 17815 Rev 2 ECMF02-2AMX6 Figure 16. USB 2.0 Application schematics GND USB Transceiver ESDALC6V1-1U2 ID D+ DV BUS D+ ESD ESD D+ DESD ESD D- GND NC Micro-USB LFTVS10-1F3 Doc ID 17815 Rev 2 7/15 Ordering information scheme ECMF02-2AMX6 3 Ordering information scheme Figure 17. Ordering information scheme ECMF 02 – 2 A xxx Function ESD common mode filter Number of lines 02 = 2 lines Number of ESD protected lines 2 = 2 ESD protected lines Version Package MX6 = µQFN-6L 8/15 Doc ID 17815 Rev 2 ECMF02-2AMX6 Package information 4 Package information ● ● Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. µQFN-6L dimensions Dimensions D Ref. E Millimeters Min. Typ. 0.50 0.02 0.25 1.70 1.50 0.50 0.40 Max. Min. Inches Typ. Max. 0.022 A TOP VIEW 0.45 0.00 0.18 1.65 1.45 0.45 0.30 0.55 0.018 0.020 0.05 A A1 A1 b 0.00 0.0008 0.0009 0.012 0.069 0.061 0.022 0.020 SIDE VIEW e 0.30 0.007 0.010 1.75 0.065 0.067 1.55 0.057 0.059 0.55 0.018 0.020 0.50 0.012 0.016 b D E e L L Figure 18. Footprint (dimensions in mm) Figure 19. Marking 0.25 0.6 KD 1.9 1.25 Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Doc ID 17815 Rev 2 0.7 9/15 Package information Figure 20. Tape and reel specifications Dot identifying Pin A1 location 2.0 0.22 4.0 ECMF02-2AMX6 Ø 1.55 1.85 8.0 KD KD KD 1.63 0.75 4.0 All dimensions are typical values in mm User direction of unreeling 10/15 Doc ID 17815 Rev 2 3.5 1.75 ECMF02-2AMX6 Recommendation on PCB assembly 5 5.1 Recommendation on PCB assembly Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 21. Stencil opening dimensions L T W b) General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect ratio = ---- ≥ 1.5 T L×W Aspect area = --------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) b) Stencil opening thickness: 100 µm Stencil opening for leads: Opening to footprint ratio is 90%. Figure 22. Recommended stencil window position 15 µm 570 µm 7 µm 236 µm 250µm Stencil window Footprint Doc ID 17815 Rev 2 600 µm 11/15 Recommendation on PCB assembly ECMF02-2AMX6 5.2 Solder paste 1. 2. 3. 4. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste recommended. Offers a high tack force to resist component displacement during PCB movement. Use solder paste with fine particles: powder particle size 20-45 µm. 5.3 Placement 1. 2. 3. 4. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. Standard tolerance of ± 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5. 6. 5.4 PCB design preference 1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 12/15 Doc ID 17815 Rev 2 ECMF02-2AMX6 Recommendation on PCB assembly 5.5 Reflow profile Figure 23. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec 90 sec max 6 7 Time (min) Note: Minimize air convection currents in the reflow oven to avoid component movement. 5.6 Layout recommendation Connection to PCB GND must be as short as possible to ensure ESD remaining voltage and SCC21 performance. Figure 24. Layout recommendation Zdiff according to the application Vias to GND plane Doc ID 17815 Rev 2 13/15 Ordering information ECMF02-2AMX6 6 Ordering information Table 4. Ordering information Marking KD(1) Package µQFN-6L Weight 3.55 mg Base qty 3000 Delivery mode Tape and reel 7” Order code ECMF02-2AMX6 1. The marking can be rotated by 90° to differentiate assembly location For the latest information on available order codes see the product pages on www.st.com. 7 Revision history Table 5. Date 10-Aug-2010 28-Jun-2011 Document revision history Revision 1 2 Initial release. Added Complies with the following standards:, and Air discharge parameter in Table 1. Removed Figure 6. Sdd41 / Sdd23 inter-lane differential cross-coupling measurements. Changes 14/15 Doc ID 17815 Rev 2 ECMF02-2AMX6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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