ECMF02-4CMX8

ECMF02-4CMX8 Common mode filter with ESD protection for USB 2.0 interface Datasheet  production data Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as:  Computers  Printers  Communication systems  Cellular phone handsets and accessories  Video equipment 0LFUR4)1/ SLQYLHZ Description The ECMF02-4CMX8 affords key component integration such as common mode filter D+ and D- lines and ESD protection on all lines. This device offers an optimized flow-through footprint for USB 2.0 applications. Features  Integrated common mode filter  Differential pair ESD protection  16 V VBUS ESD and EOS protection Figure 1. Pin configuration (top view)  ID pin ESD protection  Low profile micro QFN-8L package  High bandwidth: > 6 GHz 9%86 *1' ' ' ' ' ,' *1'  Optimized for high speed USB 2.0  High common mode attenuation at 900 MHz and 1.8 GHz  Support for audio over USB 2.0 thanks to bidirectional ESD protection  Ultra compact, low board space  Low height: < 0.55 mm Complies with the following standards:  IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge)  RoHS2 compliant May 2015 This is information on a product in full production. DocID022286 Rev 3 1/16 www.st.com Characteristics 1 ECMF02-4CMX8 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value ESD discharge IEC 61000-4-2, level 4 Contact discharge on D+/D- pins Contact discharge on VBUS and ID pins Air discharge on all pins Unit 10 20 30 VPP Peak pulse voltage(1) PPP Peak pulse power (8/20µs) on VBUS 150 W IPP Peak pulse current (8/20µs) on VBUS 4.8 A Tj Maximum operating junction temperature -40 to +125 °C Storage temperature range -55 to +150 °C Tstg kV 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353. Figure 2. Electrical characteristics - definitions , 6\PERO 3DUDPHWHU 9%5 ,50 950 9&/ ,33 ,5 %UHDNGRZQYROWDJH /HDNDJHFXUUHQW# 950 6WDQGRII YROWDJH &ODPSLQJYROWDJH 3HDNSXOVHFXUUHQW %UHDNGRZQFXUUHQW ,33 9&/ 9%5 950 ,5 ,50 ,50 ,5 ,33 2/16 DocID022286 Rev 3 9 950 9%5 9&/ ECMF02-4CMX8 Characteristics Table 2. Electrical characteristics (values, Tamb = 25 °C) Symbol Test conditions Min. Typ. Max. Unit Data lines VBR IR = 1 mA IRM VRM = 5.5 V per line RDC DC serial resistance on data line 6 V 100 nA 3 4 Ω 16.5 18 V VBUS VBR IR = 1 mA 15 IRM VRM = 12 V 50 nA VCL Clamping voltage. IPP = 1 A, tp = 8/20 µs 20 V VCL Clamping voltage. IPP = 2.5 A, tp = 8/20 µs 24 V ID VBR IR = 1 mA IRM VRM = 1.5 V per line 6 V 100 DocID022286 Rev 3 nA 3/16 16 Characteristics ECMF02-4CMX8 Figure 3. SDD21 differential attenuation measurement (Z0 diff = 90 Ω ) for data lines D+ and D6''G%       )+]  N 0 0 0 * Figure 4. SCC21 common mode attenuation measurement (Z0 com = 45 Ω )  6&&G%        )+]  N 4/16 0 0 0 DocID022286 Rev 3 * ECMF02-4CMX8 Characteristics Figure 5. ID frequency response measurement (Z0 = 75 Ω )  6G%      )+]  N 0 0 0 * Figure 6. Differential (ZDD21) and common mode (ZCC21) impedance versus frequency ( =''DQG=&&ȍ ( ( ( ( ='' ( =&& DocID022286 Rev 3 ( ( 5/16 16 Characteristics ECMF02-4CMX8 Figure 7. ESD test conditions 9%86 *1' $WWHQXDWRUV ' '  G% ' ' ,' *1'  G% 2VFLOORVFRSH  : Figure 8. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on VBUS  933 (6'SHDNYROWDJH  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV   9   9   9 6/16 DocID022286 Rev 3   9 ECMF02-4CMX8 Characteristics Figure 9. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on VBUS   9   9   9   9  933 (6'SHDNYROWDJH  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV Figure 10. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on ID  933 (6'SHDNYROWDJH  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV   9   9   9 DocID022286 Rev 3   9 7/16 16 Characteristics ECMF02-4CMX8 Figure 11. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on ID   9   9   9   9  933 (6'SHDNYROWDJH  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV Figure 12. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on differential lane  933 (6'SHDNYROWDJH  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV   9   9   9 8/16 DocID022286 Rev 3   9 ECMF02-4CMX8 Characteristics Figure 13. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on differential lane   9   9   9   9  933 (6'SHDNYROWDJH  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV  9&/ FODPSLQJYROWDJH#QV Figure 14. Eye diagram (loaded by Zdiff = 90 ) Figure 15. Eye diagram (loaded by Zdiff = 90 ) with USB2.0 [mask 1] board only with USB2.0 [mask 1] board with ECM02-4CMX8 5LVHWLPHSV )DOOWLPHSV   (\HKHLJKWPY  (\HZLGWKQV  5LVHWLPHSV )DOOWLPHSV   DocID022286 Rev 3 (\HKHLJKWPY  (\HZLGWKQV  9/16 16 Characteristics ECMF02-4CMX8 Figure 16. TDR measurement (loaded by Zdiff = 90 ), rise time 400 ps  =GLII:      WQV     Figure 17. HS sync 10/16 DocID022286 Rev 3   ECMF02-4CMX8 Characteristics Figure 18. Total harmonic distortion on differential lanes Figure 19. Crosstalk on differential lanes DocID022286 Rev 3 11/16 16 Application schematic 2 ECMF02-4CMX8 Application schematic Figure 20. Application schematic 9%86 *1' ' ' ' ' ,' *1' 0LFUR86% UHFHSWDFOH 12/16 DocID022286 Rev 3 7RZDUGV86%WUDQVFHLYHU (&0)&0; ECMF02-4CMX8 3 Package information Package information  Epoxy meets UL94, V0  Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Micro QFN-8L package information Figure 21. Micro QFN-8L package outline ' $ $ ( H  E 3,1 /  3.1 Table 3. Micro QFN-8L package mechanical data Dimensions Ref. Inches(1) Millimeters Typ. Min. Max. Typ. Min. Max. A 0.50 0.45 0.55 0.020 0.018 0.022 A1 0.02 0.00 0.05 0.0008 0.00 0.002 b 0.20 0.15 0.25 0.008 0.006 0.010 D 2.50 2.45 2.55 0.098 0.096 0.100 E 1.20 1.15 1.25 0.047 0.045 0.049 DocID022286 Rev 3 13/16 16 Package information ECMF02-4CMX8 Table 3. Micro QFN-8L package mechanical data (continued) Dimensions Ref. Inches(1) Millimeters Typ. Min. Max. Typ. Min. Max. e 0.50 0.45 0.55 0.020 0.018 0.022 L 0.40 0.30 0.50 0.016 0.012 0.020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 22. Footprint Figure 23. Marking ;; ::