HSP061-4M10Y

HSP061-4M10Y Datasheet Automotive 3 V 4-line high speed port protection in QFN-10L Features • • • • • • • • Flow-through routing to keep signal integrity Large bandwidth: 8.7 GHz Ultra low capacitance: 0.3 pF Operating junction temperature range: -40 °C to 150 °C RoHS compliant and halogen free Complies with ISO 10605 / IEC 61000-4-2 - C = 150 pF, R = 330 Ω – ±8 kV (contact discharge) – ±15 kV (air discharge) Complies with ISO 10605 - C = 330 pF, R = 330 Ω – ±8 kV (contact discharge) – ±15 kV (air discharge) Complies with ISO 7637-3: – Pulse 3a/3b: +/-150 V – Pulse 2a: +/- 45 V Applications • • • • • • • USB 5Gbps USB 10Gbps HDMI2.1 FPD-Llink III GMSL 1000BASE-T1 APIX3 Product status link HSP061-4M10Y Description The HSP061-4M10Y is a 4-line ultra-low capacitance TVS designed to protect highspeed interfaces with differential lines in automotive applications. Electro-static discharge (ESD) capability is compliant with ISO 10605, and IEC 61000-4-2, which are system level ESD standards and then with the ESD component level standards with low energy such as human body model (HBM), and charge device model (CDM). The surge capability is compliant with ISO 7637-3. The large bandwidth is compatible with USB 5Gbps, USB 10Gbps, HDMI2.1 12Gbps, FPD-Link III 4 - 16Gbps, GMSL 3 - 12Gbps, 1000BASE-T1, APIX3 6Gbps. The Y suffix in the part number indicates an AEC-Q101 qualified device for automotive applications. The device is packaged in a 10-pin QFN of 2.5 mm x 1.0 mm with a nominal height of 0.51 mm. DS10041 - Rev 2 - December 2023 For further information contact your local STMicroelectronics sales office. www.st.com HSP061-4M10Y Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ISO 10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Tstg Peak pulse voltage Contact discharge ±8 Air discharge ±15 kV ISO 10605 (C = 330 pF, R = 330 Ω) Contact discharge ±8 Air discharge ±15 Storage temperature range -65 to +150 Tj Operating junction temperature range -40 to +150 TL Maximum lead temperature for soldering during 10 s °C 260 Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Min. Typ. Max. Unit VBR Breakdown voltage at 1 mA VRM Stand-off voltage 3 V IRM VRM = 3 V 70 nA VCL IPP = 1A, 8/20 µs 15 V VCL ISO 10605- C = 150 pF, R = 330 Ω, +8 kV contact, measured at 30 ns 27 C I/O - I/O Capacitance I/O to I/O, VI/O = 0 V, f = 1 MHz, VOSC = 30 mV 0.3 0.4 pF CI/O - GND Capacitance I/O to ground, VI/O = 0 V, f = 1 MHz, VOSC = 30 mV 0.6 0.8 pF Cut-off frequency at - 3dB 8.7 fc ZDiff DS10041 - Rev 2 Test conditions tr = 200 ps (10 - 90%), Z0 Diff = 100 Ohm (HDMI specification) 6 85 V 100 V GHz 115 Ω page 2/13 HSP061-4M10Y Characteristics 1.1 Characteristics (curves) Figure 1. Leakage current versus junction temperature Figure 2. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 3. ESD response to IEC 61000-4-2 (-8 kV contact discharge) Figure 4. S21 attenuation Figure 5. HDMI2.1 - 12 Gbps per channel without device (with worst cable model), 8dB CTLE and 25 mV DFE Figure 6. HDMI2.1 - 12 Gbps per channel with device (with worst cable model), 8dB CTLE and 25 mV DFE DS10041 - Rev 2 page 3/13 HSP061-4M10Y Characteristics Figure 7. USB 10 Gbps per channel without device, 0dB CTLE and DFE Figure 8. USB 10 Gbps per channel with device, 0dB CTLE and DFE Figure 9. Differential impedance (Zdiff) DS10041 - Rev 2 page 4/13 HSP061-4M10Y Characteristics Figure 10. ISO 7637-3 Pulse 3a: -150 V Figure 11. ISO 7637-3 Pulse 3b : +150 V Figure 12. ISO 7637-3 Pulse 2a: -45 V Figure 13. ISO 7637-3 Pulse 2a: +45 V DS10041 - Rev 2 page 5/13 HSP061-4M10Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 QFN-10L package information Figure 14. QFN-10L package outline Table 3. QFN-10L package mechanical data Dimensions Millimeters Ref. Min. Typ. Max. Min. Typ. Max. A 0.40 0.48 0.50 0.0157 0.0189 0.0197 A1 0.00 0.03 0.05 0.0000 0.0012 0.0020 A2 0.13 0.0049 b 0.15 0.20 0.25 0.0059 0.0079 0.0099 b1 0.35 0.40 0.45 0.0137 0.0157 0.0178 D 2.40 2.50 2.60 0.0944 0.0984 0.1024 E 0.90 1.00 1.10 0.0354 0.0394 0.0434 e L DS10041 - Rev 2 Inches 0.50 0.30 0.38 0.0197 0.43 0.0118 0.0150 0.0168 page 6/13 HSP061-4M10Y Package information 2.2 Packing and marking information Figure 15. Marking layout (refer to ordering information table for marking) Figure 16. Package orientation in reel Figure 17. Tape leader and trailer dimensions Figure 18. Tape and reel orientation Figure 19. Reel dimensions (mm) Figure 20. Inner box dimensions (mm) 30 205 205 DS10041 - Rev 2 page 7/13 HSP061-4M10Y Package information Figure 21. Tape outline Table 4. Tape and reel mechanical data Dimensions Millimeters Ref. DS10041 - Rev 2 Min. Typ. Max. ∅D0 1.50 1.55 1.60 ∅D1 0.80 F 3.45 3.50 3.55 K0 0.50 0.55 0.60 P0 3.90 4.00 4.10 P1 3.90 4.00 4.10 P2 1.95 2.00 2.05 W 7.70 8.00 8.30 page 8/13 HSP061-4M10Y Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Recommended footprint and stencil opening Stencil opening thickness: 100 µm Stencil opening ratio : 90 % Figure 22. Recommended footprint and stencil opening (µm) 3.2 PCB design 1. 2. To control the solder paste amount, closed vias are recommended instead of open vias. A symmetrical layout is recommended. Figure 23. Recommended printed circuit board layout DS10041 - Rev 2 page 9/13 HSP061-4M10Y Recommendation on PCB assembly 3.3 Solder paste 1. 2. 3. 4. 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-38 μm. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. Reflow profile Figure 24. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 30 60 90 120 150 180 210 240 270 Note: Minimize air convection currents in the reflow oven to avoid component movement. Note: Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DS10041 - Rev 2 300 page 10/13 HSP061-4M10Y Ordering information 4 Ordering information Table 5. Ordering information DS10041 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode HSP061-4M10Y H4Y QFN-10L 3.27 mg 3000 Tape and reel page 11/13 HSP061-4M10Y Revision history Table 6. Document revision history Date Revision 9-Dec-2013 1 Changes Initial release. Updated Figure 5, and Figure 6. 07-Dec-2023 2 Added Figure 7, Figure 8, Figure 10, Figure 11, Figure 12, and Figure 13. Minor text changes. DS10041 - Rev 2 page 12/13 HSP061-4M10Y IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2023 STMicroelectronics – All rights reserved DS10041 - Rev 2 page 13/13