STPS15L30CB

STPS15L30C Low drop power Schottky rectifier Datasheet - production data Description $ Dual center tab Schottky rectifier suited for switched mode power supply and high frequency DC to DC converters. . $ Packaged in DPAK, this device is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection applications. . . $ Table 1. Device summary $ $ $ '3$. Features Symbol Value IF(AV) 2 x 7.5 A VRRM 30 V Tj 150 °C VF (typ) 0.34 V  Very small conduction losses  Negligible switching losses  Extremely fast switching  Low forward voltage drop  Low capacitance  Low thermal resistance  Avalanche specification  ECOPACK®2 compliant component for DPAK on demand December 2015 This is information on a product in full production. DocID8563 Rev 4 1/8 www.st.com Characteristics 1 STPS15L30C Characteristics Table 2. Absolute ratings (limiting values per diode at 25 °C unless otherwise stated) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) Forward rms current 10 A IF(AV) Average forward current, δ = 0.5, square wave Tc = 140 °C(1) IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 200 W -65 to +175 °C 150 °C Tstg 7.5 Per device 15 Storage temperature range Maximum operating junction Tj Per diode temperature(2) A 1. Value based on Rth(j-c) max (per diode) dPtot --------------dTj 2. 1 - condition to avoid thermal runaway for a diode on its own heatsink  ------------------------Rth  j – a  Table 3. Thermal resistances Symbol Parameter Value Per diode Rth(j-c) Junction to case Rth(c) Coupling Unit 4 Total 2.4 °C/W 0.7 When the diodes 1 and 2 are used simultaneously:  Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 4. Static electrical characteristics (per diode) Symbol IR (1) VF(2) Parameter Reverse leakage current Test Conditions Tj = 25 °C Tj = 125 °C Forward voltage drop VR = VRRM Tj = 25 °C IF = 7.5 A Tj = 125 °C IF = 7.5 A Tj = 25 °C IF = 12 A Tj = 125 °C IF = 12 A Tj = 25 °C IF = 15 A Tj = 125 °C IF = 15 A 1. Pulse test: tp = 5 ms,  < 2% 2. Pulse test: tp = 380 µs,  < 2% To evaluate the conduction losses use the following equation: P = 0.27 x IF(AV) + 0.016 IF2(RMS) 2/8 DocID8563 Rev 4 Min. Typ. 70 Max. Unit 1 mA 140 mA 0.48 0.34 0.39 0.53 V 0.40 0.47 0.57 0.44 0.51 STPS15L30C Characteristics Figure 1. Average forward power dissipation versus average forward current (per diode)  Figure 2. Average forward current versus ambient temperature (δ = 0.5)(per diode) , )DY $ 3 )DY : į    į    į  į  į   5 WKMD 5WKMF      5 WKMD ƒ&:   7    , )DY $        7  į WS7    WS  į WS7    Figure 3. Normalized avalanche power derating versus pulse duration at Tj = 125 °C 1 PARM (t p ) PARM (10 µs) 7 DPE ƒ&  WS       Figure 4. Relative variation of thermal impedance junction to case versus pulse duration  = WKMF 5WK MF    0.1 į   į   į    0.01 7   t p(µs) 0.001 1 10 100 6 LQJOHSXOVH  (  WS V (  į WS7 (   WS (  1000 DocID8563 Rev 4 3/8 8 Characteristics STPS15L30C Figure 5. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 6. Junction capacitance versus reverse voltage applied (typical values, per diode) , 5 P$   (   & Q) ) 0+] 9RVF P9 7 M ƒ& 7 M  ƒ &  (  7 M  ƒ & 7 M  ƒ &  (   7 M  ƒ &  (  7 M  ƒ & 7 M  ƒ &  (  9 5  9 9 5 9  (         Figure 7. Forward voltage drop versus forward current (per diode)     Figure 8. Thermal resistance junction to ambient versus copper surface under tab , )0 $  5WKMDƒ&: (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P   '3$.  77MM ƒ& 0D[LPXPYDOXHV     7 M ƒ& 7\SLFDO YDOXHV   7 M ƒ& 0D[LPXPYDOXHV    9 )0 9   4/8 6 FPð &8            DocID8563 Rev 4         STPS15L30C 2 Package Information Package Information  Epoxy meets UL94,V0  Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DPAK package information Figure 9. DPAK package outline ( $ E F 7KHUPDOSDG ( / ' ' 5 + / $ E H H 5 F $ / /  Note: 9 *DXJH SODQH This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID8563 Rev 4 5/8 8 Package Information STPS15L30C Table 5. DPAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.264 E1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° 8° Figure 10. DPAK footprint dimensions (in mm)      % 7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ 6/8 DocID8563 Rev 4   $ % $ STPS15L30C 3 Ordering Information Ordering Information Table 6. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPS15L30CB S15L30C DPAK 0.30 g 75 Tube STPS15L30CB-TR S15L30C DPAK 0.30 g 2500 Tape and reel Revision history Table 7. Document revision history Date Revision Description of Changes 14-Jun-2012 2 Automatic revalidation date workflow started. 21-Oct-2014 3 Updated DPAK package information and reformatted to current standard. Removed IPAK. 18-Dec-2015 4 Updated DPAK package information and reformatted to current standard. DocID8563 Rev 4 7/8 8 STPS15L30C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 8/8 DocID8563 Rev 4