STPS1H100AF

STPS1H100 Datasheet 100 V, 1 A power Schottky rectifier Features • • • • • • Negligible switching losses High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Avalanche capability specified ECOPACK2 halogen-free component Description Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA, SMA Flat, SMA Flat Notch,or SMB, this diode is ideal for use in lighting and telecom power applications. Product status STPS1H100 Product summary Symbol Value IF(AV) 1A VRRM 100 V T j(max.) 175 °C VF(max.) 0.62 V DS1228 - Rev 8 - October 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS1H100 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) Forward rms current 10 A 1 A IF(AV) Average forward current, δ = 0.5 SMA TL = 150 °C SMB, SMA Flat TL = 155 °C SMA Flat Notch TL = 160 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 108 W -65 to +175 °C +175 °C Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal parameters Symbol Rth(j-l) Parameter Junction to lead Max. value SMA 30 SMB 25 SMA Flat, SMA Flat Notch 20 Unit °C/W Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 1 A IF = 2 A Min. Typ. - 0.2 - Unit 4 µA 0.5 mA 0.77 0.58 - Max. 0.62 0.86 0.65 V 0.70 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.54 x IF(AV) + 0.08 x IF2(RMS) DS1228 - Rev 8 page 2/15 STPS1H100 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) 1.2 PF(AV) (W) 0.8 0.7 δ = 0.1 δ = 0.05 δ= 0.2 δ = 0.5 Rth(j-a)=Rth(j-l) 1.0 Rth(j-a)=120°C/W 0.6 SMB / SMA Flat Rth(j-a)=100°C/W 0.8 δ= 1 SMA 0.5 Rth(j-a)=200°C/W 0.6 0.4 0.3 0.4 T 0.2 T 0.1 IF(AV) (A) 0.2 tp δ =tp/T δ=tp/T 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C) 1 Tamb (°C) tp 0.0 25 50 75 100 125 150 175 Figure 4. Junction capacitance versus reverse voltage applied (maximum values) C(pF) PARM (t p ) PARM (10 µs) 100 F=1 MHz VOSC=30 mVRMS Tj=25 °C 0.1 0.01 t p(µs) VR(V) 0.001 1 10 100 1000 10 1 10 100 Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration to ambient versus pulse duration Zth(j-a)/ Rth(j-a) Zth(j-a)/ Rth(j-a) 1.00 1.00 SMA SMB 0.10 0.10 Single pulse Single pulse t p (s) t p (s) 0.01 0.01 1.E-03 DS1228 - Rev 8 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 page 3/15 STPS1H100 Characteristics (curves) Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 8. Reverse leakage current versus reverse voltage applied (typical values) Zth(j-a)/Rth(j-a) 1.E+03 1.00 IR(µA) SMA Flat SMA Flat Notch 1.E+02 Tj=125 °C 1.E+01 0.10 1.E+00 1.E-01 Single pulse Tj=25 °C 1.E-02 t p (s) 0.01 1.E-03 1.E-02 1.E-01 1.E+00 VR(V) 1.E+01 1.E+02 1.E+03 Figure 9. Forward voltage drop versus forward current (maximum values) 1.E-03 10 20 30 40 50 60 70 80 100 Rth(j-a) (°C/W) 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm 10.00 90 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMB) IFM (A) 100.00 0 SMB 150 Tj=125 °C Tj=25 °C 1.00 100 0.10 50 S(Cu)(cm²) VFM (V) 0.01 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a) (°C/W) Rth(j-a) (°C/W) 200 200 Epoxy printed circuit board FR4, copper thickness: 35 µm Epoxy printed circuit board FR4, copper thickness: 35 µm SMA 150 150 100 100 50 50 SMA Flat SMA Flat Notch S(Cu)(cm²) S(Cu)(cm²) 0 0 0.0 0.5 DS1228 - Rev 8 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/15 STPS1H100 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 13. SMB package outline E1 D E A1 C A2 L DS1228 - Rev 8 b page 5/15 STPS1H100 SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 Figure 14. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS1228 - Rev 8 page 6/15 STPS1H100 SMA package information 2.2 SMA package information • • Epoxy meets UL94, V0 Lead-free package Figure 15. SMA package outline E1 D E A1 C L A2 b Table 5. SMA package mechanical data Dimensions Millimeters Ref. DS1228 - Rev 8 Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.097 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 page 7/15 STPS1H100 SMA package information Figure 16. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) DS1228 - Rev 8 page 8/15 STPS1H100 SMA Flat package information 2.3 SMA Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 17. SMA Flat package outline A c D L 2x L1 2 x E E1 L L2 2 x b 2x Table 6. SMA Flat package mechanical data Dimensions Ref. Millimeters Min. DS1228 - Rev 8 Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.95 0.088 0.117 E 4.80 5.60 0.188 0.221 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 L1 0.50 0.020 L2 0.50 0.020 page 9/15 STPS1H100 SMA Flat package information Figure 18. SMA Flat recommended footprint in mm (inches) 5.52 (0.217) 1.52 (0.060) 1.20 (0.047) 3.12 (0.123) 1.20 (0.047) millimeter s (inches) DS1228 - Rev 8 page 10/15 STPS1H100 SMA Flat Notch package information 2.4 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 19. SMA Flat Notch package outline Table 7. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS1228 - Rev 8 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 11/15 STPS1H100 SMA Flat Notch package information Figure 20. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS1228 - Rev 8 page 12/15 STPS1H100 Ordering Information 3 Ordering Information Table 8. Ordering information DS1228 - Rev 8 Order code Marking Package Weight Base qty. Delivery mode STPS1H100A S11 SMA 0.068 g 5000 Tape and reel STPS1H100U G11 SMB 0.107 g 2500 Tape and reel STPS1H100AF F11 SMA Flat 0.035 g 10 000 Tape and reel STPS1H100AFN A11 SMA Flat Notch 0.039 g 10 000 Tape and reel page 13/15 STPS1H100 Revision history Table 9. Document revision history DS1228 - Rev 8 Date Version Changes Jul-2003 4A Aug-2004 5 SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc). 18-Sep-2008 6 Reformatted to current standards. Added SMAflat package. 06-Apr-2018 7 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified), Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C). Removed "Normalized avalanche power derating versus junction temperature". 08-Oct-2019 8 Added Section 2.4 SMA Flat Notch package information. Last update. page 14/15 STPS1H100 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS1228 - Rev 8 page 15/15