STPS2L40AF

STPS2L40 Datasheet 40 V, 2 A low drop power Schottky rectifier Features • • • • • • Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature package Avalanche rated ECOPACK2 component Applications • • • • Telecom power supply Set-top box power supply TV power supply Battery charger Description Single chip Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMB, SMA Flat, SMA Flat Notch and SMB Flat, the STPS2L40 is ideal for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. Product status STPS2L40 Product summary Symbol Value IF(AV) 2A VRRM 40 V T j(max.) 150 °C VF(typ.) 0.31 V DS2146 - Rev 6 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS2L40 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current, δ = 0.5, square wave SMB TL = 130 °C SMB Flat TL = 140 °C Value Unit 40 V 2 A SMA Flat, SMA Flat Notch TL = 130 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 158 W -65 to +150 °C +150 °C Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMB 20 SMB Flat 10 SMA Flat 20 SMA Flat Notch 20 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C IR(1) Reverse leakage current Tj = 100 °C VR = 40 V Tj = 125 °C Tj = 25 °C Tj = 125 °C VF(1) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. Max. Unit - 220 µA - 20 mA 80 mA IF = 1 A IF = 2 A IF = 4 A Typ. 38 - 0.39 0.25 - 0.43 0.31 - 0.28 0.34 V 0.50 0.39 0.45 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.22 x IF(AV) + 0.06 x IF2(RMS) DS2146 - Rev 6 page 2/17 STPS2L40 Characteristics For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS2146 - Rev 6 page 3/17 STPS2L40 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 1.2 IF(AV)(A) PF(AV)(W) 2.2 δ = 0.1 δ = 0.2 Rth(j-a)=Rth(j-l) 2.0 δ = 0.5 SMB 1.8 δ = 0.05 1.0 Figure 2. Average forward current versus ambient temperature (δ = 0.5) SMB 1.6 0.8 Rth(j-a)=100°C/W 1.4 δ=1 1.2 0.6 1.0 0.8 0.4 0.6 T 0.2 IF(AV)(A) δ=tp/T tp 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 Figure 3. Average forward current versus ambient temperature (δ = 0.5, SMB Flat) 2.2 IF(AV)(A) SMB Flat Rth(j-a)=Rth(j-l) 2.0 0 2.8 Tamb (°C) tp δ=tp/T 0.0 0.0 0.0 T 0.4 0.2 25 50 100 125 150 Figure 4. Average forward current versus ambient temperature (δ = 0.5, SMA Flat, SMA Flat Notch) 2.2 IF(AV)(A) SMA Flat SMA Flat Notch Rth(j-a)=Rth(j-l) 2.0 1.8 75 1.8 1.6 1.6 Rth(j-a)=100°C/W 1.4 1.4 1.2 1.2 1.0 1.0 0.8 0.8 0.6 0.6 T 0.2 Tamb (°C) tp δ=tp/T DS2146 - Rev 6 25 50 75 100 125 150 0 Tamb (°C) tp δ=tp/T 0.0 0.0 0 T 0.4 0.4 0.2 Rth(j-a)=200°C/W 25 50 75 100 125 150 page 4/17 STPS2L40 Characteristics (curves) Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Zth(j-a)/ Rth(j-a) 1.0 1 SMB 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 Single pulse 0.1 0.001 1 t p (s) 0.0 1.E-02 t p(µs) 10 100 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1000 Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction to lead versus pulse duration (SMB flat) to ambient versus pulse duration (SMA Flat) Zth(j-l) / Rth(j-l) 1.0 1.0 SMB Flat 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.1 Single pulse 0.1 t p (s) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) 0.0 1.E-02 t p (s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(pF) IR(mA) 1.E+02 SMA Flat / SMA Flat Notch 0.2 Single pulse 0.0 1.E-04 Zth(j-a)/ Rth(j-a) 1000 Tj = 125 °C F=1MHz VOSC=30mVRMS Tj=25°C 1.E+01 1.E+00 100 1.E-01 Tj = 25 °C 1.E-02 V R (V) VR(V) 10 1.E-03 0 DS2146 - Rev 6 5 10 15 20 25 30 35 40 1 10 100 page 5/17 STPS2L40 Characteristics (curves) Figure 11. Forward voltage drop versus forward current (high level) 10.0 Figure 12. Forward voltage drop versus forward current (low level) IF(A) IF(A) 3.0 Tj=125°C (maximum values) (Maximum 2.5 Tj=125°C (maximum values) (Maximum Tj=25°C (maximum values) 2.0 Tj=125°C (typical values) Tj=125°C (typical values) 1.0 1.5 Tj=25°C (maximum values) 1.0 0.5 VF(V) VF(V) 0.1 0.0 0.0 0.2 0.1 0.3 0.4 0.5 0.6 0.7 0.0 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 0.2 0.3 0.4 0.5 0.6 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMB flat) Rth(j-a) (°C/W) 200 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm 0.1 Rth(j-a) (°C/W) SMB flat Epoxy printed circuit board FR4, eCu = 35 µm SMB 150 150 100 100 50 50 S(Cu)(cm²) SCu (cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.0 5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA Flat Notch) Rth(j-a) (°C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat SMA Flat Notch 150 100 50 S(Cu)(cm²) 0 0.0 DS2146 - Rev 6 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 6/17 STPS2L40 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 16. SMB package outline E1 D E A1 C A2 L DS2146 - Rev 6 b page 7/17 STPS2L40 SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 17. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS2146 - Rev 6 page 8/17 STPS2L40 SMB Flat package information 2.2 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 18. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 5. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS2146 - Rev 6 Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 L1 0.40 0.016 L2 0.60 0.024 page 9/17 STPS2L40 SMB Flat package information Figure 19. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS2146 - Rev 6 page 10/17 STPS2L40 SMA Flat package information 2.3 SMA Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 20. SMA Flat package outline A c D L 2x L1 2 x E E1 L L2 2 x b 2x Table 6. SMA Flat package mechanical data Dimensions Ref. Millimeters Min. DS2146 - Rev 6 Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.95 0.088 0.117 E 4.80 5.60 0.188 0.221 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 L1 0.50 0.020 L2 0.50 0.020 page 11/17 STPS2L40 SMA Flat package information Figure 21. SMA Flat recommended footprint in mm (inches) 5.52 (0.217) 1.52 (0.060) 1.20 (0.047) 3.12 (0.123) 1.20 (0.047) millimeter s (inches) DS2146 - Rev 6 page 12/17 STPS2L40 SMA Flat Notch package information 2.4 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 22. SMA Flat Notch package outline Table 7. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS2146 - Rev 6 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 13/17 STPS2L40 SMA Flat Notch package information Figure 23. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS2146 - Rev 6 page 14/17 STPS2L40 Ordering Information 3 Ordering information Table 8. Ordering information DS2146 - Rev 6 Order code Marking Package Weight Base qty. Delivery mode STPS2L40U GD4 SMB 0.107 g 2500 Tape and reel STPS2L40UF FGD4 SMB Flat 0.050 g 5000 Tape and reel STPS2L40AF F2L4 SMA Flat 0.035 g 10 000 Tape and reel STPS2L40AFN A24 SMA Flat Notch 0.039 g 10 000 Tape and reel page 15/17 STPS2L40 Revision history Table 9. Document revision history DS2146 - Rev 6 Date Version Changes Jul-2003 2A 31-Jan-2007 3 Reformatted to current standard. Added ECOPACK statement. Added SMBflat package. 18-Sep-2008 4 Reformatted to current standard. Updated ECOPACK statement. Added SMAflat package. 04-Dec-2018 5 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C). 27-Sep-2019 6 Added Section 2.4 SMA Flat Notch package information. Last update. page 16/17 STPS2L40 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS2146 - Rev 6 page 17/17