STPS1L20MF

STPS1L20MF Low drop power Schottky rectifier in flat package Features A ■ Very low profile package: 0.85 mm ■ Backward compatible with standard STmite footprint ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low forward voltage drop for higher efficiency and extended battery life ■ Low thermal resistance ■ Avalanche capability specified K STmite flat (DO222-AA) Table 1. Description Single Schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. Device summary Symbol Value IF(AV) 1A VRRM 20 V Tj (max) 150 °C VF (max) 0.37 V Packaged in STmite flat, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the very small size of the package this device fits battery powered equipment (cellular, notebook, PDA’s, printers) as well as chargers and PCMCIA cards. July 2011 Doc ID 12640 Rev 2 1/7 www.st.com 7 Characteristics 1 STPS1L20MF Characteristics Table 2. Absolute ratings (limiting values) Symbol Value Unit VRRM Repetitive peak reverse voltage 20 V IF(RMS) Forward current rms 2 A IF(AV) Average forward current Tc = 140 °C δ = 0.5 1 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1400 W - 65 to + 150 °C 150 °C 10000 V/µs Value Unit 20 °C/W 250 °C/W Tstg Storage temperature range (1) Tj Maximum operating junction temperature dV/dt 1. Parameter dPtot --------------dTj Critical rate of rise of reverse voltage (rated VR, Tj = 25 °C) < Table 3. 1 -------------------------Rth ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance Symbol Rth(j-c) Parameter Junction to case Rth(j-a)(1) Junction to ambient 1. Mounted with minimum recommended pad size, PC board FR4 Table 4. Symbol Static electrical characteristics Parameter Tests conditions Tj = 25 °C Tj = 85 °C IR (1) Reverse leakage current Tj = 25 °C Tj = 85 °C Tj = 25 °C Tj = 85 °C Tj = 25 °C Tj = 85 °C Tj = 25 °C VF (1) Forward voltage drop Tj = 85 °C Tj = 25 °C Tj = 85 °C Tj = 25 °C Tj = 85 °C Min. VR = VRRM VR = 10 V VR = 5 V IF = 1 A IF = 2 A Max. 0.015 0.075 0.90 4.50 0.005 0.035 0.45 2.50 0.003 0.025 0.30 1.60 0.38 0.43 0.32 0.37 0.42 0.47 0.37 0.42 0.46 0.53 0.42 0.49 0.50 0.60 0.46 0.56 Unit mA V IF = 3 A IF = 4 A 1. Pulse test: = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.32 x IF(AV) + 0.05 IF2(RMS) 2/7 Typ. Doc ID 12640 Rev 2 STPS1L20MF Figure 1. Characteristics Conduction losses versus average Figure 2. current PF(AV)(W) Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) 0.50 δ = 0.1 0.45 δ = 0.2 1.1 δ = 0.5 Rth(j-a)=Rth(j-c) 1.0 δ = 0.05 0.40 0.9 δ=1 0.35 0.8 0.7 0.30 0.6 Rth(j-a)=270°C/W 0.25 0.5 0.20 0.4 0.15 0.3 T 0.10 0.2 0.05 IF(AV)(A) 0.0 0.1 0.2 Figure 3. 0.3 0.4 0.5 0.6 0.1 δ=tp/T 0.00 0.7 0.8 0.9 1.0 0.0 1.1 0 1.2 Normalized avalanche power derating versus pulse duration 25 Figure 4. PARM(tp) PARM(1µs) 1 Tamb(°C) tp 1.2 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 0.1 0.8 0.6 0.4 0.01 0.2 tp(µs) 0.001 0.01 0.1 Figure 5. 1 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) Tj(°C) 0 25 50 Figure 6. IM(A) 75 100 150 125 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 25 1.0 0.9 20 0.8 0.7 0.6 15 TC=25°C δ = 0.5 0.5 TC=75°C 10 0.4 0.3 5 TC=125°C IM t 0 1.E-03 0.1 t(s) δ=0.5 0.2 δ = 0.2 T δ = 0.1 Single pulse tp(s) δ=tp/T 0.0 1.E-02 1.E-01 1.E+00 1.E-04 Doc ID 12640 Rev 2 1.E-03 1.E-02 tp 1.E-01 3/7 Characteristics Figure 7. STPS1L20MF Reverse leakage currrent versus reverse voltage applied (typical values) Figure 8. IR(mA) Reverse leakage currrent versus junction temperature (typical values) IR(mA) 1.E+02 1.E+02 Tj=150°C VR=20V Tj=125°C 1.E+01 1.E+01 Tj=100°C 1.E+00 1.E+00 Tj=75°C 1.E-01 1.E-01 Tj=50°C 1.E-02 1.E-02 Tj=25°C VR(V) Tj(°C) 1.E-03 1.E-03 0 Figure 9. 2 4 6 8 10 12 14 16 18 20 0 25 50 75 100 125 150 Figure 10. Forward voltage drop versus forward current Junction capacitance versus reverse voltage applied (typical values) IFM(A) C(pF) 2.0 1000 F=1MHz VOSC=30mVRMS Tj=25°C 1.8 Tj=85°C (maximum values) 1.6 1.4 Tj=85°C (typical values) 1.2 100 1.0 0.8 0.6 0.4 0.2 VR(V) 10 Tj=25°C (maximum values) VFM(V) 0.0 1 10 100 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, copper thickness = 35 µm, typical values) Rth(j-a)(°C/W) 250 200 150 100 50 S(mm²) 0 0 4/7 20 40 60 80 100 120 140 Doc ID 12640 Rev 2 160 180 200 0.40 0.45 0.50 STPS1L20MF 2 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. STmite flat dimensions Dimensions Ref. L E1 D L1 Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.85 0.95 0.031 0.033 0.037 L2 b b2 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 D 1.75 1.90 2.05 0.069 0.075 0.081 L3 E Millimeters c A E 3.60 3.80 3.90 0.142 0.150 0.154 E1 2.80 2.95 3.10 0.110 0.116 0.122 L 0.50 0.55 0.80 0.020 0.022 0.031 L1 2.10 2.40 2.60 0.083 0.094 0.102 L2 0.45 0.60 0.75 0.018 0.024 0.030 L3 0.20 0.35 0.50 0.008 0.014 0.020 Figure 12. STmite flat recommended footprint (all dimensions in mm) 0.85 0.63 2.00 0.65 0.65 0.95 1.95 4.13 Doc ID 12640 Rev 2 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS1L20MF F1L2 STmite flat 16 mg 12000 Tape and reel Revision history Table 7. 6/7 STPS1L20MF Document revision history Date Revision Changes 21-Aug-2006 1 First issue. 07-Jul-2011 2 Reformatted to current standards. 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