STTH506B-TR

STTH506 Turbo 2 ultrafast - high voltage rectifier Main product characteristics K IF(AV) VRRM Tj VF (typ) trr (max) 5A 600 V 175° C 1.1 V 30 ns A K A NC DPAK STTH506B Features and benefits ■ ■ ■ ■ ■ A K TO-220AC STTH506D A K TO-220FPAC STTH506FP Ultrafast switching Low reverse current Low thermal resistance Reduces conduction and switching losses Insulated package TO-220FPAC – Insulated voltage: 2500 VRMS – Typical package capacitance: 12 pF Order codes Part Number STTH506B STTH506B-TR STTH506D STTH506FP Marking STTH506B STTH506B STTH506D STTH506FP Description The STTH506 uses ST Turbo2 600V technology. This device is specially suited for use in switching power supplies, and industrial applications. Table 1. Symbol VRRM IF(RMS) Repetitive peak reverse voltage Absolute ratings (limiting values per diode at 25° C, unless otherwise specified) Parameter Value 600 TO-220AC, TO220FPAC RMS forward current DPAK Average forward current, δ = 0.5 Tc = 145° C Tc = 120° C tp = 10 ms Sinusoidal TO-220AC, DPAK TO-220FPAC TO-220AC, TO220FPAC DPAK 10 5 5 70 55 -65 to + 175 (1) Unit V A A A A A A °C °C 20 IF(AV) IFSM Tstg Tj 1. Surge non repetitive forward current Storage temperature range Maximum operating junction temperature 175 dP tot thermal runaway condition for a diode on its own heatsink 1 -------------- < ------------------------dTj R th ( j – a ) May 2006 Rev 1 www.st.com 1/9 Characteristics STTH506 1 Table 2. Characteristics Thermal parameters Parameter Junction to case TO-220AC, DPAK TO-220FPAC Value 3.5 6 Unit ° C/W Symbol Rth(j-c) Table 3. Symbol IR(1) VF(2) Static electrical characteristics Parameter Reverse leakage current Forward voltage drop Test conditions Tj = 25° C Tj = 150° C Tj = 25° C Tj = 150° C VR = VRRM IF = 5 A Min. Typ Max. 5 13 1.10 130 1.85 1.40 Unit µA V 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.07 x IF(AV) + 0.066 IF2(RMS) Table 4. Symbol Dynamic characteristics Parameter Test conditions IF = 0.5 A, Irr = 0.25 A, IR = 1 A, Tj = 25° C IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C IF = 5 A, dIF/dt = -100 A/µs, VR = 400 V, Tj = 25° C dIF/dt = 100 A/µs IF = 5 A VFR = 1.1 x VFmax, Tj = 25° C IF = 5 A dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25° C 4 35 3.5 Min. Typ Max. 30 ns 50 5 180 ns V Unit trr Reverse recovery time IRM tfr VFP Reverse recovery current Forward recovery time Forward recovery voltage Figure 1. PF(AV)(W) Conduction losses versus average current δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Figure 2. IFM(A) Forward voltage drop versus forward current 9 8 7 6 5 100 90 80 70 Tj=150°C (maximum values) δ=1 60 50 Tj=150°C (typical values) 4 40 3 30 20 T 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Tj=25°C (maximum values) IF(AV)(A) δ=tp/T tp 10 0 0.0 0.5 1.0 1.5 2.0 VFM(V) 2.5 3.0 3.5 4.0 2/9 STTH506 Characteristics Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration (TO-220AC, DPAK) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Zth(j-c)/Rth(j-c) Single pulse TO-220AC DPAK Zth(j-c)/Rth(j-c) Single pulse TO-220FPAC tp(s) 1.E-02 1.E-01 1.E+00 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 1.E+01 1.E-03 Figure 5. IRM(A) VR=400V Tj=125°C Peak reverse recovery current versus dIF/dt (typical values) Figure 6. trr(ns) Reverse recovery time versus dIF/dt (typical values) VR=400V Tj=125°C 14 12 10 8 6 4 250 IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 200 IF=2 x IF(AV) 150 IF=IF(AV) IF=0.5 x IF(AV) IF=0.25 x IF(AV) 100 50 2 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 0 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 Figure 7. Reverse recovery charges versus dIF/dt (typical values) Figure 8. Softness factor versus dIF/dt (typical values) IF = 2 x IF(AV) VR = 400 V Tj = 125° C 350 Qrr(nC) VR=400V Tj=125°C IF=2 x IF(AV) 2.50 2.25 2.00 S factor 300 250 IF=IF(AV) 1.75 200 IF=0.5 x IF(AV) 1.50 1.25 1.00 150 100 0.75 dIF/dt(A/µs) 50 0 50 100 150 200 250 300 350 400 450 500 0.50 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 3/9 Characteristics STTH506 Figure 9. Relative variations of dynamic parameters versus junction temperature IF=IF(AV) VR=400V Reference: Tj=125°C Figure 10. Transient peak forward voltage versus dIF/dt (typical values) 26 24 22 20 18 16 14 1.50 1.25 1.00 0.75 0.50 0.25 VFP(V) IF=IF(AV) Tj=125°C IRM and S factor 12 10 QRR 8 6 4 2 Tj(°C) 0.00 25 50 75 100 125 dIF/dt(A/µs) 0 100 200 300 400 500 0 Figure 11. Forward recovery time versus dIF/dt (typical values) tfr(ns) IF=IF(AV) VFR=1.1 x VF max. Tj=125°C Figure 12. Junction capacitance versus reverse voltage applied (typical values) 100 C(pF) F=1MHz VOSC=30mVRMS Tj=25°C 220 200 180 160 140 120 100 80 60 40 20 0 10 dIF/dt(A/µs) 1 0 100 200 300 400 500 1 10 VR(V) 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, eCU = 35 µm) 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 Rth(j-a)(°C/W) DPAK S(Cu)(cm²) 4/9 STTH506 Package mechanical data 2 Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.80 Nm Maximum torque value: 1.0 Nm Table 5. DPAK Dimensions Dimensions Ref. Millimeters Min. E B2 C2 L2 A Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 A A1 A2 B D 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 B2 C C2 H L4 B G A1 R R C D E G A2 0.60 MIN. H L2 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° L4 V2 Figure 14. DPAK Footprint dimensions (in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 5/9 Package mechanical data Table 6. TO-220AC Dimensions Dimensions Ref. Millimeters Min. H2 ØI L5 L7 L6 L2 C A STTH506 Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 A C D E F F1 G 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 F1 L9 L4 F D H2 L2 L4 M E 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 L5 L6 L7 L9 M Diam. I G 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/9 STTH506 Table 7. TO-220FPAC Dimensions Package mechanical data Dimensions Ref. Millimeters Min. A B A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 D E Dia L6 L2 L3 L5 F1 L4 D L7 F F1 G G1 H L2 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L3 L4 L5 L6 L7 Dia. In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information STTH506 3 Ordering information Delivery mode Tube Tape and reel Tube Tube Part Number STTH506B STTH506B-TR STTH506D STTH506FP Marking STTH506B STTH506B STTH506D STTH506FP Package DPAK DPAK TO-220AC TO-220FPAC Weight 0.3 g 0.3 g 1.86 1.8 g Base qty 75 2500 50 50 4 Revision history Date 18-May-2006 Revision 1 First issue. Description of Changes 8/9 STTH506 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9