STTH60P03S
Ultrafast rectifier PDP energy recovery
Datasheet production data
Features
Ultrafast recovery allowing high sustain
frequency
Decrease charge evacuation time in the
inductance
Minimize switching-on and total power losses
Increase luminous efficiency and brightness
Soft and noise-free recovery
High surge capability
A
High junction temperature
K
A
TO-247
STTH60P03SW
Description
The STTH60P03SW is an ultrafast recovery
power rectifier dedicated to energy recovery in
PDP application.
The key parameters of the DERC diode for the
energy recovery circuit have been optimized to
decrease power losses.
March 2013
This is information on a product in full production.
DocID10966 Rev 4
Table 1. Device summary
Symbol
Value
IF(AV)
60 A
VRRM
300 V
VFP (typ)
2.5 V
IRM (typ)
6A
Tj
175 °C
VF (typ)
0.9 V
1/9
www.st.com
9
Characteristics
1
STTH60P03S
Characteristics
Table 2. Absolute ratings (limiting values)
Symbol
Value
Unit
Repetitive peak reverse voltage
300
V
Forward rms current
80
A
IF(AV)
Average forward current
60
A
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
250
A
IFRM
Repetitive peak forward current
F = 200 kHz, tp = 500 ns
Sinusoidal, TC = 155 °C
150
A
Tstg
Storage temperature range
-65 to +
175
°C
175
°C
VRRM
IF(RMS)
Tj
Parameter
Maximum operating junction temperature
Table 3. Thermal parameters
Symbol
Parameter
Rth(j-c)
Junction to case
Zth(j-c)
Transient thermal resistance at 1 µs
Value
Unit
0.8
°C/W
0.002
°C/W
Table 4. Static electrical characteristics
Symbol
Parameter
Test conditions
Tj = 25 °C
IR (1)
Reverse leakage
current
VF (2)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = 0.7 x VRRM
Min.
Typ
0.1
Max.
Unit
100
µA
1
mA
1.5
IF = 30 A
V
0.9
1.15
1. Pulse test: tp = 5 ms, < 2%
2. Pulse test: tp = 380 µs, < 2%
To evaluate the conduction losses use the following equation:
P = 0.88 x IF(AV) + 0.009 IF2(RMS)
Table 5. Switching characteristics
Symbol
IRM
Sfactor
VFP
2/9
Parameter
Reverse recovery
current
Test conditions
Tj = 100 °C
Softness factor
Peak forward voltage
Tj = 25 °C
IF = 60 A, VR = 100 V
dIF/dt = 200 A/µs
IF = 60 A,
dIF/dt = 400 A/µs
DocID10966 Rev 4
Min. Typ Max.
Unit
6
A
7.5
0.5
2.5
3.5
V
STTH60P03S
Characteristics
Figure 1. Forward voltage drop versus forward
current
Figure 2. Relative variation of thermal
impedance junction to case versus pulse
duration
IFM(A)
Zth(j-c)/Rth(j-c)
200
1.0
Tj=125°C
(maximum values)
180
0.9
160
0.8
140
0.7
Tj=125°C
(typical values)
120
0.6
100
0.5
Tj=25°C
(maximum values)
80
0.4
60
0.3
40
0.2
20
0.1
VFM(V)
Single pulse
tp(s)
0.0
0
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
Figure 3. Peak reverse recovery current versus
dIF/dt (typical values)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Figure 4. Reverse recovery time versus dIF/dt
(typical values)
trr(ns)
IRM(A)
20
80
IF≤IF(AV)
VR=100V
Tj=100°C
18
16
IF≤IF(AV)
VR=100V
Tj=100°C
70
60
14
50
12
10
40
8
30
6
20
4
2
10
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
0
100
200
300
400
500
600
700
800
900
1000
Figure 5. Reverse recovery softness factor
versus dIF/dt (typical values)
0
100
200
300
400
500
600
700
800
900
1000
Figure 6. Relative variations of dynamic
parameters versus junction temperature
S factor
1.4
0.8
IF≤IF(AV)
VR=100V
Tj=100°C
0.7
IF=IF(AV)
VR=100V
Reference: Tj=100°C
1.2
1.0
0.6
IRM & S factor
0.8
0.5
0.6
0.4
0.4
0.2
0.3
Tj(°C)
dIF/dt(A/µs)
0.0
0.2
20
0
100
200
300
400
500
600
700
800
900
30
40
50
60
70
80
90
100
1000
DocID10966 Rev 4
3/9
Characteristics
STTH60P03S
Figure 7. Transient peak forward voltage
versus dIF/dt (typical values)
Figure 8. Forward recovery time versus dIF/dt
(typical values)
tfr(ns)
VFP(V)
400
6.0
IF=IF(AV)
Tj=100°C
5.5
IF=IF(AV)
VFR=1.1 x VF max.
Tj=100°C
350
5.0
300
4.5
4.0
250
3.5
200
3.0
2.5
150
2.0
1.5
100
1.0
50
0.5
dIF/dt(A/µs)
dIF/dt(A/µs)
0.0
0
100
200
300
400
500
600
700
800
900
1000
0
100
200
300
400
500
600
700
Figure 9. Reverse leakage current versus reverse voltage
IR(µA)
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
VR(V)
1.E-02
0
4/9
50
100
150
200
DocID10966 Rev 4
250
300
800
900
1000
STTH60P03S
2
Application information
Application information
Figure 10. Application characteristics
Figure 11. Application waveforms
iL
IP
IDERC
t
IRM
V(DERC1)
tp
VFP
VF
t
VS/2
DocID10966 Rev 4
5/9
Package information
3
STTH60P03S
Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.5 N·m
Maximum torque value: 1.0 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 12. TO-247 dimension definitions
Heat-sink plane
A
E
∅P
S
∅R
D
L2
L1
b1
L
b2
1
2
3
b
c
A1
e
6/9
DocID10966 Rev 4
3
2
1
BACK VIEW
STTH60P03S
Package information
Table 6. TO-247 dimension values
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Typ
Max.
A
4.85
5.15
0.191
0.203
A1
2.20
2.60
0.086
0.102
b
1.00
1.40
0.039
0.055
b1
2.00
2.40
0.078
0.094
b2
3.00
3.40
0.118
0.133
c
0.40
0.80
0.015
0.031
D(1)
19.85
20.15
0.781
0.793
E
15.45
15.75
0.608
0.620
e
5.30
5.60
0.209
L
14.20
14.80
0.559
0.582
L1
3.70
4.30
0.145
0.169
L2
P
(2)
5.45
18.50 typ.
0.215
0.220
0.728 typ.
3.55
3.65
0.139
0.143
R
4.50
5.50
0.177
0.217
S
5.30
5.70
0.209
5.50
0.216
0.224
1. Dimension D plus gate protrusion does not exceed 20.5 mm.
2. Resin thickness around the mounting hole is not less than 0.9 mm.
DocID10966 Rev 4
7/9
Ordering information
4
STTH60P03S
Ordering information
Table 7. Ordering information
5
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STTH60P03SW
STTH60P03SW
TO-247
4.46 g
30
Tube
Revision history
Table 8. Document revision history
8/9
Date
Revision
Changes
04-Nov-2004
1
First issue.
10-Jan-2005
2
Minor layout update. No content change.
04-03-2005
3
Table 7 on page 5: base quantity delivery from 50 to 30.
19-Mar-2013
4
Added ECOPACK statement.
DocID10966 Rev 4
STTH60P03S
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT AUTHORIZED FOR USE IN WEAPONS. NOR ARE ST PRODUCTS DESIGNED OR AUTHORIZED FOR USE
IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH
PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR
ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED
FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN
WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE,
AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS.
PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE
CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2013 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
DocID10966 Rev 4
9/9
很抱歉,暂时无法提供与“STTH60P03SW”相匹配的价格&库存,您可以联系我们找货
免费人工找货- 国内价格
- 1+18.26151
- 10+17.39751
- 30+16.88602