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STTH60P03SW

STTH60P03SW

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO247

  • 描述:

    DIODE GEN PURP 300V 60A TO247-3

  • 数据手册
  • 价格&库存
STTH60P03SW 数据手册
STTH60P03S Ultrafast rectifier PDP energy recovery Datasheet  production data Features  Ultrafast recovery allowing high sustain frequency  Decrease charge evacuation time in the inductance  Minimize switching-on and total power losses  Increase luminous efficiency and brightness  Soft and noise-free recovery  High surge capability A  High junction temperature K A TO-247 STTH60P03SW Description The STTH60P03SW is an ultrafast recovery power rectifier dedicated to energy recovery in PDP application. The key parameters of the DERC diode for the energy recovery circuit have been optimized to decrease power losses. March 2013 This is information on a product in full production. DocID10966 Rev 4 Table 1. Device summary Symbol Value IF(AV) 60 A VRRM 300 V VFP (typ) 2.5 V IRM (typ) 6A Tj 175 °C VF (typ) 0.9 V 1/9 www.st.com 9 Characteristics 1 STTH60P03S Characteristics Table 2. Absolute ratings (limiting values) Symbol Value Unit Repetitive peak reverse voltage 300 V Forward rms current 80 A IF(AV) Average forward current 60 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 250 A IFRM Repetitive peak forward current F = 200 kHz, tp = 500 ns Sinusoidal, TC = 155 °C 150 A Tstg Storage temperature range -65 to + 175 °C 175 °C VRRM IF(RMS) Tj Parameter Maximum operating junction temperature Table 3. Thermal parameters Symbol Parameter Rth(j-c) Junction to case Zth(j-c) Transient thermal resistance at 1 µs Value Unit 0.8 °C/W 0.002 °C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C IR (1) Reverse leakage current VF (2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = 0.7 x VRRM Min. Typ 0.1 Max. Unit 100 µA 1 mA 1.5 IF = 30 A V 0.9 1.15 1. Pulse test: tp = 5 ms,  < 2% 2. Pulse test: tp = 380 µs,  < 2% To evaluate the conduction losses use the following equation: P = 0.88 x IF(AV) + 0.009 IF2(RMS) Table 5. Switching characteristics Symbol IRM Sfactor VFP 2/9 Parameter Reverse recovery current Test conditions Tj = 100 °C Softness factor Peak forward voltage Tj = 25 °C IF = 60 A, VR = 100 V dIF/dt = 200 A/µs IF = 60 A, dIF/dt = 400 A/µs DocID10966 Rev 4 Min. Typ Max. Unit 6 A 7.5 0.5 2.5 3.5 V STTH60P03S Characteristics Figure 1. Forward voltage drop versus forward current Figure 2. Relative variation of thermal impedance junction to case versus pulse duration IFM(A) Zth(j-c)/Rth(j-c) 200 1.0 Tj=125°C (maximum values) 180 0.9 160 0.8 140 0.7 Tj=125°C (typical values) 120 0.6 100 0.5 Tj=25°C (maximum values) 80 0.4 60 0.3 40 0.2 20 0.1 VFM(V) Single pulse tp(s) 0.0 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 Figure 3. Peak reverse recovery current versus dIF/dt (typical values) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 4. Reverse recovery time versus dIF/dt (typical values) trr(ns) IRM(A) 20 80 IF≤IF(AV) VR=100V Tj=100°C 18 16 IF≤IF(AV) VR=100V Tj=100°C 70 60 14 50 12 10 40 8 30 6 20 4 2 10 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 100 200 300 400 500 600 700 800 900 1000 Figure 5. Reverse recovery softness factor versus dIF/dt (typical values) 0 100 200 300 400 500 600 700 800 900 1000 Figure 6. Relative variations of dynamic parameters versus junction temperature S factor 1.4 0.8 IF≤IF(AV) VR=100V Tj=100°C 0.7 IF=IF(AV) VR=100V Reference: Tj=100°C 1.2 1.0 0.6 IRM & S factor 0.8 0.5 0.6 0.4 0.4 0.2 0.3 Tj(°C) dIF/dt(A/µs) 0.0 0.2 20 0 100 200 300 400 500 600 700 800 900 30 40 50 60 70 80 90 100 1000 DocID10966 Rev 4 3/9 Characteristics STTH60P03S Figure 7. Transient peak forward voltage versus dIF/dt (typical values) Figure 8. Forward recovery time versus dIF/dt (typical values) tfr(ns) VFP(V) 400 6.0 IF=IF(AV) Tj=100°C 5.5 IF=IF(AV) VFR=1.1 x VF max. Tj=100°C 350 5.0 300 4.5 4.0 250 3.5 200 3.0 2.5 150 2.0 1.5 100 1.0 50 0.5 dIF/dt(A/µs) dIF/dt(A/µs) 0.0 0 100 200 300 400 500 600 700 800 900 1000 0 100 200 300 400 500 600 700 Figure 9. Reverse leakage current versus reverse voltage IR(µA) 1.E+03 1.E+02 1.E+01 1.E+00 1.E-01 VR(V) 1.E-02 0 4/9 50 100 150 200 DocID10966 Rev 4 250 300 800 900 1000 STTH60P03S 2 Application information Application information Figure 10. Application characteristics Figure 11. Application waveforms iL IP IDERC t IRM V(DERC1) tp VFP VF t VS/2 DocID10966 Rev 4 5/9 Package information 3 STTH60P03S Package information  Epoxy meets UL94, V0  Cooling method: by conduction (C)  Recommended torque value: 0.5 N·m  Maximum torque value: 1.0 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. TO-247 dimension definitions Heat-sink plane A E ∅P S ∅R D L2 L1 b1 L b2 1 2 3 b c A1 e 6/9 DocID10966 Rev 4 3 2 1 BACK VIEW STTH60P03S Package information Table 6. TO-247 dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ Max. A 4.85 5.15 0.191 0.203 A1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 D(1) 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 e 5.30 5.60 0.209 L 14.20 14.80 0.559 0.582 L1 3.70 4.30 0.145 0.169 L2 P (2) 5.45 18.50 typ. 0.215 0.220 0.728 typ. 3.55 3.65 0.139 0.143 R 4.50 5.50 0.177 0.217 S 5.30 5.70 0.209 5.50 0.216 0.224 1. Dimension D plus gate protrusion does not exceed 20.5 mm. 2. Resin thickness around the mounting hole is not less than 0.9 mm. DocID10966 Rev 4 7/9 Ordering information 4 STTH60P03S Ordering information Table 7. Ordering information 5 Ordering type Marking Package Weight Base qty Delivery mode STTH60P03SW STTH60P03SW TO-247 4.46 g 30 Tube Revision history Table 8. Document revision history 8/9 Date Revision Changes 04-Nov-2004 1 First issue. 10-Jan-2005 2 Minor layout update. No content change. 04-03-2005 3 Table 7 on page 5: base quantity delivery from 50 to 30. 19-Mar-2013 4 Added ECOPACK statement. DocID10966 Rev 4 STTH60P03S Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT AUTHORIZED FOR USE IN WEAPONS. NOR ARE ST PRODUCTS DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID10966 Rev 4 9/9
STTH60P03SW 价格&库存

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STTH60P03SW
    •  国内价格
    • 1+18.26151
    • 10+17.39751
    • 30+16.88602

    库存:17