STTH8R06GY-TR

STTH8R06-Y Automotive Turbo 2 ultrafast high voltage rectifier Features ■ Ultrafast switching ■ Low reverse recovery current ■ Low thermal resistance ■ Reduces switching losses ■ K A NC AEC-Q101 qualified D2PAK STTH8R06G-Y Description The STTH8R06, which uses ST Turbo 2 600 V technology, is specially suited as a boost diode in continuous mode power factor correction and hard switching conditions. This device is also intended for use as a free wheeling diode in power supplies and other power switching applications. November 2011 Table 1. Doc ID 022291 Rev 1 Device summary Symbol Value IF(AV) 8A VRRM 600 V Tj 175 °C VF (typ) 1.5 V trr (max) 45 ns 1/8 www.st.com 8 Characteristics 1 STTH8R06-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 40 A IF(AV) Average forward current δ = 0.5 Tc = 135 °C 8 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 90 A Tstg Storage temperature range -65 to + 175 °C Operating junction temperature range -40 to + 175 °C Tj Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Parameter Value (max) Unit 1.9 °C/W Junction to case Static electrical characteristics Symbol Parameter Test conditions IR Reverse leakage current VF Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. Typ. Max. Unit 30 VR = VRRM µA 35 400 3.2 IF = 8 A To evaluate the conduction losses use the following equation: P = 1.35 x IF(AV) + 0.075 IF2(RMS) 2/8 Value Doc ID 022291 Rev 1 V 1.5 1.95 STTH8R06-Y Table 5. Characteristics Dynamic characteristics Symbol Parameter Test conditions Reverse recovery time trr IRM Tj = 25 °C Min. Typ. IF = 0.5 A, Irr = 0.25 A, IR =1 A 25 IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V 45 5.5 Tj = 125 °C S factor Softness factor IF = 8 A, VR = 400 V, dIF/dt = -200 A/µs nC IF = 8 A, dIF/dt = 64 A/µs VFR = 2.5 V Tj = 25 °C Forward recovery voltage Figure 1. A 150 Forward recovery time VFP 7.2 0.4 Reverse recovery charges tfr Unit ns Reverse recovery current Qrr Max. Average forward power dissipation Figure 2. versus average forward current 200 ns 5 V Forward voltage drop versus forward current IFM(A) P(W) 32 24 δ = 0.1 δ = 0.2 δ = 0.5 δ = 0.05 28 Tj=125 °C (Maximum values) 20 24 δ=1 16 12 Tj=25 °C (Maximum values) Tj=125 °C (Typical values) 20 16 12 8 T 8 4 4 IF(AV)(A) δ=tp/T 0 0 1 Figure 3. 2 3 4 5 6 7 8 9 0 10 11 0.0 0.5 1.0 Relative variation of thermal Figure 4. impedance junction to case versus pulse duration 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 Peak reverse recovery current versus dIF/dt (typical values) IRM(A) Zth(j-c)/Rth(j-c) 1.0 10 0.9 9 0.8 8 0.7 7 0.6 6 0.5 5 0.4 4 0.3 0.2 VFM(V) tp IF=I F(AV) VR=400 V Tj=125 °C 3 Single pulse 2 0.1 0.0 1.E-04 1 tp(s) dIF/dt(A/µs) 0 1.E-03 1.E-02 1.E-01 1.E+00 0 50 Doc ID 022291 Rev 1 100 150 200 250 300 350 400 450 500 3/8 Characteristics Figure 5. STTH8R06-Y Reverse recovery time versus dIF/dt (typical values) Figure 6. trr(ns) Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) 90 200 IF=I F(AV) VR=400 V Tj=125 °C 80 70 IF=I F(AV) VR=400 V Tj=125 °C 180 160 140 60 120 50 100 40 80 30 60 20 40 10 20 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 Figure 7. 100 150 200 250 300 350 400 450 500 Reverse recovery softness factor versus dIF/dt (typical values) S factor 50 Figure 8. 100 150 200 250 300 350 400 450 500 Relative variations of dynamic parameters versus junction temperature 2.50 0.6 IF=I F(AV) VR=400 V Tj=125 °C 0.5 0 2.25 IF=I F(AV) VR=400 V Reference: T j=125 °C SFACTOR 2.00 1.75 0.4 1.50 1.25 0.3 1.00 0.75 0.2 IRM 0.50 0.1 0.25 dIF/dt(A/µs) 0 4/8 50 100 150 200 250 300 QRR Tj(°C) 0.00 0.0 350 400 450 500 25 Doc ID 022291 Rev 1 50 75 100 125 STTH8R06-Y Figure 9. 12 Characteristics Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) VFP(V) 160 IF=I F(AV) Tj=125 °C tFR(ns) IF=I F(AV) VFR=2.5V Tj=125 °C 140 10 120 8 100 80 6 60 4 40 2 20 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 0 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 50 100 150 200 250 300 350 400 450 500 Figure 12. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) C(pF) 80 100 F=1 MHz VOSC=30 mVRMS Tj=25 °C Epoxy printed circuit board FR4, copper thickness = 35 µm 70 60 50 40 30 20 10 VR(V) 10 S(Cu)(cm²) 0 1 10 100 1000 0 Doc ID 022291 Rev 1 5 10 15 20 25 30 35 40 5/8 Package information 2 STTH8R06-Y Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. D2PAK dimensions Dimensions Ref. A E C2 L2 D L L3 A1 B2 R C B M * V2 * FLAT ZONE NO LESS THAN 2mm Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 0.40 typ. 0° 16.90 10.30 5.08 1.30 8.90 Doc ID 022291 Rev 1 3.70 0.016 typ. 8° Figure 13. D2PAK footprint (dimensions in mm) 6/8 Inches Min. G A2 Millimeters 0° 8° STTH8R06-Y 3 Ordering information Ordering information Table 7. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH8R06GY-TR STTH8R06GY D2PAK 1.48 g 1000 Tape and reel Revision history Table 8. Document revision history Date Revision 03-Nov-2011 1 Changes Initial release. Doc ID 022291 Rev 1 7/8 STTH8R06-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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