STTH8S06B-TR

STTH8S06 Turbo 2 ultrafast high voltage rectifier Datasheet - production data Description K A This device is an ultrafast diode based on 600 V Pt doping planar technology. K TO-220AC K It can be used in hard switching conditions for power factor corrections. Its extremely low reverse recovery current reduces the switching power losses of the MOSFET and thus increases the overall application efficiency. A This diode is also intended for applications in power supplies and power conversions systems, and all sorts of power switching. Table 1: Device summary A TO-220FPAC K Features       Ultrafast recovery Low reverse recovery current Low thermal resistance Higher frequency operation Reduces switching and conduction losses Insulated TO-220FPAC:  Insulating voltage = 2000 VRMS  Package capacitance = 12 pF February 2017 DocID14277 Rev 2 This is information on a product in full production. Symbol Value IF(AV) 8A VRRM 600 V IRM(typ.) 4.4 A VF (typ.) 1.5 V Tj (max.) 175 °C trr (typ.) 12 ns 1/12 www.st.com Characteristics 1 STTH8S06 Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current δ = 0.5 square wave IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Value Unit 600 V 8 A 60 A tp = 10 ms -65 to +175 Maximum operating junction temperature 175 °C Table 3: Thermal parameters Symbol Rth(j-c) Parameter Junction to case Max. value Unit TO-220AC, DPAK 3.0 TO-220FPAC 5.5 °C/ W Table 4: Static electrical characteristics (per diode) Symbol Parameter Test conditions IR Reverse leakage current VF Forward voltage drop Tj = 25 °C Min. VR = 600 V Tj = 125 °C Tj = 25 °C IF = 8 A Tj = 150 °C Typ. - Max. 20 - 25 - 200 3.4 - 1.5 1.9 Unit µA V To evaluate the maximum conduction losses, use the following equation: P = 1.20 x IF(AV) + 0.087 x IF2(RMS) Table 5: Dynamic electrical characteristics Symbol Test conditions trr Reverse recovery time IRM Reverse recovery current Sfactor Qrr IRM Reverse recovery current Qrr IF = 1 A, dIF/dt = - 200 A/μs, VR = 30 V Tj = 25 °C Softness factor Reverse recovery charges Sfactor 2/12 Parameter Softness factor Reverse recovery charges Tj = 125 °C IF = 8 A, dIF/dt = - 200 A/μs, VR = 200 V IF = 8 A, dIF/dt = - 200 A/μs, VR = 200 V DocID14277 Rev 2 Min. Typ. Max. Unit - 12 18 ns - 1.6 2.2 A - 1 - - 17 nC - 4.4 - 0.3 - - 90 nC 6.0 A STTH8S06 1.2 Characteristics Characteristics (curves) Figure 1: Forward voltage drop versus forward current Figure 2: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC) Zth(j-c) /Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse 0.1 t p (s) 0.0 1.E-03 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) Zth(j-c) /Rth(j-c) 1.0 1.E-02 1.E-01 1.E+00 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration(DPAK) Zth(j-c) /Rth(j-c) 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 δ = 0.5 0.5 0.5 0.4 0.4 0.3 δ = 0.2 0.3 Single pulse T δ = 0.1 0.2 0.2 0.1 0.1 0.0 1.E-03 δ =tp/T t p (s) Single pulse tp 1.E-04 1.E-02 1.E-01 1.E+00 IRM(A) 1.E-02 1.E-01 1.E+00 Figure 6: Reverse recovery time versus dIF/dt (typical values) 70 V R = 200 V T j = 125 °C 1.E-03 1.E+01 Figure 5: Peak reverse recovery current versus dIF/dt (typical values) 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 t P(s) 0.0 trr(ns) V R = 200 V T j = 1 25 °C IF =2 x I F(AV ) 60 IF =I F(AV ) IF =0.5 x I F(AV ) 50 IF =2 x I F(AV ) IF =I F(AV ) 40 IF =0.5 x I F(AV ) 30 20 10 dlF/dt(A/µs) dlF/dt(A/µs) 0 0 200 400 600 800 1000 DocID14277 Rev 2 0 200 400 600 800 1000 3/12 Characteristics STTH8S06 Figure 7: Reverse recovery charges versus dIF/dt (typical values) 240 Figure 8: Junction capacitance versus reverse voltage applied (typical values) Q rr(nC) C(pF) 100 IF =2 x I F(AV ) 220 F = 1 MHz VOSC = 30 VRMS Tj = 25 °C V R = 2 00 V T j = 125 °C 200 IF =I F(AV ) 180 160 IF =0.5 x I F(AV ) 140 120 10 100 80 60 40 dlF/dt(A/µs) 20 VR(V) 1 0 0 200 400 600 800 1 1000 10 100 1000 Figure 9: Thermal resistance junction to ambient versus copper surface under tab (DPAK, typical values) Rth(j-a) (°C/W) 100 DPAK 90 80 70 60 50 40 30 Epoxy printed board FR4, e Cu= 35 µm 20 10 SCu(cm²) 0 0 4/12 5 10 15 20 DocID14277 Rev 2 25 30 35 40 STTH8S06 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     2.1 Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N·m Maximum torque value: 0.7 N·m TO-220AC package information Figure 10: TO-220AC package outline DocID14277 Rev 2 5/12 Package information STTH8S06 Table 6: TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam 6/12 Inches 2.6 typ. 3.75 0.102 typ. 3.85 DocID14277 Rev 2 0.147 0.151 STTH8S06 2.2 Package information TO-220FPAC package information Figure 11: TO-220FPAC package outline A B H Dia L6 L2 L7 L3 L5 F1 D L4 F E G1 G DocID14277 Rev 2 7/12 Package information STTH8S06 Table 7: TO-220FPAC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.50 2.70 0.098 0.106 D 2.50 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1.00 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.40 2.70 0.094 0.106 H 10.00 10.40 0.393 L2 8/12 Inches 16.00 typ. 0.409 0.630 typ. L3 28.60 30.60 0.126 1.205 L4 9.80 10.60 0.386 0.417 L5 2.90 3.60 0.114 0.142 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 DocID14277 Rev 2 STTH8S06 2.3 Package information DPAK package information Figure 12: DPAK package outline 0068772_A_21 DocID14277 Rev 2 9/12 Package information STTH8S06 Table 8: DPAK mechanical data Dimensions Dim. Millimeters Min. Typ. Inches Max. Min. Typ. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.205 0.213 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 D1 4.95 5.25 0.201 E 6.40 6.60 0.252 E1 4.60 4.70 4.80 0.181 0.185 0.189 e 2.16 2.28 2.40 0.085 0.090 0.094 e1 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.398 L 1.00 1.50 0.039 0.059 (L1) 2.60 2.80 3.00 0.102 0.110 0.118 L2 0.65 0.80 0.95 0.026 0.031 0.037 L4 0.60 1.00 0.024 R V2 5.10 0.20 0° 0.195 0.207 0.260 0.039 0.008 8° 0° Figure 13: DPAK recommended footprint (dimensions are in mm) 10/12 Max. DocID14277 Rev 2 8° STTH8S06 3 Ordering information Ordering information Table 9: Ordering information Order code 4 Marking Package Weight Base qty. Delivery mode STTH8S06D STTH8S06D TO-220AC 1.9 g 50 Tube STTH8S06FP STTH8S06FP TO-220FPAC 1.64 g 50 Tube STTH8S06B-TR STTH8 S06B DPAK 0.35 g 2500 Tape and reel Revision history Table 10: Document revision history Date Revision Changes 18-Dec-2007 1 first issue 10-Feb-2017 2 Added DPAK package. Updated Section "Features". DocID14277 Rev 2 11/12 STTH8S06 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 12/12 DocID14277 Rev 2