SQ2360EES
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Vishay Siliconix
Automotive N-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
•
•
•
•
60
RDS(on) (Ω) at VGS = 10 V
0.085
RDS(on) (Ω) at VGS = 4.5 V
0.130
ID (A)
4
Configuration
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
Single
SOT-23 (TO-236)
TrenchFET® Power MOSFET
AEC-Q101 Qualifiedc
100 % Rg and UIS Tested
Typical ESD Protection 800 V
D
D
3
G
2
S
1
G
Top View
S
N-Channel MOSFET
Marking Code: 8Mxxx
ORDERING INFORMATION
Package
SOT-23
Lead (Pb)-free and Halogen-free
SQ2360EES-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
VDS
60
Gate-Source Voltage
VGS
± 20
Continuous Drain Current
TC = 25 °C
TC = 125 °C
Continuous Source Current (Diode Conduction)
Pulsed Drain Current a
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation a
L = 0.1 mH
TC = 25 °C
TC = 125 °C
Operating Junction and Storage Temperature Range
ID
V
4
2.3
IS
3.7
IDM
16
IAS
6
EAS
1.8
PD
UNIT
3
1
A
mJ
W
TJ, Tstg
-55 to +175
°C
SYMBOL
LIMIT
UNIT
RthJA
166
RthJF
50
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
Junction-to-Foot (Drain)
PCB Mount b
°C/W
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
b. When mounted on 1" square PCB (FR-4 material).
c. Parametric verification ongoing.
S14-1082-Rev. F, 26-May-14
Document Number: 65352
1
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ2360EES
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Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
VDS
VGS = 0, ID = 250 μA
60
-
-
VGS(th)
VDS = VGS, ID = 250 μA
1.5
-
2.5
IGSS
-
-
± 5.5
VGS = 0 V
VDS = 0 V, VGS = ± 20 V
VDS = 60 V
-
-
1
-
-
50
Zero Gate Voltage Drain Current
IDSS
VGS = 0 V
VDS = 60 V, TJ = 125 °C
VGS = 0 V
VDS = 60 V, TJ = 175 °C
-
-
150
On-State Drain Current a
ID(on)
VGS = 10 V
VDS ≥ 5 V
10
-
-
Drain-Source On-State
Resistance a
Forward Transconductance b
RDS(on)
gfs
VGS = 10 V
ID = 6 A, TJ = 25 °C
-
0.058
0.085
VGS = 10 V
ID = 6 A, TJ = 125 °C
-
-
0.197
VGS = 10 V
ID = 6 A, TJ = 175 °C
-
-
0.258
VGS = 4.5 V
ID = 5 A
-
0.081
0.130
-
5.8
-
-
295
370
-
55
70
VDS = -15 V, ID = 1.9 A
V
μA
μA
A
Ω
Ω
S
Dynamic b
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
-
35
55
Total Gate Charge c
Qg
-
7.40
12
Gate-Source
Charge c
Qgs
Gate-Drain Charge c
Qgd
Gate Resistance
Rg
Turn-On Delay
Time c
Rise Time c
Turn-Off Delay Time c
Fall Time c
VGS = 0 V
VDS = 25 V, f = 1 MHz
VGS = 10 V
VDS = 30 V, ID = 2 A
-
0.95
-
-
1.94
-
f = 1 MHz
1.24
2.46
3.68
-
5
8
VDD = 30 V, RL = 15 Ω
ID ≅ 2 A, VGEN = 10 V, Rg = 1 Ω
-
11
17
-
10
15
-
8
12
td(on)
tr
td(off)
tf
pF
nC
Ω
ns
Source-Drain Diode Ratings and Characteristics b
Pulsed Current a
ISM
Forward Voltage
VSD
IF = 1.5 A, VGS = 0
-
-
16
A
-
0.8
1.2
V
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
S14-1082-Rev. F, 26-May-14
Document Number: 65352
2
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ2360EES
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
0.005
10-2
I GSS - Gate Current (A)
I GSS - Gate Current (mA)
0.004
0.003
TJ = 25 °C
0.002
0.001
0.000
10-4
TJ = 150 °C
10-6
TJ = 25 °C
10-8
10-10
0
6
12
18
24
VGS - Gate-to-Source Voltage (V)
30
0
Gate Current vs. Gate-Source Voltage
6
12
18
24
VGS - Gate-to-Source Voltage (V)
30
Gate Current vs. Gate-Source Voltage
12
12
VGS = 10 V thru 5 V
10
10
I D - Drain Current (A)
I D - Drain Current (A)
VGS = 4 V
8
6
4
2
8
6
4
TC = 25 °C
TC = 125 °C
2
VGS = 3 V
TC = - 55 °C
0
0
0
1
2
3
4
0
5
1
Output Characteristics
4
5
0.25
8
0.20
R DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
3
Transfer Characteristics
10
TC = - 55 °C
6
TC = 25 °C
4
TC = 125 °C
2
0
0.0
2
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
0.15
0.10
VGS = 4.5 V
VGS = 10 V
0.05
0.00
0.4
0.8
1.2
1.6
2.0
I D - Drain Current (A)
4
6
8
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
S14-1082-Rev. F, 26-May-14
0
2
10
12
Document Number: 65352
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ2360EES
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
600
10
VDS = 30 V
ID = 2 A
VGS - Gate-to-Source Voltage (V)
C - Capacitance (pF)
500
400
Ciss
300
200
Coss
100
8
6
4
2
Crss
0
0
0
10
20
30
40
50
60
0
6
Capacitance
Gate Charge
8
10
10
ID = 1.5 A
2.1
VGS = 10 V
I S - Source Current (A)
RDS(on) - On-Resistance (Normalized)
4
Qg - Total Gate Charge (nC)
2.5
1.7
VGS = 4.5 V
1.3
1
TJ = 25 °C
0.1
TJ = 150 °C
0.01
0.9
0.5
- 50 - 25
0
25
50
75
100
125
150
0.001
0.0
175
TJ - Junction Temperature (°C)
0.3
0.6
0.9
1.2
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
0.5
0.5
0.4
0.2
VGS(th) Variance (V)
R DS(on) - On-Resistance (Ω)
2
VDS - Drain-to-Source Voltage (V)
0.3
0.2
- 0.1
- 0.4
ID = 5 mA
ID = 250 µA
TJ = 125 °C
0.1
1.5
- 0.7
TJ = 25 °C
0.0
0
2
4
6
8
10
- 1.0
- 50
VGS - Gate-to-Source Voltage (V)
25
50
75 100
TJ - Temperature (°C)
On-Resistance vs. Gate-Source Voltage
Threshold Voltage
S14-1082-Rev. F, 26-May-14
- 25
0
125
150
175
Document Number: 65352
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ2360EES
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
100
IDM Limited
ID = 1 mA
76
10
Limited by RDS(on)*
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
80
72
68
100 μs
1 ms
1
10 ms
100 ms
0.1
64
TC = 25 °C
Single Pulse
60
- 50
- 25
0
25
50
75 100 125
TJ - Junction Temperature (°C)
150
0.01
0.01
175
BVDSS Limited
1s, 10s, DC
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Drain-Source Breakdown vs. Junction Temperature
Safe Operating Area
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 166 °C/W
0.02
3. TJM - T A = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
S14-1082-Rev. F, 26-May-14
Document Number: 65352
5
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ2360EES
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Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
Square Wave Pulse Duration (s)
10-1
1
Normalized Thermal Transient Impedance, Junction-to-Foot
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Foot (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?65352.
S14-1082-Rev. F, 26-May-14
Document Number: 65352
6
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ2360EES
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REVISION HISTORY
REVISION
F
Vishay Siliconix
a
DATE
DESCRIPTION OF CHANGE
04-Apr-14
• Correction of RDS(on) value used in calculation of maximum continuous drain current and safe operating
area curve.
• VGS = 4.5 V curve added to on-resistance vs. junction temperature graph.
Note
a. As of April 2014
S14-1082-Rev. F, 26-May-14
Document Number: 65352
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
SOT-23 (TO-236): 3-LEAD
b
3
E1
1
E
2
e
S
e1
D
0.10 mm
C
0.004"
A2
A
C
q
Gauge Plane
Seating Plane
Seating Plane
C
A1
Dim
0.25 mm
L
L1
MILLIMETERS
Min
INCHES
Max
Min
Max
0.044
A
0.89
1.12
0.035
A1
0.01
0.10
0.0004
0.004
A2
0.88
1.02
0.0346
0.040
b
0.35
0.50
0.014
0.020
c
0.085
0.18
0.003
0.007
D
2.80
3.04
0.110
0.120
E
2.10
2.64
0.083
0.104
E1
1.20
1.40
0.047
e
0.95 BSC
e1
L
1.90 BSC
0.40
L1
q
0.0748 Ref
0.60
0.016
0.64 Ref
S
0.024
0.025 Ref
0.50 Ref
3°
0.055
0.0374 Ref
0.020 Ref
8°
3°
8°
ECN: S-03946-Rev. K, 09-Jul-01
DWG: 5479
Document Number: 71196
09-Jul-01
www.vishay.com
1
Application Note 826
Vishay Siliconix
0.049
(1.245)
0.029
0.022
(0.559)
(0.724)
0.037
(0.950)
(2.692)
0.106
RECOMMENDED MINIMUM PADS FOR SOT-23
0.053
(1.341)
0.097
(2.459)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index Return to Index
APPLICATION NOTE
Document Number: 72609
Revision: 21-Jan-08
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25
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Revision: 01-Jan-2022
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Document Number: 91000