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Vishay Siliconix
Automotive N-Channel 40 V (D-S) 175 °C MOSFET
FEATURES
PowerPAK®
• TrenchFET® Gen IV power MOSFET
1212-8SLW
D
D
D 7 8
D 6
5
• AEC-Q101 qualified
• 100 % Rg and UIS tested
• Wettable flank terminals
• Low thermal resistance with 0.75 mm profile
3.
3
m
m
1
3.3
mm
Top View
3
4 S
G
Bottom View
2
S
1
S
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
D
Marking code: Q048
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω) at VGS = 10 V
0.0045
ID (A)
110
Configuration
Package
G
40
S
Single
PowerPAK 1212-8SLW
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-source voltage
VDS
40
Gate-source voltage
VGS
± 20
TC = 25 °C
Continuous drain current
TC = 125 °C
Continuous source current (diode conduction)
Pulsed drain current a
Single pulse avalanche current
L = 0.1 mH
Single pulse avalanche energy
TC = 25 °C
Maximum power dissipation a
TC = 125 °C
Operating junction and storage temperature range
Soldering recommendations (peak
ID
63
103
IDM
271
IAS
23
PD
TJ, Tstg
temperature) c
V
110
IS
EAS
UNIT
26
113
37
-55 to +175
260
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-ambient
Junction-to-case (drain)
PCB mount b
SYMBOL
LIMIT
RthJA
81
RthJC
1.32
UNIT
°C/W
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
b. When mounted on 1" square PCB (FR4 material)
c. See solder profile (www.vishay.com/doc?73257). A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection
S23-1097-Rev. B, 11-Dec-2023
Document Number: 63180
1
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-source breakdown voltage
VDS
VGS = 0, ID = 250 μA
40
-
-
VGS(th)
VDS = VGS, ID = 250 μA
2.3
2.8
3.3
Gate-source leakage
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
± 100
VGS = 0 V
VDS = 40 V
-
-
1
Zero gate voltage drain current
IDSS
VGS = 0 V
VDS = 40 V, TJ = 125 °C
-
-
50
VGS = 0 V
VDS = 40 V, TJ = 175 °C
-
-
150
On-state drain current a
ID(on)
VGS = 10 V
VDS ≥ 5 V
20
-
-
VGS = 10 V
ID = 10 A
-
0.0034
0.0045
VGS = 10 V
ID = 10 A, TJ = 125 °C
-
-
0.0076
VGS = 10 V
ID = 10 A, TJ = 175 °C
-
-
0.0095
-
60
-
-
1394
1952
Gate-source threshold voltage
Drain-source on-state
resistance a
Forward transconductance b
Dynamic
RDS(on)
gfs
VDS = 15 V, ID = 10 A
V
nA
μA
A
Ω
S
b
Input capacitance
Ciss
Output capacitance
Coss
-
474
664
Reverse transfer capacitance
Crss
-
32
45
Total gate charge c
Qg
-
23
35
-
7
-
-
5
-
f = 1 MHz
1.1
2.2
3.3
td(on)
-
15
23
tr
VDD = 20 V, RL = 6.67 Ω
ID ≅ 3 A, VGEN = 10 V, Rg = 1 Ω
-
6
9
-
23
35
-
7
11
Gate-source
charge c
Qgs
Gate-drain charge c
Qgd
Gate resistance
Rg
Turn-on delay
time c
Rise time c
Turn-off delay
time c
Fall time c
td(off)
VGS = 0 V
VGS = 10 V
VDS = 25 V, f = 1 MHz
VDS = 20 V, ID = 3 A
tf
Source-Drain Diode Ratings and Characteristic
nC
Ω
ns
b
Pulsed current a
ISM
Forward voltage
VSD
IF = 10 A, VGS = 0 V
-
-
271
A
-
0.82
1.1
V
-
29
58
ns
-
21
42
nC
-
14
-
Body diode reverse recovery time
trr
Body diode reverse recovery charge
Qrr
Reverse recovery fall time
ta
Reverse recovery rise time
tb
-
15
-
IRM(REC)
-
-1.3
-
Body diode peak reverse recovery current
pF
VDD = 32 V, IFM = 3 A, di/dt = 100 A/μs,
R = 10 Ω, L = 0.3 mH, pulse width = 2 μs
ns
A
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S23-1097-Rev. B, 11-Dec-2023
Document Number: 63180
2
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Axis Title
Axis Title
400
VGS = 10 V thru 7 V
10000
200
1st line
2nd line
VGS = 6 V
160
100
VGS = 5 V
80
1000
150
1st line
2nd line
1000
240
2nd line
ID - Drain Current (A)
320
2nd line
ID - Drain Current (A)
250
10000
100
100
TC = 25 °C
50
TC = 125 °C
VGS = 4 V
0
0
2
4
6
8
TC = -55 °C
0
10
10
10
0
2
4
6
8
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
Axis Title
10
Axis Title
120
10 000
10000
10000
1000
TC = 125 °C
60
100
30
0
12
24
36
48
100
10
8
24
32
VDS - Drain-to-Source Voltage (V)
Transconductance
Capacitance
Axis Title
VGS = 7.5 V
0.004
100
VGS = 10 V
0
10
40
60
80
100
10000
ID = 3 A
VDS = 20 V
8
1000
6
1st line
2nd line
1000
0.006
2nd line
VGS - Gate-to-Source Voltage (V)
0.008
0.002
4
100
2
0
10
0
5
10
15
20
ID - Drain Current (A)
Qg - Total Gate Charge (nC)
On-Resistance vs. Drain Current
Gate Charge
S23-1097-Rev. B, 11-Dec-2023
40
10
10000
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Ω)
16
ID - Drain Current (A)
Axis Title
20
100
Crss
0
60
0.010
0
1000
Coss
10
10
0
1000
1st line
2nd line
TC = 25 °C
2nd line
C - Capacitance (pF)
Ciss
90
1st line
2nd line
2nd line
gfs - Transconductance (S)
TC = -55 °C
25
Document Number: 63180
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Axis Title
Axis Title
2.2
TJ = 150 °C
1000
1
100
0.1
TJ = 25 °C
0.01
0.4
0.8
ID = 4 A
1.9
VGS = 10 V
1.6
1.3
VGS = 4.5 V
1.0
100
0.7
10
-50 -25
1.2
0
25
50
75
100 125 150 175
VSD - Source-to-Drain Voltage (V)
TJ - Junction Temperature (°C)
Source Drain Diode Forward Voltage
On-Resistance vs. Junction Temperature
Axis Title
Axis Title
0.6
10000
0.018
0.3
10000
1000
ID = 5 mA
-0.3
-0.6
100
-0.9
ID = 250 μA
-1.2
-1.5
10
-50 -25
0
25
50
75
0.012
1000
1st line
2nd line
0
2nd line
RDS(on) - On-Resistance (Ω)
0.015
1st line
2nd line
2nd line
VGS(th) - Variance (V)
1000
0.4
10
0
10000
1st line
2nd line
10
2nd line
RDS(on) - On-Resistance (Normalized)
10000
1st line
2nd line
2nd line
IS - Source Current (A)
100
0.009
TJ = 150 °C
0.006
100
0.003
TJ = 125 °C
TJ = 25 °C
0.000
100 125 150 175
10
0
2
4
6
8
10
TJ - Junction Temperature (°C)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
On-Resistance vs. Gate-to-Source Voltage
Axis Title
10000
54
ID = 1 mA
53
1000
52
1st line
2nd line
2nd line
VDS - Drain-to-Source Voltage (V)
55
51
50
100
49
48
47
10
-50 -25
0
25
50
75
100 125 150 175
TJ - Junction Temperature (°C)
Drain Source Breakdown vs. Junction Temperature
S23-1097-Rev. B, 11-Dec-2023
Document Number: 63180
4
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
Axis Title
10000
IDM limited
ID limited
100 μs
1000
10
Limited by RDS(on) a
1 ms
10 ms
100 ms,
1001 s,
10 s, DC
1
1st line
2nd line
2nd line
ID - Drain Current (A)
100
BVDSS limited
TC = 25 °C,
single pulse
0.1
0.01
10
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Safe Operating Area
Note
a. VGS > minimum VGS at which RDS(on) is specified
S23-1097-Rev. B, 11-Dec-2023
Document Number: 63180
5
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
t2
1. Duty cycle, D =
t1
t2
2. Per unit base = R thJA = 81 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single pulse
4. Surface mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
100
10
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty cycle = 0.5
0.2
0.1
0.1
Single pulse
0.05
0.02
0.01
10-4
10-3
10-2
Square Wave Pulse Duration (s)
10-1
1
Normalized Thermal Transient Impedance, Junction-to-Case
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Case (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63180.
S23-1097-Rev. B, 11-Dec-2023
Document Number: 63180
6
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single
0.152
(3.860)
0.039
0.068
(0.990)
(1.725)
0.010
(0.255)
(2.390)
0.094
0.088
(2.235)
0.016
(0.405)
0.026
(0.660)
0.025
0.030
(0.635)
(0.760)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Return to Index
APPLICATION NOTE
Document Number: 72597
Revision: 21-Jan-08
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7
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Revision: 01-Jan-2023
1
Document Number: 91000