TFDU6300-TR1

Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors Fast Infrared Transceiver Module (FIR, 4 Mbit/s) for IrDA Application FEATURES • Compliant to the latest IrDA physical layer specification (up to 4 Mbit/s) with an extended low power range of > 70 cm (typ. 1 m) and TV remote control (> 9 m) • Operates from 2.4 V to 3.6 V within specification • Low power consumption (1.8 mA typ. supply current) 20101 DESCRIPTION • Power shutdown mode (0.01 μA typ. shutdown current) The TFDU6300 transceiver is an infrared transceiver module compliant to the latest IrDA® physical layer low-power standard for fast infrared data communication, supporting IrDA speeds up to 4 Mbit/s (FIR), HP-SIR®, Sharp ASK® and carrier based remote control modes up to 2 MHz. Integrated within the transceiver module is a photo PIN diode, an infrared emitter (IRED), and a low-power control IC to provide a total front-end solution in a single package. • Surface mount package - universal (L 8.5 mm x H 2.5 mm x W 3.1 mm) This new Vishay FIR transceiver is built in a new smaller package using the experiences of the lead frame BabyFace technology. The transceivers are capable of directly interfacing with a wide variety of I/O devices, which perform the modulation/demodulation function. At a minimum, a VCC bypass capacitor is the only external component required implementing a complete solution. TFDU6300 has a tri-state output and is floating in shutdown mode with a weak pull-up. • Tri-state-receiver output, floating in shutdown with a weak pull-up • Low profile (universal) package capable of surface mount soldering to side and top view orientation • Directly interfaces with various super I/O and controller devices • Only one external component required • Split power supply, transmitter and receiver can be operated from two power supplies with relaxed requirements saving costs • Qualified for lead (Pb)-free and Sn/Pb processing (MSL4) • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Notebook computers, desktop PCs, tablet PC • Digital cameras and video cameras • Printers, fax machines, photocopiers, screen projectors • Telecommunication products (cellular phones, pagers) • Internet TV boxes, video conferencing systems • External infrared adapters (dongles) • Medical and industrial data collection PRODUCT SUMMARY PART NUMBER TFDU6300 DATA RATE (kbit/s) DIMENSIONS HxLxW (mm x mm x mm) LINK DISTANCE (m) OPERATING VOLTAGE (V) IDLE SUPPLY CURRENT (mA) 4000 2.5 x 8.5 x 3.1 0 to 0.7 2.4 to 3.6 2 PARTS TABLE PART DESCRIPTION QTY/REEL OR TUBE TFDU6300-TR3 Oriented in carrier tape for side view surface mounting 2500 pcs TFDU6300-TT3 Oriented in carrier tape for top view surface mounting 2500 pcs TFDU6300-TR1 Oriented in carrier tape for side view surface mounting 750 pcs TFDU6300-TT1 Oriented in carrier tape for top view surface mounting 750 pcs Rev. 2.2, 06-Sep-13 Document Number: 84763 1 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors FUNCTIONAL BLOCK DIAGRAM VCC1 Tri-State Driver Amplifier RXD Comparator VCC2 SD Logic and Control Controlled Driver TXD GND 18468_1 Fig. 1 - Functional Block Diagram PIN DESCRIPTION PIN NUMBER SYMBOL DESCRIPTION 1 VCC2 IRED anode IRED anode to be externally connected to VCC2 (VIRED). For higher voltages than 3.6 V an external resistor might be necessary for reducing the internal power dissipation. This pin is allowed to be supplied from an uncontrolled power supply separated from the controlled VCC1 - supply 2 IRED cathode IRED cathode, internally connected to driver transistor 3 I/O ACTIVE TXD This input is used to transmit serial data when SD is low. An on-chip protection circuit disables the IRED driver if the TXD pin is asserted for longer than 100 μs. When used in conjunction with the SD pin, this pin is also used to control the receiver mode. Logic reference: VCC1 I High 4 RXD Received data output, push-pull CMOS driver output capable of driving standard CMOS. No external pull-up or pull-down resistor is required. Floating with a weak pull-up of 500 k (typ.) in shutdown mode. High/low levels related to VCC1. RXD echoes the TXD signal O Low 5 SD Shutdown, also used for dynamic mode switching. Setting this pin active places the module into shutdown mode. On the falling edge of this signal, the state of the TXD pin is sampled and used to set receiver low bandwidth (TXD = low: SIR) or high bandwidth (TXD = high: MIR and FIR) mode I High 6 VCC1 Supply voltage 7 NC Internally not connected 8 GND Ground I PINOUT Definitions: Weight 0.075 g In the Vishay transceiver datasheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s 19531 Fig. 2 - Pinning Rev. 2.2, 06-Sep-13 MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR low power standard. IrPhy 1.3 extended the low power option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version. With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4 (in Oct. 2002). Document Number: 84763 2 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITIONS SYMBOL MIN. Supply voltage range, transceiver 0 V < VCC2 < 6 V VCC1 Supply voltage range, transmitter 0 V < VCC1 < 6 V VCC2 Voltage at all I/O pins Input currents Vin < VCC1 is allowed TYP. MAX. UNIT - 0.5 6 V - 0.5 6.5 V - 0.5 For all pins, except IRED anode pin Output sinking current 6 V 10 mA 25 mA Power dissipation PD 500 mW Junction temperature TJ 125 °C Ambient temperature range (operating) Storage temperature range Soldering temperature Tamb - 25 + 85 °C Tstg - 25 + 85 °C 260 °C IIRED (DC) 150 mA IIRED (RP) 700 mA See section “Recommended Solder Profiles” Average output current Repetitive pulse output current < 90 μs, ton < 20 % ESD protection Human body model 1 kV Note • Reference point pin 8, (ground) unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. EYE SAFETY INFORMATION STANDARD CLASSIFICATION IEC/EN 60825-1 (2007-03), DIN EN 60825-1 (2008-05) “SAFETY OF LASER PRODUCTS Part 1: equipment classification and requirements”, simplified method Class 1 IEC 62471 (2006), CIE S009 (2002) “Photobiological Safety of Lamps and Lamp Systems” Exempt DIRECTIVE 2006/25/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 5th April 2006 on the minimum health and safety requirements regarding the exposure of workers to risks arising from physical agents (artificial optical radiation) (19th individual directive within the meaning of article 16(1) of directive 89/391/EEC) Exempt Note • Vishay transceivers operating inside the absolute maximum ratings are classified as eye safe according the above table. ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITIONS SYMBOL MIN. VCC 2.4 TYP. MAX. UNIT 3.6 V TRANSCEIVER Supply voltage Dynamic Supply current Receive mode only, idle In transmit mode, add additional 85 mA (typ) for IRED current. Add RXD output current depending on RXD load. SIR mode ICC 1.8 3 mA MIR/FIR mode ICC 2 3.3 mA Shutdown supply current SD = high T= 25 °C, not ambient light sensitive, detector is disabled in shutdown mode ISD 0.01 Shutdown supply current SD = high, full specified temperature range, not ambient light sensitive ISD μA 1 μA Operating temperature range TA - 25 + 85 °C Input voltage low (TXD, SD) VIL - 0.5 0.5 V Rev. 2.2, 06-Sep-13 Document Number: 84763 3 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITIONS SYMBOL MIN. CMOS level (1) VIH VIN = 0.9 x VCC1 IICH TYP. MAX. UNIT VCC - 0.3 6 V -1 TRANSCEIVER Input voltage high (TXD, SD) Input leakage current (TXD, SD) Input capacitance, TXD, SD Output voltage low Output voltage high IOL = 500 μA Cload = 15 pF IOH = - 250 μA Cload = 15 pF Output RXD current limitation high state low state Short to ground Short to VCC1 SD shutdown pulse duration Activating shutdown RXD to VCC1 impedance SD mode programming pulse duration All modes +1 μA CI 5 pF VOL 0.4 V 0.9 x VCC1 VOH V 20 20 30 RRXD 400 tSDPW 200 500 mA mA  μs 600 k ns Notes • Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. (1) The typical threshold level is 0.5 x V CC1 (VCC1 = 3 V) . It is recommended to use the specified min./max. values to avoid increased operating current. OPTOELECTRONIC CHARACTERISTICS PARAMETER TEST CONDITIONS SYMBOL 9.6 kbit/s to 115.2 kbit/s  = 850 nm to 900 nm, VCC = 2.4 V Minimum irradiance Ee in angular range, MIR mode MIN. TYP. MAX. UNIT Ee 50 (5) 80 (8) mW/m2 (μW/cm2) 1.152 Mbit/s  = 850 nm to 900 nm, VCC = 2.4 V Ee 100 (10) Minimum irradiance Ee inangular range, FIR mode 4 Mbit/s  = 850 nm to 900 nm, VCC = 2.4 V Ee 130 (13) Maximum irradiance Ee in angular range (3)  = 850 nm to 900 nm Ee 5 (500) Rise time of output signal 10 % to 90 %, CL = 15 pF tr (RXD) 10 40 ns Fall time of output signal 40 ns RECEIVER Minimum irradiance Ee (1) in angular range (2) mW/m2 (μW/cm2) 200 (20) mW/m2 (μW/cm2) kW/m2 (mW/cm2) 90 % to 10 %, CL = 15 pF tf (RXD) 10 RXD pulse width of output signal, 50 %, SIR mode Input pulse length 1.4 μs < PWopt < 25 μs tPW 1.6 2.2 3 μs RXD pulse width of output signal, 50 %, MIR mode Input pulse length PWopt = 217 ns, 1.152 Mbit/s tPW 105 250 275 ns RXD pulse width of output signal, 50 %, FIR mode Input pulse length PWopt = 125 ns, 4 Mbit/s tPW 105 125 145 ns RXD pulse width of output signal, 50 %, FIR mode Input pulse length PWopt = 250 ns, 4 Mbit/s tPW 225 250 275 ns 25 80 350 ns ns ns 250 μs 100 μs Stochastic jitter, leading edge Input irradiance = 100 mW/m2, 4 Mbit/s 1.152 Mbit/s  115.2 kbit/s Receiver start up time After completion of shutdown programming sequence power on delay Latency Rev. 2.2, 06-Sep-13 tL 40 Document Number: 84763 4 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors OPTOELECTRONIC CHARACTERISTICS PARAMETER TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Note: no external resistor current limiting resistor is needed ID 330 440 600 mA Input pulse width t < 20 μs tPW TRANSMITTER IRED operating current, switched current limiter Output pulse width limitation Input pulse width 20 μs < t < 150 μs tPW Input pulse width t  150 μs tPW_lim Output leakage IRED current Output radiant intensity, see figure 3, recommended appl. circuit Output radiant intensity, see figure 3, recommended appl. circuit Output radiant intensity t 18 μs 150 μs 150 μs 1 μA IIRED -1 VCC = VIRED = 3.3 V,  = 0° TXD = high, SD = low Ie 65 180 468 (4) mW/sr VCC = VIRED = 3.3 V,  = 0°, 15° TXD = high, SD = low Ie 50 125 468 (4) mW/sr VCC1 = 3.3 V,  = 0°, 15° TXD = low or SD = high (receiver is inactive as long as SD = high) Ie 0.04 mW/sr Output radiant intensity, angle of half intensity  Peak - emission wavelength (5) p Spectral bandwidth  Optical rise time, optical fall time ± 24 875 886 deg 900 45 tropt, tfopt 10 nm nm 40 ns Optical output pulse duration Input pulse width 217 ns, 1.152 Mbit/s topt 207 217 227 ns Optical output pulse duration Input pulse width 125 ns, 4 Mbit/s topt 117 125 133 ns Optical output pulse duration Input pulse width 250 ns, 4 Mbit/s topt 242 250 258 ns 25 % Optical overshoot Notes • Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 μs after starting the preamble. (1) IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %. (2) IrDA sensitivity definition (equivalent to threshold irradiance): minimum irradiance E in angular range, power per unit area. The receiver must e meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angular range at the maximum link length. (3) Maximum irradiance E in angular range, power per unit area. The optical delivered to the detector by a source operating at the maximum e intensity in angular range at minimum link length must not cause receiver overdrive distortion and possible related link errors. If placed at the active output interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification. For more definitions see the document “Symbols and Terminology” on the Vishay website (4) Maximum value is given by eye safety class 1, IEC 60825-1, simplified method. (5) Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the standard remote control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range conditions (125 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers are used. Rev. 2.2, 06-Sep-13 Document Number: 84763 5 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors RECOMMENDED CIRCUIT DIAGRAM Operated at a clean low impedance power supply the TFDU6300 needs no additional external components. However, depending on the entire system design and board layout, additional components may be required (see figure 3). VCC2 R1 VCC1 R2 C1 GND IRED Anode V CC C2 Ground SD SD TXD TXD RXD RXD SD) and the output RXD should be directly (DC) coupled to the I/O circuit. The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. R2, C1 and C2 are optional and dependent on the quality of the supply voltages VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C2 as close as possible to the transceiver power supply pins. A tantalum capacitor should be used for C1 while a ceramic capacitor is used for C2. IRED Cathode 19307 Fig. 3 - Recommended Application Circuit The capacitor C1 is buffering the supply voltage and eliminates the inductance of the power supply line. This one should be a tantalum or other fast capacitor to guarantee the fast rise time of the IRED current. The resistor R1 is only necessary for high operating voltages and elevated temperatures. Vishay transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (TXD, In addition, when connecting the described circuit to the power supply, low impedance wiring should be used. When extended wiring is used the inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not able to follow the fast current rise time. In that case another 4.7 μF (type, see table under C1) at VCC2 will be helpful. Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. See e.g. “The Art of Electronics” Paul Horowitz, Winfield Hill, 1989, Cambridge University Press, ISBN: 0521370957. TABLE 1 - RECOMMENDED APPLICATION CIRCUIT COMPONENTS COMPONENT RECOMMENDED VALUE C1 4.7 μF, 16 V 293D 475X9 016B C2 0.1 μF, ceramic VJ 1206 Y 104 J XXMT R1 No resistor necessary, the internal controller is able to control the current R2 10 , 0.125 W I/O AND SOFTWARE In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases refer to the I/O manual, the Vishay application notes, or contact directly Vishay Sales, Marketing or Application. MODE SWITCHING The TFDU6300 is in the SIR mode after power on as a default mode, therefore the FIR data transfer rate has to be set by a programming sequence using the TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the high frequency mode. Lower frequency data can also be received in the high frequency mode but with reduced sensitivity. To switch the transceivers from low frequency mode to the high frequency mode and vice versa, the programming sequences described below are required. Rev. 2.2, 06-Sep-13 VISHAY PART NUMBER CRCW-1206-10R0-F-RT1 SETTING TO THE HIGH BANDWIDTH MODE (0.576 Mbit/s to 4 Mbit/s) 1. Set SD input to logic “high”. 2. Set TXD input to logic “high”. Wait ts  200 ns. 3. Set SD to logic “low” (this negative edge latches state of TXD, which determines speed setting). 4. After waiting th  200 ns TXD can be set to logic “low”. The hold time of TXD is limited by the maximum allowed pulse length. TXD is now enabled as normal TXD input for the high bandwidth mode. Document Number: 84763 6 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors SETTING TO THE LOWER BANDWIDTH MODE (2.4 kbit/s to 115.2 kbit/s) 1. Set SD input to logic “high”. 2. Set TXD input to logic “low”. Wait ts  200 ns. 50 % SD 3. Set SD to logic “low” (this negative edge latches state of TXD, which determines speed setting). 4. TXD must be held for th  200 ns. ts th High: FIR TXD is now enabled as normal TXD input for the high bandwidth mode. 50 % TXD 50 % Low: SIR Note • When applying this sequence to the device already in the lower bandwidth mode, the SD pulse is interpreted as shutdown. In this case the RXD output of the transceiver may react with a single pulse (going active low) for a duration less than 2 μs. The operating software should take care for this condition. In case the applied SD pulse is longer than 4 μs, no RXD pulse is to be expected but the receiver startup time is to be taken into account before the device is in receive condition. 14873 Fig. 4 - Mode Switching Timing Diagram TABLE 2 - TRUTH TABLE INPUTS SD High OUTPUTS TXD OPTICAL INPUT IRRADIANCE mW/m2 RXD x x Weakly pulled (500 k) to VCC1 0 High x Low (echo) Ie High > 150 μs x High 0 Low min. detection threshold irradiance < max. detection threshold irradiance Low (active) 0 Low > max. detection threshold irradiance x 0 Low RECOMMENDED SOLDER PROFILES Temperature (°C) Solder Profile for Sn/Pb Soldering 260 240 220 200 180 160 140 120 100 80 60 40 20 0 TRANSMITTER 240 °C max. 10 s max. at 230 °C A ramp-up rate less than 0.9 °C/s is not recommended. Ramp-up rates faster than 1.3 °C/s could damage an optical part because the thermal conductivity is less than compared to a standard IC. 2 to 4 °C/s 160 °C max. 120 to180 s Ramp-To-Spike profile is used increasingly. Shown in figure 4 and 5 are Vishay’s recommended profiles for use with the TFDU6300 transceivers. For more details please refer to the application note “SMD Assembly Instructions”. Wave Soldering 90 s max. For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended. 2 to 4 °C/s Manual Soldering 0 50 19535 100 150 200 250 300 350 Time/s Fig. 5 - Recommended Solder Profile for Sn/Pb soldering Lead (Pb)-free, Recommended Solder Profile The TFDU6300 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn(3.0 - 4.0)Ag(0.5 - 0.9)Cu, there are two standard reflow profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-Soak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Rev. 2.2, 06-Sep-13 Manual soldering is the standard method for lab use. However, for a production process it cannot be recommended because the risk of damage is highly dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering. Storage The storage and drying processes for all Vishay transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4. The data for the drying procedure is given on labels on the packing and also in the application note “Taping, Labeling, Storage and Packing”. Document Number: 84763 7 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors 280 275 T ≥ 255 °C for 10 s....30 s 250 240 225 T ≥ 217 °C for 70 s max. 200 175 150 30 s max. 125 100 90 s to 120 s 70 s max. 2 °C/s to 4 °C/s 75 200 Temperature/°C Temperature/°C Tpeak = 260 °C max. Tpeak = 260 °C < 4 °C/s 160 120 Time above 217 °C t ≤ 70 s Time above 250 °C t ≤ 40 s < 2 °C/s Peak temperature Tpeak = 260 °C 80 2 °C/s to 3 °C/s 50 1.3 °C/s 40 25 0 0 0 50 100 19532 150 200 250 300 350 0 50 100 TFDU Fig3 Time/s 150 200 250 300 Time/s Fig. 6 - Solder Profile, RSS Recommendation Fig. 7 - RTS Recommendation PACKAGE DIMENSIONS in millimeters TFDU6300 (universal) package 20627 Footprint Mounting Center Mounting Center 7 x 0.95 = 6.65 0.7 0.7 (8 x) Top View * min 0.2 Photoimageable solder mask recommended between pads to prevent bridgeing Side View (0.25) 1.2 1.4 1.4 (1.82) 0.95 0.4 0.2* 20626 Fig. 8 - Package Drawing Rev. 2.2, 06-Sep-13 Document Number: 84763 8 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters Drawing-No.: 9.800-5090.01-4 Issue: 1; 29.11.05 14017 Fig. 9 - Reel Drawing TAPE WIDTH (mm) A MAX. (mm) N (mm) W1 MIN. (mm) W2 MAX. (mm) W3 MIN. (mm) W3 MAX. (mm) 16 180 60 16.4 22.4 15.9 19.4 16 330 60 16.4 22.4 15.9 19.4 Rev. 2.2, 06-Sep-13 Document Number: 84763 9 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors TAPE DIMENSIONS in millimeters Drawing-No.: 9.700-5280.01-4 Issue: 1; 03.11.03 19855 Fig. 10 - Tape Drawing, TFDU6300 for Top View Mounting Rev. 2.2, 06-Sep-13 Document Number: 84763 10 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFDU6300 www.vishay.com Vishay Semiconductors TAPE DIMENSIONS in millimeters 19856 Drawing-No.: 9.700-5279.01-4 Issue: 1; 08.12.04 19856 Fig. 11 - Tape Drawing, TFDU6300 for Side View Mounting Rev. 2.2, 06-Sep-13 Document Number: 84763 11 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000