VS-12TTS08HM3
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Vishay Semiconductors
High Voltage, Phase Control Thyristor, 12 A
FEATURES
2
(A)
• AEC-Q101 qualified
• Meets JESD 201 class 1A whisker test
• Flexible solution for reliable AC power
rectification
TO-220AB
1
2
• Easy control peak current at charger power
up to reduce passive / electromechanical
components
3
1 (K) (G) 3
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
IT(AV)
8A
VDRM/VRRM
800 V
VTM
1.2 V
IGT
15 mA
APPLICATIONS
• On-board and off-board EV / HEV battery chargers
• Renewable energy inverters
TJ
-40 to +125 °C
Package
TO-220AB
Circuit configuration
Single SCR
DESCRIPTION
The VS-12TTS08HM3 high voltage series of silicon
controlled rectifiers are specifically designed for medium
power switching and phase control applications.
OUTPUT CURRENT IN TYPICAL APPLICATIONS
APPLICATIONS
SINGLE-PHASE BRIDGE
THREE-PHASE BRIDGE
UNITS
13.5
17
A
TEST CONDITIONS
VALUES
UNITS
Capacitive input filter TA = 55 °C, TJ = 125 °C,
common heatsink of 1 °C/W
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
IT(AV)
Sinusoidal waveform
8
A
IT(RMS)
12.5
VRRM/VDRM
800
V
ITSM
110
A
VT
8 A, TJ = 25 °C
dV/dt
dI/dt
TJ
Range
1.2
V
150
V/μs
100
A/μs
-40 to +125
°C
VOLTAGE RATINGS
PART NUMBER
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VDRM, MAXIMUM PEAK
DIRECT VOLTAGE
V
IRRM / IDRM
AT 125 °C
mA
VS-12TTS08HM3
800
800
5.0
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
Maximum average on-state current
Maximum RMS on-state current
Maximum peak one-cycle
non-repetitive surge current
SYMBOL
IT(AV)
IT(RMS)
ITSM
TEST CONDITIONS
TC = 108 °C, 180° conduction, half sine wave
10 ms sine pulse, no voltage reapplied, TJ = 125 °C
110
10 ms sine pulse, rated VRRM applied, TJ = 125 °C
45
10 ms sine pulse, no voltage reapplied, TJ = 125 °C
64
640
Maximum I2t for fusing
I2t
t = 0.1 ms to 10 ms, no voltage reapplied, TJ = 125 °C
Maximum on-state voltage drop
VTM
8 A, TJ = 25 °C
Threshold voltage
Maximum reverse and direct leakage current
Typical holding current
Typical latching current
rt
VT(TO)
IRM/IDM
IH
IL
Maximum rate of rise of off-state voltage
dV/dt
Maximum rate of rise of turned-on current
dI/dt
12.5
95
I2t
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
VR = rated VRRM / VDRM
Anode supply = 6 V, resistive load, initial IT = 1 A,
TJ = 25 °C
UNITS
8
10 ms sine pulse, rated VRRM applied, TJ = 125 °C
Maximum I2t for fusing
On-state slope resistance
VALUES
A
A2s
A2s
1.2
V
16.2
m
0.87
V
0.05
5.0
30
mA
Anode supply = 6 V, resistive load, TJ = 25 °C
50
TJ = TJ max., linear to 80 %, VDRM = Rg - k = open
150
V/μs
100
A/μs
VALUES
UNITS
TRIGGERING
PARAMETER
Maximum peak gate power
SYMBOL
TEST CONDITIONS
PGM
8.0
PG(AV)
2.0
Maximum peak positive gate current
+IGM
1.5
A
Maximum peak negative gate voltage
-VGM
10
V
Maximum average gate power
Maximum required DC gate current to trigger
Maximum required DC gate voltage to trigger
IGT
VGT
Maximum DC gate voltage not to trigger
VGD
Maximum DC gate current not to trigger
IGD
Anode supply = 6 V, resistive load, TJ = - 65 °C
20
Anode supply = 6 V, resistive load, TJ = 25 °C
15
Anode supply = 6 V, resistive load, TJ = 125 °C
10
Anode supply = 6 V, resistive load, TJ = -65 °C
1.2
Anode supply = 6 V, resistive load, TJ = 25 °C
1
Anode supply = 6 V, resistive load, TJ = 125 °C
0.7
TJ = 125 °C, VDRM = rated value
W
mA
V
0.2
0.1
mA
VALUES
UNITS
SWITCHING
PARAMETER
SYMBOL
Typical turn-on time
tgt
Typical reverse recovery time
trr
Typical turn-off time
tq
TEST CONDITIONS
TJ = 25 °C
TJ = 125 °C
0.8
3
μs
100
Revision: 04-Jun-2018
Document Number: 96538
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VS-12TTS08HM3
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Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
Maximum thermal resistance,
junction to ambient
RthJA
Typical thermal resistance,
case to heatsink
RthCS
VALUES
UNITS
-40 to +125
°C
DC operation
1.5
Mounting surface, smooth, and greased
0.5
2
g
0.07
oz.
minimum
6 (5)
maximum
12 (10)
kgf · cm
(lbf · in)
Approximate weight
Mounting torque
Case style TO-220AB
125
R thJC (DC) = 1.5 K/W
120
Conduction angle
110
30°
60°
105
90°
120°
180°
100
0
2
4
6
8
12TTS08H
Maximum Average On-state Power Loss (W)
Maximum Allowable Case Temperature (°C)
Marking device
115
10
180°
120°
90°
60°
30°
9
8
7
6
RMS Limit
5
4
Conduction angle
3
2
TJ = 125 °C
1
0
10
0
Average On-state Current (A)
R thJC (DC) = 1.5 K/W
120
Conduction period
30°
60°
90°
120°
105
180°
DC
100
0
2
4
6
8
10
2
3
4
5
6
7
8
9
12
Fig. 3 - On-State Power Loss Characteristics
Maximum Average On-state Power Loss (W)
Maximum Allowable Case Temperature (°C)
125
110
1
Average On-state Current (A)
Fig. 1 - Current Rating Characteristics
115
°C/W
62
14
Average On-state Current (A)
Fig. 2 - Current Rating Characteristics
14
DC
180°
120°
90°
60°
30°
12
10
8
RMS Limit
6
Conduction Period
4
TJ = 125 °C
2
0
0
2
4
6
8
10
12
14
Average On-state Current (A)
Fig. 4 - On-State Power Loss Characteristics
Revision: 04-Jun-2018
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VS-12TTS08HM3
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Vishay Semiconductors
120
110
At any rated load condition and with
rated Vrrm applied following surge.
Initial Tj = 150°C
at 60 Hz 0.0083s
at 50 Hz 0.0100s
90
110
Peak Half Sine Wave
Forward Current (A)
Peak Half Sine Wave
Forward Current (A)
100
80
70
60
50
100
Maximum non-repetitive surge current
versus pulse train duration.
Initial Tj = Tj max.
No voltage reapplied
Rated Vrrm reapplied
90
80
70
60
50
40
0.01
40
1
10
100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
0.1
1
Pulse Train Duration (s)
10
Fig. 6 - Maximum Non-Repetitive Surge Current
Instantaneous On-state Current (A)
1000
100
TJ = 25 °C
10
TJ = 125 °C
1
0.5
1
1.5
2
2.5
3
3.5
Instantaneous On-state Voltage (V)
Transient Thermal Impedance Z thJC (°C/W)
Fig. 7 - On-State Voltage Drop Characteristics
10
Steady state value
(DC operation)
1
0.1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Single pulse
0.01
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Fig. 8 - Thermal Impedance ZthJC Characteristics
Revision: 04-Jun-2018
Document Number: 96538
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VS-12TTS08HM3
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
12
T
T
S
08
H
M3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Current rating (12.5 A)
3
-
Circuit configuration:
4
-
Package:
T = TO-220
5
-
Type of silicon:
T = single thyristor
S = standard recovery rectifier
6
-
Voltage rating (08 = 800 V)
7
-
H = AEC-Q101 qualified
8
-
Environmental digit:
M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-12TTS08HM3
50
1000
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95222
Part marking information
www.vishay.com/doc?95028
Revision: 04-Jun-2018
Document Number: 96538
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
TO-220AB
DIMENSIONS in millimeters and inches
A
(6)
E
E2
ØP
0.014 M B A M
(7)
A
B
Seating
plane
A
Thermal pad
(E)
A1
1
Q
(6)
D
(H1)
H1
(7)
C
D2 (6)
(6) D
2 3
D
L1 (2)
C
Detail B
D1
3xb
1
2
3
3 x b2
Detail B
C
E1 (6)
L
(b, b2)
Base metal
View A - A
c
Plating
c1 (4)
c
A
2x e
A2
e1
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead tip
Conforms to JEDEC® outline TO-220AB
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.25
4.65
0.167
0.183
A1
1.14
1.40
0.045
0.055
NOTES
SYMBOL
MILLIMETERS
INCHES
NOTES
MIN.
MAX.
MIN.
MAX.
D2
11.68
12.88
0.460
0.507
6
E
10.11
10.51
0.398
0.414
3, 6
A2
2.56
2.92
0.101
0.115
E1
6.86
8.89
0.270
0.350
6
b
0.69
1.01
0.027
0.040
E2
-
0.76
-
0.030
7
b1
0.38
0.97
0.015
0.038
4
e
2.41
2.67
0.095
0.105
b2
1.20
1.73
0.047
0.068
e1
4.88
5.28
0.192
0.208
b3
1.14
1.73
0.045
0.068
4
H1
5.84
6.86
0.230
0.270
c
0.36
0.61
0.014
0.024
L
13.52
14.02
0.532
0.552
c1
0.36
0.56
0.014
0.022
4
L1
3.32
3.82
0.131
0.150
D
14.85
15.25
0.585
0.600
3
ØP
3.54
3.73
0.139
0.147
D1
8.38
9.02
0.330
0.355
Q
2.60
3.00
0.102
0.118
6, 7
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1 and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3 and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2 and E1
(7) Dimensions E2 x H1 define a zone where stamping and singulation irregularities are allowed
(8) Outline conforms to JEDEC® TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package
outline
Revision: 06-Mar-2020
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Revision: 09-Jul-2021
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Document Number: 91000