Not Available for New Designs, Use VS-GB90DA60U
VS-GB100DA60UP
www.vishay.com
Vishay Semiconductors
Insulated Gate Bipolar Transistor
(Warp 2 Speed IGBT), 100 A
FEATURES
• NPT warp 2 speed IGBT technology with
positive temperature coefficient
• Square RBSOA
• HEXFRED® antiparallel diodes with ultrasoft
reverse recovery
• Fully isolated package
SOT-227
• Very low internal inductance ( 5 nH typical)
• Industry standard outline
• UL approved file E78996
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
VCES
600 V
IC DC
100 A at 61 °C
VCE(on) typical at 100 A, 25 °C
2.4 V
IF DC
100 A at 85 °C
Package
SOT-227
Circuit
Single Switch Diode
BENEFITS
• Designed for increased operating efficiency in power
conversion: UPS, SMPS, welding, induction heating
• Easy to assemble and parallel
• Direct mounting to heatsink
• Plug-in compatible with other SOT-227 packages
• Higher switching frequency up to 150 kHz
• Lower conduction losses and switching losses
• Low EMI, requires less snubbing
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
TEST CONDITIONS
MAX.
UNITS
600
V
TC = 25 °C
125
TC = 80 °C
85
Pulsed collector current
ICM
300
Clamped inductive load current
ILM
300
Diode continuous forward current
IF
TC = 25 °C
TC = 80 °C
160
105
Peak diode forward current
IFM
200
Gate to emitter voltage
VGE
± 20
Power dissipation, IGBT
PD
Power dissipation, diode
Isolation voltage
Revision: 13-Sep-13
PD
VISOL
A
TC = 25 °C
447
TC = 80 °C
250
TC = 25 °C
313
TC = 80 °C
175
Any terminal to case, t = 1 min
2500
V
W
V
Document Number: 93001
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not Available for New Designs, Use VS-GB90DA60U
VS-GB100DA60UP
www.vishay.com
Vishay Semiconductors
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown
voltage
Collector to emitter voltage
Gate threshold voltage
Temperature coefficient of
threshold voltage
Collector to emitter leakage current
Forward voltage drop
Gate to emitter leakage current
SYMBOL
VBR(CES)
VCE(on)
VGE(th)
VGE(th)/TJ
ICES
VFM
IGES
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
VGE = 0 V, IC = 250 μA
600
-
-
VGE = 15 V, IC = 100 A
-
2.4
2.8
VGE = 15 V, IC = 100 A, TJ = 125 °C
-
3
3.4
VCE = VGE, IC = 250 μA
3
3.9
5
VCE = VGE, IC = 1 mA (25 °C to 125 °C)
-
-10
-
mV/°C
VGE = 0 V, VCE = 600 V
-
7
100
μA
VGE = 0 V, VCE = 600 V, TJ = 150 °C
-
4
10
mA
IC = 100 A, VGE = 0 V
-
1.6
2.1
IC = 100 A, VGE = 0 V, TJ = 125 °C
-
1.7
2
VGE = ± 20 V
-
-
± 200
nA
UNITS
V
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
-
460
690
-
160
250
-
70
130
-
0.36
-
-
1.42
-
-
1.78
-
-
0.52
-
-
1.6
-
-
2.12
-
-
264
-
-
54
-
td(off)
-
257
-
tf
-
80
-
Total gate charge (turn-on)
Qg
Gate to emitter charge (turn-on)
Qge
Gate to collector charge (turn-on)
Qgc
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
Turn-off delay time
Fall time
tr
TEST CONDITIONS
IC = 100 A, VCC = 480 V, VGE = 15 V
IC = 100 A, VCC = 360 V,
VGE = 15 V, Rg = 5
L = 500 μH, TJ = 25 °C
nC
mJ
IC = 100 A, VCC = 360 V,
VGE = 15 V, Rg = 5
L = 500 μH, TJ = 125 °C
Energy losses
include tail and
diode recovery
(see fig. 18)
ns
TJ = 150 °C, IC = 300 A, Rg = 22
Reverse bias safe operating area
RBSOA
Fullsquare
VGE = 15 V to 0 V, VCC = 400 V,
VP = 600 V, L = 500 μH
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Revision: 13-Sep-13
IF = 50 A, dIF/dt = 200 A/μs, VR = 200 V
IF = 50 A, dIF/dt = 200 A/μs,
VR = 200 V, TJ = 125 °C
-
95
120
ns
-
10
13
A
-
480
780
nC
-
144
185
ns
-
16
19
A
-
1136
1758
nC
Document Number: 93001
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not Available for New Designs, Use VS-GB90DA60U
VS-GB100DA60UP
www.vishay.com
Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Junction and storage temperature range
IGBT
Junction to case
Diode
Case to heatsink
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-40
-
150
°C
-
-
0.28
-
-
0.4
-
0.05
-
-
30
-
g
-
-
1.3
Nm
RthJC
RthCS
Flat, greased surface
Weight
Mounting torque
Case style
SOT-227
200
160
Allowable case temperature (°C)
°C/W
140
120
Tj = 25°C
150
IC (A)
100
80
100
60
Tj = 125°C
40
50
20
0
0
0
20
40
60
80
100
120
140
0
1
2
Continuous collector current, IC (A)
Fig. 1 - Maximum DC IGBT Collector Current vs.
Case Temperature
4
5
Fig. 3 - Typical IGBT Collector Current Characteristics
160
Allowable case temperature (°C)
1000
100
IC (A)
3
VCE (V)
10
1
0
140
120
100
80
60
40
20
0
1
Revision: 13-Sep-13
10
100
1000
0
20
40
60
80 100 120 140 160 180
VCE (V)
Continuous forward current, IF (A)
Fig. 2 - IGBT Reverse Bias SOA
TJ = 150 °C, VGE = 15 V
Fig. 4 - Maximum DC Forward Current vs.
Case Temperature
Document Number: 93001
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not Available for New Designs, Use VS-GB90DA60U
VS-GB100DA60UP
www.vishay.com
Vishay Semiconductors
200
4
3.5
150
3
100 A
VCE (V)
IF (A)
2.5
100
75 A
2
27 A
1.5
50
1
Tj = 125°C
0.5
Tj = 25°C
0
0
0
0.5
1
1.5
2
2.5
20
40
60
80
100
120
140
160
VFM (V)
TJ (°C)
Fig. 5 - Typical Diode Forward Characteristics
Fig. 8 - Typical IGBT Collector to Emitter Voltage vs.
Junction Temperature, VGE = 15 V
1.8
10
1.6
TJ = 125°C
1
EOFF
1.4
Energy (mJ)
1.2
ICES (mA)
0.1
0.01
1
0.8
0.6
TJ = 25°C
EON
0.4
0.001
0.2
0
0.0001
100
200
300
400
500
10
600
30
50
90
110
IC (A)
VCES (V)
Fig. 9 - Typical IGBT Energy Loss vs. IC
TJ = 125 °C, L = 500 μH, VCC = 360 V,
Rg = 5 , VGE = 15 V
Fig. 6 - Typical IGBT Zero Gate Voltage Collector Current
4.5
1000
TJ = 25°C
tdOFF
Switching time (μs)
4
Vgeth (V)
70
3.5
TJ = 125°C
3
tdON
tF
100
tR
2.5
2
0.0002
10
0.0004
0.0006
0.0008
0.001
IC (mA)
Fig. 7 - Typical IGBT Threshold Voltage
Revision: 13-Sep-13
0
20
40
60
80
100
120
IC (A)
Fig. 10 - Typical IGBT Switching Time vs. IC
TJ = 125 °C, L = 500 μH, VCC = 360 V,
Rg = 5 , VGE = 15 V
Document Number: 93001
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not Available for New Designs, Use VS-GB90DA60U
VS-GB100DA60UP
3.4
3.2
3
2.8
2.6
2.4
2.2
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
Vishay Semiconductors
210
190
170
150
EOFF
trr (ns)
Energy (mJ)
www.vishay.com
TJ = 125°C
130
TJ = 25°C
110
EON
90
70
50
0
10
20
30
40
100
50
1000
dIF/dt (A/μs)
RG (Ω)
Fig. 11 - Typical IGBT Energy Loss vs. Rg
TJ = 125 °C, IC = 100 A, L = 500 μH,
VCC = 360 V, VGE = 15 V
Fig. 13 - Typical trr diode vs. dIF/dt
VRR = 200 V, IF = 50 A
1000
40
tdON
35
30
25
tF
Irr (A)
Switching time (μs)
tdOFF
100
TJ = 125°C
20
TJ = 25°C
15
tR
10
5
0
10
0
10
20
30
40
100
50
1000
dIF/dt (A/μs)
RG (Ω)
ZthJC - Thermal impedance junction to case (°C/W )
Fig. 12 - Typical IGBT Switching Time vs. Rg
TJ = 125 °C, L = 500 μH, VCC = 360 V,
IC = 100 A, VGE = 15 V
Fig. 14 - Typical Irr diode vs. dIF/dt
VRR = 200 V, IF = 50 A
1
D = 0.50
0.1
0.20
0.01
0.10
0.05
0.02
0.01
0.001
0.0001
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
0.001
0.01
0.1
1
Rectangular pulse duration (t1)
Fig. 15 - Maximum Thermal Impedance ZthJC Characteristics (IGBT)
Revision: 13-Sep-13
Document Number: 93001
5
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not Available for New Designs, Use VS-GB90DA60U
VS-GB100DA60UP
ZthJC - Thermal impedance junction to case (°C/W )
www.vishay.com
Vishay Semiconductors
1
D = 0.50
0.20
0.1
0.10
0.05
0.02
0.01
0.01
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-005
0.0001
0.001
0.01
0.1
1
Rectangular pulse duration (t1)
Fig. 16 - Maximum Thermal Impedance ZthJC Characteristics (diode)
R=
L
D.U.T.
VCC
ICM
VC *
50 V
1000 V
D.U.T.
1
2
+
-V
CC
Rg
* Driver same type as D.U.T.; VC = 80 % of Vce(max)
* Note: Due to the 50 V power supply, pulse width and inductor
will increase to obtain Id
Fig. 17a - Clamped Inductive Load Test Circuit
Fig. 17b - Pulsed Collector Current Test Circuit
Diode clamp/
D.U.T.
L
- +
-5V
D.U.T./
driver
+
VCC
Rg
Fig. 18a - Switching Loss Test Circuit
Revision: 13-Sep-13
Document Number: 93001
6
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not Available for New Designs, Use VS-GB90DA60U
VS-GB100DA60UP
www.vishay.com
Vishay Semiconductors
1
2
90 %
10 %
3
VC
90 %
td(off)
10 %
IC
5%
tf
tr
td(on)
t = 5 µs
Eoff
Eon
Ets = (Eon + Eoff)
Fig. 18b - Switching Loss Waveforms Test Circuit
ORDERING INFORMATION TABLE
Device code
VS-
G
B
100
D
A
60
U
P
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Insulated Gate Bipolar Transistor (IGBT)
3
-
B = IGBT Generation 5
4
-
Current rating (100 = 100 A)
5
-
Circuit configuration (D = Single switch with antiparallel diode)
6
-
Package indicator (A = SOT-227)
7
-
Voltage rating (60 = 600 V)
8
-
Speed/type (U = Ultrafast IGBT)
9
-
Totally lead (Pb)-free
CIRCUIT CONFIGURATION
3 (C)
2 (G)
1, 4 (E)
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95036
Packaging information
www.vishay.com/doc?95037
Revision: 13-Sep-13
Document Number: 93001
7
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
Vishay Semiconductors
SOT-227
DIMENSIONS in millimeters (inches)
38.30 (1.508)
37.80 (1.488)
Chamfer
2.00 (0.079) x 45°
4 x M4 nuts
Ø 4.40 (0.173)
Ø 4.20 (0.165)
-A3
4
6.25 (0.246)
12.50 (0.492)
25.70 (1.012)
25.20 (0.992)
-B-
1
2
R full
7.50 (0.295)
15.00 (0.590)
30.20 (1.189)
29.80 (1.173)
8.10 (0.319)
4x
7.70 (0.303)
2.10 (0.082)
1.90 (0.075)
0.25 (0.010) M C A M B M
2.10 (0.082)
1.90 (0.075)
-C-
12.30 (0.484)
11.80 (0.464)
0.12 (0.005)
Notes
• Dimensioning and tolerancing per ANSI Y14.5M-1982
• Controlling dimension: millimeter
Document Number: 95036
Revision: 28-Aug-07
For technical questions, contact: indmodules@vishay.com
www.vishay.com
1
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000