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Vishay Semiconductors
Insulated Gate Bipolar Transistor
(Ultrafast IGBT), 75 A
FEATURES
• NPT Generation V IGBT technology
• Square RBSOA
• HEXFRED® low Qrr, low switching energy
• Positive VCE(on) temperature coefficient
• Fully isolated package
SOT-227
• Speed 8 kHz to 60 kHz
• Very low internal inductance ( 5 nH typical)
• Industry standard outline
• UL approved file E78996
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
BENEFITS
VCES
1200 V
IC DC
75 A at 95 °C
VCE(on) typical at 75 A, 25 °C
3.3 V
Package
SOT-227
• Designed for increased operating efficiency in power
conversion: UPS, SMPS, welding, induction heating
• Easy to assemble and parallel
• Direct mounting on heatsink
• Plug-in compatible with other SOT-227 packages
• Low EMI, requires less snubbing
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
TEST CONDITIONS
MAX.
UNITS
1200
V
TC = 25 °C
131
TC = 80 °C
89
Pulsed collector current
ICM
200
Clamped inductive load current
ILM
200
Diode continuous forward current
IF
Gate to emitter voltage
VGE
Power dissipation, IGBT
PD
Power dissipation, diode
Isolation voltage
Revision: 30-Jul-13
PD
VISOL
A
TC = 25 °C
TC = 80 °C
59
39
± 20
TC = 25 °C
658
TC = 80 °C
369
TC = 25 °C
240
TC = 80 °C
135
Any terminal to case, t = 1 min
2500
V
W
V
Document Number: 93011
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown
voltage
Collector to emitter voltage
Gate threshold voltage
Temperature coefficient of
threshold voltage
Collector to emitter leakage current
Forward voltage drop
Gate to emitter leakage current
SYMBOL
VBR(CES)
VCE(on)
VGE(th)
VGE(th)/TJ
ICES
VFM
IGES
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
VGE = 0 V, IC = 250 μA
1200
-
-
VGE = 15 V, IC = 75 A
-
3.3
3.8
VGE = 15 V, IC = 75 A, TJ = 125 °C
-
3.6
3.9
VCE = VGE, IC = 250 μA
4
5
6
VCE = VGE, IC = 1 mA (25 °C to 125 °C)
-
- 12
-
mV/°C
VGE = 0 V, VCE = 1200 V
-
3
250
μA
VGE = 0 V, VCE = 1200 V, TJ = 150 °C
-
4
20
mA
IC = 75 A, VGE = 0 V
-
3.4
5.0
IC = 75 A, VGE = 0 V, TJ = 125 °C
-
3.3
5.2
VGE = ± 20 V
-
-
± 200
nA
MIN.
TYP.
MAX.
UNITS
-
690
-
-
65
-
-
250
-
-
1.53
-
-
1.76
-
-
3.29
-
-
2.49
-
-
3.45
-
-
5.94
-
-
281
-
-
45
-
-
300
-
-
126
-
V
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Total gate charge (turn-on)
Qg
Gate to emitter charge (turn-on)
Qge
Gate to collector charge (turn-on)
Qgc
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
Turn-off delay time
Fall time
tr
TEST CONDITIONS
IC = 50 A, VCC = 600 V, VGE = 15 V
IC = 75 A, VCC = 600 V,
VGE = 15 V, Rg = 5
L = 500 μH, TJ = 25 °C
nC
mJ
IC = 75 A, VCC = 600 V,
VGE = 15 V, Rg = 5
L = 500 μH, TJ = 125 °C
Energy losses
include tail and
diode recovery
(see fig. 18)
ns
td(off)
tf
TJ = 150 °C, IC = 200 A, Rg = 22
Reverse bias safe operating area
RBSOA
Fullsquare
VGE = 15 V to 0 V, VCC = 900 V,
VP = 1200 V, L = 500 μH
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Revision: 30-Jul-13
IF = 50 A, dIF/dt = 200 A/μs, VR = 200 V
IF = 50 A, dIF/dt = 200 A/μs,
VR = 200 V, TJ = 125 °C
-
142
210
ns
-
13
16
A
-
923
1680
nC
-
202
260
ns
-
18
22
A
-
1818
2860
nC
Document Number: 93011
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not Available for New Designs, Use VS-GB90DA120U
VS-GB75DA120UP
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Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Junction and storage temperature range
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ, TStg
- 40
-
150
°C
-
-
0.19
IGBT
Junction to case
RthJC
Diode
-
-
0.52
-
0.05
-
Weight
-
30
-
g
Mounting torque
-
-
1.3
Nm
Case to heatsink
RthCS
Flat, greased surface
SOT-227
200
160
140
120
150
TJ = 25 °C
100
IC (A)
Allowable Case Temperature (°C)
Case style
°C/W
80
100
60
TJ = 125 °C
40
50
20
0
0
0
20
40
60
80
100
120
140
0
1
2
3
4
5
6
IC - Continuous Collector Current (A)
VCE (V)
Fig. 1 - Maximum DC IGBT Collector Current vs.
Case Temperature
Fig. 3 - Typical IGBT Collector Current Characteristics
Allowable Case Temperature (°C)
1000
IC (A)
100
10
1
160
140
120
100
80
60
40
20
0
10
Revision: 30-Jul-13
100
1000
10 000
0
10
20
30
40
50
60
70
VCE (V)
IF - Continuous Forward Current (A)
Fig. 2 - IGBT Reverse Bias SOA
TJ = 150 °C, VGE = 15 V
Fig. 4 - Maximum DC Forward Current vs.
Case Temperature
Document Number: 93011
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200
4.5
100 A
4.0
150
VCE (V)
IF (A)
75 A
100
3.5
3.0
TJ = 125 °C
50
27 A
2.5
TJ = 25 °C
0
2.0
0
1
2
3
4
5
25
50
75
100
125
150
VFM (V)
TJ (°C)
Fig. 5 - Typical Diode Forward Characteristics
Fig. 8 - Typical IGBT Collector to Emitter Voltage vs.
Junction Temperature, VGE = 15 V
4.0
10
3.5
TJ = 125 °C
1
Energy (mJ)
ICES (mA)
3.0
0.1
0.01
Eoff
2.0
1.5
Eon
1.0
TJ = 25 °C
0.001
2.5
0.5
0.0001
0
0
200
400
600
800
1000
1200
10
30
40
50
60
70
IC (A)
Fig. 6 - Typical IGBT Zero Gate Voltage Collector Current
Fig. 9 - Typical IGBT Energy Loss vs. IC
TJ = 125 °C, L = 500 μH, VCC = 600 V,
Rg = 5 , VGE = 15 V
6.0
80
1000
5.5
Switching Time (µs)
TJ = 25 °C
5.0
Vgeth (V)
20
VCES (V)
4.5
TJ = 125 °C
4.0
td(off)
td(on)
tf
100
tr
3.5
3.0
0.0002
10
0.0004
0.0006
0.0008
0.001
0
20
40
60
80
IC (mA)
IC (A)
Fig. 7 - Typical IGBT Threshold Voltage
Fig. 10 - Typical IGBT Switching Time vs. IC
TJ = 125 °C, L = 500 μH, VCC = 600 V,
Rg = 5 , VGE = 15 V
Revision: 30-Jul-13
Document Number: 93011
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not Available for New Designs, Use VS-GB90DA120U
VS-GB75DA120UP
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Vishay Semiconductors
14
250
230
12
Eon
190
8
trr (ns)
Energy (mJ)
TJ = 125 °C
210
10
Eoff
6
170
TJ = 25 °C
150
130
4
110
2
90
0
0
10
20
30
40
70
100
50
RG (Ω)
1000
dIF/dt (A/µs)
Fig. 13 - Typical trr diode vs. dIF/dt
VRR = 200 V, IF = 50 A
Fig. 11 - Typical IGBT Energy Loss vs. Rg
TJ = 125 °C, IC = 75 A, L = 500 μH,
VCC = 600 V, VGE = 15 V
10 000
40
30
td(on)
1000
TJ = 125 °C
25
td(off)
Irr (A)
Switching Time (µs)
35
tf
20
TJ = 25 °C
15
100
tr
10
5
10
0
10
20
30
40
0
100
50
RG (Ω)
1000
dIF/dt (A/µs)
Fig. 12 - Typical IGBT Switching Time vs. Rg
TJ = 125 °C, L = 500 μH, VCC = 600 V,
Rg = 5 , VGE = 15 V
Fig. 14 - Typical Irr diode vs. dIF/dt
VRR = 200 V, IF = 50 A
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.01
0.001
0.0001
0.00001
Single pulse
(thermal response)
0.0001
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.001
0.01
0.1
1
Rectangular Pulse Duration (t1)
Fig. 15 - Maximum Thermal Impedance ZthJC Characteristics (IGBT)
Revision: 30-Jul-13
Document Number: 93011
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay Semiconductors
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.01
Single pulse
(thermal response)
0.001
0.00001
0.0001
0.001
0.01
0.1
1
Rectangular Pulse Duration (t1)
Fig. 16 - Maximum Thermal Impedance ZthJC Characteristics (diode)
R=
L
D.U.T.
VCC
ICM
VC *
50 V
1000 V
D.U.T.
1
2
+
-V
CC
Rg
* Driver same type as D.U.T.; VC = 80 % of Vce(max)
* Note: Due to the 50 V power supply, pulse width and inductor
will increase to obtain Id
Fig. 17a - Clamped Inductive Load Test Circuit
Fig. 17b - Pulsed Collector Current Test Circuit
Diode clamp/
D.U.T.
L
- +
-5V
D.U.T./
driver
+
VCC
Rg
Fig. 18a - Switching Loss Test Circuit
Revision: 30-Jul-13
Document Number: 93011
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1
2
90 %
10 %
3
VC
90 %
td(off)
10 %
5%
IC
tf
tr
td(on)
t = 5 µs
Eoff
Eon
Ets = (Eon + Eoff)
Fig. 18b - Switching Loss Waveforms Test Circuit
ORDERING INFORMATION TABLE
Device code
VS-
G
B
75
D
A
120
U
P
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Insulated Gate Bipolar Transistor (IGBT)
3
-
B = IGBT Generation 5
4
-
Current rating (75 = 75 A)
5
-
Circuit configuration (D = Single switch with antiparallel diode)
6
-
Package indicator (A = SOT-227)
7
-
Voltage rating (120 = 1200 V)
8
-
Speed/type (U = Ultrafast IGBT)
9
-
Totally lead (Pb)-free
CIRCUIT CONFIGURATION
3 (C)
2 (G)
1, 4 (E)
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95036
Packaging information
www.vishay.com/doc?95037
Revision: 30-Jul-13
Document Number: 93011
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
Vishay Semiconductors
SOT-227
DIMENSIONS in millimeters (inches)
38.30 (1.508)
37.80 (1.488)
Chamfer
2.00 (0.079) x 45°
4 x M4 nuts
Ø 4.40 (0.173)
Ø 4.20 (0.165)
-A3
4
6.25 (0.246)
12.50 (0.492)
25.70 (1.012)
25.20 (0.992)
-B-
1
2
R full
7.50 (0.295)
15.00 (0.590)
30.20 (1.189)
29.80 (1.173)
8.10 (0.319)
4x
7.70 (0.303)
2.10 (0.082)
1.90 (0.075)
0.25 (0.010) M C A M B M
2.10 (0.082)
1.90 (0.075)
-C-
12.30 (0.484)
11.80 (0.464)
0.12 (0.005)
Notes
• Dimensioning and tolerancing per ANSI Y14.5M-1982
• Controlling dimension: millimeter
Document Number: 95036
Revision: 28-Aug-07
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1
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000