VS-HFA25TB60HN3
www.vishay.com
Vishay Semiconductors
HEXFRED®
Ultrafast Soft Recovery Diode, 25 A
FEATURES
• Ultrafast and ultrasoft recovery
• Very low IRRM and Qrr
• AEC-Q101 qualified, meets JESD 201 class 2
whisker test
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
TO-220AC
BENEFITS
Base
cathode
1
Cathode
•
•
•
•
•
3
Anode
Reduced RFI and EMI
Reduced power loss in diode and switching transistor
Higher frequency operation
Reduced snubbing
Reduced parts count
DESCRIPTION
VS-HFA25TB60... is a state of the art ultrafast recovery
diode. Employing the latest in epitaxial construction and
advanced processing techniques it features a superb
combination of characteristics which result in performance
which is unsurpassed by any rectifier previously available.
With basic ratings of 600 V and 25 A continuous current, the
VS-HFA25TB60... is especially well suited for use as the
companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED® product line features
extremely low values of peak recovery current (IRRM) and
does not exhibit any tendency to “snap-off” during the
tb portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED VS-HFA25TB60... is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
PRODUCT SUMMARY
Package
TO-220AC
IF(AV)
25 A
VR
600 V
VF at IF
1.7 V
trr typ.
23 ns
TJ max.
150 °C
Diode variation
Single die
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Cathode to anode voltage
Maximum continuous forward current
SYMBOL
IF
Single pulse forward current
IFSM
Maximum repetitive forward current
IFRM
Maximum power dissipation
Operating junction and storage temperature range
Revision: 28-Mar-12
TEST CONDITIONS
VR
PD
TJ, TStg
TC = 100 °C
VALUES
UNITS
600
V
25
225
A
100
TC = 25 °C
125
TC = 100 °C
50
- 55 to + 150
W
°C
Document Number: 94412
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VS-HFA25TB60HN3
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Vishay Semiconductors
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
Cathode to anode
breakdown voltage
VBR
IR = 100 μA
Maximum forward voltage
VFM
IF = 50 A
IF = 25 A
See fig. 1
MIN.
TYP.
MAX.
600
-
-
-
1.3
1.7
-
1.5
2.0
UNITS
V
IF = 25 A, TJ = 125 °C
-
1.3
1.7
VR = VR rated
-
1.5
20
-
600
2000
-
55
100
pF
-
8.0
-
nH
MIN.
TYP.
MAX.
UNITS
-
23
-
Maximum reverse
leakage current
IRM
Junction capacitance
CT
VR = 200 V
Series inductance
LS
Measured lead to lead 5 mm from package
body
TJ = 125 °C, VR = 0.8 x VR rated
See fig. 2
See fig. 3
μA
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
See fig. 5, 6 and 16
Peak recovery current
See fig. 7 and 8
Reverse recovery charge
See fig. 9 and 10
Peak rate of fall of recovery
current during tb
See fig. 11 and 12
SYMBOL
TEST CONDITIONS
trr
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V
trr1
TJ = 25 °C
-
50
75
trr2
TJ = 125 °C
-
105
160
IRRM1
TJ = 25 °C
IRRM2
TJ = 125 °C
Qrr1
TJ = 25 °C
-
4.5
10
IF = 25 A
-
8.0
15
dIF/dt = 200 A/μs
-
112
375
-
420
1200
VR = 200 V
ns
A
nC
Qrr2
TJ = 125 °C
dI(rec)M/dt1
TJ = 25 °C
-
250
-
dI(rec)M/dt2
TJ = 125 °C
-
160
-
MIN.
TYP.
MAX.
UNITS
-
-
300
°C
-
-
1.0
A/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Tlead
Thermal resistance,
junction to case
RthJC
Thermal resistance,
junction to ambient
RthJA
Typical socket mount
-
-
80
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth and greased
-
0.5
-
-
2.0
-
g
-
0.07
-
oz.
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
0.063” from case (1.6 mm) for 10 s
Weight
Mounting torque
Marking device
Revision: 28-Mar-12
Case style TO-220AC
K/W
HFA25TB60H
Document Number: 94412
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VS-HFA25TB60HN3
Vishay Semiconductors
10 000
1000
TJ = 150 °C
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
www.vishay.com
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
10
1
0.6
TJ = 125 °C
100
10
1
TJ = 25 °C
0.1
0.01
1.0
1.4
1.8
2.2
2.6
0
VFM - Forward Voltage Drop (V)
94065_01
1000
94065_02
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current
100
200
300
400
500
600
VR - Reverse Voltage (V)
Fig. 2 - Typical Reverse Current vs. Reverse Voltage
CT - Junction Capacitance (pF)
1000
TJ = 25 °C
100
10
1
10
100
1000
VR - Reverse Voltage (V)
94065_03
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage
ZthJC - Thermal Response
10
1
PDM
t1
0.1
Single pulse
(thermal response)
0.01
0.00001
94065_04
0.0001
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.001
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Revision: 28-Mar-12
Document Number: 94412
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA25TB60HN3
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140
Vishay Semiconductors
1400
VR = 200 V
TJ = 125 °C
TJ = 25 °C
120
1200
1000
60
Qrr (nC)
trr (ns)
100
80
VR = 200 V
TJ = 125 °C
TJ = 25 °C
IF = 50 A
IF = 25 A
IF = 10 A
IF = 50 A
IF = 25 A
IF = 10 A
800
600
400
40
200
20
100
0
100
1000
dIF/dt (A/µs)
94065_05
dIF/dt (A/µs)
94065_07
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 7 - Typical Stored Charge vs. dIF/dt
30
10 000
VR = 200 V
TJ = 125 °C
TJ = 25 °C
VR = 200 V
TJ = 125 °C
TJ = 25 °C
dI(rec)M/dt (A/µs)
25
IF = 20 A
IF = 25 A
IF = 10 A
20
IRR (A)
1000
15
10
1000
IF = 50 A
IF = 25 A
IF = 10 A
5
0
100
1000
dIF/dt (A/µs)
94065_06
Fig. 6 - Typical Recovery Current vs. dIF/dt
Revision: 28-Mar-12
100
100
94065_08
1000
dIF/dt (A/µs)
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt
Document Number: 94412
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA25TB60HN3
www.vishay.com
Vishay Semiconductors
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Revision: 28-Mar-12
Document Number: 94412
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA25TB60HN3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
HF
A
25
TB
60
H
N3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
HEXFRED® family
3
-
Electron irradiated
4
-
Current rating (25 = 25 A)
4
5
-
Package:
TB = TO-220AC
4
6
-
Voltage rating (60 = 600 V)
7
-
H = AEC-Q101 qualified
4
8
-
Environmental digit:
-N3 = Halogen-free, RoHS compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
VS-HFA25TB60HN3
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
50
1000
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95221
Part marking information
www.vishay.com/doc?95068
SPICE model
www.vishay.com/doc?95471
Revision: 28-Mar-12
Document Number: 94412
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
Vishay
Disclaimer
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000