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TSF30H60C C0G

TSF30H60C C0G

  • 厂商:

    TAIWANSEMICONDUCTOR(台半)

  • 封装:

    TO-220-3

  • 描述:

    DIODE ARRAY SCHOTT 60V ITO220AB

  • 数据手册
  • 价格&库存
TSF30H60C C0G 数据手册
TSF30H60C Taiwan Semiconductor 30A, 60V Trench Schottky Rectifier FEATURES ● ● ● ● ● ● KEY PARAMETERS Patented Trench Schottky technology Excellent high temperature stability Low power loss, high efficiency High forward surge capability RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS ● ● ● ● Switching mode power supply (SMPS) Adapters Lighting application On-board DC/DC converter PARAMETER VALUE UNIT IF 2 x 15 A VRRM 60 V IFSM 230 A TJ MAX 150 °C Package ITO-220AB Configuration Dual dies MECHANICAL DATA ● ● ● ● ● ● ● Case: ITO-220AB Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Mounting torque: 0.56 N⋅m maximum Polarity: As marked Weight: 1.75g (approximately) ITO-220AB ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device TSF30H60C UNIT TSF30H60C Repetitive peak reverse voltage VRRM 60 V Reverse voltage, total rms value VR(RMS) 42 V 30 A 15 A 230 A 620 A Forward current per device IF per diode Surge peak forward current single half sine- t = 8.3ms wave superimposed on rated load per diode t = 1.0ms IFSM Junction temperature TJ -55 to +150 °C Storage temperature TSTG -55 to +150 °C 1 Version: D2102 TSF30H60C Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance per diode RӨJL 3.4 °C/W Junction-to-ambient thermal resistance per diode RӨJA 14.8 °C/W Junction-to-case thermal resistance per diode RӨJC 3.0 °C/W Thermal Performance Note: Mounted on Heat sink with 2" x 3" x 0.25" Al-Plate. ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL IF = 7.5A, TJ = 25°C Forward voltage per diode IF = 15A, TJ = 25°C (1) IF = 7.5A, TJ = 125°C VF IF = 15A, TJ = 125°C Reverse current @ rated VR per diode Junction capacitance per diode (2) TJ = 25°C TJ = 125°C 1MHz, VR = 4.0V IR CJ TYP MAX UNIT 0.47 - V 0.55 0.70 V 0.38 - V 0.50 0.67 V - 50 µA - 45 mA 1117 - pF Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE PACKAGE PACKING TSF30H60C ITO-220AB 50 / Tube 2 Version: D2102 TSF30H60C Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 10000 30 25 CAPACITANCE (pF) AVERAGE FORWARD CURRENT (A) 35 20 15 10 1000 100 5 f=1.0MHz Vsig=50mVp-p 0 25 50 75 100 125 10 150 1 10 CASE TEMPERATURE (°C) Fig.4 Typical Forward Characteristics TJ=150°C 10000 TJ=125°C 100 10 TJ=25°C 1 10 20 30 40 50 60 70 80 90 100 10010 UF1DLW 1 TJ=150°C TJ=125°C 10 0.1 TJ=25°C TJ=125°C (A) INSTANTANEOUS FORWARD CURRENT (A) 100000 TJ=25°C 1 0.01 TJ=-55°C Pulse width Pulse width 300μs 1% duty cycle 0.001 0.1 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 1 0.8 1.1 FORWARD VOLTAGE (V) Fig.5 Typical Transient Thermal Impedance 10 TRANSIENT THERMAL IMPEDANCE (°C/W) INSTANTANEOUS REVERSE CURRENT (μA) Fig.3 Typical Reverse Characteristics 1000 100 REVERSE VOLTAGE (V) 1 0.1 0.01 0.001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 PULSE DURATION (s) 3 Version: D2102 1.2 TSF30H60C Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS ITO-220AB MARKING DIAGRAM 4 P/N = Marking Code G = Green Compound YWW = Date Code F = Factory Code Version: D2102 TSF30H60C Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: D2102
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