THD-LVDS-51R-GF

THD-LVDSSeries ▓Pitch=0.5mm Wafer Connector (Front–Flip lower contact) Product Specification 深圳市臺華達科技有限公司 S H E N Z H E N S H I TH D Electronics Co., Ltd. Product.No THD-LVDS－51R－GF Pitch=0.5mm A Release Rev. Description ■Prepared By ■Checked By ■Approved By Wafer Connector (Front–Flip Lower Contact) Approved Signatures : JIM : JIM : 黄德进 ■Date: ■Date: ■Date: 1/3 2012.05.24 2012.05.24 2012.05.24 THD-LVDSSeries ▓Pitch=0.5mm Wafer Connector (Front–Flip lower contact) ■Scope This specification covers the 1.O mm Pitch Wafer Connector THDLVDS series. ■Ordering information THDLVDS - 51 R - GF ❶ ❷ ❸ ❶ Series name：THDLVDS ❷ Number of contacts：51 ❸ PIN ■Rating ❹ ❹ Plating： GF= 1µ”~3µ” Gold Flash G3= 3µ” Gold over Nickel G5= 5µ” Gold over Nickel SN= Tin(Lead Free) over Nickel Item Standard Voltage Rating(Max.) 200V AC Current Rating(Max.) 1.0A DC Operating Temperature Range ■Material Housing L.C.P (UL94V-0) Actuator L.C.P (UL94V-0) -55°C ～ +85°C (Including terminal temperature rise) Terminal Solder pin SHELL Copper alloy Copper alloy Copper alloyl ■Performance Item Test Condition Specification Mate applicable FPC and measure by dry circuit, 20mV 40 mΩ Max. Max, 1mA. Mate applicable FPC and apply 500V DC between adjacent Insulation Resistance 100 MΩ Min. terminal or ground. Mate applicable FPC, apply 250V AC(rms) for Dielectric Strength No Breakdown 1 minute between adjacent terminal or ground. Insert the actuator, pull the FPC at a rate of 25±3mm FPC Retention Force Per pin x 2N MAX. per minute. Terminal Retention Apply axial pull out force at the rate of 25±3 mm/minute Per pin x 0.15Kgf {1.5N} Min. Force on the terminal assembled in the housing. Mate connectors and subject to the following vibration Appearance No Damage conditions, for period of 2 hours in each of 3 mutually perpendicular axes, passing DC 1mA during the test. Contact 100 mΩ Max. Vibration Resistance Amplitude : 1.5mm P-P Frequency : 10～55～10 Hz in 1 minute. Discontinuity 1 μsec Max. Duration : 2 hours in each of X,Y,Z axes. Mate applicable FPC and subject to the following shock Appearance No Damage conditions. 3 times of shocks shall be applied for each Contact 6 directions along 3 mutually perpendicular axes, 100 mΩ Max. Shock Resistance passing DC 1 mA current during the test. Contact Resistance Salt Spray Peak value : 490m/s2 {50G} Mate applicable FPC and expose to the following salt mist conditions. Upon completion of the exposure period, salt deposits shall be removed by a gentle wash or dip in running water, after which the specified measurements shall be performed. NaCl solution Concentration : 5 ± 1% Spray time :48 ± 4 hours Ambient temperature : 35 ± 2°C 2/3 Discontinuity 1 μsec Max. Appearance No Damage Contact Resistance 100 mΩ Max. THD-LVDSSeries ▓Pitch=0.5mm Wafer Connector (Front–Flip lower contact) Item Test Condition Heat Resistance Cold Resistance Specification Mate applicable FPC and expose to 85±2°C for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. Mate applicable FPC and expose to -40±2°C for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. Mate applicable FPC and expose to 60 ± 2°C, relative humidity 90 to 95% for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. Humidity Temperature Rise Mate applicable FPC and measure the temperature rise of contact when the maximum AC rated current is passed. Temperature Cycling Mate applicable FPC and subject to the following conditions for 5 cycles. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. 1 cycle a) -55±3°C 30minutes b) +85±3°C 30minutes (Transit time shall be with in 3 minutes) Solderability Tip of solder tails and fitting nails into the molten solder (held at 245±5°C) up to 0.1mm from the bottom of the housing for 3±0.5 seconds. When reflowing refer to Infrared reflow condition Soldering iron method Resistance to Soldering 0.2mm from terminal tip and fitting nail tip. Soldering time : 5 seconds Max. Solder temperature : 370～400°C ■Recommended Temperature Profile 250°C MAX(Peak Temp)3sec or less 230°C MIN/20~40sec (60sec) Start (Pre-Heat 150°C MAX) (60~90sec) (30sec) Emperature Condition Graph (Temperature On Board Pattern Side) 3/3 Appearance No Damage Contact Resistance 100 mΩ Max. Appearance No Damage Contact Resistance 100 mΩ Max. Appearance No Damage Contact Resistance 100 mΩ Max. Dielectric Strength No Breakdown Insulation Resistance 50 MΩ Min. Temperature rise 30°C Max. Appearance No Damage Contact Resistance 100 mΩ Max. Solder Wetting 95% of immersed area must show no voids, pin holes. Appearance No Damage NO.OF PIN DIMENSION A±0.15 B±0.15 C±0.15 D±0.15 E±0.1 F±0.1 G+0.10 0.00 H±0.15 I J 51 37.8 35.35 31.00 25.00 5.00 25.00 32.65 25.00 35.95 34.75 41 32.8 30.35 26.00 20.00 4.00 20.00 28.65 20.00 30.95 29.75 HOUSING SHELL 镍底 雾锡 镍底 半金雾锡 TERMINAL 深 圳 市 台 华 达 科 技 有 限 公 司 ： 黄 德 进 A Release 黄 德 2012/05/24 进 ： 深圳市台华达科技有限公司