ACM4532F2NV-510T02-D

Form No: Specification for Approval Date: 2021/08/16 Customer : 天诚科技 TAI-TECH P/N: ACM4532F2NV-510T02-D CUSTOMER P/N: DESCRIPTION: QUANTITY: REMARK: Customer Approval Feedback 西 北 臺 慶 科 技 股 份 有 限 公司 TAI-TECH Advanced Electronics Co., Ltd Sales Dep. 代理商： ■ 深圳市天诚科技有限公司 Shenzhen TsaSun Technology Co., Ltd. Room 209, 2/F, Block A, Tengfei Industrial Building, No.6, Taohua Road, Futian District, Shenzhen TEL: 0755-8335 8885 / 0755-8335 9885 E-mail: sales@tsasun.com www.tsacoil.com □ 西北臺慶科技股份有限公司 TAI-TECH Advanced Electronics Co., Ltd Headquarter: NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI, TAO-YUAN HSIEN, TAIWAN, R.O.C. TEL: +886-3-4641148 FAX: +886-3-4643565 http://www.tai-tech.com.tw E-mail: sales@tai-tech.com.tw APPROVED CHECKED 夏暁曼 夏暁曼 R&D Center APPROVED CHECKED DRAWN 羅宜春 梁周虎 卜文娟 □ 臺慶精密電子(昆山)有限公司 TAI-TECHADVANCEDELECTRONICS(KUNSHAN)CO., LTD SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN, JIANG-SU, CHINA TEL: +86-512-57619396 FAX: +86-512-57619688 E-mail: hui@tai-tech.com.tw TA734003 P2 TAI-TECH Wire Wound Type Common Mode Filter ACM4532F2NV-510T02-D 1. Features 1. High common mode impedance at high frequency effects excellent noise Halogen Pb Halogen-free Pb-free suppression performance. 2. ACM4532F2NV series realizes small size and low profile. 4.5x3.2x2.8 mm. 3. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 4. High reliability -Reliability tests comply with AEC-Q200 2. Dimension Recommended PC Board Pattern Series A(mm) B(mm) C(mm) D1(mm) D2(mm) D3(mm) L(mm) H(mm) G1(mm) G2(mm) 4532F2NV 4.5±0.2 3.2±0.2 2.8±0.2 0.75±0.2 0.85±0.2 0.60±0.2 5.0 3.6 3.4 1.7 3. Part Numbering ACM 4532 A B F 2 N V C D E F - 510 T 02 G H I - D J A: Series B: Dimension C: Material Ferrite Core D: Number of Lines 2=2 lines E: Type N45 F: Category Code V=Vehicle G: Inductance 510=51uH H: Packaging T=Taping and Reel I: Rated Current J: Control S/N 02=230mA 4. Specification TAI-TECH Part Number Common mode Impedance (Ω) [10MHz] ACM4532F2NV-510T02-D 1000 min. 2800 typ. Inductance (μH)+50/-30% [100kHz/0.1V] DC Resistance (Ω) max. Rated Current (mA) Rated Volt. (Vdc) IR (MΩ) min. 51 1.0 230 50 10 www.tai-tech.com.tw P3 TAI-TECH ACM4532F2NV-510T02-D 5.Schematic Diagram 6. MEASURING CIRCUITS 2LINE 7. Materials No. Description Specification a. Upper Plate Ferrite b. Core Ferrite Core c Termination Tin (Pb Free) d Wire Enameled Copper Wire www.tai-tech.com.tw P4 TAI-TECH 8. Reliability and Test Condition Item Performance Test Condition -55~+150℃(Including self - temperature rise) Operating temperature Storage temperature and -55~+125℃(on board) Humidity range Electrical Performance Test L(common mode) Agilent-4291A+ Agilent -16197A Refer to standard electrical characteristics list. DCR I.R. Agilent-4338B Agilent4339 Temperature Rise Test Rated Current < 1A ∆T 20℃Max 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Rated Current ≧ 1A ∆T 40℃Max Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：150±2℃ High Temperature Exposure(Storage) AEC-Q200 Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 30min Min. Temperature Cycling Step2：150±2℃ transition time 1min MAX. AEC-Q200 Step3：150±2℃ 30min Min. Step4：Low temp. transition time 1min MAX. Moisture Resistance Biased Humidity (AEC-Q200) Number of cycles： 1000 Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC Appearance：No damage. J-STD-020DClassification Reflow Profiles Impedance：within±15% of initial value 1.Baked at50℃ for 25hrs, measured at room temperature after placing for 4 Inductance：within±10% of initial value hrs. 2.Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification cool down to 25℃ in 2.5hrs. 3.Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, value cool down to 25℃ in 2.5hrs,keep at 25℃ for 2hrs then keep at -10℃ for 3hrs 4.Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity ：85±3﹪R.H, Temperature：85℃±2℃ Duration : 1000hrs Min with 100% rated current. Measured at room temperature after placing for24±2hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：150±2℃ High Temperature Operational Life (AEC-Q200) Duration ：1000hrs Min. with 100% rated current. Measured at room temperature after placing for24±2hrs External Visual Physical Dimension Resistance to Solvents Mechanical Shock Appearance：No damage. Inspect device construction, marking and workmanship. Electrical Test not required. According to the product specification size measurement According to the product specification size measurement Appearance：No damage. Add aqueous wash chemical - OKEM clean or equivalent. Peak value Normal Wave Velocity Appearance：No damage. Type (g’s) duration (D) (ms) form change (Vi)ft/sec Impedance：within±15% of initial value Inductance：within±10% of initial value SMD 100 6 Half-sine 12.3 Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification Lead 100 6 Half-sine 12.3 value shocks in each direction along 3 perpendicular axes. www.tai-tech.com.tw P5 TAI-TECH Item Performance Vibration Resistance to Soldering Heat Electrical Characterization Flammability Time(s) Temperature Number of ramp/immersion heat cycles and emersion rate 260±5(solder 10±1 25mm/s ±6 mm/s 1 temp) Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 15±1min Step2：150±2℃ within 20Sec. (AEC-Q200) Solderability Temperature(℃) Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Thermal shock ESD Test Condition IPC/JEDEC J-STD-020DClassification Reflow Profiles Oscillation Frequency: 10～2K～10Hz for 20 minute Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Test condition ： Step3：150±2℃ 15±1min Number of cycles： 300 Measured at room fempraturc after placing fo24±2hrs Appearance：No damage. Steam Aging: 16 hours ± 15 min Preheat: 150℃,60sec. Solder: Sn96.5% Ag3% Cu0. 5% More than 95% of the terminal electrode should be covered with Temperature: 245±5℃。 solder。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec. Depth: completely cover the termination Refer Specification for Approval Electrical Test not required. Summary to show Min, Max, Mean and Standard deviation . V-0 or V-1 are acceptable. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. Terminal Strength(SMD) Appearance：No damage www.tai-tech.com.tw P6 TAI-TECH 9. Soldering and Mounting 9-1. Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-1.1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 9-1.2 Soldering Iron(Figure 2): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧350℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5 sec. www.tai-tech.com.tw P7 TAI-TECH 10.Packaging Information 10-1. Reel Dimension C B D .5 ±0 13 2±0.5 .5 A R1 .9 R1 0 .5 R 0 .5 Type A(mm) B(mm) 7”x12mm 13.5±0.5 60±2 C(mm) D(mm) 13.5±0.5 178±2 120° 7"x8mm 7"x12mm 10-2. Tape Dimension / 12mm Series ACM4532F2N P(mm) Po(mm) P2(mm) Bo(mm) Ao(mm) Ko(mm) 8.00±0.10 4.00±0.10 2.00±0.05 4.90±0.10 3.60±0.10 3.00±0.10 D(mm) E(mm) 1.05+0.10/-0.00 1.75±0.10 F(mm) W(mm) t(mm) 5.50±0.05 12.00±0.10 0.26±0.05 10-3. Packaging Quantity Chip size Chip/Reel Inner Box Middle Box Carton ACM4532F2N 500 2000 10000 20000 10-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 80 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions(component level) To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw