T1610P

T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions (L x W x H in mm): 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity • High radiant sensitivity • Suitable for visible light • Fast response times 21591 DESCRIPTION T1610P is a high speed and high sensitive PIN photodiode chip with 7.7 mm2 sensitive area. It is sensitive to visible light much like the human eye and has peak sensitivity at 560 nm. Anode is the bond pad on top, cathode is the backside contact. • Angle of half sensitivity:  = ± 60° • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC APPLICATIONS • Ambient light sensor • Backlight dimmer GENERAL INFORMATION The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is provided for illustration purpose only. Customers are encouraged to perform testing in actual proposed packaged and used conditions. Vishay optoelectronics die products are tested using Vishay optoelectronics based quality assurance procedures and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore sold die may not perform on an equivalent basis to standard package products. PRODUCT SUMMARY COMPONENT T1610P Ira (μA) 2.9  (deg) ± 60 0.5 (nm) 390 to 800 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE T1610P-SD-F Note • MOQ: minimum order quantity PACKAGING Wafer sawn on foil with disco frame REMARKS MOQ: 3500 pcs PACKAGE FORM Chip ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER Reverse voltage Junction temperature Operating temperature range Storage temperature range Storage temperature range on foil TEST CONDITION SYMBOL VR Tj Tamb Tstg1 Tstg2 VALUE 16 100 - 40 to + 100 - 40 to + 100 - 40 to + 50 UNIT V °C °C °C °C Document Number: 81998 Rev. 1.4, 23-Mar-11 For technical questions, contact: optochipsupport@vishay.com www.vishay.com 1 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T1610P Vishay Semiconductors Silicon PIN Photodiode BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Breakdown voltage Reverse dark current Diode capacitance Reverse light current Angle of half sensitivity Wavelength of peak sensitivity Range of spectral bandwidth Rise time Fall time V R = 5 V , R L = 50  ,  = 515 nm V R = 5 V , R L = 50  ,  = 515 nm TEST CONDITION IR = 100 μA, E = 0 VR = 10 V, E = 0 VR = 3 V, f = 1 MHz, E = 0 EV = 100 lx, CIE illuminant A, VR = 5 V SYMBOL V(BR) Iro CD Ira  p 0.5 tr tf MIN. 16 2 730 2.9 ± 60 560 390 to 800 100 100 5 TYP. MAX. UNIT V nA pF μA deg nm nm ns ns Note • The measurements are based on samples of die which are mounted on a TO-header without resin coating BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1800 1600 CD - Diode Capacitance (pF) 1400 1200 1000 800 600 400 200 0 0 21742 1.0 S(λ)rel - Relative Spectral Sensitivity 5 10 15 20 25 30 35 21741 0.8 0.6 0.4 0.2 0.0 400 500 VR - Reverse Voltage (V) 600 700 800 900 1000 1100 λ - Wavelength (nm) Fig. 1 - Diode Capacitance vs. Reverse Voltage Fig. 2 - Relative Spectral Sensitivity vs. Wavelength MECHANICAL DIMENSIONS PARAMETER Length of chip edge (x-direction) Length of chip edge (y-direction) Sensitive area Die height Bond pad anode SYMBOL Lx Ly AS H x*y MIN. TYP. 2.97 2.97 7.7 0.28 0.125 x 0.11 MAX. UNIT mm mm mm2 mm mm2 www.vishay.com 2 For technical questions, contact: optochipsupport@vishay.com Document Number: 81998 Rev. 1.4, 23-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T1610P Silicon PIN Photodiode Vishay Semiconductors ADDITIONAL INFORMATION Frontside metallization, anode Backside metallization, cathode Dicing Die bonding technology (1) AlSi NiV-Ag Sawing Epoxy bonding Note (1) All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870. The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip backside is performed with stereo microscope with incident light and 40x to 80x magnification. The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure by QM is not installed. HANDLING AND STORAGE CONDITIONS • The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only. It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment. • Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined in MIL-HDBK-263. • Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used. PACKING Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence (humidity and contamination). Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for packing material that is returned unsorted or which we are not obliged to accept. Document Number: 81998 Rev. 1.4, 23-Mar-11 For technical questions, contact: optochipsupport@vishay.com www.vishay.com 3 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1