MCP6V11T-E/OTVAO

MCP6V11/1U/2/4 7.5 µA, 80 kHz Zero-Drift Op Amps Features: Description: • High DC Precision: - VOS Drift: ±50 nV/°C (maximum) - VOS: ±8 µV (maximum) - AOL: 112 dB (minimum, VDD = 5.5V) - PSRR: 118 dB (minimum, VDD = 5.5V) - CMRR: 119 dB (minimum, VDD = 5.5V) - Eni: 2.1 µVP-P (typical), f = 0.1 Hz to 10 Hz - Eni: 0.67 µVP-P (typical), f = 0.01 Hz to 1 Hz • Low Power and Supply Voltages: - IQ: 7.5 µA/amplifier (typical) - Wide Supply Voltage Range: 1.6V to 5.5V • Small Packages: - Singles in SC70, SOT-23 - Duals in MSOP-8, 2×3 TDFN - Quads in TSSOP-14 • Easy to Use: - Rail-to-Rail Input/Output - Gain Bandwidth Product: 80 kHz (typical) - Unity Gain Stable • Extended Temperature Range: -40°C to +125°C The Microchip Technology Inc. MCP6V11/1U/2/4 family of operational amplifiers provides input offset voltage correction for very low offset and offset drift. These are low-power devices, with a gain bandwidth product of 80 kHz (typical). They are unity gain stable, have virtually no 1/f noise, and have good Power Supply Rejection Ratio (PSRR) and Common Mode Rejection Ratio (CMRR). These products operate with a single supply voltage as low as 1.6V, while drawing 7.5 µA/amplifier (typical) of quiescent current. The Microchip Technology Inc. MCP6V11/1U/2/4 op amps are offered in single (MCP6V11 and MCP6V11U), dual (MCP6V12) and quad (MCP6V14) packages. They were designed using an advanced CMOS process. Package Types VOUT 1 VSS 2 VIN+ 3 Typical Applications: • • • • • Portable Instrumentation Sensor Conditioning Temperature Measurement DC Offset Correction Medical Instrumentation Design Aids: • • • • • SPICE Macro Models FilterLab® Software Microchip Advanced Part Selector (MAPS) Analog Demonstration and Evaluation Boards Application Notes Related Parts: • • • • MCP6V01/2/3: Auto-Zeroed, Spread Clock MCP6V06/7/8: Auto-Zeroed MCP6V26/7/8: Auto-Zeroed, Low Noise MCP6V31/1U/2/4: Zero-Drift, Low Power  2012-2014 Microchip Technology Inc. MCP6V12 MSOP MCP6V11 SOT-23 5 VDD VOUTA VINA– 4 VIN– VINA+ VSS MCP6V11U SC70, SOT-23 1 2 3 4 8 7 6 5 VDD VOUTB VINB– VINB+ MCP6V12 2×3 TDFN* 8 VDD VOUTA 1 VIN+ 1 5 VDD VSS 2 VIN– 3 VINA– 2 4 VOUT VINA+ 3 VSS 4 EP 9 7 VOUTB 6 VINB– 5 VINB+ MCP6V14 TSSOP 1 2 3 4 VINB+ 5 VINB– 6 VOUTB 7 VOUTA VINA– VINA+ VDD 14 VOUTD 13 VIND– 12 VIND+ 11 VSS 10 VINC+ 9 VINC– 8 VOUTC * Includes Exposed Thermal Pad (EP); see Table 3-1. DS20005124B-page 1 MCP6V11/1U/2/4 Typical Application Circuit VIN R1 R2 R3 VOUT R4 C2 U1 R5 R2 VDD/2 U2 MCP6XXX VDD/2 MCP6V11 Offset Voltage Correction for Power Driver DS20005124B-page 2  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings † VDD – VSS .................................................................................................................................................................6.5V Current at Input Pins ..............................................................................................................................................±2 mA Analog Inputs (VIN+ and VIN–) (Note 1) .....................................................................................VSS – 1.0V to VDD+1.0V All other Inputs and Outputs .......................................................................................................VSS – 0.3V to VDD+0.3V Difference Input voltage .................................................................................................................................|VDD – VSS| Output Short Circuit Current ........................................................................................................................... Continuous Current at Output and Supply Pins ...................................................................................................................... ±30 mA Storage Temperature .............................................................................................................................-65°C to +150°C Maximum Junction Temperature .......................................................................................................................... +150°C ESD protection on all pins (HBM, CDM, MM)   2 kV, 1.5 kV, 400V Note 1: See Section 4.2.1, Rail-to-Rail Inputs. † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 1.2 Specifications TABLE 1-1: DC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to +5.5V, VSS = GND, VCM = VDD/3,VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF (refer to Figure 1-4 and Figure 1-5). Parameters Sym. Min. Typ. Max. Units Conditions Input Offset Voltage VOS -8 — +8 µV Input Offset Voltage Drift with Temperature (Linear Temp. Co.) TC1 -50 — +50 nV/°C TA = -40 to +125°C (Note 1) Input Offset Voltage Quadratic Temp. Co. TC2 — ±0.08 — nV/°C2 TA = -40 to +125°C Power Supply Rejection Ratio PSRR 118 135 — Input Bias Current IB — +5 — pA Input Bias Current across Temperature IB — +17 — pA TA = +85°C +2.9 +5 nA TA = +125°C ±50 — pA Input Offset TA = +25°C dB Input Bias Current and Impedance IB 0 Input Offset Current IOS — Input Offset Current across Temperature IOS — ±80 — pA TA = +85°C IOS -1 ±0.4 +1 nA TA = +125°C — Ω||pF — Ω||pF Common Mode Input Impedance ZCM — 1013||6 Differential Input Impedance ZDIFF — 1013||6 Note 1: 2: For Design Guidance only; not tested. Figure 2-18 shows how VCML and VCMH changed across temperature for the first production lot.  2012-2014 Microchip Technology Inc. DS20005124B-page 3 MCP6V11/1U/2/4 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to +5.5V, VSS = GND, VCM = VDD/3,VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF (refer to Figure 1-4 and Figure 1-5). Parameters Sym. Min. Typ. Max. Units Conditions Common Mode Input Voltage Range Low VCML — — VSS  0.15 V (Note 2) Common Mode Input Voltage Range High VCMH VDD + 0.2 — — V (Note 2) Common Mode Rejection Ratio CMRR 108 125 — dB VDD = 1.6V, VCM = -0.15V to 1.8V (Note 2) CMRR 119 135 — dB VDD = 5.5V, VCM = -0.15V to 5.7V (Note 2) AOL 100 120 — dB VDD = 1.6V, VOUT = 0.3V to 1.4V AOL 112 135 — dB VDD = 5.5V, VOUT = 0.3V to 5.3V VOL VSS VSS + 14 VSS + 45 mV RL = 10 kΩ, G = +2, 0.5V input overdrive VOL — VSS + 1.4 — mV RL = 100 kΩ, G = +2, 0.5V input overdrive VOH VDD – 45 VDD – 14 VDD mV RL = 10 kΩ, G = +2, 0.5V input overdrive VOH — VDD – 1.4 — mV RL = 100 kΩ, G = +2, 0.5V input overdrive ISC — ±5 — mA VDD = 1.6V ISC — ±17 — mA VDD = 5.5V VDD 1.6 — 5.5 V IQ 4 7.5 11 µA 3 6.5 11 0.9 — 1.5 Common Mode Open-Loop Gain DC Open-Loop Gain (large signal) Output Minimum Output Voltage Swing Maximum Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current per amplifier POR Trip Voltage Note 1: 2: VPOR IO = 0, MCP6V11/1U IO = 0, MCP6V12/14 V For Design Guidance only; not tested. Figure 2-18 shows how VCML and VCMH changed across temperature for the first production lot. DS20005124B-page 4  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to +5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF (refer to Figure 1-4 and Figure 1-5). Parameters Sym. Min. Typ. Max. Units Conditions GBWP — 80 — kHz Slew Rate SR — 0.03 — V/µs Phase Margin PM — 70 — ° Eni — 0.67 — µVP-P f = 0.01 Hz to 1 Hz µVP-P f = 0.1 Hz to 10 Hz Amplifier AC Response Gain Bandwidth Product G = +1 Amplifier Noise Response Input Noise Voltage Eni — 2.1 — Input Noise Voltage Density eni — 102 — nV/√Hz f < 500 Hz Input Noise Current Density ini — 4 — fA/√Hz IMD — 50 — µVPK Amplifier Distortion (Note 1) Intermodulation Distortion (AC) VCM tone = 50 mVPK at 100 Hz, GN = 1 Amplifier Step Response Start Up Time tSTR — 2 — ms G = +1, 0.1% VOUT settling (Note 2) Offset Correction Settling Time tSTL — 300 — µs G = +1, VIN step of 2V, VOS within 100 µV of its final value Output Overdrive Recovery Time tODR — 450 — µs G = -10, ±0.5V input overdrive to VDD/2, VIN 50% point to VOUT 90% point (Note 3) Note 1: 2: 3: These parameters were characterized using the circuit in Figure 1-6. In Figure 2-37 and Figure 2-38, there is an IMD tone at DC, a residual tone at1 kHz and other IMD tones and clock tones. High gains behave differently; see Section 4.3.3, Offset at Power Up. tODR includes some uncertainty due to clock edge timing. TABLE 1-3: TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VDD = +1.6V to +5.5V, VSS = GND. Parameters Sym. Min. Typ. Max. Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 5L-SC-70 JA — 209 — °C/W Thermal Resistance, 5L-SOT-23 JA — 201 — °C/W Thermal Resistance, 8L-2×3 TDFN θJA — 53 — °C/W Thermal Resistance, 8L-MSOP θJA — 211 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W Conditions Temperature Ranges (Note 1) Thermal Package Resistances Note 1: Operation must not cause TJ to exceed Maximum Junction Temperature specification (+150°C).  2012-2014 Microchip Technology Inc. DS20005124B-page 5 MCP6V11/1U/2/4 1.3 Timing Diagrams 1.4 1.6V to 5.5V 1.6V VDD 0V tSTR 1.001(VDD/3) VOUT Test Circuits The circuits used for most DC and AC tests are shown in Figure 1-4 and Figure 1-5. Lay the bypass capacitors out as discussed in Section 4.3.10, Supply Bypassing and Filtering. RN is equal to the parallel combination of RF and RG to minimize bias current effects. 0.999(VDD/3) FIGURE 1-1: Amplifier Start Up. VDD 1 µF RN VIN RISO VOUT MCP6V1X VIN tSTL VOS + 100 µV RG VOS VOS – 100 µV FIGURE 1-2: Time. Offset Correction Settling 100 nF VDD/3 1 µF RISO VOUT MCP6V1X tODR 100 nF VIN VDD tODR VDD/2 VSS FIGURE 1-3: VL FIGURE 1-4: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. VDD/3 RN VOUT RL RF VDD VIN CL Output Overdrive Recovery. RG CL RL VL RF FIGURE 1-5: AC and DC Test Circuit for Most Inverting Gain Conditions. The circuit in Figure 1-6 tests the input’s dynamic behavior (i.e., IMD, tSTR, tSTL and tODR). The potentiometer balances the resistor network (VOUT should equal VREF at DC). The op amp’s Common mode input voltage is VCM = VIN/2. The error at the input (VERR) appears at VOUT with a noise gain of 10 V/V. 11.0 kΩ 100 kΩ 500 Ω 0.1% 0.1% 25 turn VREF = VDD/3 VDD 1 µF VIN 100 nF MCP6V1X 11.0 kΩ 100 kΩ 249 Ω 1% 0.1% 0.1% FIGURE 1-6: Input Behavior. DS20005124B-page 6 RISO 0Ω VOUT CL 20 pF RL open VL Test Circuit for Dynamic  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. DC Input Precision 20% 15% 10% 5% 4 2 0 -2 -4 -6 FIGURE 2-1: 20% 15% 10% 5% 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 VCM = VCMH Representative Part 6 125°C +85°C +25°C -40°C 4 2 0 -2 -4 -6 FIGURE 2-2: Input Offset Voltage Drift. 15% 10% 5% 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 8 Representative Part IInput O Offset V Voltage e (µV) 20% 2.5 Power Supply Voltage (V) FIGURE 2-5: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMH. 42 Samples VDD = 1.6V and 5.5V 25% 2.0 50 1.5 -50 -40 -30 -20 -10 0 10 20 30 40 Input Offset Voltage Drift; TC1 (nV/°C) 0.0 -8 0% Percen ntage of Occurrences 1.0 8 42 Samples VDD = 1.6V and 5.5V 25% 30% Power Supply Voltage (V) FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage with VCM = VCML. Input O Offset V Voltage e (µV) Percentage of Occurrences Input Offset Voltage. 0.5 0.0 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 Input Offset Voltage (µV) 35% -40°C +25°C 25 C +85°C +125°C -8 0% 30% VCM = VCML Representative Part 6 1.0 25% 8 42 Samples TA = +25°C VDD = 1.6V and 5.5V 0.5 Percentage of Occurrences 30% Input O Offset V Voltage e (µV) 2.1 6 4 2 VDD = 5.5V 0 -2 VDD = 1.6V -4 -6 0% -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 Input Offset Voltage's Quadratic Temp Co; TC2 (nV/°C2) FIGURE 2-3: Input Offset Voltage Quadratic Temp. Co.  2012-2014 Microchip Technology Inc. -8 8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Output Voltage (V) FIGURE 2-6: Output Voltage. Input Offset Voltage vs. DS20005124B-page 7 MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. 45% VDD = 1.6V Representative Part 6 Pe ercenta age of Occurrrences s Input O Offset V Voltage e (µV) 8 4 2 0 -2 -40°C 40°C +25°C +85°C +125°C -4 -6 -8 -0.5 30% 25% 20% 15% 10% 5% 2.5 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 1/PSRR (µV/V) FIGURE 2-10: 45% 8 VDD = 5.5V Representative Part 6 Pe ercenta age of Occurrrences s Input O Offset V Voltage e (µV) 35% 0% 0.0 0.5 1.0 1.5 2.0 Input Common Mode Voltage (V) FIGURE 2-7: Input Offset Voltage vs. Common Mode Voltage with VDD = 1.6V. 4 2 0 -2 -40 40°C C +25°C +85°C +125 C +125°C -4 -6 -8 40% PSRR. 21 Samples TA = +25°C 35% 30% 25% 1 6V VDD = 1.6V 20% 5 5V VDD = 5.5V 15% 10% 5% 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 0% 70% 60% -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 1/AOL (µV/V) Input Common Mode Voltage (V) FIGURE 2-8: Input Offset Voltage vs. Common Mode Voltage with VDD = 5.5V. FIGURE 2-11: DC Open-Loop Gain. 160 21 Samples TA = 25°C 155 150 CMRR, PS SRR (dB) Percentage of Occurrences 21 Samples TA = +25°C 40% 50% VDD = 5.5V 40% 30% 20% VDD = 1.6V 140 135 130 125 120 10% 115 1/CMRR (µV/V) DS20005124B-page 8 CMRR. 1.6 1.2 0.8 0.4 0.0 -0.4 -0.8 -1.2 -1.6 0% FIGURE 2-9: PSRR 145 VDD = 5.5V 5 5V VDD = 1.6V CMRR 110 -50 -25 0 25 50 75 Ambient Temperature (°C) 100 125 FIGURE 2-12: CMRR and PSRR vs. Ambient Temperature.  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. 10000 10n Input Bias s, Offse et Currrents (A A) 160 DC Ope D en-Loo op Gain n (dB) 155 150 145 VDD = 5.5V VDD = 1.6V 140 135 130 125 120 115 110 -50 -25 0 25 50 75 Ambient Temperature (°C) 100 IOS 10 10p IB 35 45 55 65 75 85 95 105 115 125 Ambient Temperature (°C) 1.E-02 10m 1.E-03 1.E 03 1m Input Cu urrent M Magnitude (A A) Inpu ut Bias s, Offse et Currents (p pA) 100 100 100p FIGURE 2-16: Input Bias and Offset Currents vs. Ambient Temperature with VDD = +5.5V. TA = +85°C VDD = 5.5V 150 1000 1n 1 1p 25 125 FIGURE 2-13: DC Open-Loop Gain vs. Ambient Temperature. 200 VDD = 5.5V 1.E-04 100µ 100 1.E-05 10µ 50 IB 1.E-06 1µ 0 1.E-07 100n -50 1.E-08 1 E-08 10n -100 1.E-09 1n IOS -150 +125°C +85°C +85 C +25°C -40°C 1.E-10 100p 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -200 Common Mode Input Voltage (V) FIGURE 2-14: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +85°C. 1.E-11 p 10p -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 Input Voltage (V) FIGURE 2-17: Input Bias Current vs. Input Voltage (below VSS). Inpu ut Bias s, Offse et Currents (p pA) 5000 4000 TA = +125°C VDD = 5.5V 3000 2000 IB 1000 0 IOS 1000 -1000 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -2000 Common Mode Input Voltage (V) FIGURE 2-15: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +125°C.  2012-2014 Microchip Technology Inc. DS20005124B-page 9 MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. Other DC Voltages and Currents FIGURE 2-22: Supply Voltage. 6.5 6.0 5.5 5.0 6.5 6.0 5.5 Supply Current vs. Power 40% RL = 25 kȍ VDD = 5.5V VDD – VOH VOL – VSS VDD = 1.6V Percent P tage off Occu urrence es 35% 850 Samples 1 Wafer Lot TA = +25°C 30% 25% 20% 15% 10% 5% FIGURE 2-20: Output Voltage Headroom vs. Ambient Temperature. DS20005124B-page 10 1.34 4 1.32 2 1.30 0 1.28 8 1.26 6 125 1.24 4 100 1.22 2 0 25 50 75 Ambient Temperature (°C) 1.20 0 -25 1.18 8 -50 1.16 6 0% 1.14 4 Outpu ut Headroom (mV) 4.5 Power Supply Voltage (V) FIGURE 2-19: Output Voltage Headroom vs. Output Current. 12 11 10 9 8 7 6 5 4 3 2 1 0 5.0 10 4.5 1 Output Current Magnitude (mA) 4.0 0.1 0.0 1 +125°C +85°C +25°C -40°C 3.5 10 Representative Part 3.0 VDD = 5.5V VDD = 1.6V 11 10 9 8 7 6 5 4 3 2 1 0 2.5 VDD – VOH Supply C Current (µA/amplifier) Outtput Vo oltage H Headro oom (m mV) 1000 VOL – VSS 4.0 Power Supply Voltage (V) FIGURE 2-21: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-18: Input Common Mode Voltage Headroom (Range) vs. Ambient Temperature. 100 3.5 -40 125 2.0 0 25 50 75 100 Ambient Temperature (°C) 1.5 -25 1.0 -50 -30 3.0 -0.4 +125°C +85°C +25°C -40°C -20 2.5 -0.3 0 -10 2.0 Lower (VCML – VSS) -0.2 10 1.5 00 0.0 -0.1 20 1.0 0.1 -40°C +25°C +85°C +125°C 30 0.5 Upper ( VCMH – VDD) 0.2 40 0.5 Inp put Com mmon Mode Voltag ge Headroo H om (V) 1 Wafer Lot 03 0.3 0.0 0.4 Output Sho ort Circuit Current (mA) 2.2 POR Trip Voltage (V) FIGURE 2-23: Voltage. Power-on Reset Trip  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. 1.6 POR R Trip Voltage (V) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 Ambient Temperature (°C) 100 125 FIGURE 2-24: Power-on Reset Voltage vs. Ambient Temperature.  2012-2014 Microchip Technology Inc. DS20005124B-page 11 MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. Frequency Response Gain Band dwidth Product (kHz) 140 90 70 60 CMRR PSRR 20 10 60 60 40 50 VDD = 1.6V GBWP 20 40 1k 10k 100k 1.E+03 1.E+04 1.E+05 Frequency (Hz) -270 1M 1.E+06 -30 50 -60 40 -90 30 ‘AOL -120 20 -150 10 180 -180 | AOL | 0 -10 -210 -240 1k 10k 100k 1.E+03 1.E+04 1.E+05 Frequency (Hz) -270 1M 1.E+06 FIGURE 2-27: Open-Loop Gain vs. Frequency with VDD = 5.5V. DS20005124B-page 12 40 0 30 Common Mode Input Voltage (V) 140 0 Open n-Loop Phase (°) VDD = 5.5V CL = 20 pF 60 20 FIGURE 2-29: Gain Bandwidth Product and Phase Margin vs. Common Mode Input Voltage. FIGURE 2-26: Open-Loop Gain vs. Frequency with VDD = 1.6V. 70 50 VDD = 1.6V 6.0 -240 40 5.5 -10 60 VDD = 5.5V 5.0 -210 60 4.5 | AOL | 0 70 4.0 180 -180 80 3.5 -150 10 80 3.0 20 90 100 2.5 -120 ‘AOL RF = 1 MŸ GBWP 2.0 30 120 1.5 -90 125 100 1.0 40 0 25 50 75 100 Ambient Temperature (°C) PM 0.5 -30 -60 -25 140 0 50 30 -50 -0.5 Open n-Loop Gain (dB) 70 FIGURE 2-28: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. CMRR and PSRR vs. VDD = 1.6V CL = 20 pF 60 Open n-Loop Gain (dB) 80 80 100k 1.E+05 Gain Bandwidth Product (kHz) 70 1k 10k 1.E+03 1.E+04 Frequency (Hz) Open n-Loop Phase (°) 100 1.E+02 FIGURE 2-25: Frequency. -20 100 1.E+02 100 0 0 10 1.E+01 -20 100 1.E+02 90 VDD = 5.5V hase Margin (°) Ph 40 30 120 120 100 VDD = 5.5V GBWP 100 80 90 80 PM 60 70 60 40 50 Ph hase Margin (°) 50 Gain Bandwidth Product (kHz) CMR RR, PSRR (dB) 80 100 PM Ph hase Margin (°) 100 0.0 2.3 VDD = 1.6V 20 40 0 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Output Voltage (V) FIGURE 2-30: Gain Bandwidth Product and Phase Margin vs. Output Voltage.  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. Closed-Loo op Output Impedance (Ÿ) 1.E+05 100k 140 VDD = 1.6V 120 Chan nnel-to-Channel Sepa aration, RTI (dB) 1.E+04 10k 1.E+03 1k 1.E+02 100 1.E+01 10 G = 1 V/V G = 11 V/V G = 101 V/V 1.E+001 100 1.E+02 1k 1.E+03 100k 10k 1.E+04 1.E+05 Frequency (Hz) 60 40 0 1k 1.E+03 1M 1.E+06 10k 100k 1.E+04 1.E+05 Frequency (Hz) 1M 1.E+06 FIGURE 2-33: Channel-to-Channel Separation vs. Frequency. 10 VDD = 5.5V Max ximum Outputt Voltag ge Swiing (VP--P) Closed-Loo op Output Impedance (Ÿ) MCP6V12 MCP6V14 80 20 FIGURE 2-31: Closed-Loop Output Impedance vs. Frequency with VDD = 1.6V. 1.E+05 100k 100 1.E+04 10k 1.E+03 1k 1.E+02 100 1.E+01 10 1.E+001 100 1.E+02 G = 1 V/V G = 11 V/V G = 101 V/V 1k 1.E+03 100k 10k 1.E+04 1.E+05 Frequency (Hz) 1 1.E+02 VDD = 1.6V 1.E+03 1.E+04 1.E+05 01 0.1 1M 1.E+06 FIGURE 2-32: Closed-Loop Output Impedance vs. Frequency with VDD = 5.5V.  2012-2014 Microchip Technology Inc. VDD = 5.5V 100 1k 10k Frequency (Hz) 100k FIGURE 2-34: Maximum Output Voltage Swing vs. Frequency. DS20005124B-page 13 MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. Input Noise and Distortion 1000 1000 eni 100 100 VDD = 5.5V VDD = 1.6V 10 10 Eni(0 Hz to f) GDM = 1 V/V VDD tone = 50 mVPK, f = 100 Hz IMD Sp pectrum m, RTI ((µVPK) Input Noise Voltage Density; eni (nV/¥Hz) 1000 Integrated d Input Noise Voltage; Eni (µVP-P) 2.4 100 IMD tone at DC 100 Hz tone 10 1 1 1 10 1.E+02 100 1.E+03 1k 1.E+04 10k 1.E+05 100k 1.E+00 1.E+01 Frequency (Hz) 1 10 1.E+00 FIGURE 2-35: Input Noise Voltage Density and Integrated Input Noise Voltage vs. Frequency. Input N Noise Voltage; eni(t) (0.5 µV/div) In nput No oise Vo oltage D Density y (nV/¥ ¥Hz) VDD = 1.6V 100 VDD = 5.5V 60 40 20 NPBW = 10 Hz NPBW = 1 Hz 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 0 0 10 20 30 Common Mode Input Voltage (V) FIGURE 2-36: Input Noise Voltage Density vs. Input Common Mode Voltage. 40 50 60 Time (s) 70 80 90 100 FIGURE 2-39: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD =1.6V. 3.0 GDM = 1 V/V VCM tone = 50 mVPK, f = 100 Hz VDD = 5.5V 2.5 Input N Noise Voltage; eni(t) (0.5 µV/div) IMD Sp pectrum m, RTI ((µVPK) 1000 10k 1.E+05 VDD = 1.6V f < 500 Hz 140 80 1k 1.E+04 1.E+01 100 1.E+02 1.E+03 Frequency (Hz) FIGURE 2-38: Inter-Modulation Distortion vs. Frequency with VDD Disturbance (see Figure 1-6). 160 120 VDD = 5.5V VDD = 1.6V 2.0 100 1.5 residual 100 Hz tone 1.0 IMD tone at DC 0.5 VDD = 1.6V VDD = 5.5V 10 0.0 NPBW = 10 0 Hz -0.5 -1.0 -1.5 1 1 1.E+00 NPBW = 1 Hz -2.0 10 1.E+01 100 1k 1.E+02 1.E+03 Frequency (Hz) 10k 1.E+04 100k 1.E+05 FIGURE 2-37: Inter-Modulation Distortion vs. Frequency with VCM Disturbance (see Figure 1-6). DS20005124B-page 14 0 10 20 30 40 50 60 Time (s) 70 80 90 100 FIGURE 2-40: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD =5.5V.  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. Time Response 80 80 35 60 70 TPCB 30 40 25 20 VDD = 1.6V VDD = 5.5V 20 0 15 -20 10 -40 VOS 5 -60 0 -80 Temperature increased by using heat gun for 5 seconds. -5 -120 Input O Offset Voltage (mV) 30 20 0 0 VDD 6 5 6 5.5 5 5.0 4 3 POR Trip Point 4 2 3 1 2 0 1 -1 0 -2 VOS -1 -2 40 60 80 100 120 140 160 180 200 Time (µs) Non-inverting Small Signal VDD = 5.5V G=1 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 -3 0.5 -4 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Time (ms) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) FIGURE 2-45: Step Response. FIGURE 2-42: Input Offset Voltage vs. Time at Power Up. Non-inverting Large Signal 80 VDD = 5.5V G=1 VIN 6 VDD = 5.5V G = -1 70 Output V Voltage (10 mV/div) 7 Input, O Output Voltage (V) 20 FIGURE 2-44: Step Response. Power Supply Voltage (V) G=1 7 40 10 20 30 40 50 60 70 80 90 100 Time (s) FIGURE 2-41: Input Offset Voltage vs. Time with Temperature Change. 8 50 Outtput Voltage (V) 0 60 10 -100 -10 VDD = 5.5V G=1 Output V Voltage (10 mV/div) 40 PCB T Temperature (°C) Input O Offset Voltage (µV) 2.5 60 5 VOUT 50 4 3 40 2 30 1 20 0 10 -1 0 0 2 4 6 8 10 12 Time (ms) 14 16 18 20 FIGURE 2-43: The MCP6V11/1U/2/4 Family Shows No Input Phase Reversal with Overdrive.  2012-2014 Microchip Technology Inc. 0 20 40 FIGURE 2-46: Response. 60 80 100 120 140 160 180 200 Time (µs) Inverting Small Signal Step DS20005124B-page 15 MCP6V11/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.6V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF. VDD = 5.5V G = -1 5.0 7 7 6 6 Input Voltage × G (1 V/div) 5.5 Outp put Voltage (V) Outtput Voltage (V) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 5 VOUT G VIN 4 4 3 3 2 2 VDD = 5 5.5V 5V G = -10 V/V 0.5V Overdrive 1 G VIN 1 VOUT 0 0.5 0.0 FIGURE 2-47: Response. Inverting Large Signal Step 0 -1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) -1 0 1 0.07 Falling Edge 0.06 0.05 0.03 0.02 VDD = 1.6V 0.01 5 5 6 VDD = 1.6V tODR, low 1.E-03 1m 0.04 2 Time 2 (500 3 3µs/div) 4 4 0.5V Input Overdrive Overdriv ve Recovery Time (s) VDD = 5.5V 1 FIGURE 2-49: Output Overdrive Recovery vs. Time with G = -10 V/V. 1.E-02 10m 0.08 Sle ew Rate (V/µs) 5 5V VDD = 5 5.5V tODR, high Rising Edge 1.E-04 100µ 0.00 -50 -25 0 25 50 75 Ambient Temperature (°C) FIGURE 2-48: Temperature. DS20005124B-page 16 100 Slew Rate vs. Ambient 125 1 10 100 Inverting Gain Magnitude (V/V) 1000 FIGURE 2-50: Output Overdrive Recovery Time vs. Inverting Gain.  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP6V11 MCP6V11U SOT-23 SOT-23, SC-70 2×3 TDFN MSOP TSSOP 1 4 1 1 1 4 3 2 2 2 VIN–, VINA– Inverting Input (Op Amp A) 3 1 3 3 3 VIN+, VINA+ Non-inverting Input (Op Amp A) 3.1 MCP6V12 MCP6V14 VOUT, VOUTA Output (Op Amp A) 5 5 8 8 4 VDD — 5 5 5 VINB+ Non-inverting Input (Op Amp B) — — 6 6 6 VINB– Inverting Input (Op Amp B) — — 7 7 7 VOUTB Output (Op Amp B) — — — — 8 VOUTC Output (Op Amp C) — — — — 9 VINC– Inverting Input (Op Amp C) — — — — 10 VINC+ 2 2 4 4 11 VSS — — — — 12 VIND+ Non-inverting Input (Op Amp D) — — — — 13 VIND– Inverting Input (Op Amp D) — — — — 14 VOUTD — — 9 — — EP Analog Outputs Analog Inputs The non-inverting and inverting inputs (VIN+, VIN–, …) are high-impedance CMOS inputs with low bias currents. 3.3 Description — The analog output pins (VOUT) are low-impedance voltage sources. 3.2 Symbol 3.4 Positive Power Supply Non-inverting Input (Op Amp C) Negative Power Supply Output (Op Amp D) Exposed Thermal Pad (EP); must be connected to VSS Exposed Thermal Pad (EP) There is an internal connection between the exposed thermal pad (EP) and the VSS pin; they must be connected to the same potential on the printed circuit board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance (θJA). Power Supply Pins The positive power supply (VDD) is 1.6V to 5.5V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors.  2012-2014 Microchip Technology Inc. DS20005124B-page 17 MCP6V11/1U/2/4 NOTES: DS20005124B-page 18  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 4.0 APPLICATIONS The MCP6V11/1U/2/4 family of zero-drift op amps is manufactured using Microchip’s state of the art CMOS process. It is designed for precision applications with requirements for small packages and low power. Its low supply voltage and low quiescent current make the MCP6V11/1U/2/4 devices ideal for battery-powered applications. 4.1 Overview of Zero-Drift Operation Figure 4-1 shows a simplified diagram of the MCP6V11/1U/2/4 zero-drift op amps. This diagram will be used to explain how slow voltage errors are reduced in this architecture (much better VOS, ΔVOS/ΔTA (TC1), CMRR, PSRR, AOL and 1/f noise). The Low-Pass Filter reduces high-frequency content, including harmonics of the Chopping Clock. The Output Buffer drives external loads at the VOUT pin (VREF is an internal reference voltage). The Oscillator runs at fOSC1 = 50 kHz. Its output is divided by two, to produce the Chopping Clock rate of fCHOP = 25 kHz. The internal POR part starts the part in a known good state, protecting against power supply brown-outs. The Digital Control block controls switching and POR events. 4.1.2 CHOPPING ACTION Figure 4-2 shows the amplifier connections for the first phase of the Chopping Clock and Figure 4-3 shows them for the second phase. Its slow voltage errors alternate in polarity, making the average error small. VREF Output Buffer VOUT VIN+ VIN+ VIN– Main Amp. VIN– NC Oscillator Aux. Amp. Digital Control Chopper Output Switches POR FIGURE 4-1: Simplified Zero-Drift Op Amp Functional Diagram. 4.1.1 NC Low-Pass Filter Low-Pass Filter Chopper Input Switches Main Amp. Aux. Amp. FIGURE 4-2: First Chopping Clock Phase; Equivalent Amplifier Diagram. VIN+ VIN– Main Amp. NC BUILDING BLOCKS The Main Amplifier is designed for high gain and bandwidth, with a differential topology. Its main input pair (+ and - pins at the top left) is used for the higher frequency portion of the input signal. Its auxiliary input pair (+ and - pins at the bottom left) is used for the lowfrequency portion of the input signal and corrects the op amp’s input offset voltage. Both inputs are added together internally. The Auxiliary Amplifier, Chopper Input Switches and Chopper Output Switches provide a high DC gain to the input signal. DC errors are modulated to higher frequencies, while white noise is modulated to low frequency.  2012-2014 Microchip Technology Inc. Low-Pass Filter Aux. Amp. FIGURE 4-3: Second Chopping Clock Phase; Equivalent Amplifier Diagram. DS20005124B-page 19 MCP6V11/1U/2/4 4.1.3 INTERMODULATION DISTORTION (IMD) These op amps will show intermodulation distortion (IMD) products when an AC signal is present. The signal and clock can be decomposed into sine wave tones (Fourier series components). These tones interact with the zero-drift circuitry’s nonlinear response to produce IMD tones at sum and difference frequencies. Each of the square wave clock’s harmonics has a series of IMD tones centered on it. See Figure 2-37 and Figure 2-38. 4.2 4.2.1 Other Functional Blocks RAIL-TO-RAIL INPUTS The input stage of the MCP6V11/1U/2/4 op amps uses two differential CMOS input stages in parallel. One operates at low Common mode input voltage (VCM, which is approximately equal to VIN+ and VIN– in normal operation) and the other at high VCM. With this topology, the input operates with VCM up to VDD + 0.2V, and down to VSS – 0.15V, at +25°C (see Figure 2-18). The input offset voltage (VOS) is measured at VCM = VSS – 0.15V and VDD + 0.2V to ensure proper operation. The transition between the input stages occurs when VCM ≈ VDD – 0.9V (see Figure 2-7 and Figure 2-8). For the best distortion and gain linearity, with non-inverting gains, avoid this region of operation. 4.2.1.1 VIN+ Bond Pad Input Voltage Limits In order to prevent damage and/or improper operation of these amplifiers, the circuit must limit the voltages at the input pins (see Section 1.1 “Absolute Maximum Ratings †”). This requirement is independent of the current limits discussed later on. Bond V – IN Pad Input Stage VSS Bond Pad FIGURE 4-4: Structures. Simplified Analog Input ESD The input ESD diodes clamp the inputs when they try to go more than one diode drop below VSS. They also clamp any voltages well above VDD; their breakdown voltage is high enough to allow normal operation, but not low enough to protect against slow overvoltage (beyond VDD) events. Very fast ESD events (that meet the spec) are limited so that damage does not occur. In some applications, it may be necessary to prevent excessive voltages from reaching the op amp inputs; Figure 4-5 shows one approach to protecting these inputs. D1 and D2 may be small signal silicon diodes, Schottky diodes for lower clamping voltages or diode connected FETs for low leakage. VDD Phase Reversal The input devices are designed to not exhibit phase inversion when the input pins exceed the supply voltages. Figure 2-43 shows an input voltage exceeding both supplies with no phase inversion. 4.2.1.2 VDD Bond Pad U1 D1 MCP6V1X V1 D2 VOUT V2 FIGURE 4-5: Protecting the Analog Inputs Against High Voltages. The ESD protection on the inputs can be depicted as shown in Figure 4-4. This structure was chosen to protect the input transistors against many (but not all) overvoltage conditions, and to minimize input bias current (IB). DS20005124B-page 20  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 4.2.1.3 4.3 Input Current Limits In order to prevent damage and/or improper operation of these amplifiers, the circuit must limit the currents into the input pins (see Section 1.1 “Absolute Maximum Ratings †”). This requirement is independent of the voltage limits discussed previously. Figure 4-6 shows one approach to protecting these inputs. The resistors R1 and R2 limit the possible current in or out of the input pins (and into D1 and D2). The diode currents will dump onto VDD. V1 V2 R1 MCP6V1X Table 1-1 gives both the linear and quadratic temperature coefficients (TC1 and TC2) of input offset voltage. The input offset voltage, at any temperature in the specified range, can be calculated as follows: EQUATION 4-1: = TA – 25°C VOS(TA) = input offset voltage at TA VOS = input offset voltage at +25°C TC1 = linear temperature coefficient TC2 = quadratic temperature coefficient R2 VSS – min(V1, V2) 2 mA max(V1, V2) – VDD min(R1, R2) > 2 mA FIGURE 4-6: Protecting the Analog Inputs Against High Currents. It is also possible to connect the diodes to the left of resistors R1 and R2. In this case, the currents through the diodes D1 and D2 need to be limited by some other mechanism. The resistors then serve as in-rush current limiters; the DC current into the input pins (VIN+ and VIN–) should be very small. A significant amount of current can flow out of the inputs (through the ESD diodes) when the Common mode voltage (VCM) is below ground (VSS); see Figure 2-17. RAIL-TO-RAIL OUTPUT The output voltage range of the MCP6V11/1U/2/4 zero-drift op amps is VDD – 20 mV (minimum) and VSS + 20 mV (maximum) when RL = 10 kΩ is connected to VDD/2 and VDD = 5.5V. Refer to Figure 2-19 and Figure 2-20 for more information. This op amp is designed to drive light loads; use another amplifier to buffer the output from heavy loads.  2012-2014 Microchip Technology Inc. 2 ΔT VOUT min(R1, R2) > 4.2.2 INPUT OFFSET VOLTAGE OVER TEMPERATURE Where: U1 D2 4.3.1 V OS  T A  = VOS + TC 1  T + TC2  T VDD D1 Application Tips 4.3.2 DC GAIN PLOTS Figures 2-9 to 2-11 are histograms of the reciprocals (in units of µV/V) of CMRR, PSRR and AOL, respectively. They represent the change in input offset voltage (VOS) with a change in Common mode input voltage (VCM), power supply voltage (VDD) and output voltage (VOUT). The 1/AOL histogram is centered near 0 µV/V because the measurements are dominated by the op amp’s input noise. The negative values shown represent noise and tester limitations, not unstable behavior. Production tests make multiple VOS measurements, which validates an op amp's stability; an unstable part would show greater VOS variability, or the output would stick at one of the supply rails. 4.3.3 OFFSET AT POWER UP When these parts power up, the input offset (VOS) starts at its uncorrected value (usually less than ±5 mV). Circuits with high DC gain can cause the output to reach one of the two rails. In this case, the time to a valid output is delayed by an output overdrive time (like tODR), in addition to the start-up time (like tSTR). It can be simple to avoid this extra start-up time. Reducing the gain is one method. Adding a capacitor across the feedback resistor (RF) is another method. DS20005124B-page 21 MCP6V11/1U/2/4 SOURCE RESISTANCES The input bias currents have two significant components; switching glitches that dominate at room temperature and below, and input ESD diode leakage currents that dominate at +85°C and above. Make the resistances seen by the inputs small and equal. This minimizes the output offset caused by the input bias currents. The inputs should see a resistance on the order of 10 Ω to 1 kΩ at high frequencies (i.e., above 1 MHz). This helps minimize the impact of switching glitches, which are very fast, on overall performance. In some cases, it may be necessary to add resistors in series with the inputs to achieve this improvement in performance. Small input resistances may be needed for high gains. Without them, parasitic capacitances might cause positive feedback and instability. 4.3.5 SOURCE CAPACITANCE The capacitances seen by the two inputs should be small. Large input capacitances and source resistances, together with high gain, can lead to positive feedback and instability. 4.3.6 CAPACITIVE LOADS Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed-loop bandwidth is reduced. This produces gain peaking in the frequency response, with overshoot and ringing in the step response. These zero-drift op amps have a different output impedance than most op amps, due to their unique topology. When driving a capacitive load with these op amps, a series resistor at the output (RISO in Figure 4-7) improves the feedback loop’s phase margin (stability) by making the output load resistive at higher frequencies. The bandwidth will be generally lower than the bandwidth with no capacitive load. GN is the circuit’s noise gain. For non-inverting gains, GN and the Signal Gain are equal. For inverting gains, GN is 1+|Signal Gain| (e.g., -1 V/V gives GN = +2 V/V). 1.E+05 100k RL||(RF + RG) • 100 kŸ Recom mmended RISO (Ÿ) 4.3.4 1.E+04 10k 1.E+03 1 E+03 1k GN = 1 1.E+02 100 10p 1.E-11 GN = 10 100p 1.E-10 GN = 100 1n 10n 100n 1.E-09 1.E-08 1.E-07 Capacitive Load (F) 1µ 1.E-06 FIGURE 4-8: Recommended RISO Values for Capacitive Loads. After selecting RISO for your circuit, double check the resulting frequency response peaking and step response overshoot. Modify RISO's value until the response is reasonable. Bench evaluation is helpful. 4.3.7 STABILIZING OUTPUT LOADS This family of zero-drift op amps has an output impedance (Figure 2-31 and Figure 2-32) that has a double zero when the gain is low. This can cause a large phase shift in feedback networks that have lowimpedance near the part’s bandwidth. This large phase shift can cause stability problems. Figure 4-9 shows that the load on the output is (RL + RISO)||(RF + RG), where RISO is before the load (like Figure 4-7). This load needs to be large enough to maintain stability; it should be at least 10 kΩ. RG RF VOUT RL CL U1 MCP6V1X RISO VOUT FIGURE 4-9: Output Load. CL U1 MCP6V1X FIGURE 4-7: Output Resistor, RISO, Stabilizes Capacitive Loads. Figure 4-8 gives recommended RISO values for different capacitive loads and gains. The x-axis is the load capacitance (CL). The y-axis is the resistance (RISO). DS20005124B-page 22  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 4.3.8 GAIN PEAKING 4.3.9 Figure 4-10 shows an op amp circuit that represents non-inverting amplifiers (VM is a DC voltage and VP is the input) or inverting amplifiers (VP is a DC voltage and VM is the input). The capacitances CN and CG represent the total capacitance at the input pins; they include the op amp’s Common mode input capacitance (CCM), board parasitic capacitance and any capacitor placed in parallel. The capacitance CFP represents the parasitic capacitance coupling the output and noninverting input pins. RN VP CN CFP Reduce undesired noise and signals with: • Low bandwidth signal filters: - Minimizes random analog noise - Reduces interfering signals • Good PCB layout techniques: - Minimizes crosstalk - Minimizes parasitic capacitances and inductances that interact with fast switching edges • Good power supply design: - Isolation from other parts - Filtering of interference on supply line(s) 4.3.10 U1 MCP6V1X VM RG FIGURE 4-10: Capacitance. CG RF VOUT Amplifier with Parasitic CG acts in parallel with RG (except for a gain of +1 V/V), which causes an increase in gain at high frequencies. CG also reduces the phase margin of the feedback loop, which becomes less stable. This effect can be reduced by either reducing CG or RF||RG. CN and RN form a low-pass filter that affects the signal at VP. This filter has a single real pole at 1/(2πRNCN). The largest value of RF that should be used depends on noise gain (see GN in Section 4.3.6, Capacitive Loads), CG and the open-loop gain’s phase shift. An approximate limit for RF is: EQUATION 4-2: 2 12 pF R F   40 k    --------------  G N CG Some applications may modify these values to reduce either output loading or gain peaking (step response overshoot). At high gains, RN needs to be small, in order to prevent positive feedback and oscillations. Large CN values can also help.  2012-2014 Microchip Technology Inc. REDUCING UNDESIRED NOISE AND SIGNALS SUPPLY BYPASSING AND FILTERING With this family of operational amplifiers, the power supply pin (VDD for single supply) should have a local bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm of the pin for good high-frequency performance. These parts also need a bulk capacitor (i.e., 1 µF or larger) within 100 mm to provide large, slow currents. This bulk capacitor can be shared with other low noise, analog parts. In some cases, high-frequency power supply noise (e.g., switched mode power supplies) may cause undue intermodulation distortion, with a DC offset shift; this noise needs to be filtered. Adding a resistor into the supply connection can be helpful. 4.3.11 PCB DESIGN FOR DC PRECISION In order to achieve DC precision on the order of ±1 µV, many physical errors need to be minimized. The design of the Printed Circuit Board (PCB), the wiring, and the thermal environment have a strong impact on the precision achieved. A poor PCB design can easily be more than 100 times worse than the MCP6V11/1U/2/4 op amps’ minimum and maximum specifications. 4.3.11.1 PCB Layout Any time two dissimilar metals are joined together, a temperature dependent voltage appears across the junction (the Seebeck or thermojunction effect). This effect is used in thermocouples to measure temperature. The following are examples of thermojunctions on a PCB: • Components (resistors, op amps, …) soldered to a copper pad • Wires mechanically attached to the PCB • Jumpers • Solder joints • PCB vias DS20005124B-page 23 MCP6V11/1U/2/4 Typical thermojunctions have temperature to voltage conversion coefficients of 1 to 100 µV/°C (sometimes higher). 4.4 Microchip’s AN1258 (“Op Amp Precision Design: PCB Layout Techniques”) contains in-depth information on PCB layout techniques that minimize thermojunction effects. It also discusses other effects, such as crosstalk, impedances, mechanical stresses and humidity. Many sensors are configured as Wheatstone bridges. Strain gauges and pressure sensors are two common examples. These signals can be small and the Common mode noise large. Amplifier designs with high differential gain are desirable. 4.3.11.2 Crosstalk DC crosstalk causes offsets that appear as a larger input offset voltage. Common causes include: Typical Applications 4.4.1 WHEATSTONE BRIDGE Figure 4-11 shows how to interface to a Wheatstone bridge with a minimum of components. Because the circuit is not symmetric, the ADC input is single ended, and there is a minimum of filtering; the CMRR is good enough for moderate Common mode noise. • Common mode noise (remote sensors) • Ground loops (current return paths) • Power supply coupling Interference from the mains (usually 50 Hz or 60 Hz), and other AC sources, can also affect the DC performance. Nonlinear distortion can convert these signals to multiple tones, including a DC shift in voltage. When the signal is sampled by an ADC, these AC signals can also be aliased to DC, causing an apparent shift in offset. To reduce interference: - Keep traces and wires as short as possible Use shielding Use ground plane (at least a star ground) Place the input signal source near to the DUT Use good PCB layout techniques Use a separate power supply filter (bypass capacitors) for these zero-drift op amps 4.3.11.3 Miscellaneous Effects Keep the resistances seen by the input pins as small and as near to equal as possible, to minimize biascurrent-related offsets. Make the (trace) capacitances seen by the input pins small and equal. This is helpful in minimizing switching glitch-induced offset voltages. Bending a coax cable with a radius that is too small causes a small voltage drop to appear on the center conductor (the triboelectric effect). Make sure the bending radius is large enough to keep the conductors and insulation in full contact. Mechanical stresses can make some capacitor types (such as some ceramics) output small voltages. Use more appropriate capacitor types in the signal path and minimize mechanical stresses and vibration. Humidity can cause electrochemical potential voltages to appear in a circuit. Proper PCB cleaning helps, as does the use of encapsulants. DS20005124B-page 24 0.01C VDD R R 0.2R R R 4.4.2 100R VDD ADC U1 0.2R FIGURE 4-11: 1 kΩ MCP6V11 Simple Design. RTD SENSOR The ratiometric circuit in Figure 4-12 conditions a twowire RTD, for applications with a limited temperature range. U1 acts a difference amplifier, with a low frequency pole. The sensor’s wiring resistance (RW) is corrected in firmware. Failure (open) of the RTD is detected by an out-of-range voltage. VDD RT RN 34.8 kΩ 10.0 kΩ RF 2.00 MΩ RW RRTD 100Ω RW 10 nF U1 MCP6V11 RG RF 10.0 kΩ 2.00 MΩ 1.00 kΩ 100 nF RB 4.99 kΩ 1.0 µF 10 nF VDD ADC FIGURE 4-12: RTD Sensor.  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 4.4.3 OFFSET VOLTAGE CORRECTION Figure 4-13 shows MCP6V11 (U2) correcting the input offset voltage of another op amp (U1). R2 and C2 integrate the offset error seen at U1’s input; the integration needs to be slow enough to be stable (with the feedback provided by R1 and R3). R4 and R5 attenuate the integrator’s output; this shifts the integrator pole down in frequency. R1 VIN R3 R2 VOUT R4 C2 U1 R5 R2 VDD/2 MCP6XXX U2 VDD/2 MCP6V11 FIGURE 4-13: 4.4.4 Offset Correction. PRECISION COMPARATOR Use high gain before a comparator to improve the latter’s performance. Do not use MCP6V11/1U/2/4 as a comparator by itself; the VOS correction circuitry does not operate properly without a feedback loop. U1 VIN MCP6V11 R1 R2 R3 R4 R5 VOUT VDD/2 U2 MCP6541 FIGURE 4-14: Precision Comparator.  2012-2014 Microchip Technology Inc. DS20005124B-page 25 MCP6V11/1U/2/4 NOTES: DS20005124B-page 26  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 5.0 DESIGN AIDS Microchip provides the basic design aids needed for the MCP6V11/1U/2/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6V11/1U/2/4 op amps is available on the Microchip web site at www.microchip.com. This model is intended to be an initial design tool that works well in the op amp’s linear region of operation over the temperature range. See the model file for information on its capabilities. Bench testing is a very important part of any design and cannot be replaced with simulations. Also, simulation results using this macro model need to be validated by comparing them to the data sheet specifications and characteristic curves. 5.2 FilterLab® Software Microchip’s FilterLab® software is an innovative software tool that simplifies analog active filter (using op amps) design. Available at no cost from the Microchip web site at www.microchip.com/filterlab, the FilterLab design tool provides full schematic diagrams of the filter circuit with component values. It also outputs the filter circuit in SPICE format, which can be used with the macro model to simulate actual filter performance. 5.3 Microchip Advanced Part Selector (MAPS) MAPS is a software tool that helps efficiently identify Microchip devices that fit a particular design requirement. Available at no cost from the Microchip web site at www.microchip.com/maps, MAPS is an overall selection tool for Microchip’s product portfolio that includes Analog, Memory, MCUs and DSCs. Using this tool, a customer can define a filter to sort features for a parametric search of devices and export side-by-side technical comparison reports. Helpful links are also provided for Data Sheets, Purchase and Sampling of Microchip parts. 5.4 Analog Demonstration and Evaluation Boards Microchip offers a broad spectrum of Analog Demonstration and Evaluation Boards that are designed to help customers achieve faster time to market. For a complete listing of these boards and their corresponding user’s guides and technical information, visit the Microchip web site at www.microchip.com/analog tools. Some boards that are especially useful are: • MCP6V01 Thermocouple Auto-Zeroed Reference Design (P/N MCP6V01RD-TCPL) • MCP6XXX Amplifier Evaluation Board 1 (P/N DS51667) • MCP6XXX Amplifier Evaluation Board 2 (P/N DS51668) • MCP6XXX Amplifier Evaluation Board 3 (P/N DS51673) • MCP6XXX Amplifier Evaluation Board 4 (P/N DS51681) • Active Filter Demo Board Kit (P/N DS51614) • 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board (P/N SOIC8EV) • 14-Pin SOIC/TSSOP/DIP Evaluation Board (P/N SOIC14EV) 5.5 Application Notes The following Microchip Application Notes are available on the Microchip web site at www.microchip. com/appnotes and are recommended as supplemental reference resources. ADN003: “Select the Right Operational Amplifier for your Filtering Circuits”, DS21821 AN722: “Operational Amplifier Topologies and DC Specifications”, DS00722 AN723: “Operational Amplifier AC Specifications and Applications”, DS00723 AN884: “Driving Capacitive Loads With Op Amps”, DS00884 AN990: “Analog Sensor Conditioning Circuits – An Overview”, DS00990 AN1177: “Op Amp Precision Design: DC Errors”, DS01177 AN1228: “Op Amp Precision Design: Random Noise”, DS01228 AN1258: “Op Amp Precision Design: PCB Layout Techniques”, DS01258 These Application Notes and others are listed in the design guide: “Signal Chain Design Guide”, DS21825  2012-2014 Microchip Technology Inc. DS20005124B-page 27 MCP6V11/1U/2/4 NOTES: DS20005124B-page 28  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example: 5-Lead SC70 (MCP6V11U) Device MCP6V11UT-E/LT Note: Code DJNN DJ25 Applies to 5-Lead SC-70. Example: 5-Lead SOT-23 (MCP6V11/1U) Device Code MCP6V11T-E/OT 2CNN MCP6V11UT-E/OT 2DNN Note: 8-Lead MSOP (3x3 mm)(MCP6V12) 2C25 Applies to 5-Lead SOT-23. Example 6V12E 410256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2012-2014 Microchip Technology Inc. DS20005124B-page 29 MCP6V11/1U/2/4 8-Lead TDFN (2x3x0.75 mm)(MCP6V12) Device ABV MCP6V12T-E/MNY ABV 14-Lead TSSOP (4.4 mm)(MCP6V14) DS20005124B-page 30 Code MCP6V12-E/MNY Note: XXXXXXXX YYWW NNN Example Applies to 8-Lead 2x3 TDFN. ABV 410 25 Example 6V14E/ST 1410 256  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4        . # #$ #/! - 0  # 1/%#  #!# ##+22---  2/ D b 3 1 2 E1 E 4 5 e A e A2 c A1 L 3#   4# 5$8  %1 44" " 5 5 56 7 ( 1#  6, :#  ; 9()* <  !!1/ /  ; <  #! %%   <   6, =!# " ;    !!1/=!# " ( ( ( 6, 4#  ;  ( . #4# 4   9 4! /  ; < 9 4!=!# 8 ( <       !"!  #$! !%   # $    !%   # $     #&!  !    !#   "'( )*+ )     #&#,$  --# $##          - *9)  2012-2014 Microchip Technology Inc. DS20005124B-page 31 MCP6V11/1U/2/4  . # #$ #/! - 0  # 1/%#  #!# ##+22---  2/ DS20005124B-page 32  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4       !  . # #$ #/! - 0  # 1/%#  #!# ##+22---  2/ b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 3#   4# 5$8  %1 44" " 5 56 7 5 ( 4!1#  ()* 6$# !4!1#  6, :#   <  !!1/ /  ; <  #! %%   < ( 6, =!# "  <   !!1/=!# "  < ; 6, 4#   <  )* ( . #4# 4  < 9 . # # 4 ( < ; . #  > < > 4! /  ; < 9 4!=!# 8  < (      !"!  #$! !%   # $    !%   # $     #&!  !    !#   "'( )*+ )     #&#,$  --# $##          - *)  2012-2014 Microchip Technology Inc. DS20005124B-page 33 MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005124B-page 34  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012-2014 Microchip Technology Inc. DS20005124B-page 35 MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005124B-page 36  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012-2014 Microchip Technology Inc. DS20005124B-page 37 MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005124B-page 38  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012-2014 Microchip Technology Inc. DS20005124B-page 39 MCP6V11/1U/2/4 "  # $ % &'() *!*+,-#$  . # #$ #/! - 0  # 1/%#  #!# ##+22---  2/ DS20005124B-page 40  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012-2014 Microchip Technology Inc. DS20005124B-page 41 MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005124B-page 42  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012-2014 Microchip Technology Inc. DS20005124B-page 43 MCP6V11/1U/2/4 NOTES: DS20005124B-page 44  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 APPENDIX A: REVISION HISTORY Revision B (March 2014) The following is the list of modifications: 1. 2. 3. 4. 5. 6. Added new devices to the family: MCP6V12 and MCP6V14, and the related information throughout the document. Updated Table 1-3 with new packages’ thermal resistances. Updated Figures 1-6, 2-19 and 2-22 in Section 2.0 “Typical Performance Curves”. Added new Figure 2-33. Updated Table 3-1 in Section 3.0 “Pin Descriptions” for the new devices. Updated markings and specification drawings in Section 6.0 “Packaging Information”. Updated Product Identification System. Revision A (March 2012) • Original Release of this Document.  2012-2014 Microchip Technology Inc. DS20005124B-page 45 MCP6V11/1U/2/4 NOTES: DS20005124B-page 46  2012-2014 Microchip Technology Inc. MCP6V11/1U/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) –X /XX Examples: a) MCP6V11T-E/OT: MCP6V11T: Single Op Amp (Tape and Reel) (SOT-23) MCP6V11UT: Single Op Amp (Tape and Reel) (SC-70, SOT-23) MCP6V12: Dual Op Amp (MSOP, 2x3 TDFN) MCP6V12T: Dual Op Amp (Tape and Reel) (MSOP, 2x3 TDFN) MCP6V14: Quad Op Amp (TSSOP) MCP6V14T: Quad Op Amp (Tape and Reel) (TSSOP) a) MCP6V11UT-E/LT: a) MCP6V12-E/MS: Temperature Range: E b) MCP6V12T-E/MS: Package: LT = Plastic Small Outline Transistor, 5-lead OT = Plastic Small Outline Transistor, 5-lead MNY* = Plastic Dual Flat, No-Lead - 2×3×0.75 mm Body, 8-lead MS = Plastic Micro Small Outline, 8-lead ST = Plastic Thin Shrink Small Outline - 4.4 mm Body, 14-lead Device Tape and Reel Temperature Range Device: Package = -40°C to +125°C (Extended) b) c) Tape and Reel Extended temperature, 5LD SC70 package MCP6V11UT-E/OT: Tape and Reel, Extended temperature, 5LD SOT-23 package Extended temperature, 8LD MSOP package Tape and Reel, Extended temperature, 8LD MSOP package MCP6V12T-E/MNY: Tape and Reel, Extended temperature, 8LD 2x3 TDFN package a) MCP6V14-E/ST: b) MCP6V14T-E/ST: * Y = Nickel palladium gold manufacturing designator. Only available on the TDFN package. Note 1:  2012-2014 Microchip Technology Inc. Tape and Reel, Extended temperature, 5LD SOT-23 package Extended temperature, 14LD TSSOP package Tape and Reel Extended temperature, 14LD TSSOP package Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005124B-page 47 MCP6V11/1U/2/4 NOTES: DS20005124B-page 48  2012-2014 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2012-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-63276-007-4 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2012-2014 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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