SN74ACT244MDWREP

SN74ACT244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS724B – OCTOBER 2003 – REVISED MARCH 2006 FEATURES • • • • • • • • • (1) Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of up to –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) 4.5-V to 5.5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 9.5 ns at 5 V Inputs Are TTL Compatible DW OR NS PACKAGE (TOP VIEW) 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DESCRIPTION/ORDERING INFORMATION The SN74ACT244-EP octal buffer/driver is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PACKAGE (1) TA –55°C to 125°C –40°C to 85°C (1) ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC – DW Tape and reel SN74ACT244MDWREP SACT244MEP SOP – NS Tape and reel SN74ACT244MNSREP SACT244MEP SOIC – DW Tape and reel SN74ACT244IDWREP SACT244IEP Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (EACH BUFFER) INPUTS OE A OUTPUT Y L H H L L L H X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2006, Texas Instruments Incorporated SN74ACT244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS724B – OCTOBER 2003 – REVISED MARCH 2006 LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 VCC + 0.5 V –0.5 VCC + 0.5 range (2) UNIT VO Output voltage IIK Input clamp current VI < 0 or VI > VCC ±20 mA IOK Output clamp current VO < 0 or VO > VCC ±20 mA IO Continuous output current VO = 0 to VCC ±50 mA ±200 mA Continuous current through VCC or GND θJA Package thermal impedance (3) Tstg Storage temperature range (4) (1) (2) (3) (4) DW package 58 NS package 60 –65 150 V °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging. Recommended Operating Conditions (1) MIN MAX 4.5 5.5 UNIT VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current 24 mA ∆t/∆v Input transition rise or fall rate 8 ns/V TA Operating free-air temperature (1) 2 2 V 0.8 V 0 VCC V 0 VCC V –24 mA SN74ACT244M-EP –55 125 SN74ACT244I-EP –40 85 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback V °C SN74ACT244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS724B – OCTOBER 2003 – REVISED MARCH 2006 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH IOH = –24 mA IOH = –75 mA (1) MIN MAX IOL = 24 mA SN74ACT244I-EP MIN 4.4 4.49 4.4 5.5 V 5.4 5.49 5.4 5.4 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 4.76 MAX UNIT 4.4 V 3.85 4.5 V 0.001 0.1 0.1 0.1 5.5 V 0.001 0.1 0.1 0.1 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 V IOL = 75 mA (1) 5.5 V IOZ VO = VCC or GND 5.5 V ±0.25 ±5 ±2.5 µA II VI = VCC or GND 5.5 V ±0.1 ±1 ±1 µA ICC VI = VCC or GND, 5.5 V 4 80 40 µA 1.6 1.5 mA ∆ICC (2) (1) (2) MAX 5.5 V IOL = 50 µA VOL SN74ACT244M-EP TYP 4.5 V IOH = –50 µA TA = 25°C MIN IO = 0 One input at 3.4 V, Other inputs at GND or VCC 1.65 5.5 V 0.6 Ci VI = VCC or GND 5V 2.5 pF Co VI = VCC or GND 5V 8 pF Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms. This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. Switching Characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ FROM (INPUT) TO (OUTPUT) A Y OE Y OE Y TA = 25°C SN74ACT244M-EP SN74ACT244I-EP MIN TYP MAX MIN MAX MIN MAX 2 6.5 9 1 10 1.5 10 2 7 9 1 10 1.5 10 1.5 7 8.5 1 9.5 1 9.5 2 7 9.5 1 11 1.5 10.5 2 8 9.5 1 11 1.5 10.5 2.5 7.5 10 1 11.5 2 10.5 UNIT ns ns ns Operating Characteristics VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance CL = 50 pF, Submit Documentation Feedback f = 1 MHz TYP 45 UNIT pF 3 SN74ACT244-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS724B – OCTOBER 2003 – REVISED MARCH 2006 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test CL = 50 pF (see Note A) Open 500 Ω LOAD CIRCUIT Output Control (low-level enabling) 3V Input 1.5 V 1.5 V 0V tPLH tPHL 50% VCC S1 Open 2 × VCC Open 1.5 V 1.5 V 3V 0V tPZL tPLZ ≈VCC Output Waveform 1 S1 at 2 × VCC (see Note B) 50% VCC tPZH VOH Output TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 50% VCC VOL VOL tPHZ Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS VOL + 0.3 V 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) SN74ACT244IDWREP ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 SACT244IEP SN74ACT244MDWREP ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 SACT244MEP SN74ACT244MNSREP ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 SACT244MEP V62/04620-01XE ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 SACT244MEP V62/04620-01YE ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 SACT244MEP V62/04620-02XE ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 SACT244IEP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of