BSC0909NS

BSC0909NS OptiMOS™ Power-MOSFET Product Summary Features VDS • Optimized for 5V driver application (Notebook, VGA, POL) RDS(on),max • Low FOMSW for High Frequency SMPS • 100% Avalanche tested 34 V VGS=10 V 9.2 mW VGS=4.5 V 11.8 ID • Improved switching behaviour 44 A PG-TDSON-8 • N-channel • Very low on-resistance R DS(on) @ V GS=4.5 V • Excellent gate charge x R DS(on) product (FOM) • Qualified according to JEDEC1) for target applications • Superior thermal resistance • Pb-free plating; RoHS compliant • Halogen-free according to IEC61249-2-21 Type Package Marking BSC0909NS PG-TDSON-8 0909NS Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value V GS=10 V, T C=25 °C 44 V GS=10 V, T C=100 °C 28 V GS=4.5 V, T C=25 °C 39 V GS=4.5 V, T C=100 °C 24 V GS=4.5 V, T A=25 °C, R thJA=50 K/W 2) 12 Unit A Pulsed drain current3) I D,pulse T C=25 °C 176 Avalanche current, single pulse4) I AS T C=25 °C 35 Avalanche energy, single pulse E AS I D=25 A, R GS=25 W 10 mJ Gate source voltage V GS ±20 V 1) J-STD20 and JESD22 Rev. 3.5 page 1 2013-05-17 BSC0909NS Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Power dissipation P tot Value T C=25 °C 27 T A=25 °C, T j, T stg -55 ... 150 IEC climatic category; DIN IEC 68-1 Parameter W 2.5 R thJA=50 K/W 2) Operating and storage temperature Unit °C 55/150/56 Values Symbol Conditions Unit min. typ. max. bottom - - 4.6 top - - 20 6 cm2 cooling area2) - - 50 Thermal characteristics Thermal resistance, junction - case Device on PCB R thJC R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA 34 - - Gate threshold voltage V GS(th) V DS=V GS, I D=250 µA 1.2 - 2 Zero gate voltage drain current I DSS V DS=34 V, V GS=0 V, T j=25 °C - 0.1 1 V DS=34 V, V GS=0 V, T j=125 °C - 10 100 V µA Gate-source leakage current I GSS V GS=16 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=15 A - 9.4 11.8 mW V GS=10 V, I D=20 A - 7.7 9.2 1.5 3 6.0 W 25 50 - S Gate resistance RG Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=30 A 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 for more detailed information Rev. 3.5 page 2 2013-05-17 BSC0909NS Parameter Values Symbol Conditions Unit min. typ. max. - 1100 1500 - 390 520 Dynamic characteristics Input capacitance C iss V GS=0 V, V DS=15 V, f =1 MHz Output capacitance C oss Reverse transfer capacitance Crss - 25 - Turn-on delay time t d(on) - 9.6 - Rise time tr - 4.4 - Turn-off delay time t d(off) - 8.9 - Fall time tf - 5.4 - Gate to source charge Q gs - 3.8 5.1 Gate charge at threshold Q g(th) - 1.7 - Gate to drain charge Q gd - 1.8 2.3 Switching charge Q sw - 3.8 - Gate charge total Qg - 7.2 9.6 Gate plateau voltage V plateau - 3.3 - Gate charge total Qg V DD=15 V, I D=30 A, V GS=0 to 10 V - 15 20 Gate charge total, sync. FET Q g(sync) V DS=0.1 V, V GS=0 to 4.5 V - 6.2 - Output charge Q oss V DD=15 V, V GS=0 V - 10 13 - - 25 - - 176 V DD=15 V, V GS=4.5 V, I D=30 A, R G,ext=1.6 W pF ns Gate Charge Characteristics5) V DD=15 V, I D=30 A, V GS=0 to 4.5 V nC V nC Reverse Diode Diode continuous forward current IS Diode pulse current I S,pulse Diode forward voltage V SD V GS=0 V, I F=30 A, T j=25 °C - 0.92 - Reverse recovery charge Q rr V R=15 V, I F=I S, di F/dt =400 A/µs - - 10 4) 5) A T C=25 °C V nC See figure 13 for more detailed information See figure 16 for gate charge parameter definition Rev. 3.5 page 3 2013-05-17 BSC0909NS 1 Power dissipation 2 Drain current P tot=f(T C) I D=f(T C) parameter: V GS 30 50 40 20 10V 4.5V ID [A] Ptot [W] 30 20 10 10 0 0 0 40 80 120 160 0 40 80 TC [°C] 120 TC [°C] 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T C=25 °C; D =0 Z thJC=f(t p) parameter: t p parameter: D =t p/T 103 10 limited by on-state resistance 1 µs 102 0.5 10 µs 0.1 ZthJC [K/W] 1 ms ID [A] 0.2 1 100 µs 101 DC 0.05 0.02 0.01 0.1 100 single pulse 10-1 0.01 10-1 100 101 102 VDS [V] Rev. 3.5 160 0 0 0 0 0 0 1 10-6 10-5 10-4 10-3 10-2 10-1 100 tp [s] page 4 2013-05-17 BSC0909NS 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 150 28 10 V 5V 24 120 3V 4.5 V RDS(on) [mW] 20 ID [A] 90 4V 60 3.2 V 3.5 V 16 4V 12 4.5 V 5V 6V 8 10 V 3.5 V 30 3.2 V 4 3V 2.8 V 0 0 0 1 2 3 0 10 20 VDS [V] 30 40 50 ID [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C parameter: T j 100 120 100 80 80 gfs [S] ID [A] 60 25 °C 150 °C 60 40 40 20 20 0 0 0 1 2 3 4 5 VGS [V] Rev. 3.5 0 40 80 120 ID [A] page 5 2013-05-17 BSC0909NS 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=30 A; V GS=10 V V GS(th)=f(T j); V GS=V DS; I D=250 µA 24 2.5 20 2 1.5 VGS(th) [V] RDS(on) [mW] 16 12 1 typ 8 0.5 4 0 0 -60 -20 20 60 100 140 180 -60 -20 20 Tj [°C] 60 100 140 180 Tj [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz I F=f(V SD) parameter: T j 104 103 Ciss 103 102 150 °C IF [A] C [pF] Coss 102 25 °C Crss 101 101 100 100 0 10 20 30 0 VDS [V] Rev. 3.5 0.5 1 1.5 2 VSD [V] page 6 2013-05-17 BSC0909NS 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 W V GS=f(Q gate); I D=30 A pulsed parameter: T j(start) parameter: V DD 102 12 15 V 10 6V 24 V VGS [V] IAV [A] 8 25 °C 101 100 °C 6 125 °C 4 2 100 0 100 101 102 0 103 4 tAV [µs] 8 12 16 Qgate [nC] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=1 mA 34 V GS Qg 32 VBR(DSS) [V] 30 28 26 V gs(th) 24 Q g(th) 22 Q sw Q gs 20 -60 -20 20 60 100 140 Q gate Q gd 180 Tj [°C] Rev. 3.5 page 7 2013-05-17 BSC0909NS Package Outline PG-TDSON-8 PG-TDSON-8-5: Outline Rev. 3.5 page 8 2013-05-17 BSC0909NS Package Outline PG-TDSON-8: Tape Dimensions in mm Rev. 3.5 page 9 2013-05-17 BSC0909NS Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 3.5 page 10 2013-05-17