UFS Series N-Channel IGBT
with Anti-Parallel Hyperfast
Diode
40 A, 600 V
HGTG20N60B3D
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The HGTG20N60B3D is a MOS gated high voltage switching
device combining the best features of MOSFETs and bipolar
transistors. The device has the high input impedance of a MOSFET
and the low on−state conduction loss of a bipolar transistor. The much
lower on−state voltage drop varies only moderately between 25°C and
150°C. The diode used in anti−parallel with the IGBT is the
RHRP3060.
The IGBT is ideal for many high voltage switching applications
operating at moderate frequencies where low conduction losses are
essential.
Formerly developmental type TA49016.
G
E
E
C
G
COLLECTOR
(BOTTOM
SIDE METAL)
Features
•
•
•
•
•
•
C
40 A, 600 V at TC = 25°C
Typical Fall Time 140 ns at 150°C
Short Circuit Rated
Low Conduction Loss
Hyperfast Anti−Parallel Diode
This is a Pb−Free Device
TO−247−3LD SHORT LEAD
CASE 340CK
JEDEC STYLE
MARKING DIAGRAM
$Y&Z&3&K
G20N60B3D
$Y
&Z
&3
&K
G20N60B3D
= ON Semiconductor Logo
= Assembly Plant Code
= Numeric Date Code
= Lot Code
= Specific Device Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 7 of
this data sheet.
© Semiconductor Components Industries, LLC, 2001
April, 2020 − Rev. 2
1
Publication Order Number:
HGTG20N60B3D/D
HGTG20N60B3D
ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise specified)
Parameter
Symbol
HGTG20N60B3D
Unit
Collector to Emitter Voltage
BVCES
600
V
Collector to Gate Voltage, RGE = 1 MW
BVCGR
600
V
Collector Current Continuous
At TC = 25°C
At TC = 110°C
IC25
IC110
40
20
A
A
Average Diode Forward Current at 110°C
I(AVG)
20
A
ICM
160
A
Gate to Emitter Voltage Continuous
Collector Current Pulsed (Note 1)
VGES
±20
V
Gate to Emitter Voltage Pulsed
VGEM
±30
V
Switching Safe Operating Area at TC = 150°C
SSOA
30 A at 600 V
PD
165
W
1.32
W/°C
Power Dissipation Total at TC = 25°C
Power Dissipation Derating TC > 25°C
TJ, TSTG
−40 to 150
°C
Maximum Lead Temperature for Soldering
Operating and Storage Junction Temperature Range
TL
260
°C
Short Circuit Withstand Time (Note 2) at VGE = 15 V
tSC
4
ms
Short Circuit Withstand Time (Note 2) at VGE = 10 V
tSC
10
ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. VCE = 360 V, TC =125°C, RG = 25 W
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise specified)
Parameter
Symbol
Collector to Emitter Breakdown Voltage
BVCES
Collector to Emitter Leakage Current
Collector to Emitter Saturation Voltage
Gate to Emitter Threshold Voltage
Gate to Emitter Leakage Current
Switching SOA
Gate to Emitter Plateau Voltage
On−State Gate Charge
Current Turn−On Delay Time
Current Rise Time
Current Turn−Off Delay Time
ICES
VCE(SAT)
VGE(TH)
IGES
SSOA
VGEP
QG(ON)
td(ON)I
trI
td(OFF)I
Test Condition
Min
Typ
Max
Unit
600
−
−
V
TC = 25°C
−
−
250
mA
TC = 150°C
−
−
2.0
mA
TC = 25°C
−
1.8
2.0
V
TC = 150°C
−
2.1
2.5
V
3.0
5.0
6.0
V
IC = 250 mA, VGE = 0 V
VCE = BVCES
IC = IC110, VGE = 15 V
IC = 250 mA, VCE = VGE
VGE = ±20 V
−
−
±100
nA
VCE = 480 V
100
−
−
A
VCE = 600 V
30
−
−
A
IC = IC110, VCE = 0.5 BVCES
−
8.0
−
V
IC = IC110,
VCE = 0.5 BVCES
VGE = 15 V
−
80
105
nC
VGE = 20 V
−
105
135
nC
−
25
−
ns
−
20
−
ns
−
220
275
ns
−
140
175
ns
TC = 150°C, VGE = 15 V,
RG = 10 W, L = 45 mH
TC = 150°C,
ICE = IC110,
VCE = 0.8 BVCES,
VGE = 15 V,
RG = 10 W,
L = 100 mH
Current Fall Time
tfI
Turn−On Energy
EON
−
475
−
mJ
Turn−Off Energy (Note 3)
EOFF
−
1050
−
mJ
Diode Forward Voltage
VEC
Diode Reverse Recovery Time
trr
IEC = 20 A
−
1.5
1.9
V
IEC = 20 A, dIEC/dt = 100 A/ms
−
−
55
ns
IEC = 1 A, dIEC/dt = 100 A/ms
−
−
45
ns
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2
HGTG20N60B3D
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise specified) (continued)
Parameter
Symbol
Thermal Resistance
RqJC
Test Condition
Min
Typ
Max
Unit
IGBT
−
−
0.76
°C/W
Diode
−
−
1.2
°C/W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Turn−Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and
ending at the point where the collector current equals zero (ICE = 0 A) The HGTG20N60B3D was tested per JEDEC standard No. 24−1
Method for Measurement of Power Device Turn−Off Switching Loss. This test method produces the true total Turn−Off Energy Loss. Turn−On
losses include diode losses.
TYPICAL PERFORMANCE CURVES
PULSE DURATION = 250 ms
DUTY CYCLE < 0.5%, VCE = 10 V
ICE, COLLECTOR TO EMITTER
CURRENT (A)
ICE, COLLECTOR TO EMITTER
CURRENT (A)
100
80
TC = 150°C
60
TC = 25°C
40
TC = −40°C
20
0
4
6
8
10
VGE, GATE TO EMITTER VOLTAGE (V)
80
VGE = 10 V
PULSE DURATION = 250 ms,
DUTY CYCLE < 0.5%, TC = 25°C
60
VGE = 9 V
VGE = 8.5 V
40
VGE = 8.0 V
VGE = 7.5 V
20
VGE = 7.0 V
12
0
2
4
6
8
Figure 2. SATURATION CHARACTERISTICS
100
50
40
VGE = 15 V
30
20
10
25
50
75
100
125
10
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
ICE, COLLECTOR TO EMITTER
CURRENT (A)
ICE, DC COLLECTOR CURRENT (A)
12 V
VGE = 15 V
0
Figure 1. TRANSFER CHARACTERISTICS
0
100
80
60
TC = −40°C
40
TC = 150°C
20
0
150
TC = 25°C
PULSE DURATION = 250 ms
DUTY CYCLE < 0.5%,
VGE = 15 V
0
1
2
3
4
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
TC, CASE TEMPERATURE (°C)
Figure 3. DC COLLECTOR CURRENT vs. CASE
TEMPERATURE
Figure 4. COLLECTOR TO EMITTER ON−STATE
VOLTAGE
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3
5
HGTG20N60B3D
FREQUENCY = 1 MHz
C IES
4000
VCE, COLLECTOR TO EMITTER
VOLTAGE (V)
C, CAPACITANCE (pF)
5000
3000
2000
C OES
1000
C RES
0
0
5
10
15
20
15
600
480
360
9
VCE = 400 V
240
TC = 25°C
Ig(REF) = 1.685 mA
RL = 30 W
120
0
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
td(OFF)I, TURN−OFF DELAY TIME (ns)
td(ON)I, TURN−ON DELAY TIME (ns)
50
40
VCE = 480 V, VGE = 15 V
20
10
0
10
20
40
30
500
60
80
0
100
TJ = 150°C, RG = 10 W, L = 100 mH
400
300
VCE = 480 V, VGE = 15 V
200
100
0
ICE, COLLECTOR TO EMITTER CURRENT (A)
10
20
30
40
ICE, COLLECTOR TO EMITTER CURRENT (A)
Figure 7. TURN−ON DELAY TIME vs.
COLLECTOR TO EMITTER CURRENT
Figure 8. TURN−OFF DELAY TIME vs.
COLLECTOR TO EMITTER CURRENT
1000
100
TJ = 150°C, RG = 10 W, L = 100 mH
TJ = 150°C, RG = 10 W, L = 100 mH
TfI, FALL TIME (ns)
trI, TURN−ON RISE TIME (ns)
40
Figure 6. GATE CHARGE WAVEFORMS
TJ = 150°C, RG = 10 W, L = 100 mH
30
20
3
QG, GATE CHARGE (nC)
Figure 5. CAPACITANCE vs. COLLECTOR TO
EMITTER VOLTAGE
100
6
VCE = 200 V
0
25
12
VCE = 600 V
VCE = 480 V, VGE = 15 V
10
1
0
10
20
30
10
40
VCE = 480 V, VGE = 15 V
100
0
ICE, COLLECTOR TO EMITTER CURRENT (A)
10
20
30
ICE, COLLECTOR TO EMITTER CURRENT (A)
Figure 9. TURN−ON RISE TIME vs.
COLLECTOR TO EMITTER CURRENT
Figure 10. TURN−OFF FALL TIME vs.
COLLECTOR TO EMITTER CURRENT
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4
40
VGE, GATE TO EMITTER VOLTAGE (V)
TYPICAL PERFORMANCE CURVES (continued)
HGTG20N60B3D
EOFF, TURN−OFF ENERGY LOSS (mJ)
EON, TURN−ON ENERGY LOSS (mJ)
TYPICAL PERFORMANCE CURVES (continued)
1400
TJ = 150°C, RG = 10 W, L = 100 mH
1200
1000
800
VCE = 480 V, VGE = 15 V
600
400
200
0
0
10
20
30
40
2500
TJ = 150°C, RG = 10 W, L = 100 mH
2000
1500
1000
500
0
0
ICE, COLLECTOR TO EMITTER CURRENT (A)
ICE, COLLECTOR TO EMITTER
CURRENT (A)
fMAX, OPERATING FREQUENCY (kHz)
TJ = 150°C, TC = 75°C, VGE = 15 V
RG = 10 W, L = 100 mH
100
fMAX1 = 0.05 / (td(OFF)I + td(ON)I)
fMAX2 = (PD − PC) / (EON + EOFF)
PD = ALLOWABLE DISSIPATION
PC = CONDUCTION DISSIPATION
(DUTY FACTOR = 50%)
RqJC = 0.76°C/W
10
5
20
30
120
40
TC = 150°C, VGE = 15 V, RG = 10 W
80
60
40
20
0
40
0
100
200
300
400
500
600
700
VCE, COLLECTOR EMITTER VOLTAGE (V)
Figure 13. OPERATING FREQUENCY vs.
COLLECTOR TO EMITTER CURRENT
ZqJC, NORMALIZED THERMAL RESPONSE
30
100
ICE, COLLECTOR TO EMITTER CURRENT (A)
100
20
Figure 12. TURN−OFF ENERGY LOSS vs.
COLLECTOR TO EMITTER CURRENT
VCE = 480 V
10
10
ICE, COLLECTOR TO EMITTER CURRENT (A)
Figure 11. TURN−ON ENERGY LOSS vs.
COLLECTOR TO EMITTER CURRENT
500
VCE = 480 V, VGE = 15 V
Figure 14. SWITCHING SAFE OPERATING AREA
0.5
0.2
10−1
0.1
0.05
0.02
10−2
t1
PD
0.01
t2
SINGLE PULSE
10−3
10−5
10−4
DUTY FACTOR, D = t1 / t2
PEAK TJ = (PD x ZqJC x RqJC) + TC
10−3
10−2
10−1
100
t1, RECTANGULAR PULSE DURATION (s)
Figure 15. IGBT NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE
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5
101
HGTG20N60B3D
TYPICAL PERFORMANCE CURVES (continued)
50
tr, RECOVERY TIMES (ns)
IEC, FORWARD CURRENT (A)
100
80
150°C
60
100°C
40
20
0
0
25°C
0.5
1.0
1.5
2.0
40
TC = 25°C, dIEC/dt = 100 A/ms
trr
30
ta
20
tb
10
0
2.5
1
VEC, FORWARD VOLTAGE (V)
5
10
Figure 16. DIODE FORWARD CURRENT vs.
FORWARD VOLTAGE DROP
Figure 17. RECOVERY TIMES vs. FORWARD CURRENT
TEST CIRCUIT AND WAVEFORMS
90%
L = 100 mH
RHRP3060
10%
VGE
EOFF
EON
VCE
RG = 10 W
90%
+
−
20
VEC, FORWARD CURRENT (A)
VDD = 480 V
10%
ICE
t d(OFF)I
t fI
t rI
t d(ON)I
Figure 18. INDUCTIVE SWITCHING TEST CIRCUIT
Figure 19. SWITCHING TEST WAVEFORMS
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HGTG20N60B3D
OPERATING FREQUENCY INFORMATION
Operating frequency information for a typical device
(Figure 13) is presented as a guide for estimating device
performance for a specific application. Other typical
frequency vs collector current (ICE) plots are possible using
the information shown for a typical unit in Figures 4, 7, 8, 11
and 12. The operating frequency plot (Figure 13) of a typical
device shows fMAX1 or fMAX2 whichever is smaller at each
point. The information is based on measurements of a
typical device and is bounded by the maximum rated
junction temperature.
fMAX1 is defined by fMAX1 = 0.05 / (td(OFF)I td(ON)I).
Deadtime (the denominator) has been arbitrarily held to
10% of the on− state time for a 50% duty factor. Other
definitions are possible. td(OFF)I and td(ON)I are defined in
Figure 19.
Device turn−off delay can establish an additional
frequency limiting condition for an application other than
TJM. td(OFF)I is important when controlling output ripple
under a lightly loaded condition.
fMAX2 is defined by fMAX2 = (PD − PC) / (EOFF + EON). The
allowable dissipation (PD) is defined by PD = (TJM − TC) /
RqJC. The sum of device switching and conduction losses
must not exceed PD. A 50% duty factor was used (Figure 13)
and the conduction losses (PC) are approximated by
PC = (VCE x ICE) / 2.
EON and EOFF are defined in the switching waveforms
shown in Figure 19. EON is the integral of the instantaneous
power loss (ICE x VCE) during turn−on and EOFF is the
integral of the instantaneous power loss during turn−off. All
tail losses are included in the calculation for EOFF; i.e. the
collector current equals zero (ICE = 0).
HANDLING PRECAUTIONS FOR IGBTs
Insulated Gate Bipolar Transistors are susceptible to
gate−insulation damage by the electrostatic discharge of
energy through the devices. When handling these devices,
care should be exercised to assure that the static charge built
in the handler’s body capacitance is not discharged through
the device. With proper handling and discharge procedures,
however, IGBTs are currently being extensively used in
production by numerous equipment manufacturers in
military, industrial and consumer applications, with virtually
no damage problems due to electrostatic discharge. IGBTs
can be handled safely if the following basic precautions are
taken:
1. Prior to assembly into a circuit, all leads should be
kept shorted together either by the use of metal
shorting springs or by the insertion into conductive
material such as “ECCOSORBDt LD26” or
equivalent.
2. When devices are removed by hand from their
carriers, the hand being used should be grounded
by any suitable means − for example, with a
metallic wristband.
3. Tips of soldering irons should be grounded.
4. 1. Devices should never be inserted into or
removed from circuits with power on.
5. Gate Voltage Rating − Never exceed the
gate−voltage rating of VGEM. Exceeding the rated
VGE can result in permanent damage to the oxide
layer in the gate region.
6. Gate Termination − The gates of these devices are
essentially capacitors. Circuits that leave the gate
open− circuited or floating should be avoided.
These conditions can result in turn−on of the
device due to voltage buildup on the input
capacitor due to leakage currents or pickup.
7. Gate Protection - These devices do not have an
internal monolithic zener diode from gate to
emitter. If gate protection is required an external
zener is recommended.
ORDERING INFORMATION
Part Number
HGTG20N60B3D
NOTE:
Package
Brand
Shipping
TO−247
G20N60B3D
450 Units / Tube
When ordering, use the entire part number.
All brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders.
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7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−247−3LD SHORT LEAD
CASE 340CK
ISSUE A
A
DATE 31 JAN 2019
A
E
P1
P
A2
D2
Q
E2
S
B
D
1
2
D1
E1
2
3
L1
A1
L
b4
c
(3X) b
0.25 M
(2X) b2
B A M
DIM
(2X) e
GENERIC
MARKING DIAGRAM*
AYWWZZ
XXXXXXX
XXXXXXX
XXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
ZZ
= Assembly Lot Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13851G
TO−247−3LD SHORT LEAD
A
A1
A2
b
b2
b4
c
D
D1
D2
E
E1
E2
e
L
L1
P
P1
Q
S
MILLIMETERS
MIN NOM MAX
4.58 4.70 4.82
2.20 2.40 2.60
1.40 1.50 1.60
1.17 1.26 1.35
1.53 1.65 1.77
2.42 2.54 2.66
0.51 0.61 0.71
20.32 20.57 20.82
13.08
~
~
0.51 0.93 1.35
15.37 15.62 15.87
12.81
~
~
4.96 5.08 5.20
~
5.56
~
15.75 16.00 16.25
3.69 3.81 3.93
3.51 3.58 3.65
6.60 6.80 7.00
5.34 5.46 5.58
5.34 5.46 5.58
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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