FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer
843252-45
Datasheet
General Description
Features
The 843252-45 is a 2 LVPECL output Synthesizer optimized to
generate Ethernet reference clock frequencies. Using a 25MHz,
18pF parallel resonant crystal, the following frequencies can be
generated: 156.25MHz and 125MHz. The 843252-45 uses IDT’s 3rd
generation low phase noise VCO technology and can achieve 1ps
or lower typical rms phase jitter, easily meeting Ethernet jitter
requirements. The 843252-45 is packaged in a small 16-pin TSSOP
package.
•
•
Two differential LVPECL output pairs
•
A 25MHz crystal generates output frequencies of: 156.25MHz
and 125MHz
•
•
VCO frequency: 625MHz
•
•
•
•
Full 3.3V supply mode
Crystal oscillator interface designed for a 25MHz, 18pF parallel
resonant crystal
RMS Phase Jitter @ 156.25MHz, (1.875MHz – 20MHz) using a
25MHz crystal: 0.54ps (typical)
0°C to 70°C ambient operating temperature
Available in lead-free (RoHS 6) package
For functional replacement part us 8T49N241
Pin Assignment
Block Diagram
CLK_EN_A Pullup
XTAL_IN
125MHz
QA
25MHz
÷5
OSC
Phase
Detector
nQA
VCO
156.25MHz
QB
625MHz
XTAL_OUT
÷4
nQB
Feedback Divider
÷25
CLK_EN_A
VEE
QA
nQA
VCCOA
nc
VCCA
VCC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CLK_EN_B
VEE
QB
nQB
VCCOB
XTAL_IN
XTAL_OUT
VEE
843252-45
CLK_EN_B Pullup
16-Lead TSSOP
4.4mm x 5.0mm x 0.925mm package body
G Package
©2016 Integrated Device Technology, Inc.
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843252-45 Datasheet
Table 1. Pin Descriptions
Number
Name
Type
1
CLK_EN_A
Input
Description
Pullup
Output enable pin. LVCMOS/LVTTL interface levels. See Table 3A.
2, 9, 15
VEE
Power
Negative supply pins.
3, 4
QA, nQA
Output
Differential output pair. LVPECL interface levels.
5
VCCOA
Power
Output supply pin for QA/nQA outputs.
6
nc
Unused
7
VCCA
Power
Analog supply pin.
8
VCC
Power
Power supply pin.
10
11
XTAL_OUT
XTAL_IN
Input
No connect.
Crystal oscillator interface XTAL_IN is the input, XTAL_OUT is the output.
12
VCCOB
Power
Output supply pin for QB/nQB outputs.
13, 14
nQB, QB
Output
Differential output pair. LVPECL interface levels.
16
CLK_EN_B
Input
Pullup
Output enable pin. LVCMOS/LVTTL interface levels. See Table 3B.
NOTE: Pullup refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
k
Function Tables
Table 3A. CLK_EN_A Function Table
Input
Table 3B. CLK_EN_B Function Table
Outputs
Input
Outputs
CLK_EN_A
QA
nQA
CLK_EN_B
QB
nQB
0
LOW
HIGH
0
LOW
HIGH
1 (default)
Active
Active
1 (default)
Active
Active
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843252-45 Datasheet
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
Item
Rating
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5V
Outputs, IO
Continuos Current
Surge Current
50mA
100mA
Package Thermal Impedance, JA
92.4C/W (0 mps)
Storage Temperature, TSTG
-65C to 150C
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VCC = VCCOA = VCCOB = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
VCC
Test Conditions
Minimum
Typical
Maximum
Units
Power Supply Voltage
3.135
3.3
3.465
V
VCCA
Analog Supply Voltage
VCC – 0.15
3.3
VCC
V
VCCOA,
VCCOB
Power Supply Voltage
3.135
3.3
3.465
V
ICCA
Analog Supply Current
15
mA
IEE
Power Supply Current
75
mA
Maximum
Units
Table 4B. LVCMOS/LVTTL DC Characteristics,VCC = VCCOA = VCCOB = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
VIH
Input High Voltage
2
VCC + 0.3
V
VIL
Input Low Voltage
-0.3
0.8
V
IIH
Input High Current
CLK_EN_A,
CLK_EN_B
VCC = VIN = 3.465V
5
µA
IIL
Input Low Current
CLK_EN_A,
CLK_EN_B
VCC = 3.465V, VIN = 0V
-150
µA
Table 4C. LVPECL DC Characteristics, VCC = VCCOA = VCCOB = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
VOH
Output High Voltage; NOTE 1
VOL
Output Low Voltage; NOTE 1
VSWING
Peak-to-Peak Output Voltage Swing
Test Conditions
Minimum
Typical
Maximum
Units
VCCO – 1.4
VCCO – 0.9
V
VCCO – 2.0
VCCO – 1.7
V
0.6
1.0
V
NOTE 1: Output termination with 50 to VCCOA,B – 2V.
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843252-45 Datasheet
Table 5. Crystal Characteristics
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical
Maximum
Units
Fundamental
Frequency
25
MHz
Equivalent Series Resistance (ESR)
50
Shunt Capacitance
7
pF
NOTE: Characterized using an 18pF parallel resonant crystal.
AC Electrical Characteristics
Table 6. AC Characteristics, VCC = VCCOA = VCCOB = 3.3V ± 5%, TA = 0°C to 70°C
Symbol
Parameter
Test Conditions
fOUT
Output Frequency
tjit(Ø)
RMS Phase Jitter (Random);
NOTE 1
Minimum
Typical
Maximum
Units
QA/nQA
125
MHz
QB/nQB
156.25
MHz
125MHz,
Integration Range: 1.875MHz – 20MHz
0.56
ps
156.25MHz,
Integration Range: 1.875MHz – 20MHz
0.54
ps
t R / tF
Output Rise/Fall Time
odc
Output Duty Cycle
20% to 80%
300
700
ps
49
51
%
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. Device will meet specifications after thermal equilibrium has
been reached under these conditions.
Using a 25MHz, 18pF quartz crystal.
NOTE 1: Please refer to the Phase Noise plots.
©2016 Integrated Device Technology, Inc.
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843252-45 Datasheet
?
Typical Phase Noise at 125MHz
Ethernet Filter
Raw Phase Noise Data
?
?
Noise Power dBc
Hz
125MHz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.56ps (typical)
Phase Noise Result by adding
an Ethernet filter to raw data
Offset Frequency (Hz)
?
Typical Phase Noise at 156.25MHz
156.25MHz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.54ps (typical)
Raw Phase Noise Data
?
?
Noise Power dBc
Hz
Ethernet Filter
Phase Noise Result by adding
an Ethernet filter to raw data
Offset Frequency (Hz)
©2016 Integrated Device Technology, Inc.
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843252-45 Datasheet
Parameter Measurement Information
2V
Phase Noise Plot
Noise Power
2V
VCC,
VCCOA,
VCCA
VCCOB
Phase Noise Mask
f1
Offset Frequency
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
-1.3V± 0.165V
3.3V LVPECL Output Load AC Test Circuit
RMS Phase Jitter
nQA, nQB
nQA, nQB
QA, QB
QA, QB
Output Rise/Fall Time
Output Duty Cycle/Pulse Width/Period
Application Information
©2016 Integrated Device Technology, Inc.
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843252-45 Datasheet
Recommendations for Unused Input Pins
Inputs:
Outputs:
LVCMOS Control Pins
LVPECL Outputs
All control pins have internal pullups; additional resistance is not
required but can be added for additional protection. A 1k resistor
can be used.
All unused LVPECL outputs can be left floating. We recommend
that there is no trace attached. Both sides of the differential output
pair should either be left floating or terminated.
Power Supply Filtering Technique
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The 843252-45
provides separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC, VCCA, VCCOA, and
VCCOB should be individually connected to the power supply plane
through vias, and 0.01µF bypass capacitors should be used for
each pin. Figure 1 illustrates this for a generic VCC pin and also
shows that VCCA requires that an additional 10 resistor along with
a 10F bypass capacitor be connected to the VCCA pin.
3.3V
VCC
0.01μF
VCCA
0.01μF
10μF
Figure 1. Power Supply Filtering
Crystal Input Interface
The 843252-45 has been characterized with 18pF parallel
resonant crystals. The capacitor values, C1 and C2, shown in
Figure 2 below were determined using a 25MHz, 18pF parallel
resonant crystal and were chosen to minimize the ppm error. The
optimum C1 and C2 values can be slightly adjusted for different
board layouts.
XTAL_IN
C1
27pF
X1
18pF Parallel Crystal
XTAL_OUT
C2
27pF
Figure 2. Crystal Input Interface
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843252-45 Datasheet
LVCMOS to XTAL Interface
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure 3. The XTAL_OUT pin can be left floating. The
input edge rate can be as slow as 10ns. For LVCMOS inputs, it is
recommended that the amplitude be reduced from full swing to half
swing in order to prevent signal interference with the power rail and
to reduce noise. This configuration requires that the output
VCC
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination
at the crystal input will attenuate the signal in half. This can be
done in one of two ways. First, R1 and R2 in parallel should equal
the transmission line impedance. For most 50 applications, R1
and R2 can be 100. This can also be accomplished by removing
R1 and making R2 50.
VCC
R1
Ro
Rs
0.1µf
50Ω
XTAL_IN
Zo = Ro + Rs
R2
XTAL_OUT
Figure 3. General Diagram for LVCMOS Driver to XTAL Input Interface
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination for
LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
transmission lines. Matched impedance techniques should be
used to maximize operating frequency and minimize signal
distortion. Figures 4A and 4B show two different layouts which are
recommended only as guidelines. Other suitable clock layouts may
exist and it would be recommended that the board designers
simulate to guarantee compatibility across all printed circuit and
clock component process variations.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must be
used for functionality. These outputs are designed to drive 50
R3
125
3.3V
R4
125
3.3V
3.3V
Zo = 50
+
_
Input
Zo = 50
R1
84
Figure 4A. 3.3V LVPECL Output Termination
©2016 Integrated Device Technology, Inc.
R2
84
Figure 4B. 3.3V LVPECL Output Termination
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843252-45 Datasheet
Schematic Example
Figure 5 shows an example of 843252-45 application schematic.
In this example, the device is operated at VCC = 3.3V. The 18pF
parallel resonant 25MHz crystal is used. The C1 = 27pF and C2 =
27pF are recommended for frequency accuracy. For different
board layouts, the C1 and C2 may be slightly adjusted for
optimizing frequency accuracy. Two examples of LVPECL
terminations are shown in this schematic. Additional termination
approaches are shown in the LVPECL Termination Application
Note.
3.3V
R1
133
Zo = 50 Ohm
R2
133
QA
TL1
+
Zo = 50 Ohm
nQA
U1
-
TL2
CLK_ENB
CLK_ENA
VCCO_A
0.1u
C4
VCC
VCC
1
2
3
4
5
6
7
8
CLK_EN_A
VEE
QA
nQA
VCCOA
nc
VCCA
VCC
CLK_EN_B
VEE
QB
nQB
VCCO_B
XTAL_IN
XTAL_OUT
VEE
16
15
14
13
12
11
10
9
R3
82.5
QB
nQB
R4
82.5
VCCO_B
0.1u
C7
Zo = 50 Ohm
R5
VCCA
10
C5
0.1u
+
C3
0.1u
Zo = 50 Ohm
C6
10u
C1
R7
50
27pF
VCC=3.3V
X1 25MHz
18pF
VCCO_A=3.3V
Logic Input Pin Examples
Set Logic
Input to
'1'
VCC
RU1
1K
VCCO_B=3.3V
C2
Set Logic
Input to
'0'
VCC
R8
50
Optional
LVPECL
Y-Termination
R9
50
27pF
RU2
Not Install
To Logic
Input
pins
RD1
Not Install
To Logic
Input
pins
RD2
1K
Figure 5. 843252-45 Schematic Example
©2016 Integrated Device Technology, Inc.
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843252-45 Datasheet
Power Considerations
This section provides information on power dissipation and junction temperature for the 843252-45.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the 843252-45 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 75mA = 259.9mW
•
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power_MAX (3.3V, with all outputs switching) = 259.9mW + 60mW = 319.9mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 92.4°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.320W * 92.4°C/W = 99.6°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (multi-layer).
Table 7. Thermal Resistance JA for 16 Lead TSSOP, Forced Convection
JA vs. Air Flow
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
92.4°C/W
88.0°C/W
85.9°C/W
3. Calculations and Equations.
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843252-45 Datasheet
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 6.
VCCO
Q1
VOUT
RL
50Ω
VCCO - 2V
Figure 6. LVPECL Driver Circuit and Termination
To calculate worst case power dissipation into the load, use the following equations which assume a 50 load, and a termination voltage
of VCCO – 2V.
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V
(VCCO_MAX – VOH_MAX) = 0.9V
•
For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.7V
(VCCO_MAX – VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOH_MAX) = [(2V – (VCCO_MAX – VOH_MAX))/RL] * (VCCO_MAX – VOH_MAX) =
[(2V – 0.9V)/50] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOL_MAX) = [(2V – (VCCO_MAX – VOL_MAX))/RL] * (VCCO_MAX – VOL_MAX) =
[(2V – 1.7V)/50] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
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Reliability Information
Table 8. JA vs. Air Flow Table for a 16 Lead TSSOP
JA vs. Air Flow
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
92.4°C/W
88.0°C/W
85.9°C/W
Transistor Count
The transistor count for 843252-45 is: 2039
Package Outline and Package Dimensions
Package Outline - G Suffix for 16-Lead TSSOP
Table 9. Package Dimensions for 16 Lead TSSOP
All Dimensions in Millimeters
Symbol
Minimum
Maximum
N
16
A
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
4.90
5.10
E
6.40 Basic
E1
4.30
4.50
e
0.65 Basic
L
0.45
0.75
0°
8°
aaa
0.10
Reference Document: JEDEC Publication 95, MO-153
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843252-45 Datasheet
Ordering Information
Table 10. Ordering Information
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
843252AG-45LF
3252A45L
“Lead-Free” 16 Lead TSSOP
Tube
0C to 70C
843252AG-45LFT
3252A45L
“Lead-Free” 16 Lead TSSOP
Tape & Reel
0C to 70C
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
Revision History Sheet
Rev
A
A
B
Table
Page
Description of Change
T10
13
Ordering Information - removed leaded devices.
Updated data sheet format.
5/28/15
1
Product Discontinuation Notice - Last time buy expires November 2, 2016.
PDN# CQ-15-05
11/5/15
Obsolete datasheet per PDN# CQ-15-05.
Updated datasheet header/footer.
11/7/16
©2016 Integrated Device Technology, Inc.
Date
13
Revision B, November 7, 2016
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