FEMTOCLOCKS™ Crystal-to-LVDS
Frequency Synthesizer
844003BI-01
DATASHEET
General Description
Features
The 844003BI-01 is a 3 differential output LVDS Synthesizer
designed to generate Ethernet reference clock frequencies. Using
a 19.53125MHz or 25MHz, 18pF parallel resonant crystal, the
following frequencies can be generated based on the settings of 4
frequency select pins (DIV_SELA[1:0], DIV_SELB[1:0]): 625MHz,
312.5MHz, 156.25MHz, and 125MHz. The 844003BI-01 has 2
output banks, Bank A with 1 differential LVDS output pair and
Bank B with 2 differential LVDS output pairs.
•
Three differential LVDS output pairs on two banks, Bank A with
one LVDS pair and Bank B with two LVDS output pairs
•
Using a 19.53125MHz or 25MHz crystal, the two output banks
can be independently set for 625MHz, 312.5MHz, 156.25MHz
or 125MHz
•
Selectable crystal oscillator interface or LVCMOS/LVTTL
single-ended input
•
•
VCO range: 490MHz - 680MHz
•
•
•
Full 3.3V supply mode
-40°C to 85°C ambient operating temperature
The two banks have their own dedicated frequency select pins and
can be independently set for the frequencies mentioned above.
The 844003BI-01 uses IDT’s 3rd generation low phase noise VCO
technology and can achieve 1ps or lower typical rms phase jitter,
easily meeting Ethernet jitter requirements. The 844003BI-01 is
packaged in a small 24-pin TSSOP package.
RMS phase jitter @ 156.25MHz (1.875MHz – 20MHz):
0.56ps (typical)
Available in lead-free (RoHS 6) package
Pin Assignment
DIV_SELB0
VCO_SEL
MR
VDDO_A
QA0
nQA0
OEB
OEA
FB_DIV
VDDA
VDD
DIV_SELA0
Block Diagram
OEA
24
23
22
21
20
19
18
17
16
15
14
13
DIV_SELB1
VDDO_B
QB0
nQB0
QB1
nQB1
XTAL_SEL
REF_CLK
XTAL_IN
XTAL_OUT
GND
DIV_SELA1
24-Lead TSSOP, E-Pad
4.40mm x 7.8mm x 0.925mm
package body
G Package
Pullup
DIV_SELA[1:0] Pullup
VCO_SEL Pullup
REF_CLK
1
2
3
4
5
6
7
8
9
10
11
12
QA0
Pulldown
0
XTAL_IN
OSC
1
0
Phase
Detector
VCO
00
01
10
11
÷1
÷2
÷3
÷4 (default)
00
01
10
11
÷2
÷4
÷5
÷8 (default)
QA0
1
XTAL_OUT
XTAL_SEL Pullup
QB0
FB_DIV
0 = ÷25 (default)
1 = ÷32
FB_DIV Pulldown
DIV_SELB[1:0]
QB0
QB1
QB1
Pullup
MR Pulldown
OEB Pullup
844003BI-01 Rev B 12/18/14
1
©2014 Integrated Device Technology, Inc.
844003BI-01 DATA SHEET
Table 1. Pin Descriptions
Number
Name
1,
24
DIV_SELB0,
DIV_SELB1
2
VCO_SEL
Type
Input
Input
Description
Pullup
Division select pin for Bank B. Default = HIGH.
LVCMOS/LVTTL interface levels. See Table 3B.
Pullup
VCO select pin. When Low, the PLL is bypassed and the crystal reference or
REF_CLK (depending on XTAL_SEL setting) are passed directly to the output
dividers. Has an internal pullup resistor so the PLL is not bypassed by default.
LVCMOS/LVTTL interface levels.
Pulldown
Active HIGH Master Reset. When logic HIGH, the internal dividers are reset
causing the true outputs Qx to go low and the inverted outputs nQx to go high.
When logic LOW, the internal dividers and the outputs are enabled. Has an
internal pulldown resistor so the power-up default state of outputs and dividers
are enabled. LVCMOS/LVTTL interface levels.
3
MR
Input
4
VDDO_A
Power
Output supply pin for Bank A outputs.
5, 6
QA0, nQA0
Output
Differential output pair. LVDS interface levels.
7
OEB
Input
Pullup
Output enable Bank B. Active High outputs are enable. When logic HIGH, the
output pairs on Bank B are enabled. When logic LOW, the output pairs are in a
high impedance state. Has an internal pullup resistor so the default power-up
state of outputs are enabled. LVCMOS/LVTTL interface levels. See Table 3E.
8
OEA
Input
Pullup
Output enable Bank A. Active High output enable. When logic HIGH, the output
pair in Bank A is enabled. When logic LOW, the output pair is in a high
impedance state. Has an internal pullup resistor so the default power-up state of
output is enabled. LVCMOS/LVTTL interface levels. See Table 3D.
9
FB_DIV
Input
Pulldown
Feedback divide select. When Low (default), the feedback divider is set for ÷25.
When HIGH, the feedback divider is set for ÷32. See Table 3C.
LVCMOS/LVTTL interface levels.
10
VDDA
Power
Analog supply pin.
11
VDD
Power
Core supply pin.
12,
13
DIV_SELA0,
DIV_SELA1
Input
14
GND
Power
Power supply ground.
15,
16
XTAL_OUT,
XTAL_IN
Input
Parallel resonant crystal interface. XTAL_OUT is the output, XTAL_IN is the
input. XTAL_IN is also the overdrive pin if you want to overdrive the crystal circuit
with a single-ended reference clock.
17
REF_CLK
Input
Pulldown
Single-ended reference clock input. Has an internal pulldown resistor to pull to
low state by default. Can leave floating if using the crystal interface.
LVCMOS/LVTTL interface levels.
18
XTAL_SEL
Input
Pullup
Crystal select pin. Selects between the single-ended REF_CLK or crystal
interface. Has an internal pullup resistor so the crystal interface is selected by
default. LVCMOS/LVTTL interface levels.
19, 20
nQB1, QB1
Output
21, 22
nQB0, QB0
Output
Differential output pair. LVDS interface levels.
23
VDDO_B
Power
Output supply pin for Bank B outputs.
Pullup
Division select pin for Bank A. Default = HIGH. See Table 3A.
LVCMOS/LVTTL interface levels.
Differential output pair. LVDS interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
2
Rev B 12/18/14
844003BI-01 DATA SHEET
Table 2. Pin Characteristics
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
k
RPULLDOWN
Input Pulldown Resistor
51
k
Function Tables
Table 3A. Output Bank A Configuration
Select Function Table
Inputs
Outputs
Table 3D. OEA Select Function Table
Input
Outputs
DIV_SELA1
DIV_SELA0
QA0/ nQA0
OEA
QA0/ nQA0
0
0
÷1
0
High Impedance
0
1
÷2
1
Active (default)
1
0
÷3
1
1
÷4 (default)
Table 3C. Feedback Divider Configuration
Select Function Table
Input
FB_DIV
Feedback Divide
0
÷25 (default)
1
÷32
Table 3E. OEB Select Function Table
Input
Outputs
OEB
QB[0:1]/ nQB[0:1]
0
High Impedance
1
Active (default)
Table 3B. Output Bank B Configuration
Select Function Table
Inputs
Outputs
DIV_SELB1
DIV_SELB0
QB[0:1]/ nQB[0:1]
0
0
÷2
0
1
÷4
1
0
÷5
1
1
÷8 (default)
Rev B 12/18/14
3
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
Table 3F. Bank A Frequency Table
Inputs
Feedback
Divider
Bank A
Output Divider
M/N
Multiplication
Factor
QA0/ nQA0
Output Frequency
(MHz)
Crystal Frequency
(MHz)
FB_DIV
DIV_SELA1
DIV_SELA0
25
0
0
0
25
1
25
625
25
0
0
1
25
2
12.5
312.5
20
0
0
1
25
2
12.500
250
22.5
0
1
0
25
3
8.333
187.5
25
0
1
1
25
4
6.25
156.25
24
0
1
1
25
4
6.25
150
20
0
1
1
25
4
6.25
125
19.44
1
0
0
32
1
32
622.08
19.44
1
0
1
32
2
16
311.04
15.625
1
0
1
32
2
16
250
18.75
1
1
0
32
3
10.667
200
19.44
1
1
1
32
4
8
155.52
18.75
1
1
1
32
4
8
150
15.625
1
1
1
32
4
8
125
Feedback
Divider
Bank B
Output Divider
M/N
Multiplication
Factor
QBx/ nQBx
Output Frequency
(MHz)
Table 3G. Bank B Frequency Table
Inputs
Crystal Frequency
(MHz)
FB_DIV
DIV_SELB1
DIV_SELB0
25
0
0
0
25
2
12.5
312.5
20
0
0
0
25
2
12.5
250
25
0
0
1
25
4
6.25
156.25
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
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Rev B 12/18/14
844003BI-01 DATA SHEET
Inputs
Feedback
Divider
Bank B
Output Divider
M/N
Multiplication
Factor
QBx/ nQBx
Output Frequency
(MHz)
Crystal Frequency
(MHz)
FB_DIV
DIV_SELB1
DIV_SELB0
24
0
0
1
25
4
6.25
150
20
0
0
1
25
4
6.25
125
25
0
1
0
25
5
5
125
25
0
1
1
25
8
3.125
78.125
24
0
1
1
25
8
3.125
75
20
0
1
1
25
8
3.125
62.5
19.44
1
0
0
32
2
16
311.04
15.625
1
0
0
32
2
16
250
19.44
1
0
1
32
4
8
155.52
18.75
1
0
1
32
4
8
150
15.625
1
0
1
32
4
8
125
15.625
1
1
0
32
5
6.4
100
19.44
1
1
1
32
8
4
77.76
18.75
1
1
1
32
8
4
75
15.625
1
1
1
32
8
4
62.5
Rev B 12/18/14
5
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
Item
Rating
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5V
Outputs, IO
Continuous Current
Surge Current
10mA
15mA
Package Thermal Impedance, JA
37C/W (0 mps)
Storage Temperature, TSTG
-65C to 150C
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VDD = VDDA = VDDO_A = VDDO_B = 3.3V ± 5%, TA = -40°C to 85°C
Symbol
Parameter
VDD
VDDA
Test Conditions
Minimum
Typical
Maximum
Units
Positive Supply Voltage
3.135
3.3
3.465
V
Analog Supply Voltage
3.135
3.3
3.465
V
VDDO_A, VDDO_B Output Supply Voltage
3.135
3.3
3.465
V
IDD
Power Supply Current
135
mA
IDDA
Analog Supply Current
12
mA
IDDO_A + IDDO_B
Output Supply Current
80
mA
Table 4B. LVCMOS/LVTTL DC Characteristics, VDD = VDDA = VDDO_A = VDDO_B = 3.3V ± 5%, TA = -40°C to 85°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input
High Current
IIL
Input
Low Current
Test Conditions
Minimum
Typical
Maximum
Units
2
VDD + 0.3
V
-0.3
0.8
V
REF_CLK, MR, FB_DIV
VDD = VIN = 3.465V
150
µA
DIV_SELA[0:1], OEA,
OEB, DIV_SELB[0:1],
VCO_SEL, XTAL_SEL
VDD = VIN = 3.465V
5
µA
REF_CLK, MR, FB_DIV
VDD = 3.465V, VIN = 0V
-5
µA
DIV_SELA[0:1], OEA,
OEB, DIV_SELB[0:1],
VCO_SEL, XTAL_SEL
VDD = 3.465V, VIN = 0V
-150
µA
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
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Rev B 12/18/14
844003BI-01 DATA SHEET
Table 4C. LVDS DC Characteristics, VDD = VDDA = VDDO_A = VDDO_B = 3.3V ± 5%, TA = -40°C to 85°C
Symbol
Parameter
VOD
Differential Output Voltage
VOD
VOD Magnitude Change
VOS
Offset Voltage
VOS
VOS Magnitude Change
Test Conditions
Minimum
Typical
250
1.25
1.33
Maximum
Units
450
mV
50
mV
1.41
V
50
mV
Table 5. Crystal Characteristics
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical
Maximum
Units
Fundamental
FB_DIV = ÷25
19.6
27.2
MHz
FB_DIV = ÷32
15.313
21.25
MHz
Equivalent Series Resistance (ESR)
50
Shunt Capacitance
7
pF
Drive Level
1
mW
Frequency
Rev B 12/18/14
7
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
AC Electrical Characteristics
Table 6. AC Characteristics, VDD = VDDA = VDDO_A = VDDO_B = 3.3V ± 5%, TA = -40°C to 85°C
Parameter
fOUT
Symbol
Output Frequency Range
490
Maximum
Units
680
MHz
Output Divider = ÷2
245
340
MHz
Output Divider = ÷3
163.33
226.67
MHz
Output Divider = ÷4
122.5
170
MHz
Output Divider = ÷5
98
136
MHz
Output Divider = ÷8
61.25
MHz
ps
Outputs @ Same Frequency
75
ps
NOTE 2, 3, 4
Outputs @ Different Frequencies
170
ps
625MHz (1.875MHz – 20MHz)
0.53
ps
RMS Phase Jitter (Random);
NOTE 5
312.5MHz (1.875MHz – 20MHz):
0.53
ps
156.25MHz (1.875MHz – 20MHz)
0.56
ps
125MHz (1.875MHz – 20MHz)
0.58
ps
tsk(o)
Output Skew
odc
Output Divider = ÷1
Typical
85
Bank Skew; NOTE 1
tR / tF
Minimum
33
tsk(b)
tjit(Ø)
Test Conditions
NOTE 2, 3
Output Rise/Fall Time
Output Duty Cycle
20% to 80%
200
450
ps
Output Divider ÷1
47
53
%
Output Divider = ÷1
43
57
%
NOTE 1: Defined as skew within a bank of outputs at the same voltages and with equal load conditions.
NOTE 2: Defined as skew between outputs at the same supply voltages and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 4: Characterized using output dividers 1, 2, 4, 8.
NOTE 5: Refer to the Phase Noise Plots.
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
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Rev B 12/18/14
844003BI-01 DATA SHEET
0
-10
156.25MHz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.56ps (typical)
-20
10Gb Ethernet Filter
-30
-40
-50
-60
-70
-80
-90
-100
-110
➝
Noise Power dBc
Hz
➝
Typical Phase Noise at 156.25MHz
Raw Phase Noise Data
-120
-130
➝
-140
-150
Phase Noise Result by adding a
10Gb Ethernet filter to raw data
-160
-170
-180
-190
1k
Typical Phase Noise at 625MHz
0
-10
-20
10k
100k
1M
10M
Offset Frequency (Hz)
➝
100
625MHz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.53ps (typical)
10Gb Ethernet Filter
-30
-40
-50
-70
➝
Noise Power dBc
Hz
-60
-80
-90
Raw Phase Noise Data
-100
-110
-120
➝
-130
-140
-150
Phase Noise Result by adding a
10Gb Ethernet filter to raw data
-160
-170
-180
-190
100
1k
10k
100k
1M
10M
Offset Frequency (Hz)
Rev B 12/18/14
9
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
Parameter Measurement Information
Noise Power
Phase Noise Plot
VDD,
VDDA,
VDDO_A,
VDDO_B
Phase Noise Mask
GND
f1
Offset Frequency
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
3.3V LVDS Output Load AC Test Circuit
RMS Phase Jitter
nQx
nQB0
Qx
QB0
nQy
nQB1
Qy
QB1
tsk(b)
Output Skew
Bank Skew
nQA0,
nQB0, nQB1
nQA0,
nQB0, nQB1
QA0,
QB0, QB1
80%
80%
VOD
QA0,
QB0, QB1
20%
20%
tR
Output Duty Cycle/Pulse Width/Period
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
tF
Output Rise/Fall Time
10
Rev B 12/18/14
844003BI-01 DATA SHEET
Parameter Measurement Information, continued
Offset Voltage Setup
Differential Output Voltage Setup
Application Information
Power Supply Filtering Technique
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter perform- ance,
power supply isolation is required. The 844003BI-01 provides
separate power supplies to isolate any high switching noise from the
outputs to the internal PLL. VDD, VDDA, VDDO_A and VDDO_B should
be individually connected to the power supply plane through vias,
and 0.01µF bypass capacitors should be used for each pin. Figure 1
illustrates this for a generic VDD pin and also shows that VDDA
requires that an additional 10 resistor along with a 10F bypass
capacitor be connected to the VDDA pin.
Rev B 12/18/14
3.3V
VDD
.01µF
10Ω
.01µF
10µF
VDDA
Figure 1. Power Supply Filtering
11
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
Crystal Input Interface
The 844003BI-01 has been characterized with 18pF parallel
resonant crystals. The capacitor values shown in Figure 2 below
were determined using a 19.53125MHz or 25MHz, 18pF parallel
resonant crystal and were chosen to minimize the ppm error.
XTAL_IN
C1
22pF
X1
18pF Parallel Crystal
XTAL_OUT
C2
22pF
Figure 2. Crystal Input Interface
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
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Rev B 12/18/14
844003BI-01 DATA SHEET
Overdriving the XTAL Interface
The XTAL_IN input can be overdriven by an LVCMOS driver or by one
side of a differential driver through an AC coupling capacitor. The
XTAL_OUT pin can be left floating. The amplitude of the input signal
should be between 500mV and 1.8V and the slew rate should not be
less than 0.2V/ns. For 3.3V LVCMOS inputs, the amplitude must be
reduced from full swing to at least half the swing in order to prevent
signal interference with the power rail and to reduce internal noise.
Figure 3A shows an example of the interface diagram for a high
speed 3.3V LVCMOS driver. This configuration requires that the sum
of the output impedance of the driver (Ro) and the series resistance
(Rs) equals the transmission line impedance. In addition, matched
termination at the crystal input will attenuate the signal in half. This
VDD
can be done in one of two ways. First, R1 and R2 in parallel should
equal the transmission line impedance. For most 50 applications,
R1 and R2 can be 100. This can also be accomplished by removing
R1 and changing R2 to 50. The values of the resistors can be
increased to reduce the loading for a slower and weaker LVCMOS
driver. Figure 3A shows an example of the interface diagram for an
LVPECL driver. This is a standard LVPECL termination with one side
of the driver feeding the XTAL_IN input. It is recommended that all
components in the schematics be placed in the layout. Though some
components might not be used, they can be utilized for debugging
purposes. The datasheet specifications are characterized and
guaranteed by using a quartz crystal as the input.
XTAL_OUT
R1
100
Zo = 50 ohms
Ro
C1
Rs
XTAL_IN
R2
100
Zo = Ro + Rs
.1uf
LVCMOS Driver
Figure 3A. General Diagram for LVCMOS Driver to XTAL
Input Interface
XTAL_OUT
C2
Zo = 50 ohms
XTAL_IN
.1uf
Zo = 50 ohms
LVPECL Driver
R1
50
R2
50
R3
50
Figure 3A. General Diagram for LVPECL Driver to XTAL Input Interface
Rev B 12/18/14
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FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
Recommendations for Unused Input and Output Pins
Inputs:
Outputs:
Crystal Inputs
LVDS Outputs
For applications not requiring the use of the crystal oscillator input,
both XTAL_IN and XTAL_OUT can be left floating. Though not
required, but for additional protection, a 1k resistor can be tied from
XTAL_IN to ground.
All unused LVDS output pairs can be either left floating or terminated
with 100 across. If they are left floating, we recommend that there
is no trace attached.
REF_CLK Input
For applications not requiring the use of the reference clock,
it can be left floating. Though not required, but for additional
protection, a 1k resistor can be tied from the REF_CLK to ground.
LVCMOS Control Pins
All control pins have internal pullups or pulldowns; additional
resistance is not required but can be added for additional protection.
A 1k resistor can be used.
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
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844003BI-01 DATA SHEET
LVDS Driver Termination
For a general LVDS interface, the recommended value for the
termination impedance (ZT) is between 90 and 132. The actual
value should be selected to match the differential impedance (Z0) of
your transmission line. A typical point-to-point LVDS design uses a
100 parallel resistor at the receiver and a 100 differential
transmission-line environment. In order to avoid any
transmission-line reflection issues, the components should be
surface mounted and must be placed as close to the receiver as
possible. IDT offers a full line of LVDS compliant devices with two
types of output structures: current source and voltage source. The
standard termination schematic as shown in Figure 4A can be used
LVDS
Driver
with either type of output structure. Figure 4B, which can also be
used with both output types, is an optional termination with center tap
capacitance to help filter common mode noise. The capacitor value
should be approximately 50pF. If using a non-standard termination, it
is recommended to contact IDT and confirm if the output structure is
current source or voltage source type. In addition, since these
outputs are LVDS compatible, the input receiver’s amplitude and
common-mode input range should be verified for compatibility with
the output.
ZO ZT
LVDS
Receiver
ZT
Figure 4AStandard LVDS Termination
LVDS
Driver
ZT
2
ZO ZT
C
ZT
2
LVDS
Receiver
Figure 4BOptional LVDS Termination
Rev B 12/18/14
15
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
EPAD Thermal Release Path
In order to maximize both the removal of heat from the package and
the electrical performance, a land pattern must be incorporated on
the Printed Circuit Board (PCB) within the footprint of the package
corresponding to the exposed metal pad or exposed heat slug on the
package, as shown in Figure 5. The solderable area on the PCB, as
defined by the solder mask, should be at least the same size/shape
as the exposed pad/slug area on the package to maximize the
thermal/electrical performance. Sufficient clearance should be
designed on the PCB between the outer edges of the land pattern
and the inner edges of pad pattern for the leads to avoid any shorts.
and dependent upon the package power dissipation as well as
electrical conductivity requirements. Thus, thermal and electrical
analysis and/or testing are recommended to determine the minimum
number needed. Maximum thermal and electrical performance is
achieved when an array of vias is incorporated in the land pattern. It
is recommended to use as many vias connected to ground as
possible. It is also recommended that the via diameter should be 12
to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is
desirable to avoid any solder wicking inside the via during the
soldering process which may result in voids in solder between the
exposed pad/slug and the thermal land. Precautions should be taken
to eliminate any solder voids between the exposed heat slug and the
land pattern. Note: These recommendations are to be used as a
guideline only. For further information, refer to the Application Note
on the Surface Mount Assembly of Amkor’s Thermally/Electrically
Enhance Leadfame Base Package, Amkor Technology.
While the land pattern on the PCB provides a means of heat transfer
and electrical grounding from the package to the board through a
solder joint, thermal vias are necessary to effectively conduct from
the surface of the PCB to the ground plane(s). The land pattern must
be connected to ground through these vias. The vias act as “heat
pipes”. The number of vias (i.e. “heat pipes”) are application specific
SOLDER
PIN
PIN PAD
EXPOSED HEAT SLUG
GROUND PLANE
THERMAL VIA
SOLDER
PIN
LAND PATTERN
(GROUND PAD)
SOLDER
PIN PAD
Figure 5. Assembly for Exposed Pad Thermal Release Path - Side View (drawing not to scale)
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
16
Rev B 12/18/14
844003BI-01 DATA SHEET
Package Outline and Package Dimensions
Package Outline - G Suffix for 24 Lead TSSOP, E-Pad
Table 9. Package Dimensions
Symbol
N
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
P
P1
bbb
Rev B 12/18/14
17
All Dimensions in Millimeters
Minimum
Nominal
Maximum
24
1.10
0.05
0.15
0.85
0.90
0.95
0.19
0.30
0.19
0.22
0.25
0.09
0.20
0.09
0.127
0.16
7.70
7.90
6.40 Basic
4.30
4.40
4.50
0.65 Basic
0.50
0.60
0.70
5.0
5.5
3.0
3.2
0°
8°
0.076
0.10
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
Power Considerations
This section provides information on power dissipation and junction temperature for the 844003BI-01.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the 844003BI-01 is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (135mA + 12mA) = 509.36mW
•
Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 80mA = 277.20mW
Total Power_MAX = 509.36mW + 277.20mW = 786.56mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The
maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming a moderate air
flow of 1 meter per second and a multi-layer board, the appropriate value is 31°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.787W * 31°C/W = 109.4°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board.
Table 7. Thermal Resistance JA for 24 Lead TSSOP, E-Pad, Forced Convection
JA by Velocity
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
0
1
2
37°C/W
31°C/W
30°C/W
18
Rev B 12/18/14
844003BI-01 DATA SHEET
Reliability Information
Table 8. JA vs. Air Flow Table for a 24 Lead TSSOP, E-Pad
JA by Velocity
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2
37°C/W
31°C/W
30°C/W
Transistor Count
The transistor count for 844003BI-01 is: 3537
Rev B 12/18/14
19
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
844003BI-01 DATA SHEET
Ordering Information
Table 10. Ordering Information
Part/Order Number
844003BGI-01LF
844003BGI-01LFT
Marking
ICS44003BI01L
ICS44003BI01L
Package
“Lead-Free” 24 Lead TSSOP, E-Pad
“Lead-Free” 24 Lead TSSOP, E-Pad
Shipping Packaging
Tube
2500 Tape & Reel
Temperature
-40C to 85C
-40C to 85C
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
20
Rev B 12/18/14
844003BI-01 DATA SHEET
Revision History Sheet
Rev
Table
Page
T1
T5
T6
2
7
8
14
Pin Characteristics - added pin numbers 17– 23 to the table.
Crystal Characteristics - moved 15.315MHz min. from ESR row to Frequency ÷32 row.
AC Characteristics - added test conditions to fOUT rows and filled in Units column.
Updated Thermal Release Path section.
08/20/08
T10
18
Ordering Information - removed leaded devices PDN CQ-13-02.
Updated datasheet format
12/18/14
A
B
Rev B 12/18/14
Description of Change
Date
21
FEMTOCLOCKS™ CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER
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