BA3259HFP

Secondary LDO Regulators for Local Power Supplies Dual-output Secondary Fixed/Variable Output LDO Regulators for Local Power Supplies BA3259HFP,BA30E00WHFP No.09026EAT02 Description The BA3259HFP and BA30E00WHFP are 2-output, low-saturation regulators. These units have both a 3.3 V fixed output as well as a variable output with a voltage accuracy of ±2%, and incorporate an overcurrent protection circuit to prevent IC destruction due to output shorting along with a TSD (Thermal Shut Down) circuit to protect the IC from thermal destruction caused by overloading. Features 1) Output voltage accuracy: ± 2%. 2) Reference voltage accuracy: ± 2% 3) Output current capacity: 1 A (BA3259HFP), 0.6 A (BA30E00WHFP) 4) Ceramic capacitor can be used to prevent output oscillation (BA3259HFP) 6) Low dissipation with two voltage input supported (BA30E00WHFP) 7) Built-in thermal shutdown circuit 8) Built-in overcurrent protection circuit Applications Available to all commercial devices, such as FPD, TV, and PC sets besides DSP power supplies for DVD and CD sets. Product Lineup Part Number BA3259HFP BA30E00WHFP Output voltage Vo1 3.3 V 3.3 V Output voltage Vo2 0.8 V to 3.3 V 0.8 V to 3.3 V Output Current Io1 1 A max 0.6 A max Output Current Io2 1 A max 0.6 A max Package HRP5 HRP7 Absolute Maximum Ratings BA3259HFP Parameter Applied voltage Power dissipation Operating temperature range Ambient storage temperature range Maximum junction temperature Symbol Vcc Pd Topr Tstg Tjmax Limit 15 *1 2300 *2 BA30E00WHFP Units V mW °C °C °C Parameter Applied voltage Power dissipation Operating temperature range Ambient storage temperature range Maximum junction temperature Symbol Vcc Pd Topr Tstg Tjmax Limit 18 *1 2300 *2 Units V mW °C °C °C 0 to 85 −55 to 150 150 −25 to 105 −55 to 150 150 *1 Must not exceed Pd. *2 Derated at 18.4 mW/°C at Ta>25°C when mounted on a glass epoxy board (70 mm  70 mm  1.6 mm). Recommended Operating Conditions BA3259HFP Parameter Symbol Min. Typ. Max. Unit Input power supply Vcc 4.75 − 14.0 V voltage 3.3 V output current Io1 − − 1 A Variable output current Io2 − − 1 A BA30E00WHFP Parameter Input power supply voltage 1 Input power supply voltage 2 3.3 V output current Variable output current Symbol Vcc1 Vcc2 Io1 Io2 Min. 4.1 2.8 − − Typ. Max. Unit − − − − 16.0 Vcc1 0.6 0.6 V V A A www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/8 2009.04 - Rev.A BA3259HFP,BA30E00WHFP Electrical Characteristics BA3259HFP (Unless otherwise specified, Ta=25°C, Vcc=5 V, R1=R2=5 k) Parameter Symbol Min. Typ. Max. Circuit current IB − 3 5 [3.3 V Output Block] Output voltage 1 Vo1 3.234 3.300 3.366 Minimum I/O voltage difference 1 ∆Vd1 − 1.1 1.3 Current capability 1 Io1 1.0 − − Ripple rejection 1 R.R.1 46 52 − Input stability 1 ∆VLINE1 − 5 15 Load stability 1 ∆VLOAD1 − 5 20 Temperature coefficient of output Tcvo1 − ±0.01 − voltage 1 *3 [Variable output] Reference voltage VREF 0.784 0.800 0.816 Minimum I/O voltage difference 2 ∆Vd2 − 1.1 1.3 Current capability 2 Io2 1.0 − − Ripple rejection 2 R.R.2 46 52 − Input stability 2 ∆VLINE2 − 5 15 Load stability 2 ∆VLOAD2 − 5 20 Temperature coefficient of output Tcvo2 − ±0.01 − *3 voltage 2 Variable pin current IADJ − 0.05 1.0 *3: Operation is guaranteed within these parameters Technical Note Unit mA V V A dB mV mV %/°C V V A dB mV mV %/°C A Conditions Io1=0 mA, Io2=0mA Io1=50mA Io1=1 A, Vcc=3.8V f=120Hz, ein=0.5Vp-p, Io1=5mA Vcc=4.75→14V, Io1=5mA Io1=5mA→1 A Io1=5mA,Tj=0°C to 85°C Io2=50 mA Io2=1 A f=120Hz, ein=0.5 Vp-p, Io2=5mA Vcc=4.75→14V, Io2=5mA Io2=5 mA→1 A Io2=5mA,Tj=0°C to 85°C VADJ=0.85V BA30E00WHFP (Unless otherwise specified, Ta=25°C, Vcc1=Vcc2=VEN=5 V, R1=50 k, R2=62.5 k) Parameter Symbol Min. Typ. Max. Unit Conditions Bias current Ib − 0.7 1.6 mA Io1=0mA, Io2=0mA Standby current IST − 0 10 A VEN=GND EN pin on voltage VON 2.0 − − V Active mode EN pin off voltage VOFF − − 0.8 V Standby mode EN pin current IEN − 50 100 A VEN=3.3V [3.3 V output] Output voltage 1 Vo1 3.234 3.300 3.366 V Io1=50mA Minimum I/O voltage difference 1 ∆Vd1 − 0.30 0.60 V Io1=300mA,Vcc=3.135V Output current capacity 1 Io1 0.6 − − A Ripple rejection 1 R.R.1 − 68 − dB f=120Hz, ein=1Vp-p,Io1=100mA Input stability 1 Reg.I1 − 5 30 mV Vcc1=4.1→16V,Io1=50mA Load stability 1-1 Reg.L1-1 − 30 90 mV Io1=0 mA→0.6A Load stability 1-2 Reg.L1-2 − 30 90 mV Vcc1=3.7V,Io1=0→0.4A Temperature coefficient of output Tcvo1 − ±0.01 − %/°C Io1=5mA,Tj=0°C to 125°C *3 voltage 1 [Variable output] (at 1.8 V) Reference voltage VADJ 0.784 0.800 0.816 V Io2=50 mA At Io2=3.3V Minimum I/O voltage difference 2 ∆Vd2 − 0.30 0.60 V Io2=300mA,Vcc1=Vcc2=3.135V Output current capacity 2 Io2 0.6 − − A Ripple rejection 2 R.R.2 − 66 − dB f=120 Hz,ein=1Vp-p,Io2=100mA Input stability 2 Reg.I2 − 5 30 mV Vcc1=Vcc2=4.1V→16V,Io2=50mA Load stability 2 Reg.L2 − 30 90 mV Io2=0mA→0.6A Temperature coefficient of output Tcvo2 − ±0.01 − %/°C Io2=5mA,Tj=0°C to 125°C voltage 2 *3 *3: Operation is guaranteed within these parameters www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/9 2009.04 - Rev.A BA3259HFP,BA30E00WHFP BA3259HFP Electrical Characteristics Curves (Unless otherwise specified, Ta=25°C, Vcc=5 V) 4.0 CIRCUIT CURRENT： Icc［ mA ］ 3.5 Technical Note 5 ADJ PIN CURRENT：IADJ ［µA］ 60 CIRCUIT CURRENT：IB［mA ］ 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 12 14 SUPPLY VOLTAGE：Vcc［V］ 4 50 3 40 2 30 1 20 0 0.0 0.2 0.4 0.6 0.8 1.0 OUTPUT CURRENT：Io1［A］ 10 5 6 7 8 9 10 11 12 13 14 SUPPLY VOLTAGE：Vcc［V］ Fig.1 Circuit Current (with no load) 4.0 Fig.2 Circuit Current vs Load Current Io 1.6 1.4 OUTPUT VOLTAGE：Vo2［V］ 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Fig.3 ADJ Pin Outflow Current 4.0 3.5 OUTPUT VOLTAGE：Vo1［V］ 3.0 2.5 2.0 1.5 1.0 0.5 0.0 3.5 OUTPUT VOLTAGE：Vo1［V］ 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 12 14 SUPPLY VOLTAGE：Vcc［V］ 0 2 4 6 8 10 12 14 0.0 0.5 1.0 1.5 2.0 2.5 SUPPLY VOLTAGE：Vcc［V］ OUTPUT CURRENT：Io1［A］ Fig. 4 Input Stability (3.3 V output with no load) INPUT/OUTPUT VOLTAGE DIFFERENCE ： dVd［ V ］ Fig. 5 Input Stability (Variable output with no load) 1.4 Fig. 6 Load Stability (3.3 V output) 80 RIPPLE REJECTION：R.R.［dB］ 70 60 50 40 R.R.(3.3 V output) R.R.(Variable output :1.5 V) 1.6 1.4 OUTPUT VOLTAGE：Vo2［V］ 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 OUTPUT CURRENT：Io2［A］ 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 30 20 10 0 10 100 1000 10000 OUT PUT CURRENT ： Io1［ A ］ FREQUENCY：f［Hz］ Fig. 7 Load Stability (Variable output: 1.5 V) 3.35 3.34 OUTPUT VOLTAGE：Vo1［V］ 3.33 3.32 3.31 3.30 3.29 3.28 3.27 3.26 3.25 -30 -15 0 15 30 45 60 Fig. 8 I/O Voltage Difference (3.3 V output) (3.3 V output, Io1=0 A  1 A) 1.506 CIRCUIT CURRENT：IB［mA ］ 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 Fig.9 R.R. 1.504 OUTPUT VOLTAGE：Vo2［V］ 1.502 1.500 1.498 1.496 1.494 1.492 1.490 75 -30 -15 0 15 30 45 60 75 -30 -15 0 15 30 45 60 75 TEMPERATURE：Ta［℃］ TEMPERATURE：Ta［℃］ TEMPERATURE：Ta［℃］ Fig. 10 Output Voltage vs Temperature (3.3 V output) Fig. 11 Output Voltage vs Temperature (Variable output: 1.5 V) Fig. 12 Circuit Current vs Temperature www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/9 2009.04 - Rev.A BA3259HFP,BA30E00WHFP Technical Note BA30E00WHFP Electrical Characteristics Curves (Unless otherwise specified, Ta=25°C, Vcc1=Vcc2=5V) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 2 4 6 8 10 12 14 16 18 SUPPLY VOLTAGE：Vcc［V］ 40 ADJ PIN CURRENT：IADJ ［µA］ 0.4 35 CIRCUIT CURRENT：Icc［mA ］ 30 25 20 15 10 5 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 OUTPUT CURRENT：Io［A］ CIRCUIT CURRENT：Icc［mA］ 0.3 0.2 0.1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 ADJ PIN VOLTAGE：VADJ ［V］ Fig.13 Circuit Current (with no load) 4.0 3.5 OUTPUT VOLTAGE：Vo1［V］ Fig. 14 Circuit Current vs Load Current Io (Io=0  600 mA) 1.6 1.4 OUTPUT VOLTAGE：Vo2［V］ OUTPUT VOLTAGE：Vo1 ［V］ Fig. 15 ADJ Pin Source Current 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 12 14 16 18 SUPPLY VOLTAGE：Vcc［V］ 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 2 4 6 8 10 12 14 16 18 SUPPLY VOLTAGE：Vcc［V］ 0.0 0. 2 0.4 0.6 0. 8 1.0 1.2 1.4 1.6 OUTPUT CURRENT：Io1 ［A］ Fig. 16 Input Stability (3.3 V output Io1=600 mA) INPUT/OUTPUT VOLTAGE DIFFERENCE ：dVd ［V］ Fig. 17 Input Stability (Variable output: 1.8 V) 0.5 Fig. 18 Load Stability (3.3 V output) 80 Vo2(Variable output:1.8V) 2.0 1.5 0.4 RIPPLE REJECTION：R.R.［dB］ 70 60 Vo1(3.3V output) OUTPUT VOLTAGE：Vo2［V］ 0.3 50 40 30 20 10 0 1.0 0.2 0.5 0.1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 OUTPUT CURRENT：Io2［A］ 0.0 0. 0 0.1 0.2 0.3 0.4 0.5 0.6 OUTPUT CURRENT：Io ［A ］ 100 1000 FREQUENCY：f［Hz］ 10000 Fig. 19 Load Stability (Variable output: 1.8 V) 3.35 Fig. 20 I/O Voltage Difference (Vcc=3.135 V, 3.3 V output) 1.90 CIRCUIT CURRENT：Icc［mA ］ 1.0 0.9 Fig.21 R.R. (ein=1 Vp-p, Io=100 mA) OUTPUT VOLTAGE：Vo1［V］ OUTPUT VOLTAGE：Vo2［V］ 3.33 1.85 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 3.30 1.80 3.28 1.75 3.25 -25 -10 5 20 35 50 65 80 95 TEMPERATURE：Ta［℃］ 1.70 -25 -10 5 20 35 50 65 80 95 TEMPERATURE：Ta［℃］ 0.0 -25 -10 5 20 35 50 65 80 95 TEMPERATURE：Ta［℃］ Fig. 22 Output Voltage vs Temperature (3.3 V output) Fig. 23 Output Voltage vs Temperature (Variable output: 1.8 V) Fig. 24 Circuit Current vs Temperature (Io=0 mA) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/9 2009.04 - Rev.A BA3259HFP,BA30E00WHFP Block Diagrams / Standard Example Application Circuits VO1 5 3.3 V CO1 1 μF Reference Voltage GND(Fin) Vcc1 Technical Note Current Limit Vcc1 Current Limit Sat. Prevention GND FIN Current Limit Thermal Shutdown VO2 4 GND 3 ADJ 2 Vcc 1 1.5 V CO2 1μF R2 R1 Thermal Shut Down Vcc2 Vcc2 Current Limit Sat. Prevention VR EF V IN CIN 3.3 μF EN 1 Vcc2 1μF 2 Vcc1 3 G ND 1μF 4 Vo1 47μF 5 Vo2 47 μF 6 ADJ R2 7 R1 Fig.25 BA3259HFP Block Diagram Pin No. 1 2 3 4 5 FIN Pin name Vcc ADJ GND Vo2 Vo1 GND Function Power supply pin Variable output voltage detection pin GND pin Variable output pin 3.3 V output pin GND pin Pin No. 1 2 3 4 5 6 7 FIN PIN Vcc1 (3Pin) Vcc2 (2Pin) Vo1 (5Pin) Vo2 (6Pin) 1 2 3 4 5 Fig.26 BA30E00WHFP Block Diagram Pin name EN Vcc2 Vcc1 GND Vo1 Vo2 ADJ GND Function Output on/off control pin: High active Power supply pin 2 Power supply pin 1 GND pin Power supply pin for 3.3 V output Variable output voltage detection pin (0.8 V to 3.3 V) Variable output voltage detection pin GND pin PIN Vcc (1Pin) Vo1 (5Pin) Vo2 (4Pin) External capacitor setting range Approximately 3.3 F 1 F to 1000 F 1 F to 1000 F TOP VIEW External capacitor setting range Approximately 1 F Approximately 1 F 47 F to 1000 F 47 F to 1000 F TOP VIEW 1 234567 HRP5 HRP7 Setting the Output Voltage Vo2 The following output voltage setting method applies to the variable output pin. R2 ) - R2  IADJ Vo2=VADJ  ( 1 + R1 VADJ: Output feedback reference voltage (0.8 V typ.) (0.05A typ.: BA3259HFP) IADJ: ADJ pin source current (0.2A typ.: BA30E00WHFP) Vo2 R2 ADJ IADJ R1 VADJ R1 BA3259HFP: 1 k to 10 k BA30E00HFP: 1 k to 5 k The above is recommended. Note:Connect R1 and R2 to make output voltage settings as shown in Fig.25 and Fig.26. Keep in mind that the offset voltage caused by the current (IADJ) flowing out of the ADJ pin will become high if higher resistance is used. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/9 2009.04 - Rev.A BA3259HFP,BA30E00WHFP Technical Note Function Explanation 1) Two-input power supply (BA30E00WHFP) The input voltages (Vcc1 and Vcc2) supply power to two outputs (Vo1 and Vo2, respectively). The power dissipation between the input and output pins can be suppressed for each output according to usage. Efficiency comparison: 5V single input vs. 5V/3V two inputs Regulator with single input and two outputs Regulator with two inputs and two outputs (Vo2=1.8V, Io1=Io2=0.3A) Conventional 5V Vcc REG1 Vo1 3.3 V/0.3 A Vo2 REG2 1.8 V/0.3 A Power loss between input and output (Vcc − Vo1)  Io1 + (Vcc − Vo2)  Io2 = (5 − 3.3)  0.3 + (5 − 1.8)  0.3 = 0.51W + 0.96W = 1.47W  Single 5V input results in decreased efficiency Current 5V Vcc REG1 Vo1 3.3 V/0.3 A 3V REG2 Vo2 1.8 V/0.3 A Power loss between input and output (Vcc1 − Vo1)  Io1 + (Vcc2 − Vo2)  Io2 = (5 − 3.3)  0.3 + (5 − 1.8)  0.3 = 0.51W + 0.36W = 0.87W Reduced power loss by 0.6W.  Additional 3V input improves efficiency 2) Standby function (BA30E00WHFP) The standby function is operated through the EN pin. Output is turned on at 2.0 V or higher and turned off at 0.8 V or lower. Thermal Design If the IC is used under the conditions of excess of the power dissipation, the chip temperature will rise, which will have an adverse effect on the electrical characteristics of the IC, such as a reduction in current capability. Furthermore, if the temperature exceeds Tjmax, element deterioration or damage may occur. Implement proper thermal designs to ensure that the power dissipation is within the permissible range in order to prevent instantaneous IC damage resulting from heat and maintain the reliability of the IC for long-term operation. Refer to the power derating characteristics curves in Fig. 27. Power Consumption Pc (W) Calculation Method: BA3259HFP Vcc IP Vcc Power Tr Controller Vcc Power Tr Icc GND  Power consumption of 3.3 V power transistor Pc1=(Vcc − 3.3)  Io1  Power consumption of Vo2 power transistor 3.3 V Pc2=(Vcc − Vo2)  Io2 output Vo1  Power consumption by circuit current Io1 Pc3=Vcc  Icc  0.8 V to Pc=Pc1 + Pc2 + Pc3 3.3 V output * Vcc: Applied voltage Vo2 Io1: Load current on Vo1 side Io2 Io2: Load current on Vo2 side Icc: Circuit current BA30E00WHFP Vcc1 Vcc1 Controller Vcc2 IB1 IB2 Power Tr Vcc2 Power Tr Icc1+Icc2 GND  Power consumption of power transistor on Vol1 (3.3 V output) Pc1=(Vcc1 − Vo1)  Io1  Power consumption of power transistor on Vo2 (variable output ) 3.3 V Pc2=(Vcc2 − Vo2)  Io2 output Io1  Power consumption by circuit current Io1 Pc3=Vcc1  Icc1 + Vcc2  Icc2  0.8 V to Pc=Pc1 + Pc2 + Pc3 3.3 V Io2 output * Vcc1, Vcc2: Applied voltage Io1: Load current on 3.3 V output side Io2 Io2: Load current on variable output side Icc1, Icc2: Circuit currents The Icc (circuit current) varies with the load. Refer to the above and implement proper thermal designs so that the IC will not be used under conditions of excess power dissipation Pd under all operating temperatures. 10.0 5.0 ESR [] 2.0 1.0 0.5 0.2 Fig. 27 Ambient Temperature vs. Power Dissipation 10 Board size: 70 mm  70 mm  1.6 mm (with a thermal via incorporated by the board) 9 Board surface area: 10.5 mm  10.5 mm (1) 2-layer board (Backside copper foil area: 15 mm  15 mm) 8 (3) 7.3W (2) 2-layer board (Backside copper foil area: 70 mm  70 mm) (3) 4-layer board (Backside copper foil area: 70 mm  70 mm) 7 6 (2) 5.5W 5 4 3 (1) 2.3W 2 1 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [°C] POWER DISSIPATION: Pd [W] Unstable region 10.0 5.0 2.0 1.0 0.7 0.5 0.2 Unstable region ESR [] 0.1 0.05 0.02 0.01 0 Stable region Stable region 0.1 0.05 0.02 0.01 0 800 1000 Unstable region 200 400 600 Io [mA] 200 400 600 Io [mA] 800 1000 Fig.28 BA3259HFP ESR Fig.29 BA30E00WHFP ESR www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/9 2009.04 - Rev.A BA3259HFP,BA30E00WHFP  Input / Output Equivalent Circuits BA3259HFP Vcc Vcc Vo2 Vo1 ADJ Technical Note BA30E00WHFP Vcc1 cc1 V Vo1 Vcc2 Vo2 ADJ Fig.30 BA3259HFP I/O Equivalent Circuits Fig.31 BA30E00WHFP I/O Equivalent Circuit Explanation of external components BA3259HFP 1) Vcc (Pin 1) It is recommended that a ceramic capacitor with a capacitance of approximately 3.3F is placed between Vcc and GND at a position closest to the pins as possible. 2) Vo (Pins 4 and 5) Insert a capacitor between Vo and GND in order to prevent output oscillation. The capacitor may oscillate if the capacitance changes as a result of temperature fluctuations. Therefore, it is recommended that a ceramic capacitor with a temperature coefficient of X5R or above and a maximum capacitance change (resulting from temperature fluctuations) of ±10% be used. The capacitance should be between 1F and 1,000F. (Refer to Fig. 28.) BA33E00HFP 1) Vcc1 (Pin 3) and Vcc2 (Pin 2) Insert capacitors with a capacitance of 1F between Vcc1 and GND and Vcc2 and GND. The capacitance value will vary depending on the application. Be sure to implement designs with sufficient margins. 2) Vo1 (Pin 5) and Vo2 (Pin 6) Insert a capacitor between Vo and GND in order to prevent oscillation. The capacitance of the capacitor may greatly vary with temperature changes, making it impossible to completely prevent oscillation. Therefore, use a tantalum aluminum electrolytic capacitor with a low ESR (Equivalent Serial Resistance) that ensures good performance characteristics at low temperatures. The output oscillates if the ESR is too high or too low. Refer to the ESR characteristics in Fig. 29 and operate the IC within the stable operating region. If there is a sudden load change, use a capacitor with a higher capacitance . A capacitance between 47F and 1,000F is recommended. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/9 2009.04 - Rev.A BA3259HFP,BA30E00WHFP Technical Note  Notes for use 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all operating conditions. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 7) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. 8) Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 9) Thermal Shutdown Circuit (TSD) This IC incorporates a built-in thermal shutdown circuit for protection against thermal destruction. Should the junction temperature (Tj) reach the thermal shutdown ON temperature threshold, the TSD will be activated, turning off all output power elements. The circuit will automatically reset once the chip's temperature Tj drops below the threshold temperature. Operation of the thermal shutdown circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the thermal shutdown circuit. 10) Overcurrent protection circuit An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload currents. Continued use of the protection circuits should be avoided. Please note that current increases negatively impact the temperature. 11) Damage to the internal circuit or element may occur when the polarity of the Vcc pin is opposite to that of the other pins inapplications. (I.e. Vcc is shorted with the GND pin while an external capacitor is charged.) Use a maximum capacitance of 1000 mF for the output pins. Inserting a diode to prevent back-current flow in series with Vcc or bypass diodes between Vcc and each pin is recommended. 抵抗 R esistor Bypass diode T ransistor (NP(NPN) トランジスタ N) (PIN B) （端子 B ） C (PINB) C ～ ～ Diode for preventing back current flow E ～ ～ GND P＋ N Ｎ ( PIN A) （端子 A ） ～ ～ B B E GND Other adjacent elements VCC N P＋ O utput pin P N P＋ N N P＋ N Ｎ P Ｐ N P substr P 基板 ate 寄生素子 Parasitic element GND P substrate P 基板 G ND GND Parasitic element Parasitic element Fig. 32 Bypass diode Fig. 33 Example of Simple Bipolar IC Architecture www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/9 2009.04 - Rev.A ～ ～ (PINA) BA3259HFP,BA30E00WHFP Technical Note B A 3 2 5 9 H F P - T R Part No. Part No. 3259 30E00W Package HFP: HRP5 HRP7 Packaging and forming specification TR: Embossed tape and reel (HRP5, HRP7) HRP5 9.395±0.125 (MAX 9.745 include BURR) 1.017±0.2 Tape 1.905±0.1 Embossed carrier tape 2000pcs TR direction the at right when you ( The on the leftishand1pin of product is thethe upperthe right hand hold ) reel and you pull out tape on 8.82 ± 0.1 (5.59) Quantity Direction of feed (7.49) 0.835±0.2 1.523±0.15 10.54±0.13 8.0±0.13 1pin 1.2575 1 2 3 4 5 5.5° 4.5°+4.5° − +0.1 0.27 −0.05 1.72 0.73±0.1 0.08 S S 0.08±0.05 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. HRP7 9.395±0.125 (MAX 9.745 include BURR) 1.017±0.2 Tape 1.905±0.1 Embossed carrier tape 2000pcs TR The direction is the 1pin of product is at the upper right when you hold 8.82±0.1 (5.59) Quantity Direction of feed 1.523±0.15 0.835±0.2 10.54±0.13 8.0±0.13 (7.49) ( reel on the left hand and you pull out the tape on the right hand 1pin ) 0.8875 12 34 5 6 7 +5.5° 4.5° −4.5° 0.73±0.1 +0.1 0.27 -0.05 S 0.08±0.05 1.27 0.08 S Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/9 2009.04 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A