SCT3060AL
Datasheet
N-channel SiC power MOSFET
lOutline
VDSS
650V
RDS(on) (Typ.)
60mW
ID
39A
PD
165W
TO-247N
(1)(2)(3)
lInner circuit
lFeatures
(1) Gate
(2) Drain
(3) Source
1) Low on-resistance
2) Fast switching speed
*1 Body Diode
3) Fast reverse recovery
4) Easy to parallel
lPackaging specifications
5) Simple to drive
Packing
Tube
6) Pb-free lead plating ; RoHS compliant
Reel size (mm)
-
Tape width (mm)
-
Type
lApplication
Basic ordering unit (pcs)
・Solar inverters
Taping code
・DC/DC converters
30
C11
Marking
SCT3060AL
・Switch mode power supplies
・Induction heating
・Motor drives
lAbsolute maximum ratings (Ta = 25°C)
Parameter
Drain - Source voltage
Continuous drain current
Value
Unit
VDSS
650
V
Tc = 25°C
ID
*1
39
A
Tc = 100°C
ID *1
27
A
ID,pulse *2
97
A
VGSS
-4 to +22
V
-4 to +26
V
0 / +18
V
Tj
175
°C
Tstg
-55 to +175
°C
Pulsed drain current
Gate - Source voltage (DC)
Gate-Source Surge Voltage (tsurge < 300nsec)
VGSS_surge
Recommended Drive Voltage
VGS_op
Junction temperature
Range of storage temperature
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Symbol
1/12
*4
*3
TSQ50211-SCT3060AL
14.Jun.2018 - Rev.005
Datasheet
SCT3060AL
lThermal resistance
Values
Parameter
Symbol
RthJC
Thermal resistance, junction - case
Unit
Min.
Typ.
Max.
-
0.70
0.91
C/W
lElectrical characteristics (Ta = 25°C)
Values
Parameter
Drain - Source breakdown
voltage
Symbol
V(BR)DSS
Conditions
Unit
Min.
Typ.
Max.
650
-
-
V
Tj = 25°C
-
1
10
mA
Tj = 150°C
-
2
-
VGS = 0V, ID = 1mA
VDS = 650V, VGS = 0V
Zero gate voltage
drain current
IDSS
Gate - Source leakage current
IGSS+
VGS = +22V, VDS = 0V
-
-
100
nA
Gate - Source leakage current
IGSS-
VGS = -4V, VDS = 0V
-
-
-100
nA
2.7
-
5.6
V
-
60
78
mW
Tj = 125°C
-
79.2
-
f = 1MHz, open drain
-
12
-
Gate threshold voltage
VGS (th)
VDS = 10V, ID = 6.67mA
VGS = 18V, ID = 13A
Static drain - source
on - state resistance
Gate input resistance
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RDS(on) *5 Tj = 25°C
RG
2/12
W
TSQ50211-SCT3060AL
14.Jun.2018 - Rev.005
Datasheet
SCT3060AL
lElectrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Transconductance
gfs *5
VDS = 10V, ID = 13A
-
4.9
-
Input capacitance
Ciss
VGS = 0V
-
852
-
Output capacitance
Coss
VDS = 500V
-
55
-
Reverse transfer capacitance
Crss
f = 1MHz
-
24
-
Effective output capacitance,
energy related
Co(er)
VGS = 0V
VDS = 0V to 300V
-
126
-
Turn - on delay time
td(on) *5
VDD = 300V, ID = 13A
-
19
-
VGS = 18V/0V
-
37
-
td(off) *5
RL = 23W
-
34
-
tf *5
RG = 0W
-
21
-
-
70
-
Rise time
tr
Turn - off delay time
Fall time
Turn - on switching loss
Turn - off switching loss
*5
Eon *5
Eoff *5
S
pF
pF
ns
VDD = 300V, ID=13A
VGS = 18V/0V
RG = 0W L=500mH
*Eon includes diode
reverse recovery
mJ
-
10
-
lGate Charge characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Total gate charge
Qg *5
VDD = 300V
-
58
-
Gate - Source charge
Qgs *5
ID = 13A
-
15
-
Gate - Drain charge
Qgd
VGS = 18V
-
23
-
VDD = 300V, ID = 13A
-
9.6
-
Gate plateau voltage
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TSZ22111・15・001
*5
V(plateau)
3/12
nC
V
TSQ50211-SCT3060AL
14.Jun.2018 - Rev.005
Datasheet
SCT3060AL
lBody diode electrical characteristics (Source-Drain) (Ta = 25°C)
Values
Parameter
Inverse diode continuous,
forward current
Symbol
IS
Conditions
*1
Unit
Min.
Typ.
Max.
-
-
39
A
-
-
97
A
-
3.2
-
V
-
15
-
ns
-
55
-
nC
-
8
-
A
Tc = 25°C
Inverse diode direct current,
pulsed
ISM *2
Forward voltage
VSD *5
Reverse recovery time
trr *5
Reverse recovery charge
Qrr *5
Peak reverse recovery current
Irrm
VGS = 0V, IS = 13A
IF = 13A, VR = 300V
di/dt = 1100A/ms
*5
*1 Limited only by maximum temperature allowed.
*2 PW 10ms, Duty cycle 1%
*3 Example of acceptable Vgs waveform
*4 Please be advised not to use SiC-MOSFETs with Vgs below 13V as doing so may cause
thermal runaway.
*5 Pulsed
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Datasheet
SCT3060AL
lElectrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
180
1000
Operation in this area is limited by RDS(ON)
PW = 100µs
140
100
Drain Current : ID [A]
Power Dissipation : PD [W]
160
120
100
80
60
40
10
PW = 1ms
PW = 10ms
PW = 100ms
1
Ta = 25ºC
Single Pulse
20
0.1
0
0
50
100
150
0.1
200
Case Temperature : TC [°C]
1
10
100
1000
Drain - Source Voltage : VDS [V]
Transient Thermal Resistance : Rth [K/W]
Fig.3 Typical Transient Thermal
Resistance vs. Pulse Width
1
0.1
0.01
Ta = 25ºC
Single Pulse
0.001
0.0001
0.001
0.01
0.1
1
10
Pulse Width : PW [s]
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SCT3060AL
lElectrical characteristic curves
Fig.4 Typical Output Characteristics(I)
Fig.5 Typical Output Characteristics(II)
20
40
20V
20V
18V
18V
Ta = 25ºC
Pulsed
16V
Drain Current : ID [A]
Drain Current : ID [A]
30
14V
20
12V
10
Ta = 25ºC
Pulsed
10V
14V
16V
15
10
12V
10V
5
VGS= 8V
VGS= 8V
0
0
0
2
4
6
8
10
0
Drain - Source Voltage : VDS [V]
2
3
4
5
Drain - Source Voltage : VDS [V]
Fig.6 Tj = 150ºC Typical Output
Characteristics(I)
Fig.7 Tj = 150ºC Typical Output
Characteristics(II)
20
40
20V
18V
20V
18V
14V
Ta = 150ºC
Pulsed
16V
30
12V
10V
20
10
VGS= 8V
14V
16V
15
Drain Current : ID [A]
Drain Current : ID [A]
1
10V
12V
10
VGS= 8V
5
Ta = 150ºC
Pulsed
0
0
0
2
4
6
8
0
10
Drain - Source Voltage : VDS [V]
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1
2
3
4
5
Drain - Source Voltage : VDS [V]
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TSQ50211-SCT3060AL
14.Jun.2018 - Rev.005
Datasheet
SCT3060AL
lElectrical characteristic curves
Fig.8 Typical Transfer Characteristics (I)
Fig.9 Typical Transfer Characteristics (II)
40
100
VDS = 10V
Pulsed
VDS = 10V
Pulsed
Drain Current : ID [A]
Drain Current : ID [A]
10
Ta= 150ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
1
0.1
30
20
Ta= 150ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
10
0
0.01
0
2
4
6
8
0
10 12 14 16 18 20
Gate - Source Voltage : VGS [V]
6
8
10 12 14 16 18 20
Fig.11 Transconductance vs. Drain Current
10
6
VDS = 10V
ID = 6.67mA
5
VDS = 10V
Pulsed
Transconductance : gfs [S]
Gate Threshold Voltage : V GS(th) [V]
4
Gate - Source Voltage : VGS [V]
Fig.10 Gate Threshold Voltage
vs. Junction Temperature
4
3
2
1
0
-50
2
1
Ta = 150ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
0.1
0
50
100
150
0.1
200
Junction Temperature : Tj [ºC]
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1
10
Drain Current : ID [A]
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TSQ50211-SCT3060AL
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Datasheet
SCT3060AL
lElectrical characteristic curves
Fig.12 Static Drain - Source On - State
Resistance vs. Gate - Source Voltage
Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperature
0.24
Ta = 25ºC
Pulsed
0.2
0.16
ID = 26A
0.12
ID = 13A
0.08
0.04
0
6
8
10
12
14
16
18
20
22
Static Drain - Source On-State Resistance
: RDS(on) [W]
Static Drain - Source On-State Resistance
: RDS(on) [W]
0.24
Gate - Source Voltage : VGS [V]
0.2
VGS = 18V
Pulsed
0.16
0.12
ID = 26A
0.08
ID = 13A
0.04
0
-50
0
50
100
150
200
Junction Temperature : Tj [ºC]
Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current
Static Drain - Source On-State Resistance
: RDS(on) [W]
1
0.1
Ta = 150ºC
Ta = 125ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
VGS = 18V
Pulsed
0.01
1
10
100
Drain Current : ID [A]
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SCT3060AL
lElectrical characteristic curves
Fig.15 Typical Capacitance
vs. Drain - Source Voltage
Fig.16 Coss Stored Energy
10
10000
Ciss
1000
Capacitance : C [pF]
Coss Stored Energy : EOSS [mJ]
Ta = 25ºC
Coss
100
Crss
10
Ta = 25ºC
f = 1MHz
VGS = 0V
5
0
1
0.1
1
10
100
0
1000
Drain - Source Voltage : VDS [V]
200
300
400
Drain - Source Voltage : VDS [V]
Fig.17 Switching Characteristics
Fig.18 Dynamic Input Characteristics
10000
20
1000
Gate - Source Voltage : VGS [V]
Ta = 25ºC
VDD = 300V
VGS = 18V
RG = 0W
Pulsed
tf
Switching Time : t [ns]
100
100
td(off)
tr
10
td(on)
1
Ta = 25ºC
VDD = 300V
ID = 13A
Pulsed
15
10
5
0
0.1
1
10
100
0
Drain Current : ID [A]
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20
40
60
Total Gate Charge : Qg [nC]
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TSQ50211-SCT3060AL
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Datasheet
SCT3060AL
lElectrical characteristic curves
Fig.19 Typical Switching Loss
vs. Drain - Source Voltage
Fig.20 Typical Switching Loss
vs. Drain Current
600
Ta = 25ºC
ID=13A
VGS = 18V/0V
RG=0W
L=500mH
100
Switching Energy : E [mJ]
Switching Energy : E [mJ]
150
Eon
50
Ta = 25ºC
VDD=300V
VGS = 18V/0V
RG=0W
L=500mH
400
Eon
200
Eoff
Eoff
0
0
100
200
300
400
0
500
Drain - Source Voltage : VDS [V]
20
40
Drain Current : ID [A]
Fig.21 Typical Switching Loss
vs. External Gate Resistance
Switching Energy : E [mJ]
600
Ta = 25ºC
VDD=300V
ID=13A
VGS = 18V/0V
L=500mH
400
Eon
200
Eoff
0
0
5
10
15
20
25
30
External Gate Resistance : RG [W]
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SCT3060AL
lElectrical characteristic curves
Fig.22 Inverse Diode Forward Current
vs. Source - Drain Voltage
Fig.23 Reverse Recovery Time
vs.Inverse Diode Forward Current
1000
Reverse Recovery Time : trr [ns]
Inverse Diode Forward Current : IS [A]
100
VGS = 0V
Pulsed
10
1
Ta = 150ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
0.1
0.01
Ta = 25ºC
di / dt = 1100A / us
VR = 300V
VGS = 0V
Pulsed
100
10
0
1
2
3
4
5
6
7
8
1
Source - Drain Voltage : VSD [V]
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10
100
Inverse Diode Forward Current : IS [A]
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TSQ50211-SCT3060AL
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Datasheet
SCT3060AL
lMeasurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Fig.3-1 Switching Energy Measurement Circuit
Fig.3-2 Switching Waveforms
Eon = ID×VDS
Same type
device as
D.U.T.
VDS
Irr
Eoff = ID×VDS
Vsurge
D.U.T.
ID
ID
Fig.4-1 Reverse Recovery Time Measurement Circuit Fig.4-2 Reverse Recovery Waveform
D.U.T.
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Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications :
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products specified in this document are not designed to be radiation tolerant.
7) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, and power transmission systems.
8) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
9) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
10) ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
11) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
12) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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