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BLUENRG-332AT

BLUENRG-332AT

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    VFQFN32_EP

  • 描述:

    BLUENRG-332AT

  • 数据手册
  • 价格&库存
BLUENRG-332AT 数据手册
BlueNRG-LPS Datasheet Programmable Bluetooth® Low Energy wireless SoC Features • Product status link BlueNRG-LPS • Product summary Order code BlueNRG-332xy • • • • • • Bluetooth Low Energy system-on-chip supporting Bluetooth 5.3 specifications – 2 Mbps data rate – Long range (Coded PHY) – Advertising extensions – Channel selection algorithm #2 – GATT caching – Direction finding (AoA/AoD) – LE Ping procedure – Periodic advertising and periodic advertising sync transfer – LE L2CAP connection-oriented channel – LE power control and path loss monitoring Radio – RX sensitivity level: -97 dBm @ 1 Mbps, -104 dBm @ 125 kbps (long range) – Programmable output power up to +8 dBm (at antenna connector) – Data rate supported: 2 Mbps, 1 Mbps, 500 kbps and 125 kbps – 128 physical connections – Integrated balun – Support for external PA and LNA – BlueNRG core coprocessor (DMA based) for Bluetooth Low Energy timing critical operation – 2.4 GHz proprietary radio driver – Suitable for systems requiring compliance with the following radio frequency regulations: ETSI EN 300 328, EN 300 440, FCC CFR47 part 15, ARIB STD-T66 Ultra-low power radio performance – 8 nA in SHUTDOWN mode (1.8 V) – 0.8 uA in DEEPSTOP mode (with external LSE and BLE wake-up sources, 1.8 V) – 1.0 uA in DEEPSTOP mode (with internal LSI and BLE wake-up sources, 1.8 V) – 4.3 mA peak current in TX (@ 0 dBm, 3.3 V) – 3.4 mA peak current in RX (@ sensitivity level, 3.3V) High performance and ultra-low power Arm® Cortex®-M0+ 32-bit, running up to 64 MHz Dynamic current consumption: 14 µA/MHz Operating supply voltage: from 1.7 to 3.6 V -40 ºC to 105 ºC temperature range Supply and reset management – High efficiency embedded SMPS step-down converter with intelligent bypass mode – Ultra-low power power-on-reset (POR) and power-down-reset (PDR) – Programmable voltage detector (PVD) DS13819 - Rev 2 - April 2022 For further information contact your local STMicroelectronics sales office. www.st.com BlueNRG-LPS • • • • • • • • • • • • • • DS13819 - Rev 2 Clock sources – 64 MHz PLL Fail safe 32 MHz crystal oscillator with integrated trimming capacitors – – 32 kHz crystal oscillator – Internal low-power 32 kHz RO On-chip non-volatile Flash memory of 192 kB On-chip RAM of 24 kB + 4 kB PKA RAM One-time-programmable (OTP) memory area of 1 kB Embedded UART bootloader Ultra-low power modes with or without timer and RAM retention Quadrature decoder Enhanced security mechanisms such as: – Flash read/write protection – SWD disabling – Secure bootloader Security features – True random number generator (RNG) – Hardware encryption AES maximum 128-bit security co-processor – HW public key accelerator (PKA) – Cryptographic algorithms: RSA, Diffie-Helman, ECC over GF(p) – CRC calculation unit – 64-bit unique ID System peripherals – 1x DMA controller with 8 channels supporting ADC, SPI-I2S, I2C, USART, LPUART, TIMERS – 1x SPI with I2S interface multiplexed – 1x I2C (SMBus/PMBus) – 1x LPUART (low power) – 1x USART (ISO 7816 smartcard mode, IrDA, SPI Master and Modbus) – 1x independent WDG – 1x real-time clock (RTC) – 1x independent SysTick – 1x 16-bits, four channel general purpose timer – 2x 16-bits, two channel general purpose timer – Infrared interface Up to 20 fast I/Os – All of them with wake-up capability – All of them retain state in low-power – All of them 5 V tolerant Analog peripherals – 12-bit ADC with 8 input channels, up to 16 bits with down sampler – Battery monitoring – Analog watchdog Development support – Serial wire debug (SWD) – 4 breakpoints and 2 watchpoints All packages are ECOPACK2 compliant page 2/63 BlueNRG-LPS Applications • • • • • • • • • • • Industrial Home and industrial automation Asset tracking, ID location, real-time locating system Smart lighting Fitness,wellness and sports Healthcare, consumer medical Security/proximity Remote control Assisted living Mobile phone peripherals PC peripherals Description The BlueNRG-LPS is an ultra-low power programmable Bluetooth® Low Energy wireless SoC solution. It embeds STMicroelectronics’s state-of-the-art 2.4 GHz radio IPs, optimized for ultra-low-power consumption and excellent radio performance, for unparalleled battery lifetime. It is compliant with Bluetooth® Low Energy SIG core specification version 5.3 addressing point-to-point connectivity and Bluetooth Mesh networking and allows large-scale device networks to be established in a reliable way. The BlueNRG-LPS is also suitable for 2.4 GHz proprietary radio wireless communication to address ultra-low latency applications. The BlueNRG-LPS embeds a Arm® Cortex®-M0+ microcontroller that can operate up to 64 MHz and also the BlueNRG core co-processor (DMA based) for Bluetooth Low Energy timing critical operations. The main Bluetooth® Low Energy 5.3 specification supported features are: 2 Mbps data rate, long range (Coded PHY), advertising extensions, channel selection algorithm #2, GATT caching, Direction Finding (AoA/AoD), hardware support for simultaneous connection, master/slave and multiple roles simultaneously, extended packet length support, LE Ping procedure, periodic advertising and periodic advertising sync transfer, LE power control and path loss monitoring. In addition, the BlueNRG-LPS provides enhanced security hardware support by dedicated hardware functions: True random number generator (RNG), encryption AES maximum 128-bit security co-processor, public key accelerator (PKA), CRC calculation unit, 64-bit unique ID, Flash memory read and write protection. The Public Key Acceleration (PKA) supports the modular arithmetic including exponentiation with maximum modulo size of 3136 bits and the elliptic curves over prime field scalar multiplication, ECDSA signature, ECDSA verification with maximum modulo size of 521 bits CRC calculation unit. The BlueNRG-LPS can be configured to support standalone or network processor applications. In the first configuration, the BlueNRG-LPS operates as a single device in the application for managing both the application code and the Bluetooth Low Energy stack. The BlueNRG-LPS embeds high-speed and flexible memory types: Flash memory of 192 kB, RAM memory of 24 kB, one-time-programmable (OTP) memory area of 1 kB, ROM memory of 7 kB. Direct data transfer between memory and peripherals and from memory-to-memory is supported by eight DMA channels with a full flexible channel mapping by the DMAMUX peripheral. The BlueNRG-LPS embeds a 12-bit ADC, allowing measurements of up to eight external sources and up to three internal sources, including battery monitoring and a temperature sensor. The BlueNRG-LPS has a low-power RTC and three general purpose 16-bit timers. The BlueNRG-LPS features standard and advanced communication interfaces: 1x SPI/I2S, 1x LPUART, 1x USART supporting ISO 7816 (smartcard mode), IrDA and Modbus mode, 1x I2C supporting SMBus/PMBus. The BlueNRG-LPS operates in the -40 to +105 °C temperature range from a 1.7 V to 3.6 V power supply. A comprehensive set of power-saving modes enables the design of low-power applications. The BlueNRG-LPS integrates a high efficiency SMPS step-down converter and an integrated PDR circuitry with a fixed threshold that generates a device reset when the VDD drops under 1.65 V. The BlueNRG-LPS comes in different package versions supporting up to: DS13819 - Rev 2 page 3/63 BlueNRG-LPS 20 I/Os for the QFN32 package. 20 I/Os for the WLCSP36 package. Figure 1. The BlueNRG-LPS block diagram 192 kB Flash JTAG/SWD NVIC SRAM0 Arm® Cortex®M0+ SRAM1 DMAMUX MR_BLE AHB Lite DMA (8 ch) PKA + RAM RNG PWRC RCC LSE 32 kHz GPIOA LSI 32 kHz GPIOB CRC SYSCFG ADC APB HSE 32 MHz I2C1 RTC RC64MPLL SPI3/I2S3 TIM2 Power supply/ POR/PDR/PVD USART IWDG LPUART TIM16 TIM17 DS13819 - Rev 2 page 4/63 BlueNRG-LPS Functional overview 1 Functional overview 1.1 System architecture The main system consists of 32-bit multilayer AHB bus matrix that interconnects: • Three masters: • – CPU (Cortex®-M0+) core S-bus – DMA1 – Radio system Seven slaves: – – – – – – – Internal Flash memory on CPU (Cortex®-M0+) S bus Internal SRAM0 (12 kB) Internal SRAM1 (12 kB) APB0 peripherals (through an AHB to APB bridge) APB1 peripherals (through an AHB to APB bridge) AHB0 peripherals AHBRF including AHB to APB bridge and radio peripherals (connected to APB2) The bus matrix provides access from a master to a slave, enabling concurrent access and efficient operation even when several high-speed peripherals work simultaneously. Figure 2. Bus matrix DMA1 Radio system S0 S1 S2 M1 SRAM0 M2 SRAM1 M3 APB0 M4 Flash APB1 M5 Flash Controller AHB0 M6 M0 CPU ARM Cortex-M0+ APB2 Bus Matrix DS13819 - Rev 2 page 5/63 BlueNRG-LPS Arm® Cortex®-M0+ core with MPU 1.2 Arm® Cortex®-M0+ core with MPU The BlueNRG-LPS contains an Arm® Cortex®-M0+ microcontroller core. The Arm® Cortex®-M0+ was developed to provide a low-cost platform that meets the needs of CPU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced response to interrupts. The Arm® Cortex®-M0+ can run from 1 MHz up to 64 MHz. The Arm® Cortex®-M0+ processor is built on a highly area and power optimized 32-bit processor core, with a 2-stage pipeline Von Neumann architecture. The processor delivers exceptional energy efficiency through a small but powerful instruction set and extensively optimized design, providing high-end processing hardware including a single-cycle multiplier. The interrupts are handled by the Arm® Cortex®-M0+ Nested Vector Interrupt Controller (NVIC). The NVIC controls specific Arm® Cortex®-M0+ interrupts as well as the BlueNRG-LPS peripheral interrupts. With its embedded ARM core, the BlueNRG-LPS family is compatible with all ARM tools and software. 1.3 Memories 1.3.1 Embedded Flash memory The Flash controller implements the erase and program Flash memory operation. The flash controller also implements the read and write protection. The Flash memory features are: • Memory organization: • • – 1 bank of 192 kB – Page size: 2 kB – Page number 96 32-bit wide data read/write Page erase and mass erase The Flash controller features are: • • • • 1.3.2 Flash memory read operations: single read or mass read Flash memory write operations: single data write or 4x32-bits burst write or mass write Flash memory erase operations: page erase or mass erase Page write protect mechanism: 4 variable-size memory segments Embedded SRAM The BlueNRG-LPS has a total of 24 kB of embedded SRAM, split into two banks as shown in the following table: Table 1. SRAM overview 1.3.3 SRAM bank Size Address Retained in DEEPSTOP SRAM0 12 kB 0x2000 0000 Always SRAM1 12 kB 0x2000 3000 Programmable by the user Embedded ROM The BlueNRG-LPS has a total of 7 kB of embedded ROM. This area is ST reserved and contains: • • 1.3.4 The UART bootloader from which the CPU boots after each reset (first 6 kB of ROM memory) Some ST reserved values including the ADC trimming values (the last 1 kB of ROM memory) Embedded OTP The one-time-programmable (OTP) is a memory of 1 kB dedicated for user data. The OTP data cannot be erased. The user can protect the OTP data area by writing the last word at address 0x1000 1BFC and by performing a system reset. This operation freezes the OTP memory from further unwanted write operations. DS13819 - Rev 2 page 6/63 BlueNRG-LPS Security and safety 1.3.5 Memory protection unit (MPU) The MPU is used to manage accesses to memory to prevent one task from accidentally corrupting the memory or resources used by any other active task. This memory area is organized into up to 8 protected areas. The protection area sizes are between 32 bytes and the whole 4 gigabytes of addressable memory. The MPU is especially helpful for applications where some critical or certified code has to be protected against the misbehavior of other tasks. It is usually managed by an RTOS (real-time operating system). If a program accesses a memory location that is prohibited by the MPU, the RTOS can detect it and take action. In an RTOS environment, the kernel can dynamically update the MPU area settings, based on the process to be executed. The MPU is optional and can be bypassed for applications that do not need it. 1.4 Security and safety The BlueNRG-LPS contains many security blocks for the BLE and the host application. It includes: 1.5 • • • • • • Flash read/write protection over accidental and intentional actions As protection against potential hacker attacks, the SWD access can be disabled Secure bootloader (refer to the dedicated application note AN5471) Customer storage of the BLE keys True random number generator (RNG) Public key accelerator (PKA) including: • – Modular arithmetic including exponentiation with maximum modulo size of 3136 bits – Elliptic curves over prime field scalar multiplication, ECDSA signature, ECDSA verification with maximum modulo size of 521 bits Cyclic redundancy check calculation unit (CRC) RF subsystem The BlueNRG-LPS embeds an ultra-low power radio, compliant with Bluetooth® Low Energy (BLE) specification. The BLE features 1 Mbps and 2 Mbps transfer rates as well as long range options (125 kbps, 500 kbps), supports multiple roles simultaneously acting at the same time as Bluetooth® Low Energy sensor and hub device. The BLE protocol stack is implemented by an efficient system partitioned as follows: • • 1.5.1 Hardware part: BlueCore handling time critical and time consuming BLE protocol parts Firmware part: Arm® Cortex®-M0+ core handling non time critical BLE protocol parts RF front-end block diagram The RF front end is based on a direct modulation of the carrier in TX, and uses a low IF architecture in RX mode. Thanks to an internal transformer with RF pins, the circuit directly interfaces the antenna (single ended connection, impedance close to 50 Ω). The natural band pass behavior of the internal transformer simplifies outside circuitry aimed at harmonic filtering and out of band interferer rejection. In transmit mode, the maximum output power is user selectable through the programmable LDO voltage of the power amplifier. A linearized, smoothed analog control offers a clean power ramp-up. In receive mode the circuit can be used in standard high performance or in reduced power consumption (user programmable). The automatic gain control (AGC) is able to reduce the chain gain at both RF and IF locations, for an optimized interferer rejection. Thanks to the use of complex filtering and highly accurate I/Q architecture, high sensitivity, and excellent linearity can be achieved. DS13819 - Rev 2 page 7/63 BlueNRG-LPS Power supply management Figure 3. BlueNRG-LPS RF block diagram Note: QFN32: VSS through exposed pad,and VSSRF pins must be connected to ground plane. CSP36: VSSRF pins must be connected to ground plane. 1.6 Power supply management 1.6.1 SMPS step-down regulator The device integrates a step-down converter to improve low power performance when the VDD voltage is high enough. The SMPS output voltage can be programmed from 1.2 V to 1.90 V. It is internally clocked at 4 MHz or 8 MHz. The device can be operated without the SMPS by just wiring its output to VDD. This is the case for applications where the voltage is low, or where the power consumption is not critical. Except for the configuration SMPS OFF, an L/C BOM must be present on the board and connected to the VFBSD pad. DS13819 - Rev 2 page 8/63 BlueNRG-LPS Power supply management Figure 4. Power supply configuration 1.6.2 Power supply schemes The BlueNRG-LPS embeds three power domains: • VDD33 (VDDIO or VDD): • – the voltage range is between 1.7 V and 3.6 V – it supplies a part of the I/O ring, the embedded regulators and the system analog IPs as power management block and embedded oscillators VDD12o: • – always-on digital power domain – this domain is generally supplied at 1.2 V during active phase of the device – this domain is supplied at 1.0 V during low power mode (DEEPSTOP) VDD12i: – interruptible digital power domain – this domain is generally supplied at 1.2 V during active phase of the device – this domain is shut down during low power mode (DEEPSTOP) Figure 5. Power supply domain overview 1.6.3 Linear voltage regulators The digital power supplies are provided by different regulators: DS13819 - Rev 2 page 9/63 BlueNRG-LPS Operating modes • The main LDO (MLDO): • – it provides 1.2 V from a 1.4-3.3 V input voltage – it supplies both VDD12i and VDD12o when the device is active – it is disabled during the low power mode (DEEPSTOP) Low power LDO (LPREG): • – it stays enabled during both active and low power phases – it provides 1.0 V voltage – it is not connected to the digital domain when the device is active – it is connected to the VDD12o domain during low power mode (DEEPSTOP) A dedicated LDO (RFLDO) to provide a 1.2 V to the analog RF block An embedded SMPS step-down converter is available (inserted between the external power and the LDOs). 1.6.4 Power supply supervisor The BlueNRG-LPS device embeds several power voltage monitoring: • • • 1.7 Power-on-reset (POR): during the power-on, the device remains in reset mode if VDDIO is below a VPOR threshold (typically 1.65 V) Power-down-reset (PDR): during power-down, the PDR puts the device under reset when the supply voltage (VDD) drops below the VPDR threshold (around 20 mV below VPOR). The PDR feature is always enabled Power voltage detector (PVD): can be used to monitor the VDDIO (against a programmed threshold) or an external analog input signal. When the feature is enabled and the PVD measures a voltage below the comparator, an interrupt is generated (if unmasked) Operating modes Several operating modes are defined for the BlueNRG-LPS: • • • RUN mode DEEPSTOP mode SHUTDOWN mode Table 2. Relationship between the low power modes and functional blocks Mode SHUTDOWN DEEPSTOP IDLE RUN CPU OFF OFF OFF ON Flash OFF OFF ON ON RAM OFF ON/OFF granularity 12 kB ON/OFF ON/OFF Radio OFF OFF ON/OFF ON/OFF Supply system OFF OFF ON ( DC-DC ON/OFF) ON ( DC-DC ON/OFF) Register retention OFF ON ON ON HS clock OFF OFF ON ON LS clock OFF ON/OFF ON ON Peripherals OFF OFF ON/OFF ON/OFF Wake-on RTC OFF ON/OFF ON/OFF NA Wake on LPUART OFF ON/OFF ON/OFF NA Wake on IWDG OFF ON/OFF ON/OFF NA Wake-on GPIOs OFF ON/OFF ON/OFF NA Wake-on reset pin ON ON ON NA GPIOs configuration retention PWRC pull-up/pull-down only ON ON ON DS13819 - Rev 2 page 10/63 BlueNRG-LPS Operating modes 1.7.1 RUN mode In RUN mode the BlueNRG-LPS is fully operational: • • • • All interfaces are active The internal power supplies are active The system clock and the bus clock are running The CPU core and the radio can be used The power consumption may be reduced by gating the clock of the unused peripherals. 1.7.2 DEEPSTOP mode DEEPSTOP is the only low-power mode of the BlueNRG-LPS allowing the restart from a saved context environment and the application at wake-up to go on running. The conditions to enter DEEPSTOP mode are: • • • • • The radio is sleeping (no radio activity) The CPU is sleeping (WFI with SLEEPDEEP bit activated) No unmasked wake-up sources are active The low-power mode selection (LPMS) bit of the power controller unit is 0 (default) The GPIO Retention Mode Selection (GPIORET) bit of the Power Controller unit must be set In DEEPSTOP mode: • • • • • • The system and the bus clocks are stopped Only the essential digital power domain is ON and supplied at 1.0 V The bank RAM0 is kept in retention The bank RAM1 can be in retention or not, depending on the software configuration The I/Os pull-up and pull-down can be controlled during DEEPSTOP mode, depending on the software configuration The low speed clock can be running or stopped, depending on the software configuration: • • • – ON or OFF – Sourced by LSE or by LSI The RTC, IWDG and LPUART stay active, if enabled and the low speed clock is ON The radio wake-up block, including its timer, stay active (if enabled and the low speed clock is ON) Up to 20 GPIOs retaining their configuration: • – I/Os retain the RUN mode configuration while in DEEPSTOP mode Up to 20 I/Os are able to be in output driving: • – A static low or high level Some I/Os are able to be in output driving: – The low speed clock (on PA10) – The RTC output (on PA8) Possible wake-up sources are: • • • • • The radio block is able to generate two events to wake up the system through its embedded wake-up timer running on low speed clock: – Radio wake-up time is reached – CPU host wake-up time is reached The RTC can generate a wake-up event The IWDG can generate a reset event The LPUART is able to generate a wake-up event All GPIOs are able to wake up the system At wake-up, all the hardware resources located in the digital power domain that are OFF during the DEEPSTOP mode, are reset. The CPU reboots. The wake-up reason is visible in the register of the power controller. DS13819 - Rev 2 page 11/63 BlueNRG-LPS Reset management 1.7.3 SHUTDOWN mode The SHUTDOWN mode is the least power consuming mode. The conditions to enter SHUTDOWN mode are the same conditions needed to enter DEEPSTOP mode except that the LPMS bit of the power controller unit is 1. In SHUTDOWN mode, the BlueNRG-LPS is in ultra-low power consumption: all voltage regulators, clocks and the RF interface are not powered. The BlueNRG-LPS can enter shutdown mode by internal software sequence. The only way to exit shutdown mode is by asserting and deasserting the RSTN pin. In SHUTDOWN mode: • • • • • The system is powered down as both the regulators are OFF The VDDIO power domain is ON All the clocks are OFF, LSI and LSE are OFF The I/Os pull-up and pull-down can be controlled during SHUTDOWN mode, depending on the software configuration The only wake-up source is a low pulse on the RSTN pin The exit from SHUTDOWN is similar to a POR startup. The PDR feature can be enabled or disabled during SHUTDOWN. 1.8 Reset management The BlueNRG-LPS offers two different resets: • • The PORESETn: this reset is provided by the low power management unit (LPMU) analog block and corresponds to a POR or PDR root cause. It is linked to power voltage ramp-up or ramp-down. This reset impacts all resources of the BlueNRG-LPS. The exit from SHUTDOWN mode is equivalent to a POR and thus generates a PORESETn. The PORESETn signal is active when the power supply of the device is below a threshold value or when the regulator does not provide the target voltage. The PADRESETn (system reset): this reset is built through several sources: – PORESETn – Reset due to the watchdog The BlueNRG-LPS device embeds a watchdog timer, which may be used to recover from software crashes – Reset due to CPU Lockup The Cortex®-M0+ generates a lockup to indicate the core is in the lock-up state resulting from an unrecoverable exception. The lock-up reset is masked if a debugger is connected to the Cortex®-M0+ – Software system reset The system reset request is generated by the debug circuitry of the Cortex®-M0+. The debugger sets the SYSRESETREQ bit of the application interrupt and reset control register (AIRCR). This system reset request through the AIRCR can also be done by the embedded software (into the hardfault handler for instance) – Reset from the RSTN external pin The RSTN pin toggles to inform that a reset has occurred This PADRESETn resets all resources of the BlueNRG-LPS, except: – – – – – Debug features Flash controller key management RTC timer Power controller unit Part of the RCC registers The pulse generator guarantees a minimum reset pulse duration of 20 μs for each internal reset source. In case of reset from the RSTN external pad, the reset pulse is generated when the pad is asserted low. DS13819 - Rev 2 page 12/63 BlueNRG-LPS Clock management 1.9 Clock management Three different clock sources may be used to drive the system clock of the BlueNRG-LPS: • • • HSI: high speed internal 64 MHz RC oscillator PLL64M: 64 MHz PLL clock HSE: high speed 32 MHz external crystal The BlueNRG-LPS also has a low speed clock tree used by some timers in the radio, RTC, IWDG and LPUART. Three different clock sources can be used for this low speed clock tree: • • • Low speed internal (LSI): low speed and low drift internal RC with a fixed frequency between 24 kHz and 49 kHz depending on the sample Low speed external (LSE) from: – An external crystal 32.768 kHz – A single-ended 32.738 kHz input signal A 32 kHz clock derived from dividing HSI or HSE. In this case, the slow clock is not available in DEEPSTOP low-power mode By default, after a system reset, all low speed sources are OFF. Both the activation and the selection of the slow clock are relevant during DEEPSTOP mode and at wakeup as slow clock generates a clock for the timers involved in wake-up event generation. The HSI and the PLL64M clocks are provided by the same analog block called RC64MPLL. The 64 MHz clock output by this block can be: • • A non-accurate clock when no external XO provides an input clock to this block (HSI) An accurate clock when the external XO provides the 32 MHz and once its internal PLL is locked (PLL64M) After reset, the CLK_SYS is divided by four to provide 16 MHz to the whole system (CPU, DMA, memories and peripherals). DS13819 - Rev 2 page 13/63 BlueNRG-LPS Clock management Figure 6. Clock tree It is possible to output some internal clocks on external pads: • • The low speed clocks can be output on the LCO I/O The high speed clocks can be output on the MCO I/O This is possible by programming the associated I/O in the correct alternate function. Most of the peripherals only use the system clock except: • DS13819 - Rev 2 I2C, USART: they use an always 16 MHz clock to have a fixed reference clock for baud rate management. The goal is to allow the CPU to boost or slow down the system clock (depending on on-going activities) without impacting a potential on-going serial interface transfer on external I/Os page 14/63 BlueNRG-LPS Boot mode • • • • • • • 1.10 LPUART: always uses a 16 MHz clock or LSE to have a fixed reference clock for baud rate management. The goal is to allow the CPU to boost or slow down the system clock (depending on on-going activities) without impacting a potential on-going serial interface transfer on external I/Os. SPI: when using the I2S mode, the baud rate is managed through the always 16 MHz or always 32 MHz clock or system clock (CLK_SYS) to reach higher baud rates. When running in other modes than the I2S, the baud rate is managed by the system clock. This implies its baud rate is impacted by dynamic system clock frequency changes. RNG: in parallel with the system clock, the RNG uses an always 16 MHz clock to generate at a constant frequency the random number whatever the system clock frequency Flash controller: in parallel with the system clock, the Flash controller uses an always 16 MHz clock to generate specific delays required by the Flash memory during programming and erase operations for example PKA: in parallel with the system clock, the PKA uses the system clock frequency Radio: it does not directly use the system clock for its APB/AHB interfaces, but the system clock with a potential divider (1 or 2 or 4). In parallel, the radio uses an always 16 MHz and an always 32 MHz for modulator, demodulator and to have a fixed reference clock to manage specific delays ADC: in parallel with the system clock, ADC uses a 64 MHz prescaled clock running at 16 MHz Boot mode Following CPU boot, the application software can modify the memory map at address 0x0000 0000. This modification is performed by programming the REMAP bit in the Flash controller. The following memory can be remapped: • • 1.11 Main Flash memory SRAM0 memory Embedded UART bootloader The BlueNRG-LPS has a pre-programmed bootloader supporting UART protocol with automatic baud rate detection. The main features of the embedded bootloader are: • • • • Auto baud rate detection up to 1 Mbps Flash mass erase, section erase Flash programming Flash readout protection enable/disable The pre-programmed bootloader is an application, which is stored in the BlueNRG-LPS internal ROM at manufacturing time by STMicroelectronics. This application allows upgrading the device Flash with a user application using a serial communication channel (UART). Bootloader is activated by hardware by forcing PA10 high during hardware reset, otherwise, application residing in Flash is launched. Note: Bootloader protocol is described in a separate application note (the UART bootloader protocol, AN5471) 1.12 General purpose inputs/outputs (GPIO) Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions. Fast I/O toggling can be achieved thanks to their mapping on the AHB0 bus. The I/Os alternate function configuration can be locked if needed following a specific sequence in order to avoid spurious writing to the I/Os registers. 1.13 Direct memory access (DMA) The DMA is used in order to provide high-speed data transfer between peripherals and memory as well as memory-to-memory. Data can be quickly moved by DMA without any CPU actions. In this manner, CPU resources are free for other operations. The DMA controller has eight channels in total. Each has an arbiter to handle the priority among DMA requests. DMA main features are: • DS13819 - Rev 2 Eight independently configurable channels (requests) page 15/63 BlueNRG-LPS Nested vectored interrupt controller (NVIC) • • • • • • • • • 1.14 Each of the eight channels is connected to dedicated hardware DMA requests, software trigger is also supported on each channel. This configuration is done by software Priorities among requests from channels of DMA are software programmable (four levels consisting of very high, high, medium, low) or hardware in case of equality (request 1 has priority over request 2, and so on) Independent source and destination transfer size (byte, half word, word), emulating packing and unpacking. Source/destination addresses must be aligned on the data size Support for circular buffer management Three event flags (DMA half transfer, DMA transfer complete and DMA transfer error) logically ORed together in a single interrupt request for each channel Memory-to-memory transfer (RAM only) Peripheral-to-memory and memory-to-peripheral, and peripheral-to-peripheral transfers Access to SRAMs, APB0 and APB1 peripherals as source and destination Programmable number of data to be transferred: up to 65536 Nested vectored interrupt controller (NVIC) The interrupts are handled by the Cortex®-M0+ nested vector interrupt controller (NVIC). NVIC controls specific Cortex®-M0+ interrupts as well as the BlueNRG-LPS peripheral interrupts. The NVIC benefits are the following: • • • • • • • • Nested vectored interrupt controller that is an integral part of the ARM® Cortex®-M0+ Tightly coupled interrupt controller provides low interrupt latency Control system exceptions and peripheral interrupts NVIC supports 32 vectored interrupts Four programmable interrupt priority levels with hardware priority level masking Software interrupt generation using the ARM® exceptions SVCall and PendSV Support for NMI ARM® Cortex® M0+ vector table offset register VTOR implemented NVIC hardware block provides flexible interrupt management features with minimal interrupt latency. 1.15 Analog digital converter (ADC) The BlueNRG-LPS embeds a 12-bit ADC. The ADC consists of a 12-bit successive approximation analog-todigital converter (SAR) with 2 x 8 multiplexed channels allowing measurements of up to eight external sources and up to two internal sources. The ADC main features are: • • • • • • • • • • 1.15.1 Conversion frequency is up to 1 Msps Three input voltage ranges are supported (0 - 1.2 V, 0 - 2.4 V, 0 - 3.6 V) Up to eight analog single-ended channels or four analog differential inputs or a mix of both Temperature sensor conversion Battery level conversion up to 3.6 V ADC continuous or single mode conversion is possible ADC down-sampler for multi-purpose applications to improve analog performance while off-loading the CPU (ratio adjustable from 1 to 128) A watchdog feature to inform when data is outside thresholds DMA capability Interrupt sources with flags. Temperature sensor The temperature sensor (TS) generates a voltage that varies linearly with temperature. The temperature sensor is internally connected to the ADC input channel, which is used to convert the sensor output voltage into a digital value. To improve the accuracy of the temperature sensor measurement, each device is individually factory-calibrated by ST. The temperature sensor factory calibration data are stored by ST in the system memory area, accessible in read-only mode. DS13819 - Rev 2 page 16/63 BlueNRG-LPS True random number generator (RNG) 1.16 True random number generator (RNG) RNG is a random number generator based on a continuous analog noise that provides a 16-bit value to the host when read. The minimum period is 1.25 us, corresponding to 20 RNG clock cycles between two consecutive random number. 1.17 Timers and watchdog The BlueNRG-LPS includes three general-purpose timers, one watchdog timer and a SysTick timer. 1.17.1 General-purpose timers (TIM2, TIM16, TIM17) There are up to three general-purpose timers embedded in the BlueNRG-LPS. Each general-purpose timer can be used to generate PWM outputs, or act as a simple time base. • TIM2 • – Full-featured general-purpose timer – Features four independent channels for input capture/output compare, PWM or one-pulse mode output – Independent DMA request generation, support of quadrature encoders TIM16 and TIM17 – – – – – – 1.17.2 General-purpose timers with mid-range features: 16-bit auto-reload upcounters and 16-bit prescalers 1 channel and 1 complementary channel All channels can be used for input capture/output compare, PWM or one-pulse mode output The timers have independent DMA request generation The timers are internally connected to generate an infrared interface (IRTIM) for remote control Independent watchdog (IWDG) The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It is clocked from the LS clock and it can operate in DEEPSTOP mode. It can also be used as a watchdog to reset the device when a problem occurs. 1.17.3 SysTick timer This timer is dedicated to real-time operating systems, but could also be used as a standard down counter. It features: • • • 1.18 A 24-bit down counter Autoreload capability Maskable system interrupt generation when the counter reaches 0 Real-time clock (RTC) The RTC is an independent BCD timer/counter. The RTC provides a time of day/clock/calendar with programmable alarm interrupt. RTC includes also a periodic programmable wake-up flag with interrupt capability. The RTC provides an automatic wake-up to manage all low power modes. Two 32-bit registers contain seconds, minutes, hours (12- or 24-hour format), day (day of week), date (day of month), month, and year, expressed in binary coded decimal format (BCD). The sub-second value is also available in binary format. Compensations for 28-, 29- (leap year), 30-, and 31-day months are performed automatically. Daylight saving time compensation can also be performed. Additional 32-bit registers contain the programmable alarm sub seconds, seconds, minutes, hours, day, and date. A digital calibration circuit with 0.95 ppm resolution is available to compensate for quartz crystal inaccuracy. After power-on reset, all RTC registers are protected against possible parasitic write accesses. As long as the supply voltage remains in the operating range, the RTC never stops, regardless of the device status (RUN mode, low power mode or under system reset). The RTC counter does not freeze when CPU is halted by a debugger. 1.19 Inter-integrated circuit interface (I2C) The BlueNRG-LPS embeds one I2Cs. The I2C bus interface handles communications between the microcontroller and the serial I2C bus. It controls all I2C bus-specific sequencing, protocol, arbitration and timing. DS13819 - Rev 2 page 17/63 BlueNRG-LPS Universal synchronous/asynchronous receiver transmitter (USART) The I2C peripheral supports: • I2C bus specification and user manual rev. 5 compatibilities: • – Slave and master modes – Multimaster capability – Standard-mode (Sm), with a bitrate up to 100 kbit/s – Fast-mode (Fm), with a bitrate up to 400 kbit/s – Fast-mode Plus (fm+), with a bitrate up to 1 Mbit/s and 20 mA output driver I/Os – 7-bit and 10-bit addressing mode – Multiple 7-bit slave addresses (2 addresses, 1 with configurable mask) – All 7-bit address acknowledge mode – General call – Programmable setup and hold times – Easy to use event management – Optional clock stretching – Software reset System management Bus (SMBus) specification rev 2.0 compatibility: – – – – – • Power system management protocol (PMBusTM) specification rev 1.1 compatibility • Independent clock: a choice of independent clock sources allowing the I2C communication speed to be independent from the PCLK reprogramming Programmable analog and digital noise filters 1-byte buffer with DMA capability • • 1.20 Hardware PEC (Packet Error Checking) generation and verification with ACK control Address resolution protocol (ARP) support Host and device support SMBus alert Timeouts and idle condition detection Universal synchronous/asynchronous receiver transmitter (USART) USART offers flexible full-duplex data exchange with external equipment requiring an industry standard NRZ asynchronous serial data format. USART is able to communicate with a speed up to 2 Mbit/s. Furthermore, USART is able to detect and automatically set its own baud rate, based on the reception of a single character. The USART peripheral supports: • • • • • • • • • Synchronous one-way communication Half-duplex single wire communication Local interconnection network (LIN) master/slave capability Smart card mode, ISO 7816 compliant protocol IrDA (infrared data association) SIR ENDEC specifications Modem operations (CTS/RTS) RS485 driver enable Multiprocessor communications SPI-like communication capability High speed data communication is possible by using DMA (direct memory access) for multibuffer configuration. 1.21 LPUART The device embeds one low-power UART, enabling asynchronous serial communication with minimum power consumption. The LPUART supports half duplex single wire communication and modem operations (CTS/RTS), allowing multiprocessor communication. The LPUART has a clock domain independent from the CPU clock, and can wake up the system from DEEPSTOP mode using baud rates up to 9600 baud. The wake-up events from Stop mode are programmable and can be: DS13819 - Rev 2 page 18/63 BlueNRG-LPS Serial peripheral interface (SPI) • • • Start bit detection Any received data frame A specific programmed data frame Only a 32.768 kHz clock (LSE) is needed to allow LPUART communication up to 9600 baud. Therefore, even in DEEPSTOP mode, the LPUART can wait for an incoming frame while having an extremely low energy consumption. Higher speed clock can be used to reach higher baud rates in RUN mode. The LPUART interfaces can be served by the DMA controller. 1.22 Serial peripheral interface (SPI) The BlueNRG-LPS has one SPI interface (SPI3) allowing communication up to 32 Mbit/s in both master and slave modes. The SPI peripheral supports: • • • • • • • • • • Master or slave operation Multimaster support Full-duplex synchronous transfers on three lines Half-duplex synchronous transfer on two lines (with bidirectional data line) Simplex synchronous transfers on two lines (with unidirectional data line) Serial communication with external devices NSS management by hardware or software for both master and slave: dynamic change of master/slave operations SPI Motorola support SPI TI mode support Hardware CRC feature for reliable communication All SPI interfaces can be served by the DMA controller. 1.23 Inter-IC sound (I2S) The BlueNRG-LPS SPI interface SPI3 supports the I2S protocol. The I2S interface can operate in slave or master mode with half-duplex communication. It can address four different audio standards: • • • • Philips I2S standard MSB-justified standards (left-justified) LSB-justified standards (right-justified) PCM standard. The I2S interfaces DMA capability for transmission and reception. 1.24 Serial wire debug port The BlueNRG-LPS embeds an ARM SWD interface that allows interactive debugging and programming of the device. The interface is composed of only two pins: SWDIO and SWCLK. The enhanced debugging features for developers allow up to 4 breakpoints and up to 2 watchpoints. 1.25 TX and RX event alert The BlueNRG-LPS is provided with the TX_SEQUENCE and RX_SEQUENCE signals which alert, respectively, transmission and reception activities. A signal can be enabled for TX and RX on two pins, through alternate functions: • • TX_SEQUENCE is available on PA10 (AF2) or PB14 (AF1). RX_SEQUENCE is available on PA8 (AF2) or PA11 (AF2). The signal is high when radio is in TX (or RX), low otherwise. The signals can be used to control external antenna switching and support coexistence with other wireless technologies. Note: DS13819 - Rev 2 The RF_ACTIVITY signal is used to notify if there is an ongoing RF operation ( either TX or RX). It is a logical OR between the RX_SEQUENCE and TX_SEQUENCE. This signal can be used to enable an antenna switch component when achieving antenna switching during AoA or AoD operation. page 19/63 BlueNRG-LPS Direction finding 1.26 Direction finding The BlueNRG-LPS Bluetooth radio controller supports the angle of arrival (AoA) and angle of departure (AoD) features by managing: • • the constant tone extension (CTE) inside a packet the antenna switching mechanism for both AoA and AoD. The antenna switching mechanism provides a 7-bit antenna identifier ANTENNA_ID[6:0] indicating the antenna number to be used. In a AoD transmitter or in a AoA receiver, the radio needs to switch antenna during the CTE field of the packet. For this purpose, the ANTENNA_ID signal can be enabled on some I/Os, by programming them in the associated alternate function. This signal needs to be provided to an external antenna switching circuit, since ANTENNA_ID[0] is the least significant bit and ANTENNA _ID[6] the most significant bit of the antenna identifier to be used. DS13819 - Rev 2 page 20/63 BlueNRG-LPS Pinouts and pin description 2 Pinouts and pin description The BlueNRG-LPS comes in two package versions: WLCSP36 offering 20 GPIOs and QFN32 offering 20 GPIOs. Figure 7. Pinout top view (QFN32 package) VDD1 PB4 PB5 RSTN VCAP VFBSD VSS VLXSD 32 31 30 29 28 27 26 25 PB3 1 24 VDDSD PB2 2 23 PB6 PB1 3 22 PB7 PB0 4 21 AT3/PB12/XTALO GND PAD DS13819 - Rev 2 PA3 5 20 AT2/PB13/XTALI PA2 6 19 AT1/PB14 PA1 7 18 AT0/PB15 PA0 8 17 9 10 11 12 13 14 PA8 PA9 PA10 PA11 VDD2 RF1 15 OSCIN 16 VDDRF OSCOUT page 21/63 BlueNRG-LPS Pinouts and pin description Figure 8. Pinout bump side view (WLCSP36 package) DS13819 - Rev 2 page 22/63 BlueNRG-LPS Pinouts and pin description Table 3. Pins description Pin number Pin name (function Pin type I/O structure after reset) Alternate functions Additional functions FT_a USART_CTS, LPUART_TX, SPI3_SCK, TIM2_CH4, TIM17_CH1, ANTENNA_ID[3], I2S3_SCK ADC_VINP0, wakeup I/O FT_a USART_RTS_DE, TIM2_CH3, TIM16_BK ADC_VINM0, wakeup PB1 I/O FT_a USART_CK, TIM2_ETR, TIM16_CH1N, ANTENNA_ID[1] ADC_VINP1, wakeup D7 PB0 I/O FT_a USART_RX, LPUART_RTS_DE, TIM16_CH1, ANTENNA_ID[0] ADC_VINM1, wakeup 5 H5 PA3 I/O FT_a SWCLK, USART_RTS_DE, SPI3_SCK, TIM2_CH2, TIM16_CH1N, I2S3_SCK ADC_VINP2, wakeup 6 G6 PA2 I/O FT_a SWDIO, USART_CK, SPI3_MCK, TIM2_CH1, TIM16_CH1, I2S3_MCK ADC_VINM2, wakeup 7 F7 PA1 I/O FT_f I2C1_SDA, IR_OUT, USART_TX, TIM2_CH4 Wakeup 8 H7 PA0 I/O FT_f I2C1_SCL, USART_CTS, IR_OUT, TIM2_CH3 Wakeup 9 M7 PA8 I/O FT USART_RX, RX_SEQUENCE, SPI3_MISO, TIM2_CH3, TIM16BK, I2S3_MISO Wakeup, RTC_OUT 10 J6 PA9 I/O FT USART_TX, RTC_OUT, SPI3_NSS, TIM2_CH4, TIM17_CH1, I2S3_WS Wakeup 11 K5 PA10 I/O FT LPUART_CTS, TX_SEQUENCE, SPI3_MCK, TIM17_CH1N, I2S3_MCK Wakeup, LCO 12 J4 PA11 I/O FT MCO, RX_SEQUENCE, SPI3_MOSI, TIM17_BK, I2S3_SD Wakeup 13 A6 VDD2 S - - 1.7-3.6 battery voltage input 14 M5 RF1 I/O RF - RF input/output. Impedance 50 Ω 15 L2 VDDRF S - - 1.7-3.6 battery voltage input 16 M1 OSCOUT I/O FT_a - 32 MHz crystal 17 K1 OSCIN I/O FT_a - 32 MHz crystal 18 F3 PB15 I/O FT_a USART_RX Wakeup 19 E2 PB14 I/O FT_a TX_SEQUENCE, I2C1_SDA, TIM2_ETR, MCO, USART_RX PVD_IN, Wakeup 20 D3 PB13 I/O FT_a TIM2_CH4 SXTAL1, Wakeup 21 C2 PB12 I/O FT_a LPUART_CTS, LCO, TIM2_CH3 SXTAL0, Wakeup 22 E4 PB7 I/O FT_f USART_CTS, I2C1_SDA, LPUART_RX, TIM2_CH2, RF_ACTIVITY Wakeup 23 C4 PB6 I/O FT_f I2C1_SCL, LPUART_TX, TIM2_CH1, TIM17_CH1, ANTENNA_ID[6] Wakeup 24 B1 VDDSD S - - 1.7-3.6 battery voltage input 25 D1 VLXSD S - - SMPS input/output QFN32 WLCSP36 1 C6 PB3 I/O 2 D5 PB2 3 E6 4 DS13819 - Rev 2 page 23/63 BlueNRG-LPS Pinouts and pin description Pin number QFN32 Pin name (function Pin type I/O structure after reset) WLCSP36 Alternate functions Additional functions 26 A2 VSSSD S - - SMPS Ground 27 B3 VFBSD S - - SMPS output 28 A4 VDDA_VCAP S - - 1.2 V digital core 29 B5 RSTN I/O RST 30 G4 PB5 I/O FT_a LPUART_RX, TIM2_CH2, TIM17_BK, ANTENNA_ID[5] Wakeup, ADC_VINP3 31 F5 PB4 I/O FT_a LPUART_TX, TIM2_CH1, TIM17_CH1N, ANTENNA_ID[4] Wakeup, ADC_VINM3 32 - VDD1 S - - 1.7-3.6 battery voltage input - B7 VSSA S - - Ground analog ADC core - k7 VSSIO S - - Ground I/O - L6 VSSIFADC S - - Ground analog RF - H1 VSSSX S - - Ground analog RF - L4 VSSRFTRX S - - Ground analog RF Exposed pad - GND S - - Ground Reset pin Table 4. Legend/abbreviations used in the pinout table Name Abbreviation Pin name Pin type I/O structure Definition Unless otherwise specified in brackets below, the pin name and the pin function during and after reset are the same as the actual pin name S Supply pin I Input only pin I/O Input / output pin FT 5 V tolerant I/O TT 3.6 V tolerant I/O RF RF I/O RST Bidirectional reset pin with weak pull-up resistor Options for TT or FT I/Os Notes Pin functions _f(1). I/O, Fm+ capable _a(2). I/O, with analog switch function supplied by IO BOOSTER(3) Unless otherwise specified by a note, all I/Os are set as analog inputs during and after reset Alternate functions Functions selected through GPIOx_AFR registers Additional functions Functions directly selected/enabled through peripheral registers 1. The related I/O structures in Table 3. Pins description are: FT_f 2. The related I/O structures in Table 3. Pins description are: FT_a 3. IO BOOSTER block allows the good behavior of those switches to be guaranteed when the VBAT goes below 2.7 V. DS13819 - Rev 2 page 24/63 BlueNRG-LPS Pinouts and pin description Table 5. Alternate function port A AF0 Port Port A AF1 I2C1/ SYS_AF/ USART AF2 IR/LPUART/USART IR/RTC USART/RF AF3 AF4 SPI3 TIM2 AF5 AF6 AF7 SYS_AF TIM16/TIM17 SYS_AF PA0 I2C1_SCL USART_CTS IR_OUT - TIM2_CH3 - - - PA1 I2C1_SDA IR_OUT USART_TX - TIM2_CH4 - - - PA2 SWDIO USART_CK - SPI3_MCKK / I2S3_MCK TIM2_CH1 SWDIO TIM16_CH1 SWDIO PA3 SWCLK USART_RTS_DE - SPI3_SCK / I2S3_SCK TIM2_CH2 SWCLK TIM16_CH1N SWCLK PA8 USART_RX - RX_SEQUENCE SPI3_MISO / I2S3_MISO TIM2_CH3 - TIM16_BK - PA9 USART_TX - RTC_OUT SPI3_NSS / I2S3_WS TIM2_CH4 - TIM17_CH1 - PA10 - LPUART_CTS TX_SEQUENCE SPI3_MCK / I2S3_MCK - - TIM17_CH1N - PA11 MCO - RX_SEQUENCE SPI3_MOSI / I2S3_SD - - TIM17_BK - Table 6. Alternate function port B AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 I2C1/ USART/ LPUART SYS_AF/ LPUART LPUART/TIM2 TIM16/RIM17 TIM2/SYS_AF/ LPUART TIM2 - RF/USART - PB0 USART_RX LPUART_RTS_DE TIM16_CH1 - - - ANTENNA_ID[0] - PB1 USART_CK - TIM16_CH1N TIM2_ETR - - ANTENNA_ID[1] - PB2 USART_RTS_DE - TIM16_BK TIM2_CH3 - - ANTENNA_ID[2] - PB3 USART_CTS LPUART_TX TIM17_CH1 TIM2_CH4 SPI3_SCK / I2S3_SCK - ANTENNA_ID[3] - PB4 LPUART_TX - TIM17_CH1N - TIM2_CH1 - ANTENNA_ID[4] - PB5 LPUART_RX - TIM17_BK - TIM2_CH2 - ANTENNA_ID[5] - PB6 I2C1_SCL - TIM17_CH1 LPUART_TX TIM2_CH1 - ANTENNA_ID[6] - PB7 I2C1_SDA - USART_CTS LPUART_RX TIM2_CH2 - RF_ACTIVITY - PB12 - LCO LPUART_CTS - TIM2_CH3 - - - PB13 - - - - TIM2_CH4 - - - PB14 I2C1_SMBA TX_SEQUENCE TIM2_ETR MCO - - USART_RX - PB15 - - - - - - USART_TX - Port Port B DS13819 - Rev 2 page 25/63 BlueNRG-LPS Memory mapping 3 Memory mapping Program memory, data memory and registers are organized within the same linear 4-Gbyte address space. Figure 9. Memory map 0x8FFF FFFF 0xFFFF FFFF Reserved Reserved (Error) APB2 (RF) 0x6000 0000 0xE00F FFFF 0xE000 0000 0x6002 0000 Cortex®-M0+ Internal Peripherals 0x4890 0000 0x4800 0000 0x4102 0000 0x4100 0000 Reserved (Error) 0x4002 0000 0x4000 0000 Reserved AHB0 Reserved (Error) APB1 Reserved (Error) APB0 0x8FFF FFFF 0x2FFF FFFF Reserved (Error) Peripherals 0x2000 6000 SRAM1 (12kB) 0x2000 3000 0x2000 0000 0x4000 0000 SRAM0 (12kB) Reserved (Error) 0x1006 FFFF Reserved (Error) 0x2FFF FFFF Main FLASH (192kB) SRAM 0x1004 0000 0x2000 0000 Reserved 0x1006 FFFF Reserved 0x1000 0000 Reserved (Error) CODE 0x0000 3FFF 0x0000 0000 Cortex®-M0+, Flash or SRAM0, depending on REMAP configuration 0x0000 0000 DS13819 - Rev 2 page 26/63 BlueNRG-LPS Application circuits 4 Application circuits The schematics below are purely indicative. Figure 10. Application circuit: DC-DC converter, WLCSP36 package VDD VDD C1 C3 C2 C4 VDD C5 C7 D7 E6 D5 C6 F5 G4 C4 E4 E2 D3 C2 F3 XTAL_LS B5 L2 BlueNRG-L PS PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 AT1_PB14 AT2_PB13 AT3_PB12 AT0_PB15 F1 C16 L1 D1 C8 NC C9 A1 L3 C10 L4 M5 RF1 C13 C11 C12 C14 A2 K7 L4 L6 H1 B7 C15 B3 VFBSD VLXSD VSSSD VSSIO VSS_FTRX VSS_IFADC VSSSX VSSA X1 RSTN PA0 PA1 PA2 PA3 PA8 PA9 PA10 PA11 VDDA_VCAP H7 F7 G6 H5 M7 J6 K5 J4 VDDSD VDD2 VDDRF U1 A4 B1 A6 L2 C6 K1 OSCIN X2 M1 OSCOUT XTAL_HS _ BlueNRG-LPS CSP36 Figure 11. Application circuit: DC-DC converter, QFN32 package X1 C15 V DD C5 C6 C8 C9 V DD 25 26 27 28 29 C7 30 31 32 V L X SD V SS V FBSD V CA P RSTN PB5 PB4 V DD1 XTAL_HS V DD SD PB6 PB7 AT3/PB12/X TA L0 AT2/PB13/X TA L1 AT1/PB14 AT0/PB15 OSCIN L1 24 23 22 21 20 19 18 17 X2 U1 L2 XTAL_LS C16 BlueNRG-LPS C3 OSCOUT V DDRF RF1 V DD2 PA 11 PA 10 PA 9 PA 8 DS13819 - Rev 2 A1 C10 L4 C13 C11 C12 C14 V DD C2 PB3 PB2 PB1 PB0 PA 3 PA 2 PA 1 PA 0 GND 1 2 3 4 5 6 7 8 33 C4 L3 16 15 14 13 12 11 10 9 C1 C15 V DD BlueNRG-L PS_QFN32 page 27/63 BlueNRG-LPS Application circuits Table 7. Application circuit external components Note: DS13819 - Rev 2 Component Description C1 Decoupling capacitor C2 Decoupling capacitor C3 Decoupling capacitor C4 Decoupling capacitor C5 Decoupling capacitor C6 Decoupling capacitor C7 Main LDO capacitor C8 DC–DC converter output capacitor C9 DC–DC converter output capacitor C10 DC block capacitor C12 RF Matching capacitor C13 RF Matching capacitor C14 RF Matching capacitor C15 32 kHz crystal loading capacitor C16 32 kHz crystal loading capacitor L1 DC-DC converter output inductor L2 DC-DC converter noise filter L3 RF matching inductor L4 RF matching inductor X1 Low speed crystal X2 High speed crystal U1 BlueNRG-LPS In order to make the board DC–DC OFF, the inductance L1 must be removed and the supply voltage must be applied to the VFBSD pin. page 28/63 BlueNRG-LPS Electrical characteristics 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referenced to ground (GND). 5.1.1 Minimum and maximum values Unless otherwise specified, the minimum and maximum values are guaranteed in the following standard conditions: • Ambient temperature is TA = 25 °C • Supply voltage is VDD: 3.3 V • • System clock frequency is 32 MHz (clock source HSI) SMPS clock frequency is 4 MHz Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean ±3σ). 5.1.2 Typical values Unless otherwise specified, typical data are based on TA = 25 °C, VDD = 3.3 V. They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean ± 2σ). 5.1.3 Typical curves Unless otherwise specified, all typical curves are only given as design guidelines and are not tested. 5.1.4 Loading capacitor The loading conditions used for pin parameter measurement are shown in the figure below. Figure 12. Pin loading conditions DS13819 - Rev 2 page 29/63 BlueNRG-LPS Absolute maximum ratings 5.1.5 Pin input voltage The input voltage measurement on a pin of the device is described in the figure below. Figure 13. Pin input voltage 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in the tables below, may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 8. Voltage characteristics Symbol VDD1, VDD2, VDD3, VDD4, VDDRF, VDDSD VDDA_VCAP FXTALOUT, FXTALIN PA0 to PA15, PB0 to PB15 Max. DC-DC converter supply voltage input and output -0.3 +3.9 DC voltage on linear voltage regulator -0.3 +1.32 DC Voltage on HSE -0.3 1.32 -0.3 +3.9 DC voltage on digital input/output pins DC voltage on analog pins XTAL0/PB12, XTAL1/PB13 DC voltage on XTAL pins |ΔVDD| DS13819 - Rev 2 Min. VLXSD, VFBSD RF1 Note: Ratings DC voltage on RF pin Variations between different VDDX power pins of the same domain -0.3 Unit V +3.6 +1.4 50 mV All the main power and ground pins must always be connected to the external power supply, in the permitted range. page 30/63 BlueNRG-LPS Operating conditions Table 9. Current characteristics Symbol Ratings Max. ΣIVDD Total current into sum of all VDD power lines (source) 130 ΣIVGND Total current out of sum of all ground lines (sink) 130 IVDD(PIN) Maximum current into each VDD power pin (source) 100 IVGND(PIN) Maximum current out of each ground pin (sink) 100 Output current sunk by any I/O and control pin 20 Output current sourced by any I/O and control pin 20 Total output current sunk by sum of all I/Os and control pins 100 Total output current sourced by sum of all I/Os and control pins 100 Total injected current (sum of all I/Os and control pins) -5/0 IIO(PIN) ΣIIO(PIN) Σ|IINJ(PIN)| Unit mA Table 10. Thermal characteristics Symbol Ratings Value TSTG Storage temperature range -40 to -125 TJ Maximum junction temperature 125 5.3 Operating conditions 5.3.1 Summary of main performance Unit °C Table 11. Main performance SMPS ON Symbol ICORE DS13819 - Rev 2 Parameter Core current consumption Typ. Typ. VDD = 1.8 V VDD = 3.3 V SHUTDOWN 8 19 DEEPSTOP, no timer, wake-up GPIO, RAM0 retained 0.6 0.61 DEEPSTOP, no timer, wakeup GPIO, all RAM retained 0.63 0.64 DEEPSTOP (32 kHz LSI), RAM0 retained 1.06 1.12 DEEPSTOP (32 kHz LSI), all RAMs retained 1.09 1.15 DEEPSTOP (32 kHz LSE), RAM0 retained 0.85 0.96 DEEPSTOP (32 kHz LSE), all RAM retained 0.88 0.99 Test conditions Unit nA µA CPU in RUN (64 MHz). Dhrystone, clock source PLL64 2638 CPU in RUN (32 MHz). Dhrystone, clock source PLL64 2186 CPU in WFI (64 MHz), all peripherals off, clock source PLL64 1688 uA page 31/63 BlueNRG-LPS Operating conditions Symbol ICORE IDYNAMIC DS13819 - Rev 2 Parameter Core current consumption Dynamic current Test conditions Typ. Typ. VDD = 1.8 V VDD = 3.3 V CPU in WFI (16 MHz), all peripherals off, clock source Direct HSE 1000 Radio RX at sensitivity level 3350 Radio TX 0 dBm output power 4300 Radio RX at sensitivity level with CPU in WFI (32MHz), clock source Direct HSE 4950 Radio TX 0 dBm output power with CPU in WFI (32MHz), clock source Direct HSE 5600 Computed value: (CPU 64 MHz Dhrystone - CPU 32 MHz Dhrystone) / 32 14 Unit uA µA/MHz page 32/63 BlueNRG-LPS Operating conditions Table 12. Main performance SMPS bypassed Symbol ICORE DS13819 - Rev 2 Parameter Core current consumption Typ. Typ. VDD = 1.8 V VDD = 3.3 V SHUTDOWN 8 19 DEEPSTOP, no timer, wake-up GPIO, RAM0 retained 0.6 0.61 DEEPSTOP, no timer, wake-up GPIO, all RAM retained 0.63 0.64 DEEPSTOP (32 kHz LSI), RAM0 retained 1.06 1.12 DEEPSTOP (32 kHz LSI), all RAMs retained 1.09 1.15 DEEPSTOP (32 kHz LSE ), RAM0 retained 0.85 0.96 DEEPSTOP (32 kHz LSE), all RAM retained 0.88 0.99 Test conditions CPU in RUN (64 MHz). Dhrystone, clock source PLL64 4450 CPU in WFI (64 MHz), all peripherals off, clock source PLL64 2313 CPU in WFI (16 MHz), all peripherals off, clock source Direct HSE 700 Radio RX at sensitivity level 6700 Radio TX 0 dBm output power 8900 Radio RX at sensitivity level with CPU in WFI (32MHz), clock source Direct HSE 9200 Radio TX 0 dBm output power with CPU in WFI (32MHz), clock source Direct HSE 11000 Unit nA µA page 33/63 BlueNRG-LPS Operating conditions Table 13. Peripheral current consumption at VDD = 3.3 V, system clock (CLK_SYS), SMPS on Parameter 5.3.2 Test conditions Typ. ADC 39 DMA 37 GPIOA 2 GPIOB 2 I2C1 38 IWDG 9 LPUART 53 PKA 25 RNG 88 RTC 12 SPI3/I2S3 46 Systick 10 TIM2 140 TIM16 87 TIM17 87 USART 79 SYSCFG 22 CRC 8 Unit µA General operating conditions Table 14. General operating conditions Symbol Parameter fHCLK Min. Max. Internal AHB clock frequency 1 64 fPCLK0 Internal APB0 clock 1 64 fPCLK1 Internal APB1 clock frequency 1(1) 64 fPCLK2 Internal APB2 clock frequency 16 32 VDD Standard operating voltage 1.7 3.6 VFBSMPS SMPS feedback voltage 1.4 3.6 VDDRF Minimum RF voltage 1.7 3.6 VIN I/O input voltage -0.3 VDD+0.3 PD Power dissipation at TA=105 Conditions °C(2) TA Ambient temperature TJ Junction temperature range QFN32 package Maximum power dissipation Unit MHz V 30 mW -40 105 °C -40 105 1. It could be 0 if all the peripherals are disabled. 2. TA cannot exceed TJ max. 5.3.3 RF general characteristics All performance data are referred to a 50 Ω antenna connector, via reference design. DS13819 - Rev 2 page 34/63 BlueNRG-LPS Operating conditions Table 15. Bluetooth Low Energy RF general characteristics Symbol Parameter FRANGE Frequency Test conditions Min. Typ. range(1) Max. Unit 2400 2483.5 2402 2480 MHz RFCH RF channel center frequency(1) PLLRES RF channel spacing(1) 2 MHz ΔF Frequency deviation(1) 250 kHz Δf1 Frequency deviation average(1) 450 During the packet and including both initial frequency offset and drift 550 kHz ±150 kHz 2 Mbps ±50 ppm CFdev Center frequency deviation(1) Δfa Frequency deviation Δf2 (average) / Δf1 (average)(1) 0.80 Rgfsk On-air data rate(1) 1 STacc Symbol time accuracy(1) MOD Modulation scheme BT Bandwidth-bit period product Mindex Modulation index(1) PMAX Maximum output At antenna connector, VSMPS = 1.9 V, LDO code +8 dBm PMIN Minimum output At antenna connector -20 dBm PRFC RF power accuracy @ 27 °C ±1.5 All temperatures ±2.5 GFSK 0.5 0.45 0.5 0.55 dB 1. Tested according to Bluetooth SIG radio frequency physical layer (RF PHY) test suite (not tested in production). 5.3.4 RF transmitter characteristics All performance data are referred to a 50 Ω antenna connector, via reference design. Table 16. Bluetooth Low Energy RF transmitter characteristics at 1 Mbps not coded Symbol Parameter Test conditions PBW1M 6 dB bandwidth for modulated carrier Using resolution bandwidth of 100 kHz PRF1, 1 Ms/s In-band emission at ±2 MHz(1) Using resolution bandwidth of 100 kHz and average detector -20 dBm PRF2, 1 Ms/s In-band emission at ±[3+n]MHz, where n=0,1,2..(1) Using resolution bandwidth of 100 kHz and average detector -30 dBm PSPUR Spurious emission Harmonics included. Using resolution bandwidth of 1 MHz and average detector -41 dBm Freqdrift Frequency drift(1) Integration interval #n – integration interval #0, where n=2,3,4..k -50 +50 kHz IFreqdrift Initial carrier frequency drift(1) Integration interval #1 – integration interval #0 -23 +23 kHz IntFreqdrift Intermediate carrier frequency drift(1) Integration interval #n – integration interval #(n-5), where n=6,7,8..k -20 +20 kHz Drift Rate max Maximum drift rate(1) Between any two 10-bit groups separated by 50 µs -20 +20 kHz/50 µs ZRF1 DS13819 - Rev 2 Optimum RF load (impedance at RF1 pin) @ 2440 MHz Min. Typ. Max. Unit 500 kHz 40 Ω page 35/63 BlueNRG-LPS Operating conditions 1. Tested according to Bluetooth SIG radio frequency physical layer (RF PHY) test suite (not tested in production). Table 17. Bluetooth Low Energy RF transmitter characteristics at 2 Mbps not coded Symbol Parameter Test conditions PBW1M 6 dB bandwidth for modulated carrier Using resolution bandwidth of 100 kHz PRF1, 2 Ms/s In-band emission at ±4 MHz(1) Using resolution bandwidth of 100 kHz and average detector -20 dBm PRF2, 2 Ms/s In-band emission at±5 MHz(1) Using resolution bandwidth of 100 kHz and average detector -20 dBm PRF3, 2 Ms/s In-band emission at ±[6+n]MHz, where n=0,1,2..(1) Using resolution bandwidth of 100 kHz and average detector -30 dBm PSPUR Spurious emission Harmonics included. Using resolution bandwidth of 1 MHz and average detector -41 dBm Freqdrift Frequency drift(1) Integration interval #n – integration interval #0, where n=2,3,4..k -50 +50 kHz IFreqdrift Initial carrier frequency drift(1) Integration interval #1 – integration interval #0 -23 +23 kHz IntFreqdrift Intermediate carrier frequency drift(1) Integration interval #n – integration interval #(n-5), where n=6,7,8..k -20 +20 kHz DriftRatemax Maximum drift rate(1) Between any two 20-bit groups separated by 50 µs -20 +20 kHz/50µs Optimum RF load ZRF1 (impedance at RF1 pin) Min. Typ. Max. Unit 670 kHz @ 2440 MHz 40 Ω 1. Tested according to Bluetooth SIG radio frequency physical layer (RF PHY) test suite (not tested in production). Table 18. Bluetooth Low Energy RF transmitter characteristics at 1 Mbps LE coded (S=8) Symbol Parameter Test conditions PBW 6 dB bandwidth for modulated carrier Using resolution bandwidth of 100 kHz PRF1, LE coded In-band emission at ±2 MHz(1) Using resolution bandwidth of 100 kHz and average detector -20 dBm PRF2, LE coded In-band emission at ±[3+n] MHz, where n=0,1,2..(1) Using resolution bandwidth of 100 kHz and average detector -30 dBm PSPUR Spurious emission Harmonics included. Using resolution bandwidth of 1 MHz and average detector -41 dBm Freqdrift Frequency drift(1) Integration interval #n – integration interval #0, where n=1,2,3..k -50 +50 kHz IFreqdrift Initial carrier frequency drift(1) Integration interval #3 – integration interval #0 -19.2 +19.2 kHz IntFreqdrift Intermediate carrier frequency drift(1) Integration interval #n – integration interval #(n-3), where n=7,8,9..k -19.2 +19.2 kHz DriftRatemax Maximum drift rate(1) Between any two 16-bit groups separated by 48 µs -19.2 +19.2 kHz/48 µs ZRF1 Optimum RF load (Impedance at RF1 pin) @ 2440 MHz Min. Typ. Max. Unit 500 kHz 40 Ω 1. Tested according to Bluetooth SIG radio frequency physical layer (RF PHY) test suite (not tested in production). 5.3.5 RF receiver characteristics All performance data are referred to a 50 Ω antenna connector, via reference design. DS13819 - Rev 2 page 36/63 BlueNRG-LPS Operating conditions Table 19. Bluetooth Low Energy RF receiver characteristics at 1 Msym/s uncoded Symbol Parameter Test conditions RXSENS Sensitivity PER < 30.8% PSAT Saturation ZRF1 Optimum RF source (impedance at RF1 pin) Min. Typ. Max. Unit - -97 dBm PER < 30.8% 8 dBm @ 2440 MHz 40 Ω Wanted signal = -67 dBm, PER < 30.8% 8 dBc Wanted signal = -67 dBm, PER < 30.8% -1 dBc Wanted signal = -67 dBm, PER < 30.8% -35 dBc Wanted signal = -67 dBm, PER < 30.8% -47 dBc Wanted signal = -67 dBm, PER < 30.8% -25 dBc Wanted signal= -67 dBm, PER < 30.8% -25 dBc RF selectivity with BLE equal modulation on interfering signal C/ICO-channel C/I1 MHz C/I2 MHz Co-channel interference fRX = finterference Adjacent interference finterference = fRX ± 1 MHz Adjacent Interference finterference = fRX ± 2 MHz Adjacent interference C/I3 MHz finterference = fRX ± (3+n) MHz [n = 0,1,2…] C/IImage C/IImage±1 MHz Image frequency interference finterference = fimage Adjacent channel-to-image frequency finterference = fimage ± 1 MHz Out of band blocking (interfering signal CW) C/IBlock Interfering signal frequency 30 MHz – 2000 MHz Wanted signal = -67 dBm, PER < 30.8%, measurement resolution 10 MHz 5 dB C/IBlock Interfering signal frequency 2003 MHz – 2399 MHz Wanted signal = -67 dBm, PER < 30.8%, measurement resolution 3 MHz -5 dB C/IBlock Interfering signal frequency 2484 MHz – 2997 MHz Wanted signal = -67 dBm, PER < 30.8%, measurement resolution 3 MHz -5 dB C/IBlock Interfering signal frequency 3000 MHz – 12.75 GHz Wanted signal = -67 dBm, PER < 30.8%, measurement resolution 25 MHz 10 dB Intermodulation characteristics (CW signal at f1, BLE interfering signal at f2) P_IM(3) Input power of IM interferer at 3 and 6 MHz distance from wanted signal Wanted signal = -64 dBm, PER < 30.8% -27 dBm P_IM(-3) Input power of IM interferer at -3 and -6 MHz distance from wanted signal Wanted signal = -64 dBm, PER < 30.8% -40 dBm P_IM(4) Input power of IM interferer at ±4 and ±8 MHz distance from wanted signal Wanted signal= -64 dBm, PER < 30.8% -32 dBm P_IM(5) Input power of IM interferer at ±5 and ±10 MHz distance from wanted signal Wanted signal = -64 dBm, PER < 30.8% -32 dBm Table 20. Bluetooth Low Energy RF receiver characteristics at 2 Msym/s uncoded Symbol Parameter Test conditions RXSENS Sensitivity PER < 30.8% -94 dBm PSAT Saturation PER < 30.8% 8 dBm @ 2440 MHz 40 Ω ZRF1 DS13819 - Rev 2 Optimum RF source (impedance at RF1 pin) Min. Typ. Max. Unit page 37/63 BlueNRG-LPS Operating conditions Symbol Parameter Test conditions Min. Typ. Max. Unit RF selectivity with BLE equal modulation on interfering signal C/ICO-channel C/I2 MHz C/I4 MHz Co-channel interference fRX = finterference Adjacent interference finterference = fRX ± 2 MHz Adjacent interference finterference = fRX ± 4 MHz Wanted signal= -67 dBm, PER < 30.8% 8 dBc Wanted signal = -67 dBm, PER < 30.8% -14 dBc Wanted signal = -67 dBm, PER < 30.8% -41 dBc Wanted signal = -67 dBm, PER < 30.8% -45 dBc Wanted signal = -67 dBm, PER < 30.8% -25 dBc Wanted signal= -67 dBm, PER < 30.8% -14 dBc Adjacent interference C/I6 MHz finterference = fRX ± (6+2n) MHz [n = 0,1,2…] C/IImage C/IImage±1 MHz Image frequency interference finterference = fimage-2M Adjacent channel-to-image frequency finterference = fimage-2M ± 2 MHz Out of band blocking (interfering signal CW) C/IBlock Interfering signal frequency 30 MHz – 2000 MHz Wanted signal= -67 dBm, PER < 30.8%, measurement resolution 10 MHz 5 dB C/IBlock Interfering signal frequency 2003 MHz – 2399 MHz Wanted signal= -67 dBm, PER < 30.8%, measurement resolution 3 MHz -5 dB C/IBlock Interfering signal frequency 2484 MHz – 2997 MHz Wanted signal= -67 dBm, PER < 30.8%, measurement resolution 3 MHz -5 dB C/IBlock Interfering signal frequency 3000 MHz – 12.75 GHz Wanted signal= -67 dBm, PER < 30.8%, measurement resolution 25 MHz 10 dB Intermodulation characteristics (CW signal at f1, BLE interfering signal at f2) DS13819 - Rev 2 P_IM(6) Input power of IM interferer at 6 and 12 MHz distance from wanted signal Wanted signal= -64 dBm, PER < 30.8% -27 dBm P_IM(-6) Input power of IM interferer at -6 and -12 MHz distance from wanted signal Wanted signal= -64 dBm, PER < 30.8% -30 dBm P_IM(8) Input power of IM interferer at ±8 and ±16 MHz distance from wanted signal Wanted signal= -64 dBm, PER < 30.8% -30 dBm P_IM(10) Input power of IM interferer at ±10 and ±20 MHz distance from wanted signal Wanted signal= -64 dBm, PER < 30.8% -28 dBm page 38/63 BlueNRG-LPS Operating conditions Table 21. Bluetooth Low Energy RF receiver characteristics at 1 Msym/s LE coded (S=2) Symbol Parameter Test conditions RXSENS Sensitivity PER < 30.8% PSAT Saturation PER < 30.8% ZRF1 Optimum RF source (impedance at RF1 pin) Min. Typ. Max. Unit -100 dBm 8 dBm 40 Ω Wanted signal = -79 dBm, PER < 30.8% 2 dBc Wanted signal = -79 dBm, PER < 30.8% -5 dBc Wanted signal = -79 dBm, PER < 30.8% -38 dBc Wanted signal = -79 dBm, PER < 30.8% -50 dBc Wanted signal = -79 dBm, PER < 30.8% -30 dBc Wanted signal = -79 dBm, PER < 30.8% -34 dBc - @ 2440 MHz RF selectivity with BLE equal modulation on interfering signal C/ICO-channel C/I1 MHz C/I2 MHz Co-channel interference fRX = finterference Adjacent interference finterference = fRX ± 1 MHz Adjacent interference finterference = fRX ± 2 MHz Adjacent interference C/I3 MHz finterference = fRX ± (3+n) MHz [n = 0,1,2…] C/IImage C/IImage±1 MHz Image frequency interference finterference = fimage Adjacent channel-to-image frequency finterference = fimage ± 1 MHz Table 22. Bluetooth Low Energy RF receiver characteristics at 1 Msym/s LE coded (S=8) Symbol Parameter Test conditions RXSENS Sensitivity PER < 30.8% PSAT Saturation PER < 30.8% ZRF1 Optimum RF source (impedance at RF1 pin) Min. Typ. Max. Unit -104 dBm 8 dBm 40 Ω Wanted signal = -79 dBm, PER < 30.8% 1 dBc Wanted signal = -79 dBm, PER < 30.8% -4 dBc Wanted signal = -79 dBm, PER < 30.8% -39 dBc Wanted signal = -79 dBm, PER < 30.8% -53 dBc Wanted signal = -79 dBm, PER < 30.8% -33 dBc Wanted signal = -79 dBm, PER < 30.8% -32 dBc @ 2440 MHz - RF selectivity with BLE equal modulation on interfering signal C/ICO-channel C/I1 MHz C/I2 MHz Co-channel interference fRX = finterference Adjacent interference finterference = fRX ± 1 MHz Adjacent interference finterference = fRX ± 2 MHz Adjacent interference C/I3 MHz finterference = fRX ± (3+n) MHz [n = 0,1,2…] C/IImage C/IImage ± 1 MHz DS13819 - Rev 2 Image frequency interference finterference = fimage Adjacent channel-to-image frequency finterference = fimage ± 1 MHz page 39/63 BlueNRG-LPS Operating conditions 5.3.6 Embedded reset and power control block characteristics Table 23. Embedded reset and power control block characteristics 5.3.7 Symbol Parameter Test conditions Min. Typ. Max. Unit TRSTTEMPO Reset temporization after PDR is detected VDD rising VPDR Power-down reset threshold VPVD0 PVD0 threshold PVD0 threshold at the falling edge of VDDIO 2.05 VPVD1 PVD1 threshold PVD1 threshold at the falling edge of VDDIO 2.21 VPVD2 PVD2 threshold PVD2 threshold at the falling edge of VDDIO 2.36 VPVD3 PVD3 threshold PVD3 threshold at the falling edge of VDDIO 2.53 VPVD4 PVD4 threshold PVD4 threshold at the falling edge of VDDIO 2.64 VPVD5 PVD5 threshold PVD5 threshold at the falling edge of VDDIO 2.82 VPVD6 PVD6 threshold PVD6 threshold at the falling edge of VDDIO 2.91 VPVD7 PVD threshold for VIN_PVD PVD7 threshold (VBGP) at the falling edge of VIN_PVD 1 500 us 1.58 V Supply current characteristics The current consumption is a function of several parameters and factors such as: the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code. The MCU is put under the following conditions: • • • • All I/O pins are in analog input mode All peripherals are disabled except when explicitly mentioned The Flash memory access time is adjusted with the minimum wait states number When the peripherals are enabled fPCLK = fHCLK Table 24. Current consumption Symbol Parameter Conditions 25 °C 85 °C 105 °C 1821 1863 1898 1594 1634 1669 1481 1521 1554 Clock OFF 654 3930 8870 Clock source LSI 1214 4556 9530 1272 4653 9674 1232 4584 9569 Clock source LSI RTC, LPUART and IWDG ON 1291 4682 9722 Clock source LSE 991 4828 10596 fHCLK = 64 MHz All peripherals disabled IDD(RUN) Supply current in RUN mode fHCLK = 32 MHz All peripherals disabled fHCLK = 16 MHz All peripherals disabled Clock source LSI RTC ON IDD(DEEPSTOP) Supply current in DEEPSTOP(1) Clock source LSI IWDG ON DS13819 - Rev 2 Typ. Unit µA nA page 40/63 BlueNRG-LPS Operating conditions Symbol Parameter Typ. Conditions 25 °C 85 °C 105 °C 1010 4344 9316 971 4277 9242 1076 4458 9426 1150 4585 9646 Clock source LSE RTC ON Clock source LSE IDD(DEEPSTOP) Supply current in IWDG ON DEEPSTOP(1) Clock source LSE. LPUART ON Clock source LSE RTC, LUART and IWDG ON IDD(SHUTDOWN) Supply current in SHUTDOWN 15 350 1090 IDD(RST) Current under reset condition 1098 1160 1230 Unit nA µA 1. The current consumption in DEEPSTOP is measured considering the entire SRAM retained. 5.3.8 Wake-up time from low power modes The wake-up times reported are the latency between the event and the execution of the instruction. The device goes to low-power mode after WFI (wait for interrupt) instructions. Table 25. Low power mode wake-up timing 5.3.9 Symbol Parameter Conditions TWUDEEPSTOP Wake-up time from DEEPSTOP mode to RUN mode Typ. Unit Wake-up from GPIO VDD = 3.3 V Flash memory 170 µs High speed crystal requirements The high speed external oscillator must be supplied with an external 32 MHz crystal that is specified for a 6 to 8 pF loading capacitor. The BlueNRG-LPS includes internal programmable capacitances that can be used to tune the crystal frequency in order to compensate the PCB parasitic one. These internal load capacitors are made by a fixed one, in parallel with a 6-bit binary weighted capacitor bank. Thanks to low CL step size (1-bit is typically 0.07 pF), very fine crystal tuning is possible. With a typical XTAL sensitivity of -14 ppm/pF, it is possible to trim a 32 MHz crystal, with a resolution of 1 ppm. The requirements for the external 32 MHz crystal are reported in the table below. Table 26. HSE crystal requirements Symbol Parameter fNOM Oscillator frequency fTOL Frequency tolerance ESR Conditions Min. Typ. Max. Unit 32 Includes initial accuracy, stability over temperature, aging and frequency pulling due to incorrect load capacitance MHz ±50 ppm Equivalent series resistance 100 Ω PD Drive level 100 µW CL HSE crystal load capacitance 9.2(3) pF CLstep HSE crystal load capacitance 1-bit value 27 °C, typical corner GMCONF = 3 5 (1) 7(2) 27 °C, GMCONF = 3 0.07 pF XOTUNE code between 32 and 33 1. XOTUNE programed at minimum code = 0 2. XOTUNE programed at center code = 32 DS13819 - Rev 2 page 41/63 BlueNRG-LPS Operating conditions 3. XOTUNE programed at maximum code = 63 5.3.10 Low speed crystal requirements Low speed clock can be supplied with an external 32.768 kHz crystal oscillator. Requirements for the external 32.768 kHz crystal are reported in the table below. Table 27. LSE crystal requirements 5.3.11 Symbol Parameter Conditions Min. Typ. Max. fNOM Nominal frequency ESR Equivalent series resistance 90 kΩ PD Drive level 0.1 µW 32.768 Unit kHz High speed ring oscillator characteristics Table 28. HSI oscillator characteristics 5.3.12 Symbol Parameter fNOM Nominal frequency Conditions Min. Typ. Max. 64 Unit MHz Low speed ring oscillator characteristics Table 29. LSI oscillator characteristics 5.3.13 Symbol Parameter Conditions fNOM Nominal frequency ΔFRO_ΔT/FRO Frequency spread vs. temperature Min. Standard deviation Typ. Max. Unit 33 kHz 140 ppm/ºC PLL characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Table 30. PLL characteristics Symbol Parameter Conditions At ±1 MHz offset from carrier Unit -114 dBc/Hz -128 dBc/Hz At ±25 MHz offset from carrier -135 dBc/Hz (measured at 2.4 GHz) At 2.4 GHz±6 MHz offset from carrier (measured at 2.4 GHz) DS13819 - Rev 2 Max. dBc/Hz At 2.4 GHz ±3 MHz offset from carrier RF carrier phase noise Typ. -110 (measured at 2.4 GHz) PNSYNTH Min. LOCKTIMETX PLL lock time to TX With calibration @2.5 ppm 150 µs LOCKTIMERX PLL lock time to RX With calibration @2.5 ppm 110 µs LOCKTIMERXTX PLL lock time RX to TX Without calibration @2.5 ppm 47 µs LOCKTIMETXRX PLL lock time TX to RX Without calibration @2.5 ppm 32 µs page 42/63 BlueNRG-LPS Operating conditions 5.3.14 Flash memory characteristics The characteristics below are guaranteed by design. Table 31. Flash memory characteristics Symbol Parameter tprog Typ. Max. 32-bit programming time 20 40 tprog_burst 4x32-bit burst programming time 4x20 4x40 tERASE Page (2 kbyte) erase time 20 40 tME Mass erase time 20 40 IDD Test conditions Average consumption from VDD Write mode 3 Erase mode 3 Mass erase 5 Unit µs ms mA Table 32. Flash memory endurance and data retention 5.3.15 Symbol Parameter Test conditions Min. Unit NEND Endurance TA = -40 to +105 ºC 10 kcycles tRET Data retention TA = 105 ºC 10 Years Electrostatic discharge (ESD) Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts x (n + 1) supply pins). This test conforms to the ANSI/JEDEC standard. Table 33. ESD absolute maximum ratings Class Max.(1) Unit Symbol Parameter Conditions VESD(HBM) Electrostatic discharge voltage (human body model) Conforming to ANSI/ESDA/JEDEC JS-001 2 2000 VESD(CBM) Electrostatic discharge voltage (charge device model) Conforming to ANSI/ESDA/STM5.3.1 JS-002 C2a 500 V 1. Guaranteed by design. 5.3.16 I/O port characteristics Unless otherwise specified, the parameters given in the tables below are derived from tests performed under the conditions summarized in Table 14. General operating conditions. All I/Os are designed as CMOS-compliant. Table 34. I/O static characteristics Symbol Parameter VIL I/O input low level voltage VIH I/O input high level voltage Ilkg Input leakage current Conditions 1.62 V < VDD < 3.6 V Typ. Max. Unit 0.3 x VDD 0.7 x VDD 0
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