GP19NC60K

STGB19NC60K STGP19NC60K 20 A - 600 V - short circuit rugged IGBT Features ■ ■ ■ ■ Low on-voltage drop (VCE(sat)) Low Cres / Cies ratio (no cross conduction susceptibility) Short circuit withstand time 10 µs IGBT co-packaged with ultra fast free-wheeling diode 3 1 2 3 1 TO-220 D2PAK Applications ■ ■ High frequency inverters Motor drivers Description This IGBT utilizes the advanced PowerMESH™ process resulting in an excellent trade-off between switching performance and low on-state behavior. Figure 1. Internal schematic diagram Table 1. Device summary Marking GB19NC60K GP19NC60K Package D2PAK TO-220 Packaging Tape and reel Tube Order codes STGB19NC60KT4 STGP19NC60K May 2008 Rev 2 1/15 www.st.com 15 Contents STGB19NC60K - STGP19NC60K Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 4 5 6 Test circuits ............................................... 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2/15 STGB19NC60K - STGP19NC60K Electrical ratings 1 Electrical ratings Table 2. Symbol VCES IC IC (1) (1) Absolute maximum ratings Parameter Collector-emitter voltage (VGE = 0) Collector current (continuous) at TC = 25 °C Collector current (continuous) at TC = 100 °C Turn-off latching current Pulsed collector current Gate-emitter voltage Total dissipation at TC = 25 °C Short circuit withstand time, VCE = 0.5 V(BR)CES Tj = 125 °C, RG = 10 Ω, VGE = 12 V Operating junction temperature Value 600 35 20 75 75 ±20 125 10 – 55 to 150 Unit V A A A A V W µs °C ICL (2) ICP (3) VGE PTOT tscw Tj 1. Calculated according to the iterative formula: T J ( MAX ) – T c I c ( T c ) = ------------------------------------------------------------------------------------R thj – c × V CE ( sat ) ( MAX ) ⋅ ( T c ,I c ) 2. Vclamp = 80%,(VCES), Tj =150°C, RG = 10 Ω, VGE = 15 V 3. Pulse width limited by max. junction temperature allowed Table 3. Symbol Thermal resistance Parameter Value 0.95 62.5 Unit °C/W °C/W Rthj-case Thermal resistance junction-case max. Rthj-amb Thermal resistance junction-ambient max. 3/15 Electrical characteristics STGB19NC60K - STGP19NC60K 2 Electrical characteristics (TCASE = 25 °C unless otherwise specified) Table 4. Symbol V(BR)CES Static Parameter Test conditions Min. 600 2.0 1.8 150 1 4.5 6.5 ±100 15 2.75 Typ. Max. Unit V V V µA mA V nA S Collector-emitter breakdown IC = 1 mA voltage (VGE= 0) Collector-emitter saturation voltage Collector cut-off current (VGE = 0) Gate threshold voltage Gate-emitter leakage current (VCE = 0) Forward transconductance VGE = 15 V, IC = 12 A VGE = 15 V, IC = 12 A, Tc = 125 °C VCE = 600 V VCE = 600 V, TC = 125 °C VCE = VGE, IC = 250 µA VGE = ±20 V VCE = 15 V , IC = 12 A VCE(sat) ICES VGE(th) IGES gfs (1) 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5% Table 5. Symbol Cies Coes Cres Qg Qge Qgc Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-emitter charge Gate-collector charge Test conditions Min. Typ. 1170 127 28 55 11 26 Max. Unit pF pF pF nC nC nC VCE = 25 V, f = 1 MHz, VGE = 0 VCE = 480 V, IC = 12 A, VGE = 15 V (see Figure 17) 4/15 STGB19NC60K - STGP19NC60K Electrical characteristics Table 6. Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on tr(Voff) td(off) tf tr(Voff) td(off) tf Switching on/off (inductive load) Parameter Turn-on delay time Current rise time Turn-on current slope Turn-on delay time Current rise time Turn-on current slope Off voltage rise time Turn-off delay time Current fall time Off voltage rise time Turn-off delay time Current fall time Test conditions VCC = 480 V, IC = 12 A , RG = 10 Ω VGE = 15 V, (see Figure 16) VCC = 480 V, IC = 12 A , RG = 10 Ω VGE = 15 V, Tc = 125 °C (see Figure 16) VCC = 480 V, IC = 12 A , RG = 10 Ω VGE = 15 V, (see Figure 16) Vcc = 480 V, IC = 12 A, , RGE = 10 Ω VGE = 15 V Tc = 125 °C (see Figure 16) Min. Typ. 30 8 1450 30 8 1380 35 105 85 65 145 125 Max. Unit ns ns A/µs ns ns A/µs ns ns ns ns ns ns Table 7. Symbol Eon Eoff (1) Ets Eon Eoff (1) Ets Switching energy (inductive load) Parameter Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses Test conditions VCC = 480 V, IC = 12 A , RG = 10 Ω VGE = 15 V, (see Figure 16) VCC = 480 V, IC = 12 A , RG = 10 Ω VGE = 15 V, TC = 125 °C (see Figure 16) Min Typ. 165 255 420 250 445 695 Max Unit µJ µJ µJ µJ µJ µJ 1. Turn-off losses include also the tail of the collector current. 5/15 Electrical characteristics STGB19NC60K - STGP19NC60K 2.1 Figure 2. IC(A) Electrical characteristics (curves) Output characteristics HV43020 Figure 3. Transfer characteristics HV43025 VCE = 15 V IC(A) 100 VGE=15V 100 80 14V 80 13V 60 12V 40 11V 20 10V 9V 0 0 5 10 15 20 25 30 8V VCE(V) 0 0 3 5 8 10 13 15 20 40 60 VGE(V) Figure 4. Gfs(S) 8 7.5 7 6.5 6 5.5 5 4.5 4 3.5 3 2.5 2 1.5 2 Transconductance HV43110 TJ=-50°C Figure 5. VCE(sat) (V) 2.4 2.3 Collector-emitter on voltage vs temperature HV43100_b 25A TJ=25°C 2.1 2.0 1.8 12A TJ=125°C 1.7 1.5 1.4 1.2 6A 4 6 8 10 12 IC(A) -75 -50 -25 0 25 50 75 100 125 150 TJ(°C) Figure 6. Gate charge vs gate-source voltage Figure 7. C(pF) Capacitance variations HV43000 2000 1500 Cies 1000 500 Coes Cres 0 0 10 20 30 40 VCE(V) 6/15 STGB19NC60K - STGP19NC60K Figure 8. Normalized gate threshold voltage vs temperature HV43070 Electrical characteristics Figure 9. VCE(sat) (V) 2.55 2.3 2.05 1.8 1.55 25°C -50°C Collector-emitter on voltage vs collector current HV43090 VGE(th) (norm) 1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0.70 -100 -50 0 IC=250µA 1.3 1.05 0.8 50 100 150 TJ(°C) 125°C 0 5 10 15 20 25 30 35 40 IC(A) Figure 10. Normalized breakdown voltage vs temperature BVCES (norm) Figure 11. Switching losses vs temperature HV43080 1.10 1.08 1.06 1.04 1.02 1.00 0.98 0.96 0.94 -100 IC=250µA -50 0 50 100 150 TJ(°C) Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current 7/15 Electrical characteristics Figure 14. Turn-off SOA STGB19NC60K - STGP19NC60K Figure 15. Thermal impedance 8/15 STGB19NC60K - STGP19NC60K Test circuits 3 Test circuits Figure 17. Gate charge test circuit Figure 16. Test circuit for inductive load switching Figure 18. Switching waveforms 9/15 Package mechanical data STGB19NC60K - STGP19NC60K 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/15 STGB19NC60K - STGP19NC60K Package mechanical data TO-220 mechanical data mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 ∅P Q 4.40 0.61 1.14 0.48 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6 inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116 11/15 Package mechanical data STGB19NC60K - STGP19NC60K D²PAK (TO-263) mechanical data mm Dim Min A A1 b b2 c c2 D D1 E E1 e e1 H J1 L L1 L2 R V2 4.40 0.03 0.70 1.14 0.45 1.23 8.95 7.50 10 8.50 2.54 4.88 15 2.49 2.29 1.27 1.30 0.4 0° 8° 0° 5.28 15.85 2.69 2.79 1.40 1.75 0.192 0.590 0.099 0.090 0.05 0.051 Typ Max 4.60 0.23 0.93 1.70 0.60 1.36 9.35 10.40 Min 0.173 0.001 0.027 0.045 0.017 0.048 0.352 0.295 0.394 0.334 inch Typ Max 0.181 0.009 0.037 0.067 0.024 0.053 0.368 0.409 0.1 0.208 0.624 0.106 0.110 0.055 0.069 0.016 8° 0079457_M 12/15 STGB19NC60K - STGP19NC60K Packing mechanical data 5 Packing mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956 BASE QTY 1000 * on sales type 13/15 Revision history STGB19NC60K - STGP19NC60K 6 Revision history Table 8. Date 14-May-2008 28-May-2008 Document revision history Revision 1 2 Initial release Inserted new drawing: Figure 15: Thermal impedance Changes 14/15 STGB19NC60K - STGP19NC60K Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 15/15