L99DZ70XP
Door actuator driver
Features
■
One full bridge for 6 A load (Ron = 150 mΩ)
■
Two half bridges for 3 A load (Ron = 300 mΩ)
■
Two half bridges for 0.75 A load
(Ron = 1600 mΩ)
■
One highside driver for 6 A load (Ron = 90 mΩ)
■
Two configurable highside drivers for up to
1.5 A load (Ron = 500 mΩ) or 0.4 A
(Ron = 1800 mΩ)
■
Two highside drivers for 0.5 A load
(Ron = 1600 mΩ)
Applications
■
■
Programmable softstart function to drive loads
with higher inrush currents as current limitation
value
■
Very low current consumption in standby mode
(IS < 6 µA typ; Tj ≤ 85 °C; ICC < 5 µA typ;
Tj ≤ 85 °C)
■
Current monitor output for all highside drivers
■
Device contains temperature warning and
protection
■
Openload detection for all outputs
■
Over-current protection for all otputs
■
Separated half bridges for door lock motor
■
PWM control of all outputs
■
Charge pump output for reverse polarity
protection
■
STM standard serial peripheral interface (STSPI 3.0)
■
Control block for electrochromic element
Table 1.
PowerSSO-36
Door actuator driver with 6 bridges for double
door lock control, mirror fold and mirror axis
control, highside driver for mirror defroster,
bulbs and LEDs (replacement for L9950).
Control block with external MOS transistor for
charging / discharging of electrochromic glass.
Description
The L99DZ70XP is a microcontroller driven
multifunctional door actuator driver for automotive
applications. Up to five DC motors and five
grounded resistive loads can be driven with six
half bridges and five highside drivers. An
electrochromic mirror glass can be controlled
using the integrated SPI-driven module in
conjunction with an external MOS transistor. The
integrated SPI controls all operating modes
(forward, reverse, brake and high impedance).
Also all diagnostic information is available via SPI
read.
Device summary
Order codes
Package
PowerSSO-36
September 2013
Tube
Tape and reel
L99DZ70XP
L99DZ70XPTR
Doc ID 15162 Rev 4
1/47
www.st.com
1
Contents
L99DZ70XP
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.4.1
2.5
3
4
SPI - Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1
Dual power supply: VS and VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.2
Wake up and active mode / standby mode . . . . . . . . . . . . . . . . . . . . . . . 24
3.3
Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.4
Diagnostic functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.5
Overvoltage and undervoltage detection at VS . . . . . . . . . . . . . . . . . . . . 25
3.6
Overvoltage and undervoltage detection at VCC . . . . . . . . . . . . . . . . . . . 25
3.7
Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . 25
3.8
Inductive loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.9
Open load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.10
Over-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.11
Current monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.12
PWM inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.13
Cross-current protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.14
Programmable soft-start function to drive loads with higher inrush current
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.15
Controller for electrochromic glass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Functional description of the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1
2/47
Outputs OUT1 - OUT11, ECV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1.1
Chip Select Not (CSN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1.2
Serial Data In (DI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Doc ID 15162 Rev 4
L99DZ70XP
Contents
4.2
4.1.3
Serial Clock (CLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1.4
Serial Data Out (DO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1.5
SPI communication flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Command byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.2.1
5
Operation code definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.3
Global status byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.4
Address mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
SPI - control and status registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.1
Control register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.2
Control register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.3
Control register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.4
Control register 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.5
Status register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.6
Status register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.7
Status register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.8
Configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6
Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
7
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8
7.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.2
PowerSSO-36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.3
PowerSSO-36 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Doc ID 15162 Rev 4
3/47
List of tables
L99DZ70XP
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
4/47
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin definition and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Operating junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Overvoltage and under voltage detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Current monitor output CM / PWM 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Charge pump output CP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
On-resistance and switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Current monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electrochrome control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Delay time from standby to active mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Inputs: CSN, CLK, PWM1/2 and DI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SDI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
DO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
DO timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
CSN timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SPI frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Operation code definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Global status byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
RAM memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
ROM memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Control register 0 (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Control register 1 (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Control register 2 (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Control register 3 (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Status register 0 (read) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Status register 1 (read) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Status register 2 (read) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Configuration register (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
PowerSSO-36 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Doc ID 15162 Rev 4
L99DZ70XP
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrochrome control block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI - Transfer timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SPI - Input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SPI - DO valid data delay time and valid time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SPI - DO enable and disable time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SPI - driver turn on/off timing, minimum CSN HI time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Example of programmable soft-start function for inductive loads . . . . . . . . . . . . . . . . . . . . 27
Write and read SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Global error flag definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
PowerSSO-36 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
PowerSSO-36 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
PowerSSO-36 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Doc ID 15162 Rev 4
5/47
Block diagram and pin description
1
L99DZ70XP
Block diagram and pin description
Figure 1.
Block diagram
VBAT
STD18NF03L
100k
10k
VS
L99PM62GXP
CP
100µF
300mΩ
100nF
1600mΩ
Charge
Pump
1600mΩ
VCC
VCC
150mΩ
1k
1k
1k
SPI
Interface
DI
DO
CLK
CSN
1k
PWM1
1k
Standby
SPC560D
Driver Interface & Diagnostic
ST SPI
M
OUT1
M
OUT2
M
OUT3
M
150mΩ
OUT4
OUT5
300mΩ
OUT6
M
500 / 1800mΩ
10 Watt
OUT7
500 / 1800mΩ
90mΩ
progr. Bulb or LED Mode
10 Watt
OUT8
OUT11
OUT9
1600mΩ
OUT10
1600mΩ
STD18NF03L
ECDR (VS)
EC Glass
Control Block
CM/PWM2
CM
MUX
All components to be
placed together as close
as possible
6BIT SPI controlled
5 nF
1k
1600mΩ
100 nF
ECV (VS)
GND
Table 2.
Pin
Symbol
Function
1, 18, 19, 36
GND
Ground: reference potential.
Important: For the capability of driving the full current at the outputs all pins
of GND must be externally connected!
2, 35
6/47
Pin definition and functions
Highside driver output 11.
The output is built by a highside switch and is intended for resistive loads,
therefore the internal reverse diode from GND to the output is missing. For
ESD reason a diode to GND is present, but the energy which can be
OUT11 dissipated is limited. The highside driver is a power DMOS transistor with an
internal parasitic reverse diode from the output to VS (bulk-drain-diode). The
output is over-current protected.
Important: for the capability of driving the full current at the outputs both pins
of OUT11 must be externally connected!
Doc ID 15162 Rev 4
L99DZ70XP
Block diagram and pin description
Table 2.
Pin
3
4
5
6, 7, 14, 15,
23, 24, 28,
29
8
9
10
Pin definition and functions (continued)
Symbol
Function
OUT1,
OUT2,
OUT3
Halfbridge outputs 1,2,3.
The output is built by a highside and a lowside switch, which are internally
connected. The output stage of both switches is a power DMOS transistor.
Each driver has an internal parasitic reverse diode (bulk-drain-diode:
highside driver from output to VS, lowside driver from GND to output). This
output is over-current protected.
VS
Power supply voltage (external reverse protection required).
For this input a ceramic capacitor as close as possible to GND is
recommended.
Important: For the capability of driving the full current at the outputs all pins
of VS must be externally connected!
DI
Serial data input.
The input requires CMOS logic levels and receives serial data from the
microcontroller. The data is a 24 bit control word and the most significant bit
(MSB, bit 23) is transferred first.
CM/
PWM2
Current monitor output/PWM2 input.
Depending on the selected multiplexer bits of the control register this output
sources an image of the instant current through the corresponding highside
driver with a ratio of 1/10.000 or 1/2000. This pin is bidirectional. The
microcontroller can overdrive the current monitor signal to provide a second
PWM input for the outputs OUT5, OUT8 and OUT10.
CSN
Chip Select Not input / Testmode.
This input is low active and requires CMOS logic levels. The serial data
transfer between L99DZ70 and the microcontroller is enabled by pulling the
input CSN to low level.
Serial data output.
The diagnosis data is available via the SPI and this tristate-output. The
output will remain in tristate, if the chip is not selected by the input CSN
(CSN = high)
11
DO
12
VCC
Supply voltage.
For this input a ceramic capacitor as close as possible to GND is
recommended.
13
CLK
Serial clock input.
This input controls the internal shift register of the SPI and requires CMOS
logic levels.
16,17
20,21
22
OUT4,
OUT5,
OUT6
Halfbridge outputs 4,5,6: see OUT1 (pin 3).
Important: For the capability of driving the full current at the outputs both
pins of OUT4 (OUT5, respectively) must be externally connected!
25
ECDR
Electrocromic driver output.
If the electrochrome mode is selected this pin is used to control the gate of
an external MOSFET, otherwise it remains in high-impedance state.
Note: It is possible to connect the pin to VS as in L9950/53/54 applications,
as long as the electrochome mode is not enabled via SPI.
26
CP
Charge pump output.
This output is provided to drive the gate of an external n-channel power
MOS used for reverse polarity protection (see Figure 1.).
Doc ID 15162 Rev 4
7/47
Block diagram and pin description
Table 2.
Pin definition and functions (continued)
Pin
Symbol
Function
27
PWM1
PWM1 input.
This input signal can be used to control the drivers OUT1-4, OUT6-7, OUT9
and OUT11 and ECV by an external PWM signal.
30
31
OUT7,
OUT8,
Highside driver outputs 7,8: see OUT9.
By selection of one of the 2 power DMOS at same output is it possible to
supply a bulb with low on-resistance or a LED with higher on-resistance in a
different application.
32
8/47
L99DZ70XP
ECV
Electrochrome voltage input and lowside driver output.
This input senses voltage in electrocrome mode for charge monitoring.
The lowside switch provides a fast discharge of electrocromic mirror and
can be used 'stand alone' as lowside switch beside electrocromic mode.
Highside driver output 9.
The output is built by a highside switch and is intended for resistive loads,
hence the internal reverse diode from GND to the output is missing. For
ESD reason a diode to GND is present but the energy which can be
dissipated is limited. The highside driver is a power DMOS transistor with an
internal parasitic reverse diode from the output to VS (bulk-drain-diode). The
output is over-current and open load protected.
33
OUT9
34
Highside driver output 10: see OUT9.
OUT10 Important: beside the bit10 in control register 1 this output can be switched
on setting bit1 for electrocromic control mode with higher priority.
Doc ID 15162 Rev 4
L99DZ70XP
Block diagram and pin description
Figure 2.
Configuration diagram (top view)
GND 1
OUT11 2
OUT1 3
OUT2 4
OUT3 5
Vs 6
Vs 7
DI 8
PowerSSO-36
CM / PWM2 9
CSN 10
DO 11
Vcc 12
CLK 13
Vs 14
Vs 15
OUT4 16
OUT4 17
GND 18
Note:
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
GND
OUT11
OUT10
OUT9
ECV
OUT8
OUT7
Vs
Vs
PWM1
CP
ECDR
Vs
Vs
OUT6
OUT5
OUT5
GND
All pins with the same name must be externally connected.
Doc ID 15162 Rev 4
9/47
Electrical specifications
L99DZ70XP
2
Electrical specifications
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
Table 3.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
-0.3...28
V
40
V
-0.3 to 5.5
V
Digital input / output voltage
-0.3 to VCC + 0.3
V
VCM
Current monitor output
-0.3 to VCC + 0.3
V
VCP
Charge pump output
-25 .. VS + 11
V
-0.3 to VS + 0.3
V
DC supply voltage
Vs
Single pulse tmax < 400 ms
Vcc
Stabilized supply voltage, logic supply
VDI, VDO, VCLK,
VCSN, VPWM
VOUTn, ECDR, ECV
IOUT,2,3,9,10,
Static output voltage (n= 1 to 11)
Output current
±1.25
A
IOUT1,6,7,8,
Output current
±5
A
IOUT4,5,11
Output current
±10
A
ECV
2.2
ESD protection
Table 4.
ESD protection
Parameter
All pins
Output pins: OUT1 - OUT6, ECV
Unit
± 2 (1)
kV
(2)
kV
±4
1. HBM according to MIL 883C, Method 3015.7 or EIA/JESD22-A114-A.
2. HBM with all unzapped pins grounded.
10/47
Value
Doc ID 15162 Rev 4
L99DZ70XP
2.3
Electrical specifications
Thermal data
Table 5.
Operating junction temperature
Symbol
Tj
Table 6.
Parameter
Operating junction temperature
Value
Unit
-40 to 150
°C
Temperature warning and thermal shutdown
Symbol
Parameter
Min.
TjTW ON
Temperature warning threshold junction
temperature
TjSD ON
Thermal shutdown threshold junction
temperature
Tj
increasing
TjSD OFF
Thermal shutdown threshold junction
temperature
Tj
decreasing
Tj
130
Max.
Unit
150
°C
170
°C
150
TjSD HYS Thermal shutdown hysteresis
2.4
Typ.
°C
5
°K
Electrical characteristics
VS = 8 to 16V, VCC= 4.5 to 5.3V, Tj = - 40 to 150°C, unless otherwise specified.
The voltages are referred to GND and currents are assumed positive, when the current
flows into the pin.
Table 7.
Supply
Item
Symbol
7.1
VS
Parameter
Operating voltage
range
VS DC supply current
7.2
IS
7.3
7.4(1)
Test condition
VS quiescent supply
current
Min.
Typ. Max. Unit
7
28
V
mA
VS = 16 V, VCC = 5.3 V
active mode
OUT1 - OUT11, ECV,
ECDR floating
7
20
VS = 16 V, VCC = 0 V
standby mode
OUT1 - OUT11, ECV,
ECDR floating
Ttest = -40°C, 25°C
4
12
Ttest = 85°C
6
Doc ID 15162 Rev 4
µA
25
11/47
Electrical specifications
Table 7.
Item
L99DZ70XP
Supply (continued)
Symbol
7.5
Parameter
Test condition
VCC DC supply current
ICC
7.6(2)
VCC quiescent supply
current
7.7(1)
Min.
Typ. Max. Unit
VS = 16 V, VCC = 5.3 V
CSN = VCC, active mode
OUT1 - OUT11, ECV,
ECDR floating
1
3
VS = 16 V,
VCC = 5.3 VCSN = VCC
standby mode
OUT1 - OUT11, ECV,
ECDR floating
Ttest = -40°C, 25°C
3
6
Ttest = 85°C
5
10
Typ.
Max.
Unit
mA
µA
1. This parameter is guaranteed by design.
2. CM/ PWM 2 = VCC or 0 V.
Table 8.
Overvoltage and under voltage detection
Item
Symbol
8.1
VSUV on
8.2
Test condition
Min.
VS UV-threshold voltage
VS increasing
5.6
7.2
V
VSUV off
VS UV-threshold voltage
VS decreasing
5.2
6.1
V
8.3
VSUV hyst
VS UV-hysteresis
8.4
VSOV off
VS OV-threshold voltage
VS increasing
18
24.5
V
8.5
VSOV on
VS OV-threshold voltage
VS decreasing
17.5
23.5
V
8.6
VSOV hyst
VS OV-hysteresis
8.7
VPOR off
Power-on-reset threshold
VCC increasing
8.8
VPOR on
Power-on-reset threshold
VCC decreasing
8.9
VPOR hyst
Power-on-reset
hysteresis
Table 9.
VCM
Parameter
ICM,r
V
2.9
2.0
V
V
0.11
and 7,8
(low on-resistance)
Min.
Typ.
0
0V