STH310N10F7-6

STH310N10F7-2, STH310N10F7-6 N-channel 100 V, 1.9 mΩ typ.,180 A, STripFET™ F7 Power MOSFETs in H2PAK-2 and H2PAK-6 packages Datasheet - production data Features TAB TAB Order code 1 2 H PAK-2 STH310N10F7-2 7 2 3 STH310N10F7-6 1 2 H PAK-6     Figure 1: Internal schematic diagram VDS RDS(on) max. ID 100 V 2.3 mΩ 180 A Among the lowest RDS(on) on the market Excellent figure of merit (FoM) Low Crss/Ciss ratio for EMI immunity High avalanche ruggedness Applications  Switching applications Description These N-channel Power MOSFETs utilize STripFET™ F7 technology with an enhanced trench gate structure that results in very low onresistance, while also reducing internal capacitance and gate charge for faster and more efficient switching. S(2,3,4,5,6,7) Table 1: Device summary Order code STH310N10F7-2 STH310N10F7-6 July 2015 Marking 310N10F7 DocID024040 Rev 4 This is information on a product in full production. Package H2PAK-2 H2PAK-6 Packing Tape and reel 1/19 www.st.com Contents STH310N10F7-2, STH310N10F7-6 Contents 1 Electrical ratings ............................................................................. 3 2 Electrical characteristics ................................................................ 4 2.1 Electrical characteristics (curves) ...................................................... 6 3 Test circuits ..................................................................................... 8 4 Package information ....................................................................... 9 5 2/19 4.1 H2PAK-2 package information ........................................................ 10 4.2 H2PAK-6 package information ........................................................ 13 4.3 Packing information ......................................................................... 16 Revision history ............................................................................ 18 DocID024040 Rev 4 STH310N10F7-2, STH310N10F7-6 1 Electrical ratings Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 100 V VGS Gate-source voltage ± 20 V Drain current (continuous) at TC = 25 °C 180 A ID(1) Drain current (continuous) at TC = 100 °C 180 A ID(2) Drain current (pulsed) 720 A PTOT Total dissipation at TC = 25 °C 315 W EAS(3) Single pulse avalanche energy (TJ = 25 °C L = 0.55 mH, IAS = 65 A) 1 J TJ Operating junction temperature Tstg Storage temperature -55 to 175 °C °C Notes: (1)Current (2)Pulse limited by package width limited by safe operating area (3)Starting TJ = 25 °C, ID = 60 A, VDD = 50 V Table 3: Thermal data Symbol Parameter Rthj-case Rthj-pcb (1) Value Unit Thermal resistance junction-case 0.48 °C/W Thermal resistance junction-pcb 35 °C/W Notes: (1)When mounted on FR-4 board of 1 inch², 2 oz Cu DocID024040 Rev 4 3/19 Electrical characteristics 2 STH310N10F7-2, STH310N10F7-6 Electrical characteristics (TCASE = 25 °C unless otherwise specified) Table 4: On/off-state Symbol V(BR)DSS Parameter Test conditions Drain-source breakdown voltage (VGS= 0) Min. ID = 250 µA Typ. Max. 100 Unit V 1 µA VDS = 100 V; TC = 125 °C 100 µA Gate body leakage current (VDS = 0) VGS = 20 V 100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 3.5 4.5 V RDS(on) Static drain-source onresistance VGS = 10 V, ID = 60 A 1.9 2.3 mΩ Max. Unit IDSS Zero gate voltage drain current (VGS = 0) IGSS VDS = 100 V 2.5 Table 5: Dynamic Symbol Parameter Ciss Input capacitance Coss Output capacitance Crss Reverse transfer capacitance Test conditions Min. Typ. VDS = 25 V, f = 1 MHz, VGS = 0 12800 pF 3500 pF 170 - Qg Total gate charge Qgs Gate-source charge Qgd Gate-drain charge pF - VDD = 50 V, ID = 180 A VGS = 10 V See Figure 14: "Gate charge test circuit" 180 nC 78 nC 34 nC Table 6: Switching times Symbol td(on) tr td(off) tf 4/19 Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions VDD = 50 V, ID = 90 A, RG = 4.7 Ω, VGS= 10 V See Figure 13: "Switching times test circuit for resistive load" DocID024040 Rev 4 Min. Typ. Max. 62 ns 108 - 148 40 Unit ns - ns ns STH310N10F7-2, STH310N10F7-6 Electrical characteristics Table 7: Source-drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current 180 A ISDM(1) Source-drain current (pulsed) 720 A VSD(2) Forward on voltage ISD = 60 A, VGS = 0 1.5 V trr Reverse recovery time Qrr Reverse recovery charge IRRM Reverse recovery current ISD = 180 A, di/dt = 100 A/µs, VDD = 80 V, Tj = 150 °C 85 ns 200 nC 4.7 A Notes: (1)Pulse width limited by safe operating area (2)Pulsed: pulse duration = 300 µs, duty cycle 1.5% DocID024040 Rev 4 5/19 Electrical characteristics 2.1 STH310N10F7-2, STH310N10F7-6 Electrical characteristics (curves) Figure 2: Safe operating area Figure 3: Thermal impedance AM15430v1 ID (A) a e ar 280tok K is ᵟ =0.5 ) is DS(on th in ax R it on y m a er d b Op ite Lim 100 0.2 0.1 10 10 100µs 0.05 -1 0.02 1 Tj= 175 °C Tc= 25 °C 1ms Sinlge pulse 10ms Zth=k Rthj-c ᵟ =tp/ t 0.01 Single pulse tp t -2 0.1 0.1 10 1 10 -5 10 V DS(V) Figure 4: Output characteristics 10 10 -2 10 -1 tp (s) AM14735v1 ID (A) V GS=10V V DS = 2V 350 300 -3 Figure 5: Transfer characteristics AM14734v1 ID (A) 10 -4 8V 7V 250 300 250 200 200 150 150 100 100 6V 50 50 5V 0 0 2 4 6 8 0 0 V DS(V) Figure 6: Gate charge vs gate-source voltage V DD=50V ID=180 A 10 8 2.20 6 2.15 4 2.10 2 2.05 50 100 150 4 5 6 7 8 V GS(V) AM15431v1 V GS=10V 2 0 3 R DS(on) (mΩ) 2.25 0 6/19 2 Figure 7: Static drain-source on-resistance AM14736v1 V GS (V) 1 Q g(nC) DocID024040 Rev 4 0 40 80 120 160 ID(A) STH310N10F7-2, STH310N10F7-6 Electrical characteristics Figure 8: Normalized V(BR)DSS vs temperature Figure 9: Capacitance variations AM14738v1 C (pF) AM14742v1 V (BR)DSS (norm) 14000 ID = 1m A 1.04 Ciss 12000 1.02 10000 8000 1.00 6000 0.98 4000 0.96 Crss 2000 Coss 0.94 -75 0 -25 25 75 125 T J(°C) Figure 10: Source-drain diode forward characteristics 20 40 60 80 100 V DS(V) Figure 11: Normalized gate threshold voltage vs temperature AM14739v1 V SD (V) 0 AM14741v1 V GS(th) (norm) 1.05 ID = 250µ A 1.0 T J=-50°C 0.95 0.90 0.85 T J=25°C 0.75 0.80 0.65 0.45 0.70 T J=150°C 0.55 0 40 80 160 120 0.60 -75 ISD(A) -25 0 25 75 125 T J(°C) Figure 12: Normalized on-resistance vs temperature AM14740v1 R DS(on) (norm) 2.0 ID = 60A 1.6 1.2 0.8 0.4 -75 -25 0 25 75 DocID024040 Rev 4 125 T J(°C) 7/19 Test circuits 3 STH310N10F7-2, STH310N10F7-6 Test circuits Figure 13: Switching times test circuit for resistive load Figure 14: Gate charge test circuit Figure 15: Test circuit for inductive load switching and diode recovery times Figure 16: Unclamped inductive load test circuit Figure 17: Unclamped inductive waveform Figure 18: Switching time waveform 8/19 DocID024040 Rev 4 STH310N10F7-2, STH310N10F7-6 4 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID024040 Rev 4 9/19 Package information 4.1 STH310N10F7-2, STH310N10F7-6 H2PAK-2 package information Figure 19: H²PAK-2 package outline 8159712_D 10/19 DocID024040 Rev 4 STH310N10F7-2, STH310N10F7-6 Package information Table 8: H²PAK-2 package mechanical data mm Dim. Min. Typ. Max. A 4.30 4.80 A1 0.03 0.20 C 1.17 1.37 e 4.98 5.18 E 0.50 0.90 F 0.78 0.85 H 10.00 10.40 H1 7.40 L 15.30 L1 1.27 1.40 L2 4.93 5.23 L3 6.85 7.25 L4 1.5 1.7 - 7.80 15.80 M 2.6 2.9 R 0.20 0.60 V 0° 8° DocID024040 Rev 4 11/19 Package information STH310N10F7-2, STH310N10F7-6 Figure 20: H²PAK-2 recommended footprint 8159712_D 12/19 DocID024040 Rev 4 STH310N10F7-2, STH310N10F7-6 4.2 Package information H2PAK-6 package information Figure 21: H²PAK-6 package outline 8159693_Rev_F DocID024040 Rev 4 13/19 Package information STH310N10F7-2, STH310N10F7-6 Table 9: H²PAK-6 package mechanical data mm Dim. Min. 14/19 Typ. Max. A 4.30 4.80 A1 0.03 0.20 C 1.17 1.37 e 2.34 2.74 e1 4.88 5.28 e2 7.42 7.82 E 0.45 0.60 F 0.50 0.70 H 10.00 H1 7.40 L 14.75 15.25 L1 1.27 1.40 L2 4.35 4.95 L3 6.85 7.25 L4 1.5 1.75 M 1.90 2.50 R 0.20 0.60 V 0° 8° DocID024040 Rev 4 - 10.40 7.80 STH310N10F7-2, STH310N10F7-6 Package information Figure 22: H²PAK-6 recommended footprint footprint_Rev_F Dimensions are in mm. DocID024040 Rev 4 15/19 Package information 4.3 STH310N10F7-2, STH310N10F7-6 Packing information Figure 23: Tape outline 16/19 DocID024040 Rev 4 STH310N10F7-2, STH310N10F7-6 Package information Figure 24: Reel outline T REE L DIMENS IONS 40 mm min. Acc ess hole At slot location B D C N A G measured Tape slot In core for Full radius At hub Tape start Table 10: Tape and reel mechanical data Tape Reel mm mm Dim. Dim. Min. Max. A0 10.5 10.7 A B0 15.7 15.9 B 1.5 D 1.5 1.6 C 12.8 D1 1.59 1.61 D 20.2 E 1.65 1.85 G 24.4 F 11.4 11.6 N 100 K0 4.8 5.0 T P0 3.9 4.1 P1 11.9 12.1 Base quantity 1000 P2 1.9 2.1 Bulk quantity 1000 R 50 T 0.25 0.35 W 23.7 24.3 DocID024040 Rev 4 Min. Max. 330 13.2 26.4 30.4 17/19 Revision history 5 STH310N10F7-2, STH310N10F7-6 Revision history Table 11: Document revision history Date Revision Changes 10-Dec-2012 1 Initial release. Part number(s) previously included in datasheet ID02287  23-Jul-2013 18/19 2    Document status promoted from preliminary to production data Modified: IDSS and VGS value in table 4 Added: EAS value in table 2 Minor text changes Updated: H2PAK-6 package information. Updated the title, features and description. Minor text changes. 27-Nov-2014 3    29-Jul-2015 4 Updated Table 2: "Absolute maximum ratings". DocID024040 Rev 4 STH310N10F7-2, STH310N10F7-6 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID024040 Rev 4 19/19