STL24N60M2
N-channel 600 V, 0.186 Ω typ., 18 A MDmesh™ M2
Power MOSFET in a PowerFLAT™ 8x8 HV package
Datasheet - production data
Features
5
4
3
2
Order code
VDS@TJ max
RDS(on) max.
ID
STL24N60M2
650 V
0.210 Ω
18 A
1
PowerFLAT™ 8x8 HV
Extremely low gate charge
Excellent output capacitance (COSS) profile
100% avalanche tested
Zener-protected
Applications
Switching applications
Figure 1: Internal schematic diagram
Description
This device is an N-channel Power MOSFET
developed using MDmesh™ M2 technology.
Thanks to its strip layout and an improved vertical
structure, the device exhibits low on-resistance
and optimized switching characteristics,
rendering it suitable for the most demanding high
efficiency converters.
Table 1: Device summary
Order code
Marking
Package
Packing
STL24N60M2
24N60M2
PowerFLAT™ 8x8 HV
Tape and reel
May 2016
DocID024777 Rev 3
This is information on a product in full production.
1/15
www.st.com
Contents
STL24N60M2
Contents
1
Electrical ratings ............................................................................. 3
2
Electrical characteristics ................................................................ 4
2.1
Electrical characteristics (curves) ...................................................... 6
3
Test circuits ..................................................................................... 8
4
Package information ....................................................................... 9
5
2/15
4.1
PowerFLAT™ 8x8 HV package information .................................... 10
4.2
PowerFLAT™ 8x8 HV packing information ..................................... 12
Revision history ............................................................................ 14
DocID024777 Rev 3
STL24N60M2
1
Electrical ratings
Electrical ratings
Table 2: Absolute maximum ratings
Symbol
Parameter
Value
Unit
VGS
Gate-source voltage
± 25
V
ID(1)
Drain current (continuous) at TC = 25 °C
18
A
ID(1)
Drain current (continuous) at TC = 100 °C
12
A
Drain current (pulsed)
72
A
IDM(1)(2)
PTOT
(1)
Total dissipation at TC = 25 °C
125
W
dv/dt(3)
Peak diode recovery voltage slope
15
V/ns
dv/dt(4)
MOSFET dv/dt ruggedness
50
V/ns
Tstg
Storage temperature range
-55 to 150
°C
Tj
Operating junction temperature range
Notes:
(1)the
value is limited by package
(2)Pulse
(3)I
SD
(4)V
width limited by safe operating area.
≤ 18 A, di/dt ≤ 400 A/µs; VDS(peak) < V(BR)DSS, VDD = 400 V.
DS
≤ 480 V
Table 3: Thermal data
Symbol
Rthj-case
Rthj-pcb
(1)
Parameter
Value
Unit
Thermal resistance junction-case max
1
°C/W
Thermal resistance junction-pcb max
45
°C/W
Notes:
(1)When
mounted on FR-4 board of inch², 2oz Cu.
Table 4: Avalanche characteristics
Symbol
Parameter
Value
Unit
IAR
Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax)
3.5
A
EAS
Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR; VDD = 50 V)
180
mJ
DocID024777 Rev 3
3/15
Electrical characteristics
2
STL24N60M2
Electrical characteristics
TC = 25 °C unless otherwise specified
Table 5: On/off states
Symbol
Parameter
Test conditions
V(BR)DSS
Drain-source breakdown
voltage
IDSS
Zero gate voltage Drain
current
IGSS
VGS = 0 V, ID = 1 mA
Min.
Typ.
Max.
600
Unit
V
VGS = 0 V, VDS = 600 V
1
µA
VGS = 0 V, VDS = 600 V,
TC = 125 °C(1)
100
µA
Gate-body leakage current
VDS = 0 V, VGS = ±25 V
±10
µA
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
3
4
V
RDS(on)
Static drain-source onresistance
VGS = 10 V, ID = 9 A
0.186
0.210
Ω
Min.
Typ.
Max.
Unit
2
Notes:
(1)Defined
by design, not subject to production test.
Table 6: Dynamic
Symbol
Parameter
Test conditions
Ciss
Input capacitance
-
1060
-
pF
Coss
Output capacitance
-
55
-
pF
Crss
Reverse transfer
capacitance
-
2.2
-
pF
Coss eq.(1)
Equivalent output
capacitance
VDS = 0 to 480 V, VGS = 0 V
-
258
-
pF
RG
Intrinsic gate
resistance
f = 1 MHz open drain
-
7
-
Ω
Qg
Total gate charge
-
29
-
nC
Qgs
Gate-source charge
-
6
-
nC
Qgd
Gate-drain charge
-
12
-
nC
VDS= 100 V, f = 1 MHz, VGS = 0 V
VDD = 480 V, ID = 18 A, VGS = 10 V
(see Figure 15: "Gate charge test
circuit")
Notes:
(1)C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C oss when VDS
increases from 0 to 80% VDSS
Table 7: Switching times
Symbol
td(on)
tr
td(off)
tf
4/15
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
VDD = 300 V, ID = 9 A RG = 4.7 Ω,
VGS = 10 V (see Figure 14:
"Switching times test circuit for
resistive load") and (Figure 19:
"Switching time waveform")
DocID024777 Rev 3
Min.
Typ.
Max.
Unit
-
14
-
ns
-
9
-
ns
-
60
-
ns
-
15
-
ns
STL24N60M2
Electrical characteristics
Table 8: Source drain diode
Symbol
Parameter
ISD(1)
Source-drain current
ISDM(1)(2)
Source-drain current
(pulsed)
VSD (3)
Forward on voltage
Test conditions
VGS = 0 V, ISD = 18 A
trr
Reverse recovery time
Qrr
Reverse recovery
charge
IRRM
Reverse recovery
current
trr
Reverse recovery time
Qrr
Reverse recovery
charge
IRRM
Reverse recovery
current
ISD = 18 A, di/dt = 100 A/µs,
VDD = 60 V (see Figure 16: " Test
circuit for inductive load
switching and diode recovery
times")
ISD = 18 A, di/dt = 100 A/µs,
VDD = 60 V, Tj = 150 °C
(see Figure 16: " Test circuit for
inductive load switching and
diode recovery times")
Min.
Typ.
Max.
Unit
-
18
A
-
72
A
-
1.6
V
-
332
ns
-
4
µC
-
24
A
-
450
ns
-
5.5
µC
-
25
A
Notes:
(1)The
value is limited by package.
(2)Pulse
width is limited by safe operating area
(3)Pulsed:
pulse duration = 300 µs, duty cycle 1.5%
DocID024777 Rev 3
5/15
Electrical characteristics
2.1
STL24N60M2
Electrical characteristics (curves)
Figure 3: Thermal impedance
Figure 2: Safe operating area
K
δ=0.5
0.2
0.1
10
-1
0.05
0.02
Zth= K*RthJ-c
δ= tp/Ƭ
0.01
Single pulse
tp
-2
10 -5
10
10
-4
10
-3
10
-2
Ƭ
tp (s)
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Gate charge vs gate-source voltage
Figure 7: Static drain-source on-resistance
R
W
VGS=10 A
0.194
0.192
0.190
0.188
0.186
0.184
0.182
0.180
0.178
0
6/15
DocID024777 Rev 3
2
4
6
8
10 12 14 16
ID(A)
STL24N60M2
Electrical characteristics
Figure 8: Capacitance variations
AM15665v1
C
(pF)
Figure 9: Normalized gate threshold voltage
vs temperature
Ciss
1000
100
Coss
10
Crss
1
0.1
1
100
10
V DS(V)
Figure 10: Normalized on-resistance vs
temperature
RDS(on)
(norm)
2.5
Figure 11: Normalized V(BR)DSS vs
temperature
ID=9 A
VGS=10 V
2.3
2.1
1.9
1.7
1.5
1.3
1.1
0.9
0.7
0.5
-50 -25
0
25
50
75 100 125 TJ(°C)
Figure 12: Output capacitance stored energy
AM15669v1
Eoss(µJ)
Figure 13: Source-drain diode forward
characteristics
8
7
6
5
4
3
2
1
0
0
100 200 300
400
500
600
VDS(V)
DocID024777 Rev 3
7/15
Test circuits
3
STL24N60M2
Test circuits
Figure 15: Gate charge test circuit
Figure 14: Switching times test circuit for
resistive load
3.3
µF
2200
RL
+
µF
VDD
VD
VGS
RG
D.U.T.
PW
GND1
(driver signal)
GND2
(power)
Figure 16: Test circuit for inductive load
switching and diode recovery times
A
A
D.U.T.
FAST
DIODE
B
B
Figure 17: Unclamped inductive load test
circuit
A
D
G
S
L=100µH
3.3
µF
B
25Ω
L
D
+
1000
µF
VD
2200
µF
VDD
VDD
+
G
RG
3.3
µF
ID
S
D.U.T.
Vi
GND1
D.U.T.
GND2
Pw
GND1
Figure 18: Unclamped inductive waveform
8/15
DocID024777 Rev 3
GND2
AM15858v1
Figure 19: Switching time waveform
STL24N60M2
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
DocID024777 Rev 3
9/15
Package information
4.1
STL24N60M2
PowerFLAT™ 8x8 HV package information
Figure 20: PowerFLAT™ 8x8 HV package outline
8222871_Rev_3_ A
10/15
DocID024777 Rev 3
STL24N60M2
Package information
Table 9: PowerFLAT™ 8x8 HV mechanical data
mm
Dim.
Min.
Typ.
Max.
A
0.75
0.85
0.95
A1
0.00
A3
0.10
0.20
0.30
b
0.90
1.00
1.10
D
7.90
8.00
8.10
0.05
E
7.90
8.00
8.10
D2
7.10
7.20
7.30
E1
2.65
2.75
2.85
E2
4.25
4.35
4.45
e
L
2.00
0.40
0.50
0.60
Figure 21: PowerFLAT™ 8x8 HV footprint
All dimensions are in millimeters.
DocID024777 Rev 3
11/15
Package information
4.2
STL24N60M2
PowerFLAT™ 8x8 HV packing information
Figure 22: PowerFLAT™ 8x8 HV tape
All dimensions are in millimeters.
Figure 23: PowerFLAT™ 8x8 HV package orientation in carrier tape
12/15
DocID024777 Rev 3
STL24N60M2
Package information
Figure 24: PowerFLAT™ 8x8 HV reel
All dimensions are in millimeters.
DocID024777 Rev 3
13/15
Revision history
5
STL24N60M2
Revision history
Table 10: Document revision history
Date
Revision
11-Jun-2013
1
First release.
2
Modified: ID (at TC = 100 °C) value in Table 3.
Modified: VSD max value, figures 3 and 11.
Updated: Section 4: Package mechanical data – Minor text
changes.
3
Updated features and description in cover page.
Updated package silhouette and Figure 1: "Internal schematic
diagram".
Updated Section 4: "Test circuits" and Section 5.1: "PowerFLAT™
8x8 HV package information".
Minor text changes
28-Feb-2014
25-May-2016
14/15
Changes
DocID024777 Rev 3
STL24N60M2
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DocID024777 Rev 3
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