STPS3H100UFY

STPS3H100-Y Datasheet Automotive 3 A - 100 V power Schottky rectifier Features • • • • • • • • • AEC-Q101 qualified revision C Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and forward voltage drop Avalanche capability specified ECOPACK2 compliant PPAP capable VRRM guaranteed from -40 to +175 °C Applications • • • • DC/DC converter Reverse polarity protection Freewheeling diodes Switching diode Description Product status link STPS3H100-Y This Schottky rectifier is packaged in SMB Flat designed for high frequency miniature switched mode power supplies such as adaptors and on board DC to DC converters for automotive applications. Product summary IF(AV) 3A VRRM 100 V Tj (max.) 175 °C VF (typ.) 0.63 V DS11461 - Rev 2 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS3H100-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit 100 V VRRM Repetitive peak reverse voltage, Tj = -40 °C to +175 °C IF(AV) Average forward current, δ = 0.5 square wave Tl = 125 °C 3 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 25 A PARM Repetitive peak avalanche power 170 W Storage temperature range -65 to +175 °C Maximum operating junction temperature range(1) -40 to +175 °C Tstg Tj tp = 10 µs, Tj = 125 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Typ. value Unit 15 °C/W Junction to lead For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C IR (1) Reverse leakage current Tj = 125 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Typ. VR = VRRM Tj = 150 °C Tj = 25 °C Min. IF = 3 A IF = 6 A - 0.40 Max. Unit 1.00 µA 1.00 - 3.3 - 0.84 - 0.63 - 0.68 0.94 0.71 mA V 0.80 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.56 x IF(AV) + 0.04 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS11461 - Rev 2 page 2/9 STPS3H100-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 3.0 PF(AV) (W) Figure 2. Average forward current versus ambient temperature (δ = 0.5) IF(AV) (A) 10 δ = 0.05 2.5 δ = 0.1 δ = 0.5 δ = 0.2 δ=1 8 2.0 6 Rth(j-a) = Rth(j-l) 1.5 4 1.0 T δ = tp/T IF(AV)(A) T 2 0.5 tp δ = tp/T Tam b (°C) tp 0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C) 0 50 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration PARM (t p ) PARM (10 µs) 1 25 1.0 0.9 Zth(j-l)/R th(j-l) SMB-Flat 0.8 0.1 0.7 0.6 0.5 0.4 0.01 0.3 0.2 t p(µs) 1 DS11461 - Rev 2 10 100 Single pulse 0.1 0.001 1000 0.0 1.E-04 t p (s) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 page 3/9 STPS3H100-Y Characteristics (curves) Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 Figure 6. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1000 F = 1 MHz 1.E+03 = 30 mV V OSC RMS T = 25 °C j Tj = 150 °C Tj = 125 °C 1.E+02 Tj = 100 °C 1.E+01 100 Tj = 75 °C 1.E+00 Tj = 50 °C 1.E-01 Tj = 25 °C VR(V) VR(V) 10 1.E-02 0 10 20 30 40 50 60 70 80 90 1 100 Figure 7. Forward voltage drop versus forward current (typical values) 10.00 10 100 Figure 8. Forward voltage drop versus forward current (maximum values) IF(A) 10.00 IF(A) 1.00 1.00 Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C 0.10 0.10 VF(V) VF(V) 0.01 0.0 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.0 Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SMB flat, typical values) 200 Rth(j-a)(°C/W) SMB flat Epoxy printed board FR4, copper thickness: 35 μm 150 100 50 SCu (cm²) 0 0.0 DS11461 - Rev 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/9 STPS3H100-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 10. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 4. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS11461 - Rev 2 Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 L1 0.40 0.016 L2 0.60 0.024 page 5/9 STPS3H100-Y SMB Flat package information Figure 11. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS11461 - Rev 2 page 6/9 STPS3H100-Y Ordering Information 3 Ordering information Table 5. Ordering information DS11461 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode STPS3H100UFY 3H100Y SMB Flat 0.050 g 5000 Tape and reel page 7/9 STPS3H100-Y Revision history Table 6. Document revision history DS11461 - Rev 2 Date Version Changes 07-Nov-2016 1 Initial release. 14-Jan-2020 2 Updated Figure 3. Minor text changes to improve readability. page 8/9 STPS3H100-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS11461 - Rev 2 page 9/9