STPS5H100BY-TR

STPS5H100-Y Datasheet Automotive high voltage power Schottky rectifier Features A K • • • • • • • • AEC-Q101 qualified Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and forward voltage drop Avalanche specification PPAP capable VRRM guaranteed from -40 °C to +175 °C Description The STPS5H100-Y is housed in a DPAK package. This high voltage Schottky barrier rectifier is designed for high frequency miniature switched mode power supplies and on board DC to DC converters for automotive applications. It is ideally suited for LED lighting and car radio applications, as well as ECU (Engine Control Unit) in automotive environment. Product status link STPS5H100-Y Product summary Symbol Value IF(AV) 5A VRRM 100 V Tj range -40 °C to +175 °C VF (max.) 0.61 V DS6906 - Rev 2 - April 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPS5H100-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage, Tj = -40 °C to +175 °C 100 V IF(RMS) Forward rms current 10 A IF(AV) Average forward current Tc = 165 °C, δ = 0.5 5 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 518 W Storage temperature range -65 to +175 °C Operating junction temperature range(1) -40 to +175 °C Tstg Tj 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal parameters Symbol Rth(j-c) Parameter Max. value Unit 2.5 °C/W Junction to case Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 5 A IF = 10 A Min. Typ. - 1.3 - Unit 3.5 µA 4.5 mA 0.73 0.57 - Max. 0.61 0.85 0.66 V 0.71 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.51 x IF(AV) + 0.02 x IF2(RMS) DS6906 - Rev 2 page 2/9 STPS5H100-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Average forward current versus ambient temperature (δ = 0.5) Figure 1. Average forward power dissipation versus average forward current 4.0 PF(AV )(W) IF(AV) (A) 6 δ = 0.1 3.5 δ = 0.2 Rth-j-a) = Rth(j-c) δ = 0.5 5 δ = 0.05 3.0 4 2.5 δ=1 2.0 Rth(j-a) = 80 °C/W 3 1.5 2 T 1.0 T 1 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 tp δ =tp/T I F(AV) (A) 3.5 4.0 4.5 5.0 5.5 6.0 Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C) 1 δ =tp/T tp 20 40 T amb (° C) 0 0 60 80 100 120 140 160 180 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration PARM (t p ) PARM (10 µs) 1. 0 Zth(j-c)/Rth(j-c) 0. 8 0.1 0. 6 0. 4 0.01 δ = 0.5 δ = 0.2 δ = 0.1 0. 2 T Single pulse t p(µs) tp(s) 0.001 1 10 100 0. 0 1E -3 1000 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 5E +3 1E -2 δ =tp/T 1E -1 tp 1E +0 Figure 6. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1000 1E +3 F= 1 MHz Tj = 25 °C Tj =125 °C 1E +2 1E +1 100 1E +0 Tj = 25 °C 1E -1 VR(V) V R (V) 1E -2 0 DS6906 - Rev 2 10 20 30 40 50 60 70 80 90 100 10 1 10 100 page 3/9 STPS5H100-Y Characteristics (curves) Figure 7. Forward voltage drop versus forward current (maximum values) I F (A) Figure 8. Thermal resistance junction to ambient versus copper surface under tab 100 50. 0 Rth(j-a) (°C/W) 80 Tj = 125 °C 10. 0 DPAK Epoxy printed circuit board, copper thickness: 35 µm 90 70 60 Tj = 25 °C 50 40 1. 0 30 20 10 VF(V) 0.1 0.0 DS6906 - Rev 2 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1. 6 SCu (cm²) 0 0 5 10 15 20 25 30 35 40 page 4/9 STPS5H100-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DPAK package information • • Epoxy meets UL94, V0 Lead-free packages Figure 9. DPAK package outline A E c2 b4 E1 L2 D1 H D L4 A1 b (2x) e R e1 c Seating plane A2 (L1) L V2 0.25 DS6906 - Rev 2 Gauge plane page 5/9 STPS5H100-Y DPAK package information Table 4. DPAK mechanical data Dimensions Dim. Millimeters Min. Inches Typ. Max. Min. Typ. Max. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.205 0.213 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 D1 4.95 5.25 0.195 E 6.40 6.60 0.252 E1 4.60 4.70 4.80 0.181 0.185 0.189 e 2.16 2.28 2.40 0.085 0.090 0.094 e1 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.398 L 1.00 1.50 0.039 0.059 (L1) 2.60 2.80 3.00 0.102 0.110 0.118 L2 0.65 0.80 0.95 0.026 0.031 0.037 L4 0.60 1.00 0.024 R V2 5.10 0.201 0.207 0.260 0.039 0.20 0.008 0° 8° 0° 8° Figure 10. DPAK recommended footprint (dimensions are in mm) 6.3 6.1 10.7 2.8 1.8 min. B 1.5 4.572 A The device must be positioned within DS6906 - Rev 2 page 6/9 STPS5H100-Y Ordering information 3 Ordering information Table 5. Ordering information DS6906 - Rev 2 Order code Marking Package Weight Base qty Delivery mode STPS5H100BY-TR S5H100Y DPAK 0.30 g 2500 Tape and reel page 7/9 STPS5H100-Y Revision history Table 6. Document revision history Date Version 07-Nov-2011 1 Changes Initial release. Removed figure 4 and figure 5. Updated Section ● Features and Section ● Description. 06-Apr-2018 2 Updated Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C) and Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified). Minor text changes to improve readability. DS6906 - Rev 2 page 8/9 STPS5H100-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS6906 - Rev 2 page 9/9