STPS3L40UFN

STPS3L40 Datasheet 40 V, 3 A low drop Schottky rectifier Features • • • • • Negligible switching losses Low forward voltage drop Low thermal resistance Avalanche rated ECOPACK2 component Applications • • • • Telecom power supply Set-top box power supply TV power supply Battery charger Description Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in SMB Flat Notch, SMB Flat and SMC, the STPS3L40 is ideal for surface mounting and used in DC/DC chargers. Product status STPS3L40 Product summary Symbol Value IF(AV) 3A VRRM 40 V T j(max.) 150 °C VF(typ.) 0.40 V DS1947 - Rev 5 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS3L40 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit 40 V 3 A VRRM Repetitive peak reverse voltage IF(AV) Average forward current, δ = 0.5, square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 95 W -65 to +150 °C +150 °C Tstg Tj SMB Flat, SMB Flat Notch TL = 120 °C TL = 115 °C SMC Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMB Flat, SMB Flat Notch 15 SMC 18 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 3 A IF = 6 A Min. Typ. - 16 - Unit 100 µA 40 mA 0.50 0.40 - Max. 0.44 0.62 0.52 V 0.58 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.30 x IF(AV) + 0.047 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS1947 - Rev 5 page 2/13 STPS3L40 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current IF(AV)(A) PF(AV) (W) 3.5 2.0 ẟ = 0.1 ẟ = 0.2 Rth(j-a) =Rt h(j-l) ẟ = 0.5 SMC 3.0 ẟ = 0.05 1.6 Figure 2. Average forward current versus ambient temperature (δ = 0.5) (SMC) 2.5 ẟ=1 Rth(j-a) =75°C/W 1.2 2.0 1.5 0.8 1.0 T T 0.4 0.5 IF(AV)(A) 0.0 0 .5 1.0 1 .5 2.0 tp ẟ=tp/T 0.0 2.5 3.0 3.5 d=tp/T 0.0 0 4.0 Figure 3. Average forward current versus ambient temperature (δ = 0.5, SMB Flat) Tamb (°C) tp 25 50 75 100 125 150 Figure 4. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) IF(AV) (A) 3.5 1 SMB flat, SMB flat Notch Rth(j-a)= Rth(j-l) 3.0 2.5 0.1 2.0 1.5 1.0 0.01 T 0.5 δ=tp/T 0.0 0 Tamb (°C) tp 25 50 75 100 125 150 t p(µs) 0.001 1 10 100 1000 Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) to lead versus pulse duration (SMB flat, SMB flat Notch) Zth(j-l) /Rth(j-l) Zth (j-a)/Rt h(j-a) 1.0 1.0 0.9 0.9 SMC 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 T 0.2 0.1 SMB flat SMB flat Notch 0.2 Single pulse Single pulse t p(s ) ẟ=t p/T 0.0 1.E-02 DS1947 - Rev 5 1.E-01 1.E+00 1.E+01 1.E+02 tp 0.1 t p (s) 0.0 1.E+03 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 page 3/13 STPS3L40 Characteristics (curves) Figure 7. Reverse leakage current versus reverse voltage applied (typical values) IR(mA ) Figure 8. Junction capacitance versus reverse voltage applied (typical values) 1000 1.E+02 C (pF) F=1MHz VOSC=30mVRMS Tj =25°C Tj =125°C 1.E+01 Tj =100°C 1.E+00 100 1.E-01 Tj =25°C 1.E-02 VR(V) 0 5 10 15 20 25 30 35 1 40 10 100 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMB flat, SMB flat Notch) Figure 9. Forward voltage drop versus forward current 100.00 VR(V) 10 1.E-03 IFM(A) 200 Rth(j-a)(°C/W) SMB flat SMB flat Notch Epoxy printed board FR4, eCU=35µm 10.00 150 Tj=125 °C (Maximum values) 1.00 Tj=125 °C (Typical v alues) 100 Tj=25°C (Maximum values) 0.10 50 VFM (V) SCu (cm²) 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMC) Rth(j-a) (°C/W) 160 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm 140 SMC 120 100 80 60 40 20 SCu (cm²) 0 0.0 DS1947 - Rev 5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/13 STPS3L40 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 12. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 4. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS1947 - Rev 5 Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 L1 0.40 0.016 L2 0.60 0.024 page 5/13 STPS3L40 SMB Flat package information Figure 13. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS1947 - Rev 5 page 6/13 STPS3L40 SMB Flat Notch package information 2.2 SMB Flat Notch package information • • Epoxy meets UL94, V0 Lead-free package Figure 14. SMB Flat Notch package outline A V G1 b D V1 G E E1 L1 L A1 L3 L2 c Table 5. SMB Flat Notch mechanical data Dimensions Millimeters Ref. Min. A 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.043 0.002 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.20 5.60 0.205 0.220 E1 4.05 4.60 0.159 0.181 G 2.00 0.079 G1 1.20 0.047 L 0.75 1.20 0.030 0.047 L1 0.30 0.012 L2 0.60 0.024 L3 DS1947 - Rev 5 Typ. Inches 0.02 0.001 V 8° 8° V1 8° 8° page 7/13 STPS3L40 SMB Flat Notch package information Figure 15. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS1947 - Rev 5 page 8/13 STPS3L40 SMC package information 2.3 SMC package information • Epoxy meets UL94, V0 Figure 16. SMC package outline E1 D E A1 A2 b C L E2 Table 6. SMC package mechanical data Dimensions Ref. DS1947 - Rev 5 Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 page 9/13 STPS3L40 SMC package information Figure 17. SMC recommended footprint 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) DS1947 - Rev 5 page 10/13 STPS3L40 Ordering Information 3 Ordering information Table 7. Ordering information DS1947 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STPS3L40UFN B34 SMB Flat Notch 0.056 g 5 000 Tape and reel STPS3L40UF FS3L4 SMB Flat 0.050 g 5000 Tape and reel STPS3L40S S3L4 SMC 0.243 g 10 000 Tape and reel page 11/13 STPS3L40 Revision history Table 8. Document revision history DS1947 - Rev 5 Date Version Changes Jul-2003 2A 08-Feb-2007 3 Reformatted to current standard. Added ECOPACK statement. Added SMBflat package. 20-May-2013 4 Updated SMC package information. Updated ECOPACK statement. Corrected Y axis labels of Figure 12. 31-Jan-2020 5 Added Section 2.2 SMB Flat Notch package information. Last update. page 12/13 STPS3L40 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS1947 - Rev 5 page 13/13