STPS3L60UFN

STPS3L60 Datasheet 60 V, 3 A low drop Schottky rectifier Features • • • • Negligible switching losses Low forward voltage drop Avalanche rated ECOPACK2 component Applications • • • • Switching diode SMPS DC/DC converter LED lighting Description Axial and surface mount power Schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. Packaged in DO-201AD, DO-15, SMB, SMBflat and SMBflat Notch, this device is intended for use in low voltage, high frequency inverters and small battery chargers and for applications where there are space constraints, for example telecom battery charger. Product status STPS3L60 Product summary Symbol Value IF(AV) 3A VRRM 60 V T j(max.) 150 °C VF(typ.) 0.53 V DS2134 - Rev 7 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS3L60 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 10 A 3 A SMB Flat Notch, SMB Flat TL = 115 °C IF(AV) Average forward current, δ = 0.5, square wave SMB, DO-201AD TL = 105 °C DO-15 TL = 72 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 100 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 144 W -65 to +150 °C +150 °C Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Parameter Max. value Junction to leads Rth(j-l) Junction to leads, lead length = 10 mm SMB Flat Notch, SMB Flat 15 SMB 20 DO-201AD 20 DO-15 35 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C IR(1) Reverse leakage current Tj = 100 °C Forward voltage drop VR = VRRM - Tj = 25 °C IF = 3 A Tj = 125 °C - Tj = 25 °C - Tj = 100 °C Tj = 125 °C Typ. - Tj = 125 °C Tj = 100 °C VF(1) Min. IF = 6 A - Max. Unit 150 µA 4 15 14 30 mA 0.62 0.53 0.61 0.51 0.59 0.79 0.62 0.71 0.6 0.69 V 1. Pulse test: tp = 380 µs, δ < 2% DS2134 - Rev 7 page 2/17 STPS3L60 Characteristics To evaluate the conduction losses, use the following equation: P = 0.44 x IF(AV) + 0.05 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS2134 - Rev 7 page 3/17 STPS3L60 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) (SMB Flat, SMB Flat Notch) PF(AV)(W) IF(AV)(A) 2.50 δ = 0.1 δ = 0.05 2.25 δ = 0.2 3.5 δ = 0.5 Rth(j-a)=Rth(j-l) 3.0 2.00 δ=1 1.75 2.5 1.50 2.0 1.25 1.5 1.00 0.75 0.50 0.5 IF(AV)(A) 0.25 δ=tp/T 0.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Tamb (°C) tp 0.0 3.5 4.0 Figure 3. Average forward current versus ambient temperature (δ = 0.5) (DO-201AD, SMB) 3.5 Rth(j-a)=100°C/W 1.0 T 0 25 50 75 100 125 150 Figure 4. Average forward current versus ambient temperature (δ = 0.5) (DO-15) IF(AV)(A) IF(AV)(A) 3.5 Rth(j-a)= Rth(j-I) Rth(j-a)=Rth(j-l) 3.0 3.0 2.5 2.5 2.0 2.0 Rth(j-a)=80°C/W 1.5 1.5 1.0 Rth(j-a)=100°C/W 1.0 0.5 0.5 Tamb (°C) 0.0 Tamb (°C) 0.0 0 25 50 75 100 125 150 Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 0 50 75 100 125 150 Figure 6. Relative variation of thermal impedance junction to lead versus pulse duration (SMB Flat, SMB Flat Notch) PARM (t p ) PARM (10 µs) 1 25 1.0 Zth(j-l) /Rth(j-l) 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 Single pulse 0.1 0.001 t p(µs) 1 DS2134 - Rev 7 10 t p (s) 0.0 100 1000 1.E-03 1.E-02 1.E-01 1.E+00 page 4/17 STPS3L60 Characteristics (curves) Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) to ambient versus pulse duration (DO-201AD) 1.0 Zth(j-a) /Rth(j-a) 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 0.1 t p (s) 0.0 Single pulse t p (s) 0.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-15) 1.0 Zth(j-a) / Rth(j-a) Zth(j-a) /Rth(j-a) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 IR(mA) 0.9 Tj=125°C 1.E+01 0.8 0.7 Tj=100°C 1.E+00 0.6 0.5 1.E-01 0.4 0.3 0.1 Single pulse VR(V) t p (s) 1.E-03 0.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 1000 Tj=25°C 1.E-02 0.2 C(pF) 0 10 15 20 25 30 35 40 45 50 55 60 Figure 12. Forward voltage drop versus forward current (high level) 30 F=1MHz Vosc=30mV Tj=25°C 5 IFM(A) 25 Tj=100°C (Typical v alues) 20 100 Tj=100°C (Maximum values) Tj=25°C (Maximum values) 15 10 5 VFM(V) VR(V) 10 1 DS2134 - Rev 7 10 100 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 page 5/17 STPS3L60 Characteristics (curves) Figure 13. Forward voltage drop versus forward current (low level) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMB flat, SMB flat Notch) IFM(A) 5 Rth(j-a)(°C/W) 200 Tj=100°C (Typical values) SMB flat SMB flat Notch Epoxy printed board FR4, copper thickness: 35 μm 4 150 3 Tj=100°C (Maximum values) 100 2 Tj=25°C (Maximum values) 50 1 VFM(V) SCu (cm²) 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 16. Thermal resistance versus lead length (DO-15) Rth (°C/W) Rth(j-a) (°C/W) 120 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm Rth(j-a) SMB 100 150 80 60 100 Rth(j-I) 40 50 20 S(Cu)(cm²) L leads (mm) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25 Figure 17. Thermal resistance versus lead length Rt h (°C/W) 90 DO-201AD R 80 th(j - a) 70 60 50 40 Rth(j-l) 30 20 10 0 5 DS2134 - Rev 7 L leads (mm) 10 15 20 25 page 6/17 STPS3L60 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB Flat Notch package information • • Epoxy meets UL94, V0 Lead-free package Figure 18. SMB Flat Notch package outline A DS2134 - Rev 7 V c L3 L2 G1 b D V1 G E E1 L1 L A1 page 7/17 STPS3L60 SMB Flat Notch package information Table 4. SMB Flat Notch mechanical data Dimensions Ref. Millimeters Min. A Typ. 0.90 A1 Inches Max. Min. 1.10 0.035 0.05 Typ. Max. 0.043 0.002 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.20 5.60 0.205 0.220 E1 4.05 4.60 0.159 0.181 G 2.00 0.079 G1 1.20 0.047 L 0.75 1.20 0.030 0.047 L1 0.30 0.012 L2 0.60 0.024 L3 0.02 0.001 V 8° 8° V1 8° 8° Figure 19. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS2134 - Rev 7 page 8/17 STPS3L60 SMB package information 2.2 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 20. SMB package outline E1 D E A1 C A2 L b Table 5. SMB package mechanical data Dimensions Millimeters Ref. DS2134 - Rev 7 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 page 9/17 STPS3L60 SMB package information Figure 21. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS2134 - Rev 7 page 10/17 STPS3L60 SMB Flat package information 2.3 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 22. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 6. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS2134 - Rev 7 Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 L1 0.40 0.016 L2 0.60 0.024 page 11/17 STPS3L60 SMB Flat package information Figure 23. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS2134 - Rev 7 page 12/17 STPS3L60 DO-201AD package information 2.4 DO-201AD package information • Epoxy meets UL 94, V0 Figure 24. DO-201AD package outline B A E Note 1 B E Note 1 ØD Note 2 ØC Table 7. DO-201AD package mechanical data Dimensions Millimeters Ref. Min. A B 25.40 Inches (for reference only) Typ. Max. - 9.50 - Min. 1.000 Typ. Max. - 0.374 - C - 5.30 - 0.209 D(1) - 1.30 - 0.051 E - 1.25 Note 2(2) 15.00 0.049 0.590 1. The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) DS2134 - Rev 7 page 13/17 STPS3L60 DO-15 package information 2.5 DO-15 package information • Epoxy meets UL 94, V0 Figure 25. DO-15 package outline C C A ØD ØB Table 8. DO-15 package mechanical data Dimensions Ref. DS2134 - Rev 7 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 6.05 - 6.75 0.238 - 0.266 B 2.95 - 3.53 0.116 - 0.139 C 26.00 - 31.00 1.024 - 1.220 D 0.71 - 0.88 0.028 - 0.0035 page 14/17 STPS3L60 Ordering Information 3 Ordering information Table 9. Ordering information DS2134 - Rev 7 Order code Marking Package Weight Base qty. Delivery mode STPS3L60UFN B36 SMB Flat Notch 0.056 g 5000 Tape and reel STPS3L60U G36 SMB 0.107 g 2500 Tape and reel STPS3L60UF FG36 SMB Flat 0.050 g 5000 Tape and reel STPS3L60RL STPS3L60 DO-201AD 1.12 g 1900 Tape and reel STPS3L60Q STPS3L60 DO-15 1000 Ammopack STPS3L60QRL STPS3L60 DO-15 6000 Tape and reel 0.04 g page 15/17 STPS3L60 Revision history Table 10. Document revision history DS2134 - Rev 7 Date Version Changes July-2003 5A 12-Jun-2009 6 Reformatted to current standards. Added SMBflat package. Added ECOPACK statement. Added cathode band graphics. 31-Jan-2020 7 Added Section 2.1 SMB Flat Notch package information. 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For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS2134 - Rev 7 page 17/17