STPS8H100FP

STPS8H100 High voltage power Schottky rectifier Datasheet - production data Features K A TO-220AC K     K K A A A NC NC D2PAK A TO-220FPAC    Negligible switching losses High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Insulated package:  TO-220FPAC, insulating voltage = 2000 VRMS sine Avalanche capability specified ECOPACK®2 compliant component for D²PAK on demand Description K Schottky barrier rectifier designed for high frequency compact switched mode power supplies such as adaptors and on-board DC-DC converters. Table 1: Device summary December 2015 DocID5387 Rev 12 This is information on a product in full production. Symbol Value IF(AV) 8A VRRM 100 V Tj (max) 175 °C VF (typ) 0.56 V 1/14 www.st.com Characteristics 1 STPS8H100 Characteristics Table 2: Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) Forward rms current 30 A 8 A TO-220AC, D2PAK TC = 165 °C TO-220FPAC TC = 150 °C IF(AV) Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 250 A PARM Repetitive peak avalanche power tp = 10 µs, Tj= 125 °C 750 W -65 to + 175 °C + 175 °C Tstg Storage temperature range Maximum operating junction temperature (1) Tj Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameter Symbol Parameter Value TO-220AC, D2PAK Rth(j-c) Unit 1.6 Junction to case °C/W TO-220FPAC 4 Table 4: Static electrical characteristics Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 8 A IF = 10 A IF = 16 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.48 x IF(AV) + 0.0125 IF2(RMS) 2/14 DocID5387 Rev 12 Min. Typ. - 2.0 - 0.56 4.5 µA 6.0 mA 0.58 0.77 0.59 - Unit 0.71 - Max. 0.64 0.81 0.65 0.68 V STPS8H100 1.1 Characteristics Characteristics (curves) 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Figure 1: Average forward power dissipation versus average forward current PF(av) (W) δ = 0.1 δ = 0.2 δ = 0.05 Figure 2: Normalized avalanche power derating versus pulse duration (Tj= 125 °C) δ = 0.5 1 PARM(t p ) PARM(10 µs) δ=1 0.1 0.01 T δ=tp/T IF(av) (A) 0 1 2 3 4 5 6 7 8 t p (µs) tp 9 0.001 1 10 Figure 3: Average forward current versus ambient temperature, δ = 0.5 (TO-220AC, D²PAK) IF(AV)(A) 10 1000 Figure 4: Average forward current versus ambient temperature, δ = 0.5 (TO-220FPAC) IF(AV)(A) 10 10 Rth(j-a)=Rth(j-c) Rth(j-a)=Rth(j-c) 8 8 6 6 4 Rth(j-a)=50°C/W 4 Rth(j-a)=15°C/W T T 2 2 δ=tp/T 0 100 0 20 tp Tamb (°C) 40 60 80 100 120 140 160 180 0 0 δ=tp/T tp 20 40 Tamb (°C) 60 80 100 120 140 160 180 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, D²PAK) Zth(j-c) /Rth(j-c) 1.0 Figure 6: Relative variation of thermal impedance junction to case versus pulse duration (TO220FPAC) Zth(j-c) /Rth(j-c) 1.0 0.8 0.8 0.6 0.6 δ = 0.5 0.4 0.4 δ = 0.2 0.2 δ = 0.5 δ = 0.2 T δ = 0.1 0.2 Single pulse 0.0 1E-4 t p (s) 1E-3 1E-2 δ=tp/T 1E-1 T δ = 0.1 Single pulse t p (s) tp 1E+0 0.0 1E-3 DocID5387 Rev 12 1E-2 1E-1 δ=tp/T tp 1E+0 1E+1 3/14 Characteristics STPS8H100 Figure 7: Reverse leakage current versus reverse voltage applied (typical values) IR(µA) 5E+3 1E+3 Figure 8: Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz Tj=25°C Tj=125°C 1E+2 500 1E+1 1E+0 200 Tj=25°C 1E-1 1E-2 VR(V) 0 10 20 30 40 50 60 70 80 90 100 Figure 9: Forward voltage drop versus forward current (maximum values) 100 VR(V) 1 10 100 Figure 10: Thermal resistance junction to ambient versus copper surface under tab 80 Rth(j-a) (°C/W) D²PAK 70 60 50 40 30 20 Epoxy printed board FR4, e CU= 35 µm 10 0 0 4/14 DocID5387 Rev 12 5 10 15 20 SCu(cm²) 25 30 35 40 STPS8H100 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N·m (for TO-220AC and TO-220FPAC) Maximum torque value: 0.7 N·m (for TO-220AC and TO-220FPAC) DocID5387 Rev 12 5/14 Package information 2.1 STPS8H100 D²PAK package information Figure 11: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 6/14 DocID5387 Rev 12 STPS8H100 Package information Table 5: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 0.4 typ. 0° 0.015 8° DocID5387 Rev 12 0° 8° 7/14 Package information STPS8H100 Figure 12: D²PAK recommended footprint (dimensions in mm) 8/14 DocID5387 Rev 12 STPS8H100 2.2 Package information TO-220AC package information Figure 13: TO-220AC package outline DocID5387 Rev 12 9/14 Package information STPS8H100 Table 6: TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.107 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 L7 6.20 L9 3.50 M Diam 10/14 Inches 6.60 0.244 3.93 0.137 2.6 typ. 3.75 0.620 0.259 0.154 0.102 typ. 3.85 DocID5387 Rev 12 0.147 0.151 STPS8H100 2.3 Package information TO-220FPAC package information Figure 14: TO-220FPAC package outline A B H Dia L6 L2 L7 L3 L5 F1 D L4 F E G1 G DocID5387 Rev 12 11/14 Package information STPS8H100 Table 7: TO-220FPAC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 12/14 Inches 16 typ. 0.108 0.63 typ. L3 28.6 30.6 0.126 L4 9.8 10.6 0.386 1.205 0.417 0.142 L5 2.9 3.6 0.114 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 DocID5387 Rev 12 STPS8H100 3 Ordering information Ordering information Table 8: Ordering information Order code Marking Weight Base qty Delivery mode STPS8H100D STPS8H100D TO-220AC 1.86g 50 Tube STPS8H100FP STPS8H100FP TO-220FPAC 1.90g 50 Tube STPS8H100G STPS8H100G D2PAK 1.48g 50 Tube STPS8H100G D2PAK 1.48g 1000 Tape and reel STPS8H100G-TR 4 Package Revision history Table 9: Document revision history Date Revision Jul-2003 6D Last update. 01-Jun-2006 10 Reformatted to current standard. Added ECOPACK statement. Changed nF to pF in Figure 11. Revision number set to 10 to align with on-line versioning. 08-Apr-2014 11 Updated D2PAK package information and Figure 2. 12 Updated features in cover page. Minor text changes in Section 1: "Characteristics". Updated Section 2: "Package information". 14-Dec-2015 Changes DocID5387 Rev 12 13/14 STPS8H100 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 14/14 DocID5387 Rev 12